Wide support LED die bonding device

Abstract

The utility model relates to the technical field of LED die bonding, and discloses a wide support LED die bonding device which comprises a die bonding machine body, the outer surface of the die bonding machine body is fixedly connected with an outer supporting table, the outer surface of the die bonding machine body is provided with a guide rail, and the inside of the guide rail is slidably connected with a guide sliding base plate. The utility model has the following advantages and effects: the guide rail is started to enable the guide sliding base plate to drive the die bonding table at the top to move until the die bonding table moves to a position corresponding to the outer supporting table, at the moment, LEDs without die bonding operation are stored on the upper surface of the group bracket, and the first telescopic rod pushes the double-head suction cup to adsorb the LEDs at the top to suspend the LEDs; at the moment, a hydraulic cylinder is started to drive a hydraulic push rod to stretch out and draw back to push a material pushing piece to move, materials are pushed along the center part of the LED through the bevel-shaped material pushing piece, the materials can be quickly pushed to the upper surface of the die bonding table at the moment, then the die bonding table is moved to the original position through a guide sliding base plate, and die bonding operation can be started; therefore, continuous die bonding operation can be carried out on batch wide-support LEDs.

Description

Technical Field

[0001] The utility model relates to the technical field of LED solid crystal, in particular to a wide bracket LED solid crystal device. Background Art

[0002] LED die bonder is a device that fixes LED wafers on the LED unit of LED bracket. The die bonding process is that the glue arm first fixes the glue on the LED unit of LED bracket, then the die bonding arm takes the LED wafer out of the crystal ring, and then fixes the LED wafer to the glued LED unit. With the continuous development of LED technology, extra-large and extra-wide brackets are becoming more and more widely used.

[0003] In the prior art, according to Chinese patent publication number CN208256722U, a LED crystal bonding device is provided, which includes a large platen, a fixture moving platform, a pin assembly, a crystal ring moving platform, a first lens assembly, and a second lens assembly. The pin assembly is arranged on one side of the fixture moving platform, and the crystal ring moving platform is arranged on the other side. The first lens assembly is arranged above the fixture moving platform and installed on one side of the pin assembly. The second lens assembly is arranged on one side of the crystal ring moving platform. Compared with the traditional crystal bonding method, the LED crystal bonding device of the utility model omits multiple intermediate links such as the suction and transportation of LED chips, thereby increasing the crystal bonding speed and greatly improving the work efficiency. The LED crystal bonding device of the utility model has a compact structure, saves production space for enterprises, and can effectively improve the benefits of enterprises.

[0004] The above patent saves production space for enterprises and can effectively improve the efficiency of enterprises. However, its die-bonding device omits multiple intermediate links such as the suction and transportation of LED chips, which may be inconvenient for die-bonding operations on batches of wide-bracket LEDs, thereby reducing the production efficiency of wide-bracket LEDs. Therefore, improvements need to be made to the current problems. Utility Model Content

[0005] The utility model aims to provide a wide bracket LED die-bonding device, which is convenient for continuous material taking operation on batches of wide bracket LEDs and improves the efficiency of die-bonding operation.

[0006] The above technical purpose of the utility model is achieved through the following technical solutions: a wide-bracket LED crystal bonding device, comprising a crystal bonding body, the outer surface of the crystal bonding body is fixedly connected to an outer support platform, the outer surface of the crystal bonding body is provided with a guide rail, the inner part of the guide rail is slidably connected to a guide sliding pad, the top of the guide sliding pad is provided with a crystal bonding platform, the inner part of the outer support platform is provided with a group of brackets, the outer surface of the outer support platform is fixedly connected to a hydraulic cylinder, one end of the hydraulic cylinder is provided with a hydraulic push rod, one end of the hydraulic push rod is fixedly connected to a push piece, the top of the group of brackets is provided with a double-headed suction cup, and the top of the double-headed suction cup is fixedly connected to a first telescopic rod.

