Packaging mechanism of electronic device

Abstract

The utility model relates to a packaging mechanism of an electronic device, which comprises a mould used for placing the electronic device and disordered nano silver-aluminum source sol and a vacuum device used for being matched with the mould to carry out vacuum treatment, and the electronic device and the disordered nano silver-aluminum source sol are placed on the mould in sequence from front to back. The mold is vacuumized through a vacuum device, the mold enters a magnetic field to adjust the spatial position of the disordered nano-silver-aluminum source sol nanowire, and the disordered nano-silver-aluminum source sol of the mold is converted into aerogel through drying so as to coat and package an electronic device. Through the design of a packaging material and a structure, the comprehensive performance of heat shielding and electromagnetic shielding is realized, the anti-interference capability of an electronic device in a special environment is guaranteed, and meanwhile, aerogel is adopted for auxiliary packaging to make up for the application of the aerogel in the aspect of device packaging.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic device packaging, in particular to a packaging mechanism for electronic devices. Background Art

[0002] As the lightest and most thermally insulating material currently available, aerogel has begun to be widely used in various thermal insulation occasions. For example, Chinese Patent Application No. 201710461564.9 discloses an aerogel thermal insulation device for electronic products, and Chinese Patent Application No. 201920836521.9 discloses an aerogel thermal insulation sheet. However, due to the brittleness of aerogel materials and the harsh conditions for material preparation, aerogel has not been widely used in device packaging. Utility Model Content

[0003] The purpose of the utility model is to provide a packaging mechanism for electronic devices, which realizes the comprehensive performance of thermal shielding and electromagnetic shielding through the design of packaging materials and structures, ensures the anti-interference ability of electronic devices in special environments, and uses aerogel for auxiliary packaging to make up for the application of aerogel in device packaging.

[0004] The purpose of the utility model is achieved in this way:

[0005] An electronic device packaging mechanism comprises a mold for placing electronic devices and disordered nano silver-aluminum source sol, and a vacuum device for cooperating with the mold for vacuum treatment. The electronic devices and the disordered nano silver-aluminum source sol are placed on the mold in a front-to-back order. The mold is evacuated by the vacuum device. The mold enters a magnetic field to adjust the spatial position of disordered nano silver-aluminum source sol nanowires. The disordered nano silver-aluminum source sol of the mold is converted into aerogel by drying to cover and package the electronic devices.

[0006] The mold is provided with a cavity for placing electronic devices and disordered nano silver-aluminum source sol, and the mold is provided with air holes connected to the cavity. The air holes are connected to the vacuum device through pipelines. When the vacuum device is started, the gas in the mold cavity is extracted through the air holes.

[0007] The vacuum device includes a vacuum pump or an air compressor that cooperates with the mold.

[0008] The spatial position of the disordered nano silver-aluminum source sol nanowires is adjusted in a magnetic field so that the disordered nano silver-aluminum source sol forms a magnetically controlled ordered nano silver wire-aluminum source sol.

[0009] The packaging mechanism of the electronic device also includes a heating device. After the disordered nano silver-aluminum source sol of the mold is converted into aerogel through drying, the heating device heats the mold, and the aerogel shrinks in the heated state.

[0010] After the mold is heated, the electronic device wrapped and packaged by the aerogel is taken out by opening the mold. A first metal layer is provided on the outer surface of the aerogel of the electronic device. The first metal layer and the aerogel are co-fired at low temperature to form a semi-crystalline aerogel layer on the aerogel part.

[0011] The first metal layer is provided on the outer surface of the aerogel of the electronic device by spraying.

[0012] A ceramic glaze layer is provided on the outer surface of the aerogel of the electronic device. The ceramic glaze layer and the aerogel are co-fired at low temperature to form a semi-crystalline aerogel layer on the aerogel part to ensure the stability of the electronic device shell structure and the aerogel structure.

[0013] The second metal layer is provided at both ends of the ceramic glaze layer of the semi-crystalline aerogel layer by spraying.

[0014] The outer peripheral side of the ceramic glaze layer of the semi-crystalline aerogel layer is provided with a second metal layer by spraying, and the second metal layer forms a metal coating layer covering the ceramic glaze layer, the semi-crystalline aerogel layer, and the electronic device to encapsulate the electronic device, further enhance the electromagnetic shielding effect of the electronic device, and ensure the anti-interference ability of the electronic device in special environments.

[0015] The beneficial effects of the utility model are as follows:

[0016] By introducing magnetic nanowires, the toughness of the aerogel structure is improved, and the electromagnetic shielding function is introduced while ensuring the thermal shielding capability.

[0017] The surface crystallization and aerogel crystallization provided by low-temperature co-firing improve the stability of the structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 The figure is a schematic diagram of the process of packaging an electronic device according to an embodiment of the present invention.

[0019] Figure 2 This is a schematic diagram of the structure of placing electronic components and sol in a mold according to one embodiment of the utility model.

[0020] Figure 3 It is a schematic structural diagram of a nano silver-aluminum source sol forming a magnetically controlled ordered nano silver wire-aluminum source sol in a mold according to an embodiment of the utility model.

