Chip welding device
By using a heating component and a vacuum outer cover that directly heat the chip around the chip welding device, the problem in the prior art that the chip is in a high-temperature environment for too long is solved, and efficient heat utilization and energy consumption savings are achieved.
Patent Information
- Application Number
- CN202423098118.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-16
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-12-16
AI Technical Summary
In the existing chip soldering technology, the chip is in a high-temperature environment for too long, resulting in waste of energy and damage to chip performance.
A chip welding device is designed, which uses a heating component to directly heat the area around the chip, melts the solder paste to complete the welding, and forms a stable environment through the vacuum cover and connecting tube to reduce unnecessary energy loss.
It effectively reduces the time the chip is in a high-temperature environment, improves heat utilization, reduces energy consumption, and ensures chip quality.
Smart Images
Figure CN222370591U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of welding, and in particular relates to a chip welding device. Background Art
[0002] In the prior art, the melting of the solder paste on the chip is mainly achieved by heating the conveying base plate and the heating plate with a thickness of at least 3mm to 370°C. During the heating process, in order to melt the solder paste on the chip, the entire conveying base plate and the heating plate need to be heated to a high temperature. In fact, the heat required to melt the solder paste accounts for only a small part, and the rest of the heat is wasted, resulting in a huge waste of energy. When the temperature of the melting solder paste is raised, it gradually rises from a low temperature to the required temperature, and the duration is relatively long, so that the chip is in a heated environment for a long time. Since the time that the chip is in a high temperature environment should be as short as possible, and the prior art cannot meet this requirement, the remaining materials on the chip are easily damaged by long-term high temperature, which in turn affects the performance of the chip. Utility Model Content
[0003] The utility model aims to overcome the deficiencies of the prior art and provide a chip welding device to reduce the time the chip is in a high temperature environment, improve heat utilization, ensure chip quality, and reduce energy consumption and save resources.
[0004] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a chip welding device, including a chip conveying component, a position adjustment component and a heating component. The chip conveying component is movably arranged on a workbench and passes under a mounting frame; the heating component is connected to the output end of the position adjustment component, and the position adjustment component drives the heating component to approach or move away from the chip.
[0005] Preferably, the heating assembly comprises a fixing seat and at least two heating bodies, the fixing seat is connected to the position adjustment assembly, the heating bodies are arranged on the fixing seat at intervals, and the two heating bodies heat the frames on both sides of the chip respectively.
[0006] Preferably, the distance between two adjacent heating bodies is greater than the chip width.
[0007] Preferably, the position adjustment component is a lifting cylinder, a mounting frame is provided on the workbench, the lifting cylinder is arranged on the mounting frame, and the heating component is connected to the lower end of the piston rod of the lifting cylinder.
[0008] Preferably, it also includes a vacuum cover and a connecting pipe, wherein the vacuum cover is arranged outside the heating component, and the top is connected to the output end of the position adjustment component, one end of the connecting pipe is connected to the inside of the vacuum cover, and the other end is connected to the vacuum pumping device.
[0009] Preferably, a sealing ring is also provided at the bottom of the vacuum housing.
[0010] Preferably, the chip conveying assembly is a conveying base plate, and the conveying base plate is connected to a transmission assembly that drives it to move on the workbench.
[0011] Preferably, the transmission assembly is a chain.
[0012] Preferably, the conveying base plate is placed on a transmission belt arranged on a workbench.
[0013] Compared with the prior art, the above technical solution has the following beneficial effects:
[0014] 1. The chip welding device of the utility model directly heats the chip surroundings through a heating component to melt the solder paste to complete the chip welding, instead of the previous method of heating the entire chip and the surrounding frame through a tray, and uses a heating body to directly heat to the problem required for welding. There is no need to use a tray for gradual heating, which reduces the time that the chip is in a high temperature environment, does not need to heat the conveying bottom plate, reduces unnecessary energy loss, improves heat utilization, and achieves the purpose of reducing energy consumption and saving resources.
[0015] 2. The distance between two adjacent heating bodies of the utility model is greater than the width of the chip, and the heating body directly contacts the frame, which prevents the heating body from directly contacting the chip and causing damage to it, thereby ensuring the quality of the chip during the welding process.
[0016] 3. The utility model connects the vacuum pumping device through the connecting pipe to perform vacuum pumping operation on the inside of the vacuum cover, thereby ensuring the environmental stability during the welding process and being beneficial to improving the welding quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a front view of the chip welding device of the present invention.
[0018] Figure 2 It is a side view of the chip welding device of the present invention.
[0019] Figure 3 It is a side view of the chip welding device of the utility model when welding a chip.
[0020] Among them: 1. workbench; 2. conveying bottom plate; 3. mounting frame; 4. vacuum cover; 5. connecting pipe; 6. lifting cylinder; 7. fixing seat; 8. heating body; 9. fixing foot 10. chip 11. frame. DETAILED DESCRIPTION
[0021] Figures 1 to 3 It is the best embodiment of the utility model, and the following Figures 1 to 3 The utility model is further described.
