Silicon wafer receiving box

Abstract

The utility model discloses a silicon wafer receiving box which comprises a supporting piece, a first limiting piece and a second limiting piece, an inclined face used for supporting silicon wafers is formed on the supporting piece, the silicon wafers are fed from the feeding end of the inclined face to the diagonal end, and the two sides of the diagonal end of the inclined face are a first side edge and a second side edge which are perpendicular to each other; the first limiting piece comprises at least two first barrier strips, the at least two first barrier strips are installed at the first side edge at intervals, the second limiting piece comprises at least two second barrier strips, the at least two second barrier strips are installed at the second side edge at intervals, and the first limiting piece and the second limiting piece are configured to block two adjacent side edges of a fed silicon wafer. The silicon wafer receiving box can correct the deviated silicon wafers falling onto the inclined plane, so that the silicon wafers falling onto the inclined plane can be automatically aligned, air between the adjacent silicon wafers can be timely exhausted, and the silicon wafers in the box can be stacked in order.

Description

Technical Field

[0001] The present application belongs to the field of silicon wafer production equipment manufacturing, and in particular, relates to a silicon wafer receiving box. Background Art

[0002] During the processing of battery cells, a material box is required to store silicon wafers or battery cells. Existing material boxes usually include a bottom plate and a side plate arranged on the bottom plate, and the bottom plate and the side plate enclose a chamber for storing silicon wafers. This structure of the material box has high requirements on the posture of the silicon wafer entering the material box when receiving the material. If the posture of the silicon wafer entering the material box is skewed, it will affect the normal stacking of the silicon wafers, causing the silicon wafers to be stacked unevenly or even cracked. Utility Model Content

[0003] The purpose of the present application is to provide a silicon wafer receiving box to solve the problem in the prior art that if the posture of the silicon wafers entering the box is skewed, the silicon wafers will be unevenly stacked.

[0004] To achieve this goal, this application adopts the following technical solutions:

[0005] The present application provides a silicon wafer receiving box, which includes a support member, a first limiting member and a second limiting member, wherein:

[0006] The support member is formed with an inclined surface for supporting the silicon wafer, the inclined surface is inclined downward along the feeding direction of the silicon wafer, the silicon wafer is fed from the feeding end of the inclined surface to the diagonal end, and the two sides of the diagonal end of the inclined surface are a first side edge and a second side edge that are perpendicular to each other;

[0007] The first limiting member includes at least two first baffles, which are installed at intervals on the first side edge; the second limiting member includes at least two second baffles, which are installed at intervals on the second side edge; the first limiting member and the second limiting member are configured to block two adjacent sides of the incoming silicon wafer to limit the incoming silicon wafer in the accommodating space formed by the first limiting member, the second limiting member and the inclined surface.

[0008] By arranging an inclined surface on the support member and arranging a first limit member and a second limit member on the inclined surface, the offset silicon wafers falling onto the inclined surface can be corrected, thereby realizing automatic alignment of the silicon wafers falling onto the inclined surface, thereby ensuring that the silicon wafers in the material box are stacked neatly; at the same time, at least two first baffles and at least two second baffles are arranged at intervals to form gaps for exhaust, so that the air between adjacent silicon wafers can be discharged in time when the silicon wafers are stacked, thereby further ensuring that the silicon wafers in the material box are stacked neatly.

[0009] Optionally, the first side extends along the first direction, the second side extends along the second direction, the installation position of the first limit member in the second direction is adjustable, and the installation position of the second limit member in the first direction is adjustable to adjust the size and position of the accommodating space.

[0010] By adjusting the installation position of the first limiter in the second direction and adjusting the installation position of the second limiter in the first direction, the size and position of the accommodating space can be adjusted to accommodate silicon wafers of different sizes, thereby improving the compatibility of the material receiving box.

[0011] Optionally, the silicon wafer receiving box also includes a base and a connecting piece, the first end of the connecting piece is mounted on the base, the second end of the connecting piece forms a mounting slope, the supporting piece is fixedly mounted on the mounting slope, the mounting slope supports the supporting piece, so that the upper surface of the supporting piece is inclined to be an inclined surface.

[0012] Through the cooperation of the base, the connecting piece and the supporting piece, an inclined surface for supporting the silicon wafer is formed on the upper surface of the supporting piece. At the same time, by replacing the connecting piece with the mounting inclined surface of different inclinations, the angle of the inclined surface can be adjusted.

[0013] Optionally, the installation position of the connecting member on the base is adjustable along a third direction to accommodate the collection of silicon wafers of different sizes, and the third direction is the direction in which the central axes of the first side and the second side are located.

