Instrument structure and vehicle with same

Abstract

The instrument structure comprises a middle frame and a PCBA (Printed Circuit Board Assembly), the middle frame comprises a bottom plate and a side plate, the bottom plate and the side plate define a mounting space, and a convex hull is arranged on the inner surface of the bottom plate; the PCBA is arranged in the installation space, a chip is arranged on the side, facing the bottom plate, of the PCBA, and the free end face of the convex hull is attached to the chip. According to the instrument structure, the PCBA is arranged in the installation space defined by the bottom plate and the side plates of the middle frame, the bottom plate and the side plates can protect the PCBA, the PCBA is prevented from being directly impacted by external force, and a precise circuit on the PCBA is prevented from being damaged. The free end face of the convex hull on the inner surface of the bottom plate is attached to the chip on the side, facing the bottom plate, of the PCBA, the convex hull can limit the chip, the position of the chip can be reliable, heat dissipated when the chip works can be transmitted to the convex hull connected with the chip, and the heat dissipation effect of the chip is good.

Description

Technical Field

[0001] The utility model mainly relates to the technical field of vehicles, and in particular to an instrument structure and a vehicle with the same. Background Art

[0002] With the development of intelligent, networked and electrified vehicles, the development of cockpit electronics has a profound impact. The instrument structure has more and more functions, which has led to the rapid development of instrument structure. For instruments, to meet increasingly complex functional requirements, it is necessary to increase the computing power of the instrument, which makes the circuit board behind it more complex and the heat generated becomes greater, which is easy to cause losses such as thermal runaway. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes an instrument structure, in which the heat dissipation effect of the chip is better.

[0004] The utility model also provides a vehicle, which comprises the above-mentioned instrument structure.

[0005] According to the instrument structure of the embodiment of the utility model, the middle frame includes a middle frame and a PCBA, the middle frame includes a bottom plate and a side plate, the bottom plate and the side plate define an installation space, and a convex bump is provided on the inner surface of the bottom plate; the PCBA is arranged in the installation space, and a chip is provided on the side of the PCBA facing the bottom plate, and the free end surface of the convex bump is in contact with the chip.

[0006] According to the instrument structure of the embodiment of the utility model, by arranging the PCBA in the installation space defined by the bottom plate and the side plate of the middle frame, the bottom plate and the side plate can protect the PCBA, prevent the external force from directly impacting the PCBA, and prevent the precision circuit on the PCBA from being damaged. The free end surface of the convex bulge on the inner surface of the bottom plate is fitted with the chip on the side of the PCBA facing the bottom plate, and the convex bulge can limit the chip, so that the position of the chip can be more reliable, and the heat emitted by the chip when working can be transferred to the convex bulge connected to the chip, so that the heat dissipation effect of the chip is better.

[0007] In some embodiments of the present invention, heat dissipation glue is provided between the chip and the convex bump.

[0008] In some embodiments of the present invention, the instrument structure further includes a screen assembly, at least a portion of which is disposed in the installation space and located on a side of the PCBA away from the base plate, and the middle frame, the PCBA and the screen assembly are fastened together.

[0009] In some embodiments of the present invention, the side panel is adhesively connected to the screen assembly; and / or the screen assembly is adhesively connected to the PCBA.

[0010] In some embodiments of the present invention, the instrument structure further includes a back cover, the back cover and the screen assembly jointly define a receiving space, and the middle frame and the PCBA are disposed in the receiving space.

[0011] In some embodiments of the present invention, a heat dissipation area is provided on the back cover, the heat dissipation area has a plurality of spaced-apart heat dissipation holes, and the heat dissipation area is arranged opposite to the convex bump.

[0012] In some embodiments of the present invention, the back cover is firmly connected to the middle frame; and / or the back cover is a plastic part.

[0013] In some embodiments of the present invention, the middle frame is a metal part; and / or a groove is provided on the outer surface of the bottom plate at a position corresponding to the convex bump, and a reinforcing rib is provided in the groove.

[0014] In some embodiments of the present invention, the middle frame is an integrated piece.

[0015] The vehicle according to the embodiment of the utility model comprises a vehicle body and the above-mentioned instrument structure, wherein the vehicle body is provided with an instrument panel; and the instrument structure is fixedly mounted on the instrument panel.