[0021] Figure 4 This is a schematic structural diagram of preparing a dried sol according to an embodiment of the utility model.

[0022] Figure 5 This is a structural schematic diagram of mold opening and electronic device and sol separation in one embodiment of the utility model.

[0023] Figure 6This is a schematic structural diagram of aerogel subjected to heating and shrinkage pretreatment according to an embodiment of the utility model.

[0024] Figure 7 This is a schematic structural diagram of the first metal layer and the aerogel in one embodiment of the utility model.

[0025] Figure 8 This is a schematic diagram of the outer surface coating structure of an aerogel in one embodiment of the utility model.

[0026] In the figure, 1 is a mold, 2 is a disordered nanosilver-aluminum source sol, 3 is a metal lead of an electronic device, 4 is an electronic device, 5 is a magnetically controlled ordered nanosilver wire-aluminum source sol, 6 is an alumina aerogel prepared by a normal temperature and pressure drying method, 7 is an aerogel pretreated by high temperature shrinkage, 8 is a metal layer after low temperature co-firing, 9 is a semi-crystallized aerogel layer after low temperature co-firing, 10 is a ceramic glaze layer, and 11 is a metal layer after low temperature co-firing (the material is the same as that of 8). DETAILED DESCRIPTION

[0027] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0028] See also Figure 1-Figure 8 , a packaging mechanism for electronic devices, including a mold 1 for placing an electronic device 4 and a disordered nanosilver-aluminum source sol 2, and a vacuum device for cooperating with the mold 1 for vacuum treatment. The electronic device 4 and the disordered nanosilver-aluminum source sol 2 are placed on the mold 1 in a front-to-back order, and the mold 1 is vacuumed by the vacuum device. The mold 1 enters a magnetic field to adjust the spatial position of the disordered nanosilver-aluminum source sol 2 nanowires. The disordered nanosilver-aluminum source sol 2 of the mold 1 is converted into aerogel by drying to cover and package the electronic device 4.

[0029] The mold 1 is provided with a cavity for placing an electronic device 4 and a disordered nano silver-aluminum source sol 2. The mold 1 is provided with an air hole connected to the cavity. The air hole is connected to a vacuum device through a pipeline. When the vacuum device is started, the gas in the cavity of the mold 1 is extracted through the air hole.

[0030] The vacuum device comprises a vacuum pump or an air compressor matched with the mold 1 .

[0031] The spatial positions of the disordered nanosilver-aluminum source sol 2 nanowires are adjusted in a magnetic field so that the disordered nanosilver-aluminum source sol 2 forms a magnetically controlled ordered nanosilver wire-aluminum source sol 5.

[0032] The packaging mechanism of the electronic device also includes a heating device. After the disordered nano silver-aluminum source sol 2 of the mold 1 is converted into aerogel by drying, the heating device heats the mold 1, and the aerogel shrinks in the heated state.

[0033] In this embodiment, the heating device includes a heating tube, a ceramic heating element or a heating coil.

[0034] After the mold 1 is heated, the electronic device 4 wrapped and encapsulated by the aerogel is taken out by opening the mold. A first metal layer 8 is provided on the aerogel outer surface of the electronic device 4. The first metal layer 8 and the aerogel are co-fired at low temperature to form a semi-crystalline aerogel layer 9 on the aerogel part.

[0035] The first metal layer 8 is provided on the outer surface of the aerogel of the electronic device 4 by spraying.

[0036] A ceramic glaze layer 10 is provided on the outer surface of the aerogel of the electronic device 4. The ceramic glaze layer 10 and the aerogel are co-fired at a low temperature to form a semi-crystalline aerogel layer 9 on the aerogel portion.

[0037] The second metal layer 11 is provided at both ends of the ceramic glaze layer 10 of the semi-crystalline aerogel layer 9 by spraying.

[0038] The outer peripheral side of the ceramic glaze layer 10 of the semi-crystalline aerogel layer 9 is provided with a second metal layer 11 by spraying, and the second metal layer 11 forms a metal coating layer covering the ceramic glaze layer 10 , the semi-crystalline aerogel layer 9 , and the electronic device 4 to encapsulate the electronic device 4 .

[0039] The specific production process is as follows:

[0040] A multi-layer core-shell structured magnetic silver nanowire is used as an additive, and the structure of the magnetic silver nanowire is Al3O4@Fe3O4@Ag.

[0041] Silver nanowires (diameter 120-150nm) are mixed with iron acetylacetonate to form a sol, which is dried at 275 degrees under nitrogen protection to form magnetic silver nanowires (Fe3O4 coated AgNWs), making the silver nanowires superparamagnetic. The thickness of the iron oxide coating layer is required to be 20nm-30nm thick;

[0042] Then, the magnetic nanowires are mixed with aluminum isopropoxide sol, and the temperature is raised to 300 degrees under nitrogen protection for drying to form ceramic-coated magnetic nanosilver wires, and the material is insulated. The ceramic coating can also be prepared into a coating structure of various ceramic materials such as SiO2, TiO2, and barium titanate. The ceramic coating thickness is required to be 40-50nm.