[0014] By adjusting the installation position of the connecting piece on the base along the third direction, the position of the supporting piece relative to the base can be adjusted; this makes it suitable for storing silicon wafers of different sizes, improves the compatibility of the material receiving box, and makes adjustment convenient and quick.

[0015] Optionally, the base is provided with a plurality of picking parts for facilitating the material box transporting mechanism to obtain the material box.

[0016] Through the cooperation between the picking part and the material box conveying mechanism, it is convenient for the material box conveying mechanism to obtain and convey the material box, thereby realizing the automatic circulation of the material box.

[0017] Optionally, a plurality of positioning members are provided on the base, and the positioning members cooperate with external guide members to realize the positioning of the placement position of the silicon wafer receiving box.

[0018] Through the cooperation of the positioning member and the guide member, the base can be positioned at the placement position of the material box, thereby achieving the positioning of the material box.

[0019] Optionally, an electronic label or graphic code for identifying the silicon wafer receiving box is provided on the base.

[0020] By setting electronic tags and graphic codes on the base, identification of different material boxes is achieved.

[0021] Optionally, a first pad is detachably mounted on the inclined surface.

[0022] By arranging the first pad on the inclined surface, direct contact between the bottom silicon wafer and the support is avoided, thereby protecting the silicon wafer. Moreover, during the use of the material box, only the first pad needs to be replaced regularly, which helps to reduce the use cost of the material box.

[0023] Optionally, a second pad is detachably mounted on the limiting surface of the first baffle and the second baffle facing the accommodating space.

[0024] By arranging the second pad on the limiting surface of the first baffle and the second baffle, direct contact between the silicon wafer and the first baffle and the second baffle is avoided, thereby protecting the silicon wafer. Moreover, during the use of the material box, only the second pad needs to be replaced regularly, which helps to reduce the use cost of the material box.

[0025] Optionally, the second pad is made of flexible material, the first end of the second pad is attached to the lower end of the limiting surface of the first baffle or the second baffle, and the second pad extends upward from the first end and extends downward after bypassing the top of the first baffle or the second baffle.

[0026] By setting the second pad, the second pad completely covers the inner side and top of the first and second baffles facing the accommodating space to prevent the silicon wafer from directly contacting and colliding with the first and second baffles when falling into the material box, thereby damaging the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the three-dimensional structure of the silicon wafer receiving box provided in the first embodiment of the present application;

[0028] Figure 2 This is a three-dimensional structural diagram of the silicon wafer receiving box provided in the first embodiment of the present application in the receiving state.

[0029] Figure 3 This is another three-dimensional structural schematic diagram of the silicon wafer receiving box in the receiving state provided in the first embodiment of the present application.

[0030] Figure 4 It is another three-dimensional structural schematic diagram of the silicon wafer receiving box provided in the first embodiment of the present application;

[0031] Figure 5 It is a schematic diagram of the three-dimensional structure of the connecting piece of the silicon wafer receiving box provided in the first embodiment of the present application;

[0032] Figure 6 This is a schematic diagram of the state of the material box conveying mechanism of the silicon wafer receiving material box provided in the first embodiment of the present application obtaining the material box;

[0033] Figure 7It is a schematic diagram of the three-dimensional structure of the silicon wafer receiving box provided in Example 2 of the present application.

[0034] Figures 1 to 7 The following reference numerals are included:

[0035] Support member 10, second mounting hole 100, third mounting hole 101, inclined surface 11, first side edge 12, second side edge 13, first pad 14, second pad 15;

[0036] A first limiting member 20 and a first stop bar 200;

[0037] A second limiting member 30 and a second stop bar 300;

[0038] Silicon wafer 40;

[0039] Base 50, first mounting hole 500, positioning member 501, mounting groove 502;

[0040] Connecting piece 60, mounting bevel 600, threaded hole 601;

[0041] Clamping portion 70, mounting block 700, clamping column 701;

[0042] The material box conveying mechanism 80 , the hook 800 , the connecting plate 801 , the side plate 802 , the cylinder 803 , and the pressing plate 804 . DETAILED DESCRIPTION

[0043] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0044] At present, during the processing of battery cells, a material box is required to store silicon wafers or battery cells. Existing material boxes usually include a bottom plate and a side plate arranged on the bottom plate, and the bottom plate and the side plate enclose a chamber for storing silicon wafers. When receiving materials, the material box of this structure has high requirements on the posture of silicon wafers entering the material box. If the posture of the silicon wafers entering the material box is skewed, it will affect the normal stacking of the silicon wafers, causing the silicon wafers to be stacked unevenly or even cracked.