[0022] like Figure 1-2As shown, a chip welding device of the utility model includes a mounting frame 3, a conveying bottom plate 2, a position adjustment component, and a heating component. The mounting frame 3 is arranged on a workbench 1. A transmission component is arranged in the workbench 1 to drive the conveying bottom plate 2 to move on the workbench 1. The transmission component in this embodiment is preferably a chain. The chip 10 is laid on the conveying bottom plate 2. The position adjustment component is installed on the mounting frame 3, and the heating component is connected to the output end of the position adjustment component. The position adjustment component drives the heating component to approach or move away from the chip 10.
[0023] The bottom of the workbench 1 is provided with fixed feet 9 to ensure the smooth operation of the whole device. The utility model directly heats the chip 10 through the heating component to melt the solder paste to complete the welding of the chip 10, which reduces the time when the chip 10 is in a high temperature environment, improves the heat utilization rate, ensures the quality of the chip 10, and reduces energy consumption and saves resources.
[0024] The position adjustment component in this embodiment is a lifting cylinder 6, and the lifting cylinder 6 is arranged on the top of the mounting frame 3. The heating component includes a fixed seat 7 and at least two heating bodies 8, the fixed seat 7 is connected to the piston rod of the lifting cylinder 6, and the two heating bodies 8 are arranged on the fixed seat 7 at intervals. The distance between two adjacent heating bodies 8 is greater than the width of the chip 10 to prevent the heating body 8 from directly contacting the chip 10 and causing damage to the chip 10. In this embodiment, the temperature of the heating body 8 during heating is 370°C to ensure that the solder paste on the chip 10 can be completely melted. The number of heating bodies 8 can be set in several groups according to the number of chips 10 placed, and the frames 11 of multiple groups of chips 10 can be heated at the same time.
[0025] Furthermore, a vacuum cover 4 is provided outside the fixing seat 7 and the heating body 8, the top of the vacuum cover 4 is connected to the output end of the lifting cylinder 6, the inside of the vacuum cover 4 is connected to the vacuum device through the connecting pipe 5, the vacuum cover 4 is lowered with the fixing seat 7, and is provided outside the chip 10, forming a vacuum environment during welding, and the bubbles generated when the solder paste melts and boils are extracted, ensuring that the chip 10 will not be oxidized during welding, thereby improving the welding quality of the chip 10. A sealing ring is also provided at the bottom of the vacuum cover 4 to ensure the sealing of the welding environment.
[0026] The working process of the utility model: combined Figure 2 , 3, the manipulator lays the chip 10 on the conveying bottom plate 2, the lifting cylinder 6 moves, driving the vacuum cover 4 to descend. The cover is arranged outside the chip 10 and is connected to the vacuum pumping device through the connecting pipe 5. The vacuum pumping device performs a vacuum operation to form a vacuum environment in the vacuum cover 4. At the same time, the heating component descends synchronously, and the heating body 8 falls to both sides of the chip 10 and contacts the frame 11. The heating body 8 heats the chip 10 at a temperature of 370°C, so that the solder paste on the chip 10 melts quickly, and the welding of the chip 10 is completed. After the welding is completed, the lifting cylinder 6 drives the vacuum cover 4 and the heating body 8 to rise, and the conveying bottom plate 2 conveys the chip 10, and prepares to weld the next group of chips 10, and repeats the action. The utility model reduces the time that the chip 10 is in a high temperature environment, improves the heat utilization rate, ensures the quality of the chip 10, and reduces energy consumption and saves resources.
[0027] The above is only the preferred embodiment of the utility model, and does not limit the utility model in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the utility model without departing from the technical solution of the utility model still belongs to the protection scope of the technical solution of the utility model.
Claims
1. A chip welding device, characterized in that: It comprises a chip conveying component, a position adjustment component and a heating component. The chip conveying component is movably arranged on a workbench (1) and passes through the bottom of a mounting frame (3). The heating component is connected to the output end of the position adjustment component, and the position adjustment component drives the heating component to approach or move away from the chip (10).
2. A chip bonding device according to claim 1, characterized in that: The heating assembly comprises a fixing seat (7) and at least two heating bodies (8), the fixing seat (7) being connected to the position adjustment assembly, the heating bodies (8) being arranged on the fixing seat (7) at intervals, and the two heating bodies (8) respectively heating the frames (11) on both sides of the chip (10).
3. A chip bonding device according to claim 2, characterized in that: The distance between two adjacent heating bodies (8) is greater than the width of the chip (10).
4. A chip bonding device according to claim 1 or 2, characterized in that: The position adjustment component is a lifting cylinder (6); a mounting frame (3) is provided on the workbench (1); the lifting cylinder (6) is arranged on the mounting frame (3); and the heating component is connected to the lower end of the piston rod of the lifting cylinder (6).
5. The chip bonding device according to claim 1, characterized in that: It also comprises a vacuum cover (4) and a connecting pipe (5), wherein the vacuum cover (4) is arranged outside the heating component and the top is connected to the output end of the position adjustment component, one end of the connecting pipe (5) is connected to the inside of the vacuum cover (4) and the other end is connected to the vacuum extraction device.
6. A chip bonding device according to claim 5, characterized in that: A sealing ring is also provided at the bottom of the vacuum cover (4).
7. A chip bonding device according to claim 1, characterized in that: The chip conveying component is a conveying base plate (2), and the conveying base plate (2) is connected to a transmission component that drives it to move on the workbench (1).
8. A chip bonding device according to claim 7, characterized in that: The transmission component is a chain.