[0007] By adopting the above technical scheme, the crystal bonding table is supported at the top by the guide slide pad during use. When the LED chip on the upper surface of the crystal bonding table is bonded and output, since the crystal bonding operation needs to be continued, the guide rail is started to make the guide slide pad drive the top crystal bonding table to move until it moves to the corresponding position of the outer support table. At this time, the LEDs that have not been subjected to the crystal bonding operation are stored on the upper surface of the grouped bracket, and the double-headed suction cup is pushed by the first telescopic rod to adsorb the top LED so that it is suspended in the air. At this time, the hydraulic cylinder is started to drive the hydraulic push rod to telescope and push the push piece to move. The material is pushed along the center part of the LED by the angled push piece. At this time, it can be quickly pushed to the upper surface of the crystal bonding table, and then the crystal bonding table is moved to its original position by the guide slide pad to start the crystal bonding operation. In this way, the batch of wide bracket LEDs can be continuously bonded, thereby improving the efficiency of the crystal bonding operation.

[0008] The utility model is further configured as follows: a guide plate is fixedly connected to one side surface of the crystal bonding table, and a positioning block is fixedly connected to the outer surface of the guide rail.

[0009] By adopting the above technical solution, the guide plate plays a transfer role to prevent the LED chip from falling, and the positioning block can position the end stop position of the guide slide pad so that it always corresponds to the discharge position of the outer support platform.

[0010] The utility model is further configured as follows: a bottom support seat is fixedly connected to the top of the guide slide plate, and a slide plate is slidably connected to the inside of the bottom support seat.

[0011] By adopting the above technical solution, the slide plate is located at the bottom of the crystal bonding table, which can provide lateral movement for the crystal bonding table, thereby facilitating rapid material receiving and discharging.

[0012] The utility model is further configured as follows: a second telescopic rod is provided on the outer surface of the crystal bonding body, and one end of the second telescopic rod is fixedly connected to a push plate.

[0013] By adopting the above technical solution, the push plate is located on one side of the crystal fixing table. The push plate can be pushed from the stop position by extending the second telescopic rod to push the crystal fixing table to drive the slide plate at the bottom to slide toward the outer support platform, thereby shortening the material connection distance with the grouped bracket and increasing the safety of the material connection process.

[0014] The utility model is further configured as follows: an outer protective groove is fixedly connected inside the outer support platform, and an inner groove is opened inside the crystal fixing body.

[0015] By adopting the above technical solution, the outer protective groove can provide batch storage space for the grouped brackets, and the inner groove can provide outward movement space for the grouped brackets, which is convenient for continuous discharge.

[0016] The utility model is further configured as follows: a connecting seat is fixedly connected to the bottom of the outer protective groove, a telescopic push rod is fixedly connected to the bottom of the connecting seat, and a cylinder is arranged at one end of the telescopic push rod.

[0017] By adopting the above technical solution, since the height of the group bracket will be lowered after the top LED is fed, the telescopic push rod can be driven by starting the cylinder to push the connecting seat up, thereby pushing the group bracket upward, so that the subsequent top LED is moved to the original position, which is convenient for material removal.

[0018] The beneficial effects of the utility model are:

[0019] 1. The utility model, through the coordinated arrangement among the crystal bonding machine body, the outer support platform, the guide rail, the guide sliding pad, the crystal bonding platform, the group bracket, the hydraulic cylinder, the hydraulic push rod, the push piece, the double-headed suction cup and the first telescopic rod, can enable the device to support the crystal bonding platform at the top through the guide sliding pad when in use. When the LED chip on the upper surface of the crystal bonding platform is bonded and output, the crystal bonding operation needs to be continued. Therefore, the guide rail is started to make the guide sliding pad drive the top crystal bonding platform to move until it moves to the corresponding position of the outer support platform. The LEDs that have not been subjected to the crystal bonding operation are stored on the upper surface of the grouped brackets. The double-headed suction cup is pushed by the first telescopic rod to adsorb the top LED and make it suspended. At this time, the hydraulic cylinder is started to drive the hydraulic push rod to extend and retract to push the push piece to move. The material is pushed along the center part of the LED by the angled push piece. At this time, it can be quickly pushed to the upper surface of the crystal bonding table, and then the crystal bonding table is moved to its original position by the guide slide pad to start the crystal bonding operation. In this way, continuous crystal bonding operations can be performed on batches of wide bracket LEDs, thereby improving the efficiency of crystal bonding operations.