[0016] According to the vehicle of the embodiment of the utility model, by arranging the PCBA in the installation space defined by the bottom plate and the side plate of the middle frame, the bottom plate and the side plate can protect the PCBA, prevent the external force from directly impacting the PCBA, and prevent the precision circuit on the PCBA from being damaged. The free end surface of the convex bulge on the inner surface of the bottom plate is in contact with the chip on the side of the PCBA facing the bottom plate, and the convex bulge can limit the chip, so that the position of the chip can be more reliable, and the heat emitted by the chip when working can be transferred to the convex bulge connected to the chip, so that the heat dissipation effect of the chip is better, and the instrument structure of the vehicle is more reliable.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0019] Figure 1 is an exploded view of the instrument structure according to an embodiment of the utility model;

[0020] Figure 2 is an exploded view of the instrument structure according to another embodiment of the utility model;

[0021] Figure 3 It is a three-dimensional diagram of the instrument structure according to an embodiment of the utility model;

[0022] Figure 4 is a cross-sectional view of the instrument structure according to an embodiment of the utility model;

[0023] Figure 5 is a top view of the instrument structure according to an embodiment of the utility model with the rear cover removed;

[0024] Figure 6 It is a cross-sectional view from another angle of the instrument structure according to an embodiment of the utility model.

[0025] Reference numerals:

[0026] 100. Instrument structure;

[0027] 1. middle frame; 11. bottom plate; 111. convex bump; 112. concave groove; 113. reinforcing rib; 12. side plate; 13. installation space;

[0028] 2. PCBA;

[0029] 3. Screen assembly; 31. Screen body; 32. Mounting plate;

[0030] 4. Back cover; 41. Accommodation space; 42. Heat dissipation area; 421. Heat dissipation holes. DETAILED DESCRIPTION

[0031] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0032] In the description of the present utility model, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0033] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] Reference below Figure 1-Figure 6 A meter structure 100 according to an embodiment of the present invention is described.

[0035] like Figure 1 As shown, the instrument structure 100 according to the embodiment of the utility model includes a middle frame 1 and a PCBA 2 (Printed Circuit Board Assembly, circuit board).

[0036] Specifically, Figure 1 As shown, the middle frame 1 includes a bottom plate 11 and a side plate 12, and the bottom plate 11 and the side plate 12 define an installation space 13. The PCBA2 is arranged in the installation space 13. A relatively precise circuit is arranged on the PCBA2. The bottom plate 11 and the side plate 12 can protect the PCBA2. When the instrument structure 100 is impacted, the bottom plate 11 and the side plate 12 can absorb a large impact force, thereby preventing external force from directly impacting the PCBA2 and preventing the precise circuit on the PCBA2 from being damaged.

[0037] like Figure 1 and Figure 4As shown, a convex hump 111 is provided on the inner surface of the base plate 11, and a chip is provided on the side of the PCBA2 facing the base plate 11. The free end surface of the convex hump 111 is in contact with the chip. Along the thickness direction of the PCBA2, the convex hump 111 can limit the chip, so that the position of the chip can be more reliable, and the position of the PCBA2 can be more reliable.

[0038] When the instrument structure 100 is working, the PCBA2 is powered on, the chip is working and generating heat, and the heat on the chip can be transferred to the convex bump 111 connected to the chip, so that the heat dissipation effect of the chip is better. For example, when the chips are arranged closely on the PCBA2, the heat on the chip can be transferred to the convex bump 111 corresponding to it, which can prevent the chip from affecting the adjacent chips when it is heated, and can prevent the PCBA2 from thermal runaway.

[0039] According to the instrument structure 100 of the embodiment of the utility model, by arranging PCBA2 in the installation space 13 defined by the bottom plate 11 and the side plate 12 of the middle frame 1, the bottom plate 11 and the side plate 12 can protect PCBA2, prevent external force from directly impacting PCBA2, and prevent the precision circuit on PCBA2 from being damaged. The free end surface of the convex bump 111 on the inner surface of the bottom plate 11 is fitted with the chip on the side of the PCBA2 facing the bottom plate 11. The convex bump 111 can limit the chip, so that the position of the chip can be more reliable, and the heat emitted by the chip when working can be transferred to the convex bump 111 connected to the chip, so that the heat dissipation effect of the chip is better.

[0040] In addition, the number and volume of the convex bumps 111 can be designed according to the number of chips and the surface area of ​​the chips, so as to ensure the limiting and heat dissipation effects of the convex bumps 111.

[0041] In some embodiments of the utility model, a heat dissipation adhesive is provided between the chip and the bump 111, which can connect the chip and the bump 111 and increase the reliability of the position of the chip and the bump 111. The heat dissipation adhesive has good thermal conductivity and can enhance the heat dissipation ability of the chip.