[0045] Embodiment 1

[0046] Therefore, this application proposes a silicon wafer receiving box, please refer to Figure 1 and Figure 2 As shown, the silicon wafer receiving box proposed in the embodiment of the present application includes a support member 10, a first stopper 20 and a second stopper 30, wherein:

[0047] The support member 10 is formed with an inclined surface 11 for supporting the silicon wafer 40. The inclined surface 11 is inclined downward along the feeding direction of the silicon wafer 40. The silicon wafer 40 is fed from the feeding end of the inclined surface 11 to the diagonal end. The two sides of the diagonal end of the inclined surface 11 are a first side edge 12 and a second side edge 13 that are perpendicular to each other.

[0048] The first limiting member 20 includes at least two first stop bars 200, which are installed at intervals on the first side 12. The second limiting member 30 includes at least two second stop bars 300, which are installed at intervals on the second side 13. The first limiting member 20 and the second limiting member 30 are configured to block two adjacent sides of the incoming silicon wafer 40 to limit the incoming silicon wafer 40 in the accommodating space formed by the first limiting member 20, the second limiting member 30 and the inclined surface 11.

[0049] It should be noted that Figure 2 The silicon wafer 40 shown in FIG. 1 is a schematic diagram of a state where multiple silicon wafers are stacked together.

[0050] Specifically, when the silicon wafer 40 is fed from the feeding end of the inclined surface 11 toward the diagonal end, it moves toward the first limit member 20 and the second limit member 30 by its own weight and finally abuts against the limit surfaces of the first limit member 20 and the second limit member 30 to achieve automatic alignment of the silicon wafer 40.

[0051] By providing an inclined surface 11 on the support member 10, and providing a first limit member 20 and a second limit member 30 on the inclined surface 11, the offset silicon wafers falling onto the inclined surface 11 can be corrected, thereby realizing automatic alignment of the silicon wafers falling onto the inclined surface 11, thereby ensuring that the silicon wafers in the material box are stacked neatly; at the same time, at least two first baffles 200 and at least two second baffles 300 are spaced apart to form gaps for exhaust, so that the air between adjacent silicon wafers can be discharged in time when stacking the silicon wafers, further ensuring that the silicon wafers in the material box are stacked neatly.

[0052] See also Figures 3 to 5 As shown, as an embodiment, the silicon wafer receiving box also includes a base 50 and a connecting member 60, the first end of the connecting member 60 is installed on the base 50, the second end of the connecting member 60 is formed with a mounting slope 600, the support member 10 is fixedly installed on the mounting slope 600, and the mounting slope 600 supports the support member 10 so that the upper surface of the support member 10 is inclined to the inclined surface 11.

[0053] Specifically, the base 50 is provided with at least one group of first mounting holes 500, and the first end of the connecting member 60 is provided with a group of threaded holes 601. The fixing screws pass through the corresponding first mounting holes 500 and are locked in the threaded holes 601 to detachably fix the connecting member 60 on the base 50.

[0054] Through the cooperation of the base 50, the connecting member 60 and the supporting member 10, an inclined surface 11 for supporting the silicon wafer 40 is formed on the upper surface of the supporting member 10. At the same time, by replacing the connecting member 60 with a mounting inclined surface 600 with different inclinations, the angle of the inclined surface 11 can be adjusted.

[0055] As an embodiment, the connecting member 60 is arranged along the third direction ( Figure 4 The installation position of the base 50 (in the Z direction) is adjustable to accommodate the collection of silicon wafers of different sizes. The base 50 is a plate-shaped structure and is arranged horizontally. The third direction is the direction in which the projection line of the bisector of the first side 12 and the second side 13 on the base 50 is located.

[0056] Specifically, the base 50 is provided with multiple groups of first mounting holes 500 along the third direction, and each group of first mounting holes 500 includes at least two first mounting holes 500. The installation position of the connecting member 60 along the third direction on the base 50 is adjusted by installing the first end of the connecting member 60 in different groups of first mounting holes 500.

[0057] By adjusting the installation position of the connecting member 60 on the base 50 along the third direction, the position of the supporting member 10 relative to the base 50 can be adjusted; this is suitable for storing silicon wafers of different sizes, improving the compatibility of the material receiving box; and the adjustment is convenient and quick.

[0058] See also Figure 1 and Figure 6 As shown, as an embodiment, the base 50 is provided with a plurality of picking portions 70 for facilitating the material box transporting mechanism 80 to obtain the material box.

[0059] Specifically, four picking parts 70 are provided on the base 50 and are located on the periphery of the support member 10. Each picking part 70 includes a mounting block 700 and a clamping column 701. The first end of the mounting block 700 is fixed on the base 50, and the clamping column 701 is fixed on the second end of the mounting block 700 and extends outward relative to the support member 10.