[0043] The ceramic-coated magnetic nano silver wire is mixed with aluminum salt, and a drying control agent and a gel network inducer are added at the same time, and the nano wire-aluminum source sol is formed by diluting with ethanol. The addition amount of the magnetic nano silver wire is 6%-10%, the addition amount of the gel network inducer is 1%-3%, and the addition amount of the drying control agent is 1%-3%.

[0044] The gel network inducer can be propylene oxide, acrylamide, etc.;

[0045] The drying control agent can be formamide, NN-dimethylformamide;

[0046] The aluminum salt may be aluminum isopropoxide, aluminum sec-butoxide, aluminum nitrate nonahydrate, aluminum chloride hexahydrate, etc.;

[0047] The sol is poured into a mold with electronic devices, and after vacuuming, it is placed in a soft magnetic field of 0.55-0.85T for 30 minutes to adjust the direction of the nanowires so that the nanowires are approximately perpendicular to the surface, and then the aerogel is generated by drying at room temperature and pressure. At this time, the crystal structure of the aerogel is a polycrystalline boehmite phase.

[0048] The next step is pretreatment, heating at 400-500 degrees in an inert protective gas (nitrogen) for 2 hours, with a heating rate of 5 degrees Celsius / min, so that the Al2O3 aerogel shrinks fully. The shrinkage rate is within 10%, and then it is cut and separated. The crystal structure of the aerogel is amorphous.

[0049] The next step is to spray aluminum fluoride glaze on the aerogel surface and silver paste on both ends, and use low-temperature co-firing to achieve partial crystallization of aluminum oxide and aluminum fluoride to ensure the stability of the case structure and aerogel structure. The co-firing temperature is 850-950 degrees, the co-firing time is 2 hours, the aerogel structure shrinkage is 5%, and the crystal is converted into a partial γ-Al2O3 structure.

[0050] Silver paste can also be directly sprayed on the entire device to form a metal coating layer to further enhance the electromagnetic shielding effect.

[0051] The above is a preferred embodiment of the utility model, which shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. The utility model may have various changes and improvements without departing from the spirit and scope of the utility model, and these changes and improvements fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A packaging mechanism for an electronic device, characterized in that: The invention comprises a mold (1) for placing an electronic device (4), a disordered nano silver-aluminum source sol (2), and a vacuum device for performing vacuum treatment in cooperation with the mold (1); the disordered nano silver-aluminum source sol (2) of the mold (1) is converted into an aerogel to cover and encapsulate the electronic device (4).

2. The packaging structure of electronic device according to claim 1, characterized in that: The mold (1) is provided with a cavity for placing an electronic device (4) and a disordered nano silver-aluminum source sol (2), and the mold (1) is provided with an air hole connected to the cavity. The air hole is connected to a vacuum device through a pipeline, and when the vacuum device is started, gas in the mold cavity of the mold (1) is extracted through the air hole.

3. The packaging structure of electronic device according to claim 1, characterized in that: The vacuum device comprises a vacuum pump or an air compressor matched with the mold (1).

4. The packaging structure of electronic device according to claim 1, characterized in that: The nanowire spatial arrangement of the disordered nanosilver-aluminum source sol (2) is adjusted by a magnetic field, so that the disordered nanosilver-aluminum source sol (2) forms a magnetically controlled ordered nanosilver wire-aluminum source sol (5).

5. The packaging structure of electronic device according to claim 1, characterized in that: It also includes a heating device for heating the mold (1); after the disordered nano silver-aluminum source sol (2) is converted into aerogel, the aerogel shrinks when the mold (1) is heated.

6. The packaging structure of electronic device according to claim 4, characterized in that: The electronic device (4) wrapped and encapsulated by the aerogel is separated from the mold (1), a first metal layer (8) is provided on the outer surface of the aerogel of the electronic device (4), and the first metal layer (8) and the aerogel are co-fired at a low temperature so that the aerogel portion forms a semi-crystalline aerogel layer (9).

7. The packaging structure of electronic device according to claim 4, characterized in that: A first metal layer (8) is provided on the outer surface of the aerogel of the electronic device (4) by spraying.

8. The packaging structure of electronic device according to claim 4, characterized in that: A ceramic glaze layer (10) is provided on the outer surface of the aerogel of the electronic device (4). The ceramic glaze layer (10) and the aerogel are co-fired at low temperature to form a semi-crystalline aerogel layer (9) on the aerogel portion.

9. The packaging structure of electronic device according to claim 8, characterized in that: The second metal layer (11) is provided at both ends of the ceramic glaze layer (10) of the semi-crystalline aerogel layer (9) by spraying.

10. The packaging structure of electronic device according to claim 8, characterized in that: The outer peripheral side of the ceramic glaze layer (10) of the semi-crystallized aerogel layer (9) is provided with a second metal layer (11) by spraying, and the second metal layer (11) forms a metal coating layer that covers the ceramic glaze layer (10), the semi-crystallized aerogel layer (9), and the electronic device (4) to encapsulate the electronic device (4).

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