[0042] In some embodiments of the present invention, Figure 2 and Figure 4 As shown, the instrument structure 100 also includes a screen assembly 3, at least part of which is arranged in the installation space 13 and is located on the side of the PCBA2 away from the bottom plate 11, the middle frame 1, PCBA2 and the screen assembly 3 are fastened together, the connection between the middle frame 1, PCBA2 and the screen assembly 3 is relatively simple and reliable, and the bottom plate 11 and the side plate 12 of the middle frame 1 can protect the screen assembly 3, when the instrument structure 100 is impacted, the bottom plate 11 and the side plate 12 can absorb greater impact force, avoid external force directly impacting the screen assembly 3, and avoid damage to the screen assembly 3.

[0043] In some embodiments of the present invention, the side panel 12 is adhesively connected to the screen assembly 3, which can increase the reliability of the connection between the screen assembly 3 and the middle frame 1, and the connection between the screen assembly 3 and the middle frame 1 is relatively simple.

[0044] In some embodiments of the utility model, the screen assembly 3 and the PCBA2 are connected by adhesive bonding, which can make the connection between the screen assembly 3 and the PCBA2 relatively simple. In this embodiment, an adhesive sponge can be used to bond the screen assembly 3 and the PCBA2, which can prevent the screen assembly 3 and the PCBA2 from interfering with each other and causing abnormal noise, thereby increasing the reliability of the connection between the screen assembly 3 and the PCBA2.

[0045] In some embodiments of the utility model, the middle frame 1 is tightly connected to the screen assembly 3 and PCBA2, which can make the connection between the middle frame 1 and the screen assembly 3 and PCBA2 simpler and more reliable, and the screen assembly 3 and PCBA2 can be checked and replaced by disassembling the middle frame 1, which can make the inspection and repair of the screen assembly 3 and PCBA2 simpler.

[0046] In some embodiments of the present invention, Figure 3 and Figure 6 As shown, the instrument structure 100 further includes a rear cover 4, and the rear cover 4 and the screen assembly 3 jointly define a receiving space 41, and the middle frame 1 and the PCBA 2 are arranged in the receiving space 41. Specifically, the screen assembly 3 includes a screen body 31 and a mounting plate 32, and the rear cover 4 and the mounting plate 32 jointly define the receiving space 41. The rear cover 4 and the mounting plate 32 can protect the middle frame 1 and the PCBA 2. When the instrument structure 100 is impacted, the rear cover 4 can absorb a large impact force, prevent the external force from directly impacting the PCBA 2, and prevent the precision circuit on the PCBA 2 from being damaged.

[0047] In some embodiments of the present invention, Figure 4 As shown, a heat dissipation area 42 is provided on the back cover 4, and the heat dissipation area 42 has a plurality of spaced heat dissipation holes 421, and the heat dissipation area 42 is arranged opposite to the convex 111. The reasonably distributed heat dissipation holes 421 can reduce the overall deformation of the back cover 4, and can increase the structural strength of the entire back cover 4. When the instrument structure 100 is working, the PCBA2 is powered on, the chip is working and generating heat, and the heat on the chip can be transferred to the convex 111 connected to the chip, and the heat on the convex 111 can be dissipated through the heat dissipation holes 421 on the back cover 4, which can increase the heat dissipation capacity of the entire instrument structure 100. In addition, the weight of the back cover 4 can be made lighter, and the lightweight of the instrument structure 100 can be achieved.

[0048] In some embodiments of the utility model, the back cover 4 is tightly connected to the middle frame 1, so that the connection between the middle frame 1 and the back cover 4 is relatively simple and reliable, and the screen assembly 3 and PCBA2 can be checked and replaced by disassembling the back cover 4 and the middle frame 1, which makes the inspection and repair of the screen assembly 3 and PCBA2 relatively simple.

[0049] In some embodiments of the present invention, the rear cover 4 is a plastic part, and when the instrument structure 100 is used in a vehicle, other parts of the instrument structure 100 wrapped by the rear cover 4 can be insulated from other structures in the vehicle. The weight of the rear cover 4 can also be made lighter, and the instrument structure 100 can be made lighter.

[0050] In some embodiments of the utility model, the middle frame 1 is a metal part, which can better shield external electromagnetic interference and try to avoid external electromagnetic interference from affecting the operation of the instrument structure 100. The metal part has a good thermal conductivity and can better transfer the heat on the chip to the outside, thereby increasing the heat dissipation capacity of the entire instrument structure 100.