[0060] Specifically, the material box transport mechanism 80 includes a mounting body, which is a U-shaped frame formed by connecting a connecting plate 801 and two side plates 802, with the U-shaped opening facing downward, and two hooks 800 are respectively provided at the lower ends of the two side plates 802, that is, there are four hooks 800 in total. When transporting the material box, each hook 800 corresponds to a clamping column 701, and the corresponding clamping column 701 is hooked by the four hooks 800 of the material box transport mechanism 80 to obtain the material box. A cylinder 803 is installed on the lower plate surface of the connecting plate 801, and a pressing plate 804 is vertically fixed at the end of the piston rod of the cylinder 803. The cylinder 803 is tilted, and the pressing plate 804 is also tilted. The inclined plate surface of the pressing plate 804 is parallel to the inclined surface 11 on the support 10. After the material box is filled with silicon wafers 40, the cylinder 803 can be used to drive the pressing plate 804 to move to press the silicon wafers 40, so that the silicon wafers 40 will not shake during the movement of the material box. The material box transport mechanism 80 can be moved by means of a robot arm, or a linear module, etc. to transfer the material box.

[0061] Through the cooperation between the picking portion 70 and the material box conveying mechanism 80 , it is convenient for the material box conveying mechanism 80 to pick up and convey the material box, thereby realizing the automatic circulation of the material box.

[0062] As an implementation manner, a plurality of positioning members 501 are disposed on the base 50 , and the positioning members 501 cooperate with external guide members to realize the positioning of the placement position of the silicon wafer receiving box.

[0063] Specifically, the positioning member 501 includes at least two positioning sleeves installed on the base 50 at intervals, and positioning columns are correspondingly arranged at the placement positions of the silicon wafer receiving box.

[0064] Through the cooperation of the positioning sleeve and the positioning column, the base 50 can be positioned at the placement position of the material box, thereby achieving the positioning of the material box.

[0065] Please refer again Figure 4 As shown, as an implementation mode, an electronic tag or a graphic code for identifying the silicon wafer receiving box is provided on the base 50, and the graphic code may be a two-dimensional code or a bar code, etc.

[0066] Specifically, a mounting groove 502 is provided on the bottom surface of the base 50 , and the electronic tag or graphic code is disposed in the mounting groove 502 .

[0067] By providing an electronic tag and a graphic code on the base 50, identification of different material boxes is achieved.

[0068] Please refer again Figure 1 As shown, as an implementation mode, a first pad 14 is detachably mounted on the inclined surface 11 .

[0069] Specifically, the first pad 14 is made of epoxy resin.

[0070] By arranging the first pad 14 on the inclined surface 11, direct contact between the silicon wafer 40 at the bottom layer in the material box and the support 10 is avoided, thereby protecting the silicon wafer 40. Moreover, during the use of the material box, it is only necessary to replace the first pad 14 regularly, which is beneficial to reducing the use cost of the material box.

[0071] As an implementation manner, a second pad 15 is detachably mounted on the limiting surfaces of the first stop bar 200 and the second stop bar 300 facing the accommodating space.

[0072] By arranging the second pad 15 on the limiting surfaces of the first baffle 200 and the second baffle 300, direct contact between the silicon wafer 40 and the first baffle 200 and the second baffle 300 is avoided, thereby protecting the silicon wafer 40. Moreover, during the use of the material box, it is only necessary to replace the second pad 15 regularly, which is beneficial to reducing the use cost of the material box.

[0073] As an embodiment, the second pad 15 is made of flexible material, and the first end of the second pad 15 is attached to the lower end of the limiting surface of the first baffle 200 or the second baffle 300. The second pad 15 extends upward from the first end and bypasses the top of the first baffle 200 or the second baffle 300 and then extends downward.

[0074] Specifically, the second pad 15 is made of Teflon.

[0075] By setting the second pad 15, the second pad 15 completely covers the inner side and the top of the first baffle 200 and the second baffle 300 facing the accommodating space, so as to prevent the silicon wafer 40 from directly contacting and colliding with the first baffle 200 and the second baffle 300 when falling into the material box, thereby damaging the silicon wafer.

[0076] The silicon wafer receiving box proposed in this embodiment has the following advantages compared with the prior art:

[0077] 1) It can correct the offset silicon wafers and realize automatic alignment of silicon wafers that fall on the inclined surface, thereby ensuring that the silicon wafers in the material box are neatly stacked.

