Deposition apparatus

Abstract

There is provided a deposition apparatus including: a mask frame; a plurality of masks disposed on the mask frame; a first plate disposed on the mask; a second plate disposed on the first plate; a plurality of upper driving units disposed between the first plate and the second plate; a plurality of lower driving units disposed between the plurality of upper driving units and the first plate; and a plurality of magnet units disposed in the magnet unit accommodation spaces, respectively. The plurality of upper driving units extend in a first direction and are arranged in a second direction crossing the first direction, and the plurality of lower driving units extend in the second direction and are arranged in the first direction. The magnet units may be aligned in a direction crossing an extension direction of the mask, and no repulsive force is generated between the magnet units and the mask. Accordingly, separation of the substrate can be prevented, and defects in deposition of the substrate can be reduced.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0052105 filed on April 20, 2023, in the Korean Intellectual Property Office (KIPO), the entire contents of which are incorporated herein by reference. Technical Field

[0002] The disclosure relates to a deposition apparatus. Background Art

[0003] In recent years, organic light emitting diode displays (OLEDs) have become the focus of next-generation flat display devices due to their excellent brightness and viewing angle. Unlike liquid crystal displays, organic light emitting diode displays do not require a separate light source, so organic light emitting diode displays are manufactured to have a thin thickness and light weight. In addition, organic light emitting diode displays have properties such as low power consumption, high brightness, and fast response speed.

[0004] The organic light emitting diode display includes a plurality of organic light emitting elements, each of which includes an anode, an organic light emitting layer and a cathode. Holes and electrons are injected into the organic light emitting layer through the anode and the cathode, and are recombined in the organic light emitting layer to generate excitons. When the excitons return from an excited state to a ground state, the organic light emitting element emits light.

[0005] When manufacturing an organic light emitting element, a mask is provided on a substrate, and an organic material for forming an organic light emitting layer is provided on the substrate through an opening defined in the mask. Since the mask includes metal and is formed very thin, it may not remain flat. A mask frame that fixes the mask and a magnet unit that holds the mask flatly to the substrate by suction are used to keep the mask flat. The magnet unit is fixed to a magnet plate.

[0006] However, when the mask is aligned in parallel with the direction in which the magnet units are arranged, a repulsive force is generated between the magnet units and the mask, and the mask may not be evenly held by attraction to the substrate. Utility Model Content

[0007] The utility model provides a deposition device. The deposition device comprises a driving unit. The driving unit moves a magnet unit so that the magnet unit is aligned in a direction intersecting with a direction along which a mask extends.

[0008] According to the disclosed embodiment, the deposition device may include: a mask frame; a plurality of masks arranged on the mask frame; a first plate arranged on the mask; a second plate arranged on the first plate; a plurality of upper drive units arranged between the first plate and the second plate; a plurality of lower drive units arranged between the plurality of upper drive units and the first plate; and a plurality of magnet units respectively arranged in the magnet unit accommodating spaces.

[0009] A plurality of upper drive units may extend in a first direction and may be arranged in a second direction intersecting the first direction, a plurality of lower drive units may extend in the second direction and may be arranged in the first direction, each of the plurality of upper drive units may include an upper support and a plurality of upper barrier walls disposed on a lower surface of the upper support, each of the plurality of lower drive units may include a lower support and a plurality of lower barrier walls disposed on an upper surface of the lower support, and each of the magnet unit accommodating spaces may be a space between a plurality of upper barrier walls adjacent to each other in the first direction and a plurality of lower barrier walls adjacent to each other in the second direction.

[0010] Each of the plurality of upper driving units may be independently movable in a direction substantially parallel to the first direction, and the plurality of magnet units overlapped with the plurality of upper driving units in a plan view may be movable in a direction substantially parallel to the first direction by moving the plurality of upper driving units.

[0011] A guide rail may be formed on a lower surface of the second plate, a guide groove extending in the first direction is defined on the guide rail, and a guide groove combining member may be formed on the first surfaces of the plurality of upper driving units to move along the guide rail.

[0012] Each of the plurality of lower driving units may be independently movable in a direction substantially parallel to the second direction, and the plurality of magnet units overlapping the plurality of lower driving units in a plan view may be movable in a direction substantially parallel to the second direction by moving the plurality of lower driving units.

[0013] A guide rail may be formed on an upper surface of the first plate, a guide groove extending in the second direction may be defined on the guide rail, and a guide groove combining member may be formed on the first surfaces of the plurality of lower driving units to move along the guide rail.

[0014] The multiple magnet units may include a first magnet unit and a second magnet unit having a polarity direction different from that of the first magnet unit, the multiple upper drive units and the multiple lower drive units may be operated in a first mode, a second mode or a third mode, and in the first mode, the first magnet unit and the second magnet unit may be alternately arranged in a first direction and a second direction.

[0015] The first mode can be changed to a second mode by moving the plurality of upper driving units, in which magnet units of the same type among the first magnet units and the second magnet units can be arranged in the second direction, and in which the first magnet units and the second magnet units can be alternately arranged in the first direction.

[0016] The plurality of masks may extend in the first direction and may be arranged in the second direction.

[0017] The first mode can be changed to a third mode by moving the plurality of lower driving units, in which magnet units of the same type among the first magnet units and the second magnet units can be arranged in the first direction, and in which the first magnet units and the second magnet units can be alternately arranged in the second direction.

[0018] The plurality of masks may extend in the second direction and may be arranged in the first direction.

[0019] The plurality of upper driving units may include a magnetic substance.

[0020] The magnetic material may be metal.

[0021] The plurality of magnet units may be respectively attached to the plurality of upper driving units stacked in a plan view through attractive forces caused by the magnetic forces of the plurality of upper driving units.

[0022] The plurality of lower driving units may be made of a non-magnetic material.

[0023] The first plate may include a cooling plate.

[0024] The first plate may include an electrostatic chuck.

[0025] The deposition apparatus may further include a driving unit connected to the second plate, and the driving unit may move in a direction substantially parallel to a third direction intersecting each of the first direction and the second direction.

[0026] Each of the plurality of magnet units may have a cubic shape.

[0027] The plurality of upper barrier walls may be arranged at regular intervals in the first direction.

[0028] The plurality of lower barrier walls may be arranged at regular intervals in the second direction.

[0029] According to the above, when the driving unit moves, the magnet unit disposed between the barrier walls of the driving unit moves together with the driving unit. Therefore, the magnet unit can be aligned in a direction intersecting the extension direction of the mask, and no repulsive force is generated between the magnet unit and the mask. Therefore, the substrate can be prevented from being separated, and defects when depositing the substrate can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other advantages of the disclosure will become readily apparent by referring to the following detailed description when considered in conjunction with the accompanying drawings, in which:

[0031] Figure 1 is a perspective view of a deposition apparatus according to a disclosed embodiment;

[0032] Figure 2is a schematic cross-sectional view of a deposition apparatus according to a disclosed embodiment;

[0033] Figure 3 is a schematic cross-sectional view of a deposition apparatus according to a disclosed embodiment;

[0034] Figure 4 is an exploded perspective view of a portion of a deposition apparatus according to a disclosed embodiment;

[0035] Figure 5A is an enlarged view of a portion of a deposition apparatus according to a disclosed embodiment;

[0036] Figure 5B is a side view of a portion of a deposition apparatus according to a disclosed embodiment;

[0037] Figure 5C is a perspective view of a portion of a deposition apparatus according to a disclosed embodiment;

[0038] Figure 5D is a perspective view of a portion of a deposition apparatus according to a disclosed embodiment;

[0039] Fig. 6A is a plan view of a portion of a deposition apparatus according to a disclosed embodiment;

[0040] Figure 6B is a plan view of a portion of a deposition apparatus according to a disclosed embodiment;

[0041] Figure 6C is a plan view of a portion of a deposition apparatus according to a disclosed embodiment;

[0042] Fig.6D is a plan view of a portion of a deposition apparatus according to a disclosed embodiment;

[0043] Fig. 6E is a plan view of a portion of a deposition apparatus according to a disclosed embodiment;

[0044] Fig. 6F is a plan view of a portion of a deposition apparatus according to a disclosed embodiment;

[0045] Fig. 7A is a schematic cross-sectional view of a portion of a deposition apparatus according to a disclosed embodiment;

[0046] Figure 7B is a schematic cross-sectional view of a portion of a deposition apparatus according to a disclosed embodiment;

[0047] Figure 8 is a plan view of a display panel manufactured using a deposition apparatus according to a disclosed embodiment;

[0048] Fig. 9yes Figure 8 A schematic cross-sectional view of a pixel shown in ; and

[0049] Fig.10 It is shown Fig. 9 A schematic cross-sectional view of a deposition process of a display panel shown in FIG. DETAILED DESCRIPTION

[0050] The disclosure can be modified in various ways and implemented in many different forms, so specific embodiments will be shown in the drawings and described in detail below. However, the disclosure should not be limited to the specific disclosed form, and should be interpreted as including all modifications, equivalents or substitutes included in the spirit and scope of the disclosure.

[0051] When an element or layer is referred to as being "on," "connected to," or "bonded to" another element or layer, the element or layer may be directly on, directly connected to, or bonded to the other element or layer, or there may be intervening elements or layers. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly bonded to" another element or layer, there are no intervening elements or layers. For this purpose, the term "connected" may refer to a physical connection, an electrical connection, and / or a fluid connection with or without intervening elements. In addition, when an element is referred to as being "in contact with," etc., another element, the element may be "in electrical contact with" or "in physical contact with" the other element; or "indirect contact with" or "direct contact with" the other element.

[0052] The same mark always refers to the same element. In the drawings, the thickness, ratio and size of the components are exaggerated in order to effectively describe the technical content. As used herein, the term "and / or" can include any combination and all combinations of one or more of the related listed items.

[0053] It will be understood that, although the terms first, second, etc. can be used to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. Therefore, without departing from the disclosed teachings, the first element discussed below can be referred to as the second element. As used herein, unless the context clearly indicates otherwise, the singular forms "one", "one (kind / person)" and "the (described)" are also intended to include plural forms.

[0054] For ease of description, spatially relative terms such as “under,” “beneath,” “lower,” “over,” “upper,” etc. may be used herein to describe the relationship of one element or feature to another (other) elements or features as shown in the figures.

[0055] It will also be understood that when the term “comprise” and / or variations thereof are used in this specification, it specifies the presence of stated features, integers, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0056] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will also be understood that, unless expressly defined as such herein, terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense.

[0057] Hereinafter, a direction intersecting a plane defined by the first direction DR1 and the second direction DR2 is referred to as a third direction DR3. The third direction DR3 may be perpendicular to the plane defined by the first direction DR1 and the second direction DR2. In the disclosure, the expression "when viewed in a section" or "in a cross-sectional view" may mean a state of viewing in the first direction DR1 or the second direction DR2. The expression "when viewed in a plane" or "in a plan view" may mean a state of viewing in the third direction DR3. The directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 are relative to each other and may be changed to other directions.

[0058] Hereinafter, a deposition apparatus PDA according to a disclosed embodiment will be described with reference to the accompanying drawings.

[0059] Figure 1 is a perspective view of a deposition apparatus PDA according to a disclosed embodiment.

[0060] The deposition apparatus PDA may include a mask frame MFS, a mask MM, a first plate PT1, a driving unit placement area DUA, a second plate PT2, and a driving unit DU.

[0061] The mask frame MFS may be a member on which the mask MM is disposed. The mask frame MFS may have a quadrilateral shape in a plan view having a side surface extending in a first direction DR1 and a side surface extending in a second direction DR2 crossing the first direction DR1. The mask frame MFS may have a quadrilateral frame shape in a plan view, however, the shape of the mask frame MFS should not be limited thereto or thereby.

[0062] The mask opening SOP may be defined in the mask frame MFS. The mask opening SOP may have a quadrilateral shape in a plan view, however, the shape of the mask opening SOP should not be limited to the quadrilateral shape. The mask frame MFS may allow the gaseous deposition material DPM (refer to Fig.10 ) through the mask opening SOP.

[0063] The mask frame MFS may include a metal material. For example, the mask frame MFS may include Invar or stainless steel.

[0064] The mask frame MFS may provide a surface for supporting the mask MM. The mask MM may be disposed on the same plane by the mask frame MFS, and the mask MM may be closely adhered to the substrate SUB during a deposition process.

[0065] The mask MM may be disposed on the mask frame MFS. Both sides of the mask MM may be connected to the mask frame MFS. For example, the mask MM may be connected to the mask frame MFS by a laser welding method.

[0066] The mask MM may extend in one direction and may be arranged in a direction crossing this direction. Figure 1 As shown in , each of the masks MM may extend in the second direction DR2, and the masks MM may be arranged in the first direction DR1, however, the disclosure should not be limited thereto or thereby. According to an embodiment, the masks MM may extend in the first direction DR1, and may be arranged in the second direction DR2.

[0067] The masks MM may include a metal material. For example, each of the masks MM may be a fine metal mask.

[0068] Each of the masks MM may include a plurality of cell areas CEA defined therein. Figure 1 As shown in , three cell areas CEA may be defined in each of the masks MM, however, the number of the cell areas CEA should not be limited to three.

[0069] The cell areas CEA may be arranged in one direction. For example, the cell areas CEA may be arranged in a direction. Figure 1 However, the arrangement direction of the cell areas CEA should not be limited thereto or thereby.

[0070] The cell area CEA may correspond to a display panel DP formed on the substrate SUB during a deposition process (refer to Figure 8 ) area. One unit area CEA may be used to form one display panel DP (refer to Figure 8 ) of the light emitting element. With the display panel DP (refer to Figure 8) The corresponding unit area may be defined on the substrate SUB. After the light emitting element is formed in the unit area, the unit area may be cut. Thus, the display panel DP (refer to Figure 8 ), however, the disclosure should not be limited thereto or thereby. According to the embodiment, a display panel DP (refer to Figure 8 ) can be formed on a substrate SUB.

[0071] The cell area CEA may have a display panel DP (refer to Figure 8 ) corresponding to the shape. For example, Figure 1 As shown in , each of the cell areas CEA may have a rectangular shape in a plan view having short sides extending in the first direction DR1 and long sides extending in the second direction DR2, however, the disclosure should not be limited thereto or thereby. According to embodiments, the cell areas CEA may have various shapes.

[0072] The mask MM may include an opening area and a closed area to form a gap between the deposition material DPM (see FIG. Fig.10 ) is deposited on the substrate SUB so that the deposited material DPM (refer to Fig.10 ) is deposited at a specific position of the substrate SUB. The cell opening MOP may be defined as an opening region of the mask MM. The cell opening MOP may be arranged in the cell area CEA in the first direction DR1 and the second direction DR2. In a plan view, the cell opening MOP may overlap with the mask opening SOP.

[0073] For example, Figure 1 As shown in , 20 cell openings MOP may be defined in each of the cell areas CEA defined in the mask MM, however, the number of cell openings MOP should not be limited thereto or thereby.

[0074] The region other than the cell opening MOP in the cell area CEA may be defined as a closed region of the mask MM. The deposition material DPM (refer to Fig.10 ) may be provided in a gaseous state and may pass only through the unit opening MOP. Therefore, the deposition material DPM (refer to Fig.10 ) is deposited on the substrate SUB at a position corresponding to the cell opening MOP.

[0075] The first plate PT1 may be disposed on the mask frame MFS and the mask MM. The first plate PT1 may have a hexahedral shape having an upper surface and a lower surface defined by the first direction DR1 and the second direction DR2. However, the shape of the first plate PT1 should not be limited thereto or thereby, and may have various shapes.

[0076] The first plate PT1 may press the substrate SUB to closely adhere the substrate SUB to the mask MM.

[0077] The first plate PT1 may include a cooling plate. A pipe through which a coolant flows may be provided in the cooling plate CP. The substrate SUB may contact the first plate PT1 during the deposition process. The deposition material DPM (refer to Fig.10 ) is heated, the substrate SUB may be thermally deformed. However, since the coolant is supplied to the first plate PT1 in contact with the substrate SUB, the heated substrate SUB can be cooled by the coolant. Therefore, the deposition material DPM (refer to Fig.10 ) causes thermal deformation of the substrate SUB.

[0078] The first plate PT1 may include an electrostatic chuck. The electrostatic chuck may be a member that attaches an object using electrostatic force. In the case where an electric potential is applied to the electrostatic chuck, the object may be oppositely charged and may be fixed to the electrostatic chuck by an attraction force due to the electrostatic force. In the case where the first plate PT1 includes the electrostatic chuck, the first plate PT1 may have an electrostatic force, and the first plate PT1 may help the mask MM and the substrate SUB to adhere to each other by an attraction force due to the electrostatic force.

[0079] The drive unit placement area DUA may be defined between the first plate PT1 and the second plate PT2. Figure 2 )、Magnetic unit MGU (refer to Figure 2 ) and lower drive unit LDU (refer to Figure 2 ) can be set in the drive unit placement area DUA. Figures 2 to 7B Components disposed in the driving unit placement area DUA are described in detail.

[0080] The second plate PT2 may be disposed on the first plate PT1. The first plate PT1 may be disposed between the mask MM and the second plate PT2. The second plate PT2 may have a hexahedral shape having an upper surface and a lower surface defined by the first direction DR1 and the second direction DR2. However, the shape of the second plate PT2 should not be limited thereto or thereby, and the second plate PT2 may have various shapes.

[0081] The second board PT2 can provide the upper drive unit UDU (refer to Figure 2) combined surface so that the upper drive unit UDU (refer to Figure 2 ) moves on a surface defined by the first direction DR1 and the second direction DR2.

[0082] The drive unit DU may be disposed on the second plate PT2. The drive unit DU may be connected to the upper surface of the second plate PT2. The drive unit DU may have a cylindrical shape extending in the third direction DR3. However, the disclosure should not be limited thereto or thereby, and the drive unit DU may have various shapes.

[0083] Figure 2 and Figure 3 It is along Figure 1 Schematic cross-sectional view of the deposition device PDA taken along line II'. Figure 3 shows movement in a direction opposite to the third direction DR3 Figure 2 However, for the sake of convenience of explanation, the upper driving unit UDU, the magnet unit MGU and the lower driving unit LDU are arranged in the same manner. Figure 2 and Figure 3 are shown separated from each other.

[0084] The upper driving unit UDU, the magnet unit MGU, and the lower driving unit LDU may be disposed in a driving unit placement area DUA (refer to Figure 1 )middle.

[0085] The upper driving unit UDU may be a member that moves the magnet units MGU stacked in one direction. The upper driving unit UDU may include an upper support UDU-S and an upper barrier wall UDU-W.

[0086] The upper support UDU-S may include an upper first surface UDU-S1 (refer to Figure 4 ) and the second surface UDU-S2 (reference Figure 4 ). The first surface UDU-S1 (refer to Figure 4 ) can face the lower surface of the second board PT2. The upper second surface UDU-S2 (refer to Figure 4 ) can face the first surface UDU-S1 (refer to Figure 4 ). The upper barrier wall UDU-W may be disposed on the upper second surface UDU-S2 (refer to Figure 4 ) Figure 4 The structure and shape of the upper drive unit UDU are described in detail.

[0087] The lower driving unit LDU may be a member that moves the magnet units MGU stacked in one direction. The lower driving unit LDU may include a lower support LDU-S and a lower barrier wall LDU-W.

[0088] The lower support member LDU-S may include a lower first surface LDU-S1 (refer to Figure 4 ) and the lower second surface LDU-S2 (refer to Figure 4 ). The lower first surface LDU-S1 (refer to Figure 4 ) can face the first plate PT1. The lower second surface LDU-S2 (refer to Figure 4 ) can face the lower first surface LDU-S1 (refer to Figure 4 ). The lower barrier wall LDU-W may be disposed on the lower second surface LDU-S2 (refer to Figure 4 ) Figure 4 The structure and shape of the lower drive unit LDU are described in detail.

[0089] The magnet unit MGU may be a member having magnetic force. The magnet unit MGU may have a cubic shape. In the case where the magnet unit MGU has a cubic shape, the magnet unit MGU may have a quadrilateral shape in a cross-sectional view. However, the shape of the magnet unit MGU should not be particularly limited as long as the magnet unit MGU has magnetic force.

[0090] The magnet unit MGU may include a magnetic material having magnetic force. For example, the magnet unit MGU may include a permanent magnet. Each of the magnet units MGU may have a first polarity and a second polarity different from the first polarity. For example, the first polarity may be defined as the north (N) pole of the magnet, and the second polarity may be defined as the south (S) pole of the magnet.

[0091] The magnet unit MGU can be distinguished by a first magnet unit MGU1 and a second magnet unit MGU2 according to the polarity direction. The first magnet unit MGU1 can be defined as a magnet unit MGU arranged so that the south (S) pole of the magnet faces the mask MM. The second magnet unit MGU2 can be defined as a magnet unit MGU arranged so that the north (N) pole of the magnet faces the mask MM.

[0092] like Figure 2 and Figure 3 As shown in , since the mask MM is not subjected to the normal force of the mask frame MFS in the portion overlapping the mask opening SOP, the mask MM will bend in the direction along which gravity acts. For example, the mask MM will bend in the direction opposite to the third direction DR3. The magnet unit MGU can apply an attractive force caused by a magnetic field to the mask MM, thereby preventing the mask MM from bending.

[0093] The expression "magnet units MGU are aligned" may mean that magnet units MGU having the same polarity direction are arranged in one direction. The alignment direction of the magnet units MGU may be defined as the direction along which the magnet units MGU having the same polarity direction are arranged. In the case where the extension direction of the mask MM is parallel to the alignment direction of the magnet unit MGU, a repulsive force may be locally generated between the mask MM and the magnet unit MGU due to the magnetic field generated by the magnet unit MGU. The repulsive force may prevent the mask MM and the substrate SUB from being closely attached to each other during the deposition process, and thus may cause the separation of the substrate SUB. In the case where the substrate SUB is separated, deposition defects may occur in the substrate SUB. According to the disclosure, the arrangement direction of the magnet unit MGU may be adjusted so that the alignment direction of the magnet unit MGU intersects with the extension direction of the mask MM. Therefore, the separation phenomenon of the substrate SUB may be prevented. Therefore, the substrate SUB may be prevented from being separated.

[0094] The driving unit DU can move linearly in a direction parallel to the third direction DR3. The second plate PT2 connected to the driving unit DU can move linearly in a direction parallel to the third direction DR3 as the driving unit DU moves. Due to the movement of the second plate PT2, the upper driving unit UDU connected to the second plate PT2 can also move linearly in a direction parallel to the third direction DR3.

[0095] Figure 4 is an exploded perspective view of a portion of a deposition apparatus according to a disclosed embodiment. Figure 4 A stacking arrangement between the upper drive unit UDU, the magnet unit MGU, and the lower drive unit LDU is shown.

[0096] The upper drive units UDU may be arranged in the second direction DR2, and the lower drive units LDU may be arranged in the first direction DR1. However, the arrangement direction of the upper drive units UDU and the lower drive units LDU should not be particularly limited as long as the arrangement direction of the upper drive units UDU intersects with the arrangement direction of the lower drive units LDU. For example, the upper drive units UDU may be arranged in the first direction DR1, and the lower drive units LDU may be arranged in the second direction DR2.

[0097] Figure 4 1 and 2. There are shown seven upper drive units UDU arranged in the second direction DR2 and seven lower drive units LDU arranged in the first direction DR1. However, the deposition device PDA (refer to Figure 1 ) The number of upper drive units UDU and the number of lower drive units LDU in should not be limited to or thereby.

[0098] The upper support member UDU-S may be combined with the upper barrier wall UDU-W. The upper support member UDU-S may be a polyhedron. For example, the upper support member UDU-S may be a hexahedron. However, the shape of the upper support member UDU-S should not be particularly limited as long as the upper support member UDU-S provides a surface for combining with the upper barrier wall UDU-W. The upper support member UDU-S may extend in a direction intersecting the direction along which the upper drive unit UDU is arranged. Figure 4 A structure in which the upper support UDU-S extends in the first direction DR1 is shown.

[0099] The upper support UDU-S may include a second plate PT2 (refer to Figure 3 ) on the first surface UDU-S1. The first surface UDU-S1 can be connected to the second board PT2 (refer to Figure 3 ) is bonded to the lower surface. This will refer to Figure 5D Detailed description.

[0100] The upper barrier wall UDU-W can define the magnet accommodation space MGUS (refer to Figure 5A ) and can push the magnet unit MGU to move it. Each of the upper barrier walls UDU-W can be a polyhedron. For example, the upper barrier wall UDU-W can be a hexahedron. However, the shape of the upper barrier wall UDU-W should not be particularly limited as long as the upper barrier wall UDU-W defines the magnet accommodating space MGUS and applies thrust to the magnet unit MGU.

[0101] The upper barrier wall UDU-W may be arranged on the upper second surface UDU-S2 in a direction substantially parallel to an extending direction of the upper support UDU-S. Figure 4 A structure in which the upper barrier walls UDU-W are arranged in a direction parallel to the first direction DR1 is shown. The upper barrier walls UDU-W may be arranged spaced apart from each other on the upper second surface UDU-S2. For example, the upper barrier walls UDU-W may be arranged spaced apart from each other at regular intervals.

[0102] The upper barrier wall UDU-W arranged in a direction substantially parallel to the extension direction of the upper support UDU-S may be coupled to the upper support UDU-S. According to the movement of the upper support UDU-S, the upper barrier wall UDU-W coupled to the upper support UDU-S may move together with the upper support UDU-S.

[0103] The upper driving unit UDU may include a magnetic substance. For example, the upper support member UDU-S may include metal, however, the disclosure should not be limited thereto or thereby. According to an embodiment, the entire upper driving unit UDU may be a non-magnetic substance.

[0104] In the case where the upper drive unit UDU includes a magnetic substance, the magnet unit MGU may be attached to the upper drive unit UDU by an attractive force caused by a magnetic force, and the magnet unit MGU may be prevented from being moved in the magnet accommodation space MGUS (refer to Figure 5A ) in the upper drive unit. However, such attachment does not imply permanent fixation or engagement. For example, in the case where the arrangement of the magnet unit MGU is changed by movement of the lower drive unit LDU, the upper drive unit UDU and the magnet unit MGU may be separated from each other and reattached to each other after the arrangement change.

[0105] The upper drive unit UDU can be on the second board PT2 (refer to Figure 3 ) moves on the lower surface of the upper support UDU-S in a direction parallel to the extension direction of the upper support UDU-S. For example, Figure 4 The upper driving unit UDU shown in FIG. 1 may move in a direction parallel to the first direction DR1 .

[0106] When the upper driving unit UDU moves, the upper barrier wall UDU-W included in the upper driving unit UDU may move together with the upper driving unit UDU. When the upper barrier wall UDU-W moves, the upper barrier wall UDU-W may apply a thrust to the magnet unit MGU in the moving direction of the upper driving unit UDU to push the magnet unit MGU in the moving direction of the upper driving unit UDU.

[0107] In a case where the magnet unit MGU is in contact with the upper driving unit UDU and the upper driving unit UDU moves, a friction force may be applied to the magnet unit MGU toward a moving direction of the upper driving unit UDU.

[0108] In a plan view, the upper drive unit UDU may overlap with the magnet unit MGU arranged in the extension direction of the upper support UDU-S among the magnet units MGU. The magnet unit MGU overlapping with the upper drive unit UDU may move in the same direction as the moving direction of the upper drive unit UDU by thrust and friction when moving. As a result, the arrangement of the magnet unit MGU may be changed by moving the upper drive unit UDU.

[0109] The lower support LDU-S may be combined with the lower barrier wall LDU-W. The lower support LDU-S may be a polyhedron. For example, the lower support LDU-S may be a hexahedron. However, the shape of the lower support LDU-S should not be particularly limited as long as the lower support LDU-S provides a surface for combining with the lower barrier wall LDU-W. The lower support LDU-S may extend in a direction intersecting the direction along which the lower drive unit LDU is arranged. Figure 4 A structure in which the lower support LDU-S extends in the second direction DR2 is shown.

[0110] The lower support LDU-S may include a first plate PT1 (refer to Figure 3 ) of the lower first surface LDU-S1. The lower first surface LDU-S1 can be connected to the first plate PT1 (refer to Figure 3 ) combination. This will refer to Figure 5D Detailed description.

[0111] The lower barrier wall LDU-W may define a magnet accommodation space MGUS (see Figure 5A ) and can push the magnet unit MGU to move. Each of the lower barrier walls LDU-W may be a polyhedron. For example, each of the lower barrier walls LDU-W may be a hexahedron. However, the shape of the lower barrier walls LDU-W should not be particularly limited as long as the lower barrier walls LDU-W define the magnet accommodating space MGUS and apply thrust to the magnet unit MGU.

[0112] The lower barrier wall LDU-W may be arranged on the lower second surface LDU-S2 in a direction substantially parallel to an extending direction of the lower support LDU-S. Figure 4 A structure in which the lower barrier walls LDU-W are arranged in a direction parallel to the second direction DR2 is shown. The lower barrier walls LDU-W may be arranged spaced apart from each other on the lower second surface LDU-S2. For example, the lower barrier walls LDU-W may be arranged spaced apart from each other at regular intervals.

[0113] The lower barrier wall LDU-W arranged in a direction substantially parallel to the extension direction of the lower support LDU-S may be coupled to the lower support LDU-S. According to the movement of the lower support LDU-S, the lower barrier wall LDU-W coupled to the lower support LDU-S may move together with the lower support LDU-S.

[0114] The lower drive unit LDU may be made of a non-magnetic material. In the case where the lower drive unit LDU is made of a non-magnetic material, the lower drive unit LDU may not interfere with the magnetic force of the magnet unit MGU acting on the mask MM. However, the lower drive unit LDU may partially include a magnetic material as long as the lower drive unit LDU does not interfere with the magnetic force of the magnet unit MGU acting on the mask MM.

[0115] The lower drive unit LDU can be on the first board PT1 (refer to Figure 3 ) on the upper surface of the lower support LDU-S in a direction substantially parallel to the extension direction of the lower support LDU-S. For example, Figure 4 The lower driving unit LDU shown in FIG. 4 may move in a direction parallel to the second direction DR2 .

[0116] When the lower driving unit LDU moves, the lower barrier wall LDU-W included in the lower driving unit LDU may move together with the lower driving unit LDU. When the lower barrier wall LDU-W moves, the lower barrier wall LDU-W may apply a thrust to the magnet unit MGU in the moving direction of the lower driving unit LDU to push the magnet unit MGU in the moving direction of the lower driving unit LDU.

[0117] In a case where the magnet unit MGU is in contact with the lower driving unit LDU and the lower driving unit LDU moves, a friction force may be applied to the magnet unit MGU toward a moving direction of the lower driving unit LDU.

[0118] In a plan view, the lower drive unit LDU may overlap with the magnet unit MGU arranged in the extension direction of the lower support LDU-S among the magnet units MGU. The magnet unit MGU overlapping with the lower drive unit LDU may move in the same direction as the moving direction of the lower drive unit LDU by thrust and friction when moving. As a result, the arrangement of the magnet unit MGU may be changed by moving the lower drive unit LDU.

[0119] FIG. 5A to FIG. 5C : is a view showing a superimposed state among the upper drive unit UDU, the magnet unit MGU, and the lower drive unit LDU.

[0120] Figure 5A 1 is an enlarged view showing the upper drive unit UDU, the magnet unit MGU, and the lower drive unit LDU corresponding to one magnet accommodating space MGUS. Figure 5B : is a side view showing a structure in which one upper driving unit UDU extending in a direction parallel to the first direction DR1 overlaps the lower driving unit LDU arranged parallel to the first direction DR1. Figure 5C : is a perspective view showing the upper driving unit UDU, the lower driving unit LDU, and the magnet unit MGU disposed in the magnet accommodating space MGUS defined by the upper driving unit UDU and the lower driving unit LDU stacked on each other.

[0121] The magnet unit MGU can be arranged in the deposition device PDA (refer to Figure 1 ) in the magnet accommodating space MGUS. The magnet accommodating space MGUS may be defined between the upper barrier walls UDU-W adjacent to each other in the first direction DR1 and the lower barrier walls LDU-W adjacent to each other in the second direction DR2. Figure 5A A magnet accommodation space MGUS is shown as an example. Figure 5C , deposition equipment PDA (refer to Figure 1 ) may include multiple upper barrier walls UDU-W and multiple lower barrier walls LDU-W, so the magnet accommodating space MGUS may also be set to multiple.

[0122] The magnet units MGU may be disposed in the magnet accommodation spaces MGUS, respectively. Figure 5A As shown in FIG. 1 , one magnet unit MGU may be disposed in one magnet accommodation space MGUS, however, the disclosure should not be limited thereto or thereby. According to an embodiment, a plurality of magnet units MGU may be disposed in one magnet accommodation space MGUS.

[0123] Since the magnet unit MGU is disposed in the magnet accommodation space MGUS, the volume of the magnet accommodation space MGUS may be substantially equal to or greater than the volume of the magnet unit MGU. Figure 5A A structure is shown in which the volume of the magnet accommodating space MGUS is substantially equal to the volume of the magnet unit MGU. However, the volume of the magnet accommodating space MGUS should not be particularly limited as long as the magnet unit MGU is disposed in the magnet accommodating space MGUS.

[0124] The upper driving unit UDU may have a structure that allows the lower driving unit LDU crossing the upper driving unit UDU to be easily moved. For example, the width of the upper barrier wall UDU-W in the second direction DR2 may be substantially equal to or less than the distance between the lower barrier walls LDU-W included in one lower driving unit LDU and adjacent to each other in the second direction DR2 (refer to Figure 5B According to an embodiment, the height of the upper barrier wall UDU-W in the third direction DR3 may be substantially equal to or less than the distance between the upper support member UDU-S and the lower support member LDU-S in the third direction DR3 (refer to Figure 5B ).

[0125] The lower driving unit LDU may have a structure that allows the upper driving unit UDU crossing the lower driving unit LDU to be easily moved. For example, the width of the lower barrier wall LDU-W in the first direction DR1 may be substantially equal to or smaller than the distance between the upper barrier walls UDU-W included in one upper driving unit UDU and adjacent to each other in the first direction DR1 (refer to Figure 5B According to an embodiment, the height of the lower barrier wall LDU-W in the third direction DR3 may be substantially equal to or less than the distance between the lower support LDU-S and the upper support UDU-S in the third direction DR3 (refer to Figure 5B ).

[0126] Reference Figure 5A , at least a portion of the magnet unit MGU may be in contact with the upper second surface UDU-S2 (refer to Figure 4 ) contacts, however, the disclosure should not be limited thereto or thereby.

[0127] At least a portion of the magnet unit MGU may be in contact with the lower drive unit LDU. In a case where the lower support LDU-S is in contact with the portion of the magnet unit MGU, the lower support LDU-S may provide a normal force to the magnet unit MGU.

[0128] Reference Figure 5B and Figure 5C , the distance between the lower supports LDU-S in the first direction DR1 may be smaller than the width of the magnet unit MGU in the first direction DR1. Therefore, when the magnet unit MGU moves along the first direction DR1, the magnet unit MGU may be supported by the lower supports LDU-S.

[0129] Figure 5D is a perspective view of the second board PT2 and the upper drive unit UDU. Figure 5D An embodiment of an upper driving unit UDU combined with a second board PT2 is shown.

[0130] The lower surface of the second plate PT2 may include a first surface UDU-S1 (refer to Figure 2 and Figure 3 ) is combined with the first combination member R1. The first surface UDU-S1 (refer to Figure 2 and Figure 3 ) may include a second coupling member R2 coupled to the second plate PT2 and moving on the second plate PT2. The first coupling member R1 may be a guide rail having a guide groove defined thereon. The guide groove may extend in an extension direction of the upper drive unit UDU coupled to the guide groove. For example, the guide groove may extend in the first direction DR1. The second coupling member R2 may correspond to a guide groove coupling member that moves along the guide rail. The upper drive unit UDU may move along the guide rail extending in the first direction DR1 in a direction parallel to the first direction DR1. However, the structures of the first coupling member R1 and the second coupling member R2 should not be particularly limited as long as the first coupling member R1 and the second coupling member R2 are coupled to each other to enable the upper drive unit UDU to move on the lower surface of the second plate PT2.

[0131] The first coupling member R1 of the lower surface of the second plate PT2 may be provided in a plurality corresponding to the number of upper drive units UDU coupled to the second plate PT2. Each of the upper drive units UDU may include a second coupling member R2 coupled to the first coupling member R1 stacked in a plan view. The upper drive units UDU may be coupled to the first coupling members R1, respectively. As a result, the upper drive units UDU may be independently movable in the first direction DR1.

[0132] Similarly, the lower drive unit LDU (refer to Figure 3 ) can be connected with the first plate PT1 (refer to Figure 3 ) combination movement. The first plate PT1 (refer to Figure 3 ) may include an upper surface that is connected to the lower first surface LDU-S1 (refer to Figure 4 ) is combined with a third combination member (not shown). Figure 4 ) may include a first plate PT1 (reference Figure 3 ) and combined with the first plate PT1 (reference Figure 3 ). The third coupling member (not shown) may correspond to a guide rail having a guide groove defined thereon. The fourth coupling member (not shown) may correspond to a guide groove coupling member of the movable guide rail. However, the structures of the third coupling member and the fourth coupling member should not be particularly limited as long as the third coupling member and the fourth coupling member are coupled to each other so that the lower drive unit LDU (refer to Figure 3 ) on the first plate PT1 (refer to Figure 3 ) on the upper surface.

[0133] 6A to 6F is a plan view showing the arrangement of the magnet unit MGU according to the movement of the drive unit.

[0134] Reference 6A to 6F The magnet unit placement plane MUAP on which the magnet unit MGU is arranged may be defined on the first plate PT1 (refer to Figure 3 ) and the second plate PT2 (refer to Figure 3 The magnet unit placement plane MUAP may include a first area A1 and a second area A2.

[0135] In a plan view, the first area A1 may be aligned with the mask MM (see Figure 1 ) is overlapped. In a plan view, the first area A1 may overlap with the mask opening SOP (refer to Figure 1 ) is overlapped. In a plan view, the second area A2 may overlap with the mask frame MFS (refer to Figure 1 In a plan view, the second area A2 may surround the first area A1.

[0136] The second area A2 may include a second-first area A2-1, a second-second area A2-2, a second-third area A2-3, and a second-fourth area A2-4. The second-first area A2-1 and the second-third area A2-3 may extend in the second direction DR2. The second-second area A2-2 and the second-fourth area A2-4 may extend in the first direction DR1.

[0137] In a plan view, the second-first area A2-1 and the second-third area A2-3 may be disposed to be respectively adjacent to the second plate PT2 (refer to Figure 3) are adjacent to the edges of the second plate PT2 (see FIG. 1 ) that are opposite to each other in the first direction DR1. In a plan view, the second-second region A2-2 and the second-fourth region A2-4 may be disposed adjacent to the second plate PT2 (see FIG. 1 ). Figure 3 ) are adjacent to edges of the PCB that are opposite to each other in the second direction DR2.

[0138] The second-first region A2-1 and the second-third region A2-3 may be arranged in the first direction DR1 such that the first region A1 is interposed between the second-first region A2-1 and the second-third region A2-3. The second-second region A2-2 and the second-fourth region A2-4 may be arranged in the second direction DR2 such that the first region A1 is interposed between the second-second region A2-2 and the second-fourth region A2-4.

[0139] Reference Fig. 6A , for convenience of explanation, the lower driving unit LDU closest to the second-third area A2-3 will be referred to as a first lower driving unit LDU, and the lower driving units LDUs sequentially arranged from the first lower driving unit LDU to the first direction DR1 will be referred to as a second lower driving unit LDU, a third lower driving unit LDU, a fourth lower driving unit LDU, a fifth lower driving unit LDU, a sixth lower driving unit LDU, and a seventh lower driving unit LDU, respectively. Fig. 6A , a region corresponding to the first lower driving unit LDU is shown by a thick solid line. The magnet units MGU overlapping the nth lower driving unit LDU in a plan view among the first to seventh lower driving units LDU will be referred to as nth row magnet units MGU.

[0140] For ease of explanation, the upper driving unit UDU disposed closest to the second to fourth areas A2-4 will be referred to as a first upper driving unit UDU, and the upper driving units UDU sequentially arranged from the first upper driving unit UDU in a direction opposite to the second direction DR2 will be referred to as a second upper driving unit UDU, a third upper driving unit UDU, a fourth upper driving unit UDU, a fifth upper driving unit UDU, a sixth upper driving unit UDU, and a seventh upper driving unit UDU, respectively. Fig. 6A , a region corresponding to the first upper driving unit UDU is shown by a thick solid line. A magnet unit MGU overlapping the m-th upper driving unit UDU in a plan view among the first to seventh upper driving units UDU will be referred to as an m-th column magnet unit MGU.

[0141] Fig. 6ASeven upper drive units UDU and seven lower drive units LDU are shown as an embodiment, however, the number of upper drive units UDU and the number of lower drive units LDU provided in the magnet unit placement plane MUAP should not be limited thereto or thereby. The number of upper drive units UDU may be different from the number of lower drive units LDU.

[0142] 6A to 6F Only the second plate PT2 (refer to Figure 5B ) The polarity of the magnet units MGU on the adjacent surfaces, and 49 magnet units MGU are shown. However, this is merely an embodiment, and the number of magnet units MGU should not be limited to or thereby.

[0143] The upper driving unit UDU and the lower driving unit LDU may operate in a plurality of modes to change the arrangement of the magnet unit MGU. For example, the upper driving unit UDU and the lower driving unit LDU may operate in a first mode, a second mode, and a third mode.

[0144] Fig. 6A 2 shows the arrangement of the magnet unit MGU corresponding to the first mode. Fig. 6A The first mode may correspond to the deposition device PDA (refer to Figure 3 ) sets the mask MM (refer to Figure 3 In the first mode, the first to seventh upper driving units UDU to UDU may be aligned in the second direction DR2, and the first to seventh lower driving units LDU to LDU may be aligned in the first direction DR1.

[0145] In the first mode, the first magnet unit MGU1 and the second magnet unit MGU2 may be arranged alternately in the first direction DR1 and the second direction DR2. For example, the first row of magnet units MGU may include the first magnet unit MGU1 and the second magnet unit MGU2 arranged alternately with the first magnet unit MGU1 in the second direction DR2. The first column of magnet units MGU may include the first magnet unit MGU1 and the second magnet unit MGU2 arranged alternately with the first magnet unit MGU1 in the first direction DR1.

[0146] The arrangement of the magnet unit MGU may be changed by moving the upper drive unit UDU or the lower drive unit LDU. For example, the upper drive unit UDU or the lower drive unit LDU may be arranged according to the mask MM (refer to Figure 1 ) moves in the extension direction, thereby, the alignment direction of the magnet unit MGU can be changed. FIG. 6B to FIG. 6FArrangement of the magnet unit MGU according to the movement of the upper drive unit UDU or the lower drive unit LDU is shown, and the upper drive unit UDU or the lower drive unit LDU after the movement is schematically shown with a thick solid line.

[0147] Figure 6B and Figure 6C An arrangement of the magnet unit MGU in a case where the first mode is changed to the third mode is shown.

[0148] Reference Figure 6B , in the process of changing the first mode to the third mode, the even-numbered lower drive units LDU of the first to seventh lower drive units LDU may move in a direction parallel to the second direction DR2. In the following description, the direction of movement is shown by arrows. For example, the second lower drive unit LDU, the fourth lower drive unit LDU, and the sixth lower drive unit LDU may move in a direction opposite to the second direction DR2, however, this is merely an embodiment. According to an embodiment, the second lower drive unit LDU, the fourth lower drive unit LDU, and the sixth lower drive unit LDU may move in the second direction DR2 according to the magnet unit placement plane MUAP.

[0149] When the second lower drive unit LDU, the fourth lower drive unit LDU and the sixth lower drive unit LDU move in a direction opposite to the second direction DR2, the lower barrier wall LDU-W of the second lower drive unit LDU, the fourth lower drive unit LDU and the sixth lower drive unit LDU may apply a force to push the second row of magnet units MGU, the fourth row of magnet units MGU and the sixth row of magnet units MGU in a direction opposite to the second direction DR2. As a result, the arrangement of the second row of magnet units MGU, the fourth row of magnet units MGU and the sixth row of magnet units MGU may be changed in a direction opposite to the second direction DR2. Therefore, the magnet unit MGU disposed at the leftmost position of the second row of magnet units MGU, the fourth row of magnet units MGU and the sixth row of magnet units MGU located in the first area A1 in the first mode may overlap with the second-second area A2-2 in the third mode.

[0150] In the third mode according to the movement of the second lower drive unit LDU, the fourth lower drive unit LDU, and the sixth lower drive unit LDU, the magnet unit MGU arranged in the odd columns may include the first magnet unit MGU1, and the magnet unit MGU arranged in the even columns may include the second magnet unit MGU2. For example, the first magnet unit MGU1 may correspond to the first column magnet unit MGU, the third column magnet unit MGU, the fifth column magnet unit MGU, and the seventh column magnet unit MGU, and the second magnet unit MGU2 may correspond to the second column magnet unit MGU, the fourth column magnet unit MGU, and the sixth column magnet unit MGU.

[0151] In the third mode, the first magnet unit MGU1 may be arranged alternately with the second magnet unit MGU2 in the second direction DR2. For example, each of the first to seventh rows of magnet units MGU overlapping the first to seventh lower drive units LDU to LDU, respectively, may correspond to the first magnet unit MGU1 and the second magnet unit MGU2 arranged alternately with the first magnet unit MGU1 in the second direction DR2.

[0152] Reference Figure 6C , in the process of changing the first mode to the third mode, the odd-numbered lower drive units LDU of the first to seventh lower drive units LDU may move in a direction parallel to the second direction DR2. For example, the first, third, fifth, and seventh lower drive units LDU may move in a direction opposite to the second direction DR2, however, this is merely an embodiment. According to an embodiment, the first, third, fifth, and seventh lower drive units LDU may move in the second direction DR2 according to the magnet unit placement plane MUAP.

[0153] When the first lower drive unit LDU, the third lower drive unit LDU, the fifth lower drive unit LDU and the seventh lower drive unit LDU move in a direction opposite to the second direction DR2, the lower barrier wall LDU-W of the first lower drive unit LDU, the third lower drive unit LDU, the fifth lower drive unit LDU and the seventh lower drive unit LDU may apply a force to push the first row of magnet units MGU, the third row of magnet units MGU, the fifth row of magnet units MGU and the seventh row of magnet units MGU in a direction opposite to the second direction DR2. As a result, the arrangement of the first row of magnet units MGU, the third row of magnet units MGU, the fifth row of magnet units MGU and the seventh row of magnet units MGU may be changed in a direction opposite to the second direction DR2. Therefore, the magnet unit MGU disposed at the leftmost position of the first row of magnet units MGU, the third row of magnet units MGU, the fifth row of magnet units MGU and the seventh row of magnet units MGU located in the first area A1 in the first mode may overlap with the second-second area A2-2 in the third mode.

[0154] In the third mode according to the movement of the first lower drive unit LDU, the third lower drive unit LDU, the fifth lower drive unit LDU, and the seventh lower drive unit LDU, the magnet unit MGU arranged in the odd columns may include the second magnet unit MGU2, and the magnet unit MGU arranged in the even columns may include the first magnet unit MGU1. For example, the second magnet unit MGU2 may correspond to the first column magnet unit MGU, the third column magnet unit MGU, the fifth column magnet unit MGU, and the seventh column magnet unit MGU, and the first magnet unit MGU1 may correspond to the second column magnet unit MGU, the fourth column magnet unit MGU, and the sixth column magnet unit MGU.

[0155] In the third mode, the first magnet unit MGU1 may be arranged alternately with the second magnet unit MGU2 in the second direction DR2. For example, each of the first to seventh rows of magnet units MGU overlapping the first to seventh lower drive units LDU to LDU, respectively, may correspond to the first magnet unit MGU1 and