[0020] 2. The utility model, through the coordinated arrangement among the slide plate, the second telescopic rod, the push plate, the connecting seat, the telescopic push rod and the cylinder, can make the push plate be located on one side of the crystal fixing table when the device is in use. The push plate can be pushed from the stop position by the extension of the second telescopic rod to push the crystal fixing table to drive the slide plate at the bottom to slide and approach the outer support platform, thereby shortening the material connection distance with the group bracket and increasing the safety of the material connection process. Since the height of the group bracket will be reduced after the top LED is fed, the telescopic push rod can be driven by starting the cylinder to push the connecting seat up, thereby pushing the group bracket to move upward, so that the subsequent top LED moves to the original position, which is convenient for material removal. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 It is a schematic diagram of the structure of the utility model;

[0023] Figure 2 This is a schematic diagram of the structure of the crystal bonding machine of the utility model;

[0024] Figure 3 For this utility model Figure 2 The enlarged structural diagram at A in the middle;

[0025] Figure 4 For this utility model Figure 2 Enlarged structural diagram at B in the middle.

[0026] In the figure, 1, crystal fixing body; 2, outer support platform; 3, guide rail; 4, guide slide pad; 5, crystal fixing platform; 6, group bracket; 7, hydraulic cylinder; 8, hydraulic push rod; 9, push piece; 10, double-head suction cup; 11, first telescopic rod; 12, guide plate; 13, positioning block; 14, bottom support seat; 15, slide plate; 16, second telescopic rod; 17, push plate; 18, outer protective groove; 19, inner groove; 20, connecting seat; 21, telescopic push rod; 22, cylinder. DETAILED DESCRIPTION

[0027] The technical solution of the utility model will be described clearly and completely below in conjunction with specific embodiments. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] reference Figure 1-4A wide bracket LED crystal bonding device comprises a crystal bonding body 1, the outer surface of the crystal bonding body 1 is fixedly connected to an outer support platform 2, the outer surface of the crystal bonding body 1 is provided with a guide rail 3, the inner part of the guide rail 3 is slidably connected to a guide sliding pad 4, a crystal bonding platform 5 is provided on the top of the guide sliding pad 4, a group bracket 6 is provided inside the outer support platform 2, a hydraulic cylinder 7 is fixedly connected to the outer surface of the outer support platform 2, a hydraulic push rod 8 is provided at one end of the hydraulic cylinder 7, a push piece 9 is fixedly connected to one end of the hydraulic push rod 8, a double-headed suction cup 10 is provided on the top of the double-headed suction cup 10, and a first telescopic rod 11 is fixedly connected to the top. When in use, the crystal bonding platform 5 is supported on the top by the guide sliding pad 4. After the LED chip on the upper surface of the crystal bonding platform 5 is bonded and output, due to the need for continuous The crystal bonding operation is performed, so the guide rail 3 is started to make the guide slide pad 4 drive the top crystal bonding table 5 to move until it moves to the corresponding position of the outer support table 2. At this time, the LEDs that have not been subjected to the crystal bonding operation are stored on the upper surface of the grouped bracket 6, and the double-headed suction cup 10 is pushed by the first telescopic rod 11 to adsorb the top LED to make it suspended. At this time, the hydraulic cylinder 7 is started to drive the hydraulic push rod 8 to telescope and push the push piece 9 to move, and the material is pushed along the center part of the LED through the angled push piece 9. At this time, it can be quickly pushed to the upper surface of the crystal bonding table 5, and then the crystal bonding table 5 is moved to the original position through the guide slide pad 4 to start the crystal bonding operation. In this way, the crystal bonding operation can be continuously performed on a batch of wide bracket LEDs, thereby improving the efficiency of the crystal bonding operation. A guide plate is fixedly connected to one side of the crystal bonding table 5 12, a positioning block 13 is fixedly connected to the outer surface of the guide rail 3, and the guide plate 12 plays a transfer bearing role to prevent the LED chip from falling. The positioning block 13 can position the end stop position of the guide slide pad 4 so that it always corresponds to the discharge position of the outer support platform 2. The top of the guide slide pad 4 is fixedly connected to a bottom support seat 14, and the inner sliding connection of the bottom support seat 14 is connected to a slide plate 15. The slide plate 15 is located at the bottom of the crystal solidifying platform 5, which can provide lateral movement for the crystal solidifying platform 5, which is convenient for rapid material connection and discharge. A second telescopic rod 16 is provided on the outer surface of the crystal solidifying body 1, and one end of the second telescopic rod 16 is fixedly connected to a push plate 17. The push plate 17 is located on one side of the crystal solidifying platform 5. The push plate 17 can be pushed from the stop position to push the crystal solidifying platform 5 to drive the bottom by the extension of the second telescopic rod 16. The slide plate 15 slides and approaches the outer support platform 2, shortening the material connection distance with the group bracket 6 and increasing the safety of the material connection process. The outer support platform 2 is fixedly connected to the inside with an outer protective groove 18, and the solid crystal body 1 is provided with an inner groove 19. The outer protective groove 18 is convenient for providing a batch storage space for the group bracket 6, and the inner groove 19 can provide an outward movement space for the group bracket to facilitate continuous discharge. The bottom of the outer protective groove 18 is fixedly connected to a connecting seat 20, and the bottom of the connecting seat 20 is fixedly connected to a telescopic push rod 21. A cylinder 22 is provided at one end of the telescopic push rod 21. Since the height of the group bracket 6 will be reduced after the top LED is fed, the telescopic push rod 21 can be driven by starting the cylinder 22 to push the connecting seat 20 up, thereby pushing the group bracket 6 to move upward.Move the subsequent top LED to its original position to facilitate material removal.