[0078] 2) When collecting materials, the air between adjacent silicon wafers can be discharged in time, further ensuring that the silicon wafers in the material box are stacked neatly.

[0079] 3) Good compatibility, able to adapt to the collection of silicon wafers of different sizes.

[0080] 4) A clamping portion is provided to facilitate the material box handling mechanism to pick up the material box.

[0081] 5) It can provide good protection for silicon wafers and prevent them from being damaged when they fall into the material box.

[0082] Embodiment 2

[0083] See also Figure 6 As shown, the main difference between this embodiment and the first embodiment is that the first side edge 12 is along the first direction ( Figure 6 The second side edge 13 extends along the second direction ( Figure 6 The first limit member 20 extends in the Y direction in the second direction, and the second limit member 30 extends in the Y direction in the first direction, so as to adjust the size and position of the accommodating space.

[0084] Specifically, a plurality of second mounting holes 100 extending along the second direction are opened at the first side 12 of the support member 10, and a plurality of third mounting holes 101 extending along the first direction are opened at the second side 13 of the support member 10. Other structures are the same as those in the first embodiment and will not be described again here.

[0085] By installing the first limit member 20 in different groups of second mounting holes 100 to adjust the installation position of the first limit member 20 in the second direction; by installing the second limit member 30 in different groups of third mounting holes 101 to adjust the installation position of the second limit member 30 in the first direction, the size and position of the accommodating space can be adjusted to suit the storage of silicon wafers of different sizes, thereby improving the compatibility of the material receiving box.

[0086] The above embodiments are only to illustrate the basic principles and characteristics of the present application. The present application is not limited by the above examples. Without departing from the spirit and scope of the present application, the present application may be subject to various changes and modifications, which are within the scope of the present application to be protected. The scope of protection claimed in the present application is defined by the attached claims and their equivalents.

Claims

1. A silicon wafer receiving box, characterized in that: The silicon wafer receiving box comprises a support member, a first limit member and a second limit member, wherein: The support member is formed with an inclined surface for supporting the silicon wafer, the inclined surface is inclined downward along the feeding direction of the silicon wafer, the silicon wafer is fed from the feeding end of the inclined surface toward the diagonal end, and the two sides of the diagonal end of the inclined surface are a first side edge and a second side edge that are perpendicular to each other; The first limiting member includes at least two first baffles, which are installed at intervals at the first side edge; the second limiting member includes at least two second baffles, which are installed at intervals at the second side edge; the first limiting member and the second limiting member are configured to block two adjacent side edges of the incoming silicon wafer so as to limit the incoming silicon wafer in a containing space formed by the first limiting member, the second limiting member and the inclined surface.

2. The silicon wafer receiving box according to claim 1, characterized in that: The first side extends along a first direction, the second side extends along a second direction, the installation position of the first limiter in the second direction is adjustable, and the installation position of the second limiter in the first direction is adjustable to adjust the size and position of the accommodating space.

3. The silicon wafer receiving box according to claim 1, characterized in that: The silicon wafer receiving box also includes a base and a connecting piece, wherein the first end of the connecting piece is mounted on the base, the second end of the connecting piece forms a mounting slope, the supporting piece is fixedly mounted on the mounting slope, and the mounting slope supports the supporting piece so that the upper surface of the supporting piece is inclined to the inclined surface.

4. The silicon wafer receiving box according to claim 3, characterized in that: The installation position of the connecting member on the base is adjustable along a third direction to accommodate the collection of silicon wafers of different sizes. The third direction is the direction of the projection line of the bisector of the first side and the second side on the base.

5. The silicon wafer receiving box according to claim 3, characterized in that: The base is provided with a plurality of picking parts for facilitating the material box conveying mechanism to obtain the material box.

6. The silicon wafer receiving box according to claim 3, characterized in that: A plurality of positioning members are arranged on the base, and the positioning members cooperate with external guide members to realize the positioning of the placement position of the silicon wafer receiving box.

7. The silicon wafer receiving box according to claim 3, characterized in that: The base is provided with an electronic label or a graphic code for identifying the silicon wafer receiving box.

8. The silicon wafer receiving box according to claim 1, characterized in that: A first pad is detachably mounted on the inclined surface.

9. The silicon wafer receiving box according to claim 1, characterized in that: A second pad is detachably mounted on the limiting surfaces of the first baffle and the second baffle facing the accommodating space.

10. The silicon wafer receiving box according to claim 9, characterized in that: The second pad is made of flexible material, the first end of the second pad is attached to the lower end of the limiting surface of the first baffle or the second baffle, and the second pad extends upward from the first end and goes around the top of the first baffle or the second baffle before extending downward.

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