[0051] In some embodiments of the present invention, Figure 5 and Figure 6 As shown, a groove 112 is provided on the outer surface of the bottom plate 11 at a position corresponding to the convex bump 111, and a reinforcing rib 113 is provided in the groove 112. While ensuring the strength of the convex bump 111 and the middle frame 1, the weight of the middle frame 1 can be reduced, and the instrument structure 100 can be made lightweight.

[0052] In some embodiments of the utility model, the middle frame 1 is an integrated piece, so that the entire middle frame 1 can fully wrap the PCBA2 and the screen body 31 in the screen assembly 3, so that the middle frame 1 has a better effect of shielding electromagnetic interference, and can increase the structural strength of the entire instrument structure 100 and increase the reliability of the instrument structure 100.

[0053] The vehicle according to the embodiment of the utility model includes a vehicle body and an instrument structure 100, wherein the vehicle body is provided with an instrument panel, and the instrument structure 100 is fixedly mounted on the instrument panel. The specific installation position of the instrument structure 100 can be installed on the vehicle's instrument panel, or accommodated in the space formed by the instrument panel, or installed in other locations that are convenient for projection onto the front windshield. For example, a instrument panel is provided in the vehicle body, and the instrument structure 100 is mounted on the instrument panel 311. In other examples, the instrument structure 100 can be accommodated in the storage space formed by the vehicle's instrument panel, wherein the instrument structure 100 can be connected to components in the instrument panel, or connected to other parts of the vehicle body such as a beam, a frame, etc.

[0054] According to the vehicle of the embodiment of the utility model, by arranging PCBA2 in the installation space 13 defined by the bottom plate 11 and the side plate 12 of the middle frame 1, the bottom plate 11 and the side plate 12 can protect PCBA2, prevent external force from directly impacting PCBA2, and prevent the precision circuit on PCBA2 from being damaged. The free end surface of the convex 111 on the inner surface of the bottom plate 11 is fitted with the chip on the side of PCBA2 facing the bottom plate 11, and the convex 111 can limit the chip, so that the position of the chip is more reliable, and the heat emitted by the chip when working can be transferred to the convex 111 connected to the chip, so that the heat dissipation effect of the chip is better, and the instrument structure 100 of the vehicle is more reliable.

[0055] Other structures and operations of the instrument structure 100 according to the embodiment of the present utility model are known to those skilled in the art and will not be described in detail here.

[0056] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0057] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An instrument structure, characterized in that: include: A middle frame, the middle frame comprising a bottom plate and side plates, the bottom plate and the side plates define an installation space, and a convex bump is provided on the inner surface of the bottom plate; PCBA, the PCBA is arranged in the installation space, a chip is arranged on the side of the PCBA facing the bottom plate, and the free end surface of the convex bump is attached to the chip.

2. The instrument structure according to claim 1, characterized in that: Heat dissipation glue is provided between the chip and the convex bump.

3. The instrument structure according to claim 1, characterized in that: Also includes: A screen assembly, at least a portion of which is disposed in the installation space and located on a side of the PCBA away from the base plate, and the middle frame, the PCBA and the screen assembly are fastened together.

4. The instrument structure according to claim 3, characterized in that: The side panel is adhesively connected to the screen assembly; And / or, the screen assembly and the PCBA are adhesively connected.

5. The instrument structure according to claim 3, characterized in that: Also includes: A back cover, wherein the back cover and the screen assembly together define a receiving space, and the middle frame and the PCBA are arranged in the receiving space.

6. The instrument structure according to claim 5, characterized in that: The back cover is provided with a heat dissipation area, the heat dissipation area has a plurality of spaced heat dissipation holes, and the heat dissipation area is arranged opposite to the convex bump.

7. The instrument structure according to claim 5, characterized in that: The back cover is firmly connected to the middle frame; And / or, the back cover is a plastic part.

8. The instrument structure according to claim 1, characterized in that: The middle frame is a metal part; And / or, a groove is provided on the outer surface of the bottom plate at a position corresponding to the convex bump, and a reinforcing rib is provided in the groove.

9. The instrument structure according to claim 1, characterized in that: The middle frame is an integral piece.

10. A vehicle, characterized in that: include: A vehicle body, wherein the vehicle body is provided with a dashboard; According to any one of claims 1-9, the instrument structure is fixedly mounted on the instrument platform.

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