[0029] The first telescopic rod 11 is used to push the double-headed suction cup 10 to absorb the top LED and push the push piece 9 to move the LED chip to the top of the LED. The upper surface of the crystal fixing table 5 can be moved to the original position by the guide slide pad 4 to start the crystal fixing operation. In this way, the batch of wide bracket LEDs can be continuously fixed with crystals, thereby improving the efficiency of the crystal fixing operation. Through the coordinated arrangement of the slide plate 15, the second telescopic rod 16, the push plate 17, the connecting seat 20, the telescopic push rod 21 and the cylinder 22, the push plate 17 can be located on one side of the crystal fixing table 5 when the device is in use. The push plate 17 can be pushed from the stop position by the extension of the second telescopic rod 16 to push the crystal fixing table 5 to drive the bottom slide plate 15 to slide and approach the outer support platform 2, thereby shortening the material connection distance with the group bracket 6 and increasing the safety of the material connection process. Since the height of the group bracket 6 will be reduced after the top LED is fed, the telescopic push rod 21 can be driven by starting the cylinder 22 to push the connecting seat 20 up, thereby pushing the group bracket 6 to move upward, so that the subsequent top LED moves to the original position, which is convenient for material removal.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wide bracket LED die bonding device, comprising a die bonding body (1), characterized in that: The outer surface of the crystal fixing body (1) is fixedly connected to an outer support platform (2), the outer surface of the crystal fixing body (1) is provided with a guide rail (3), the interior of the guide rail (3) is slidably connected to a guide slide pad (4), the top of the guide slide pad (4) is provided with a crystal fixing platform (5), the interior of the outer support platform (2) is provided with a group support (6), the outer surface of the outer support platform (2) is fixedly connected to a hydraulic cylinder (7), one end of the hydraulic cylinder (7) is provided with a hydraulic push rod (8), one end of the hydraulic push rod (8) is fixedly connected to a push piece (9), the top of the group support (6) is provided with a double-headed suction cup (10), and the top of the double-headed suction cup (10) is fixedly connected to a first telescopic rod (11).

2. A wide bracket LED die bonding device according to claim 1, characterized in that: A guide plate (12) is fixedly connected to one side of the crystal fixing table (5), and a positioning block (13) is fixedly connected to the outer surface of the guide rail (3).

3. The wide bracket LED die bonding device according to claim 1, characterized in that: The top of the guide slide pad (4) is fixedly connected to a bottom support seat (14), and the interior of the bottom support seat (14) is slidably connected to a slide plate (15).

4. The wide bracket LED die bonding device according to claim 1, characterized in that: A second telescopic rod (16) is provided on the outer surface of the crystal bonding body (1), and one end of the second telescopic rod (16) is fixedly connected to a push plate (17).

5. The wide bracket LED die bonding device according to claim 1, characterized in that: An outer protective groove (18) is fixedly connected to the interior of the outer support platform (2), and an inner groove (19) is provided inside the crystal fixing body (1).

6. The wide bracket LED die bonding device according to claim 5, characterized in that: The bottom of the outer protective groove (18) is fixedly connected to a connecting seat (20), the bottom of the connecting seat (20) is fixedly connected to a telescopic push rod (21), and one end of the telescopic push rod (21) is provided with a cylinder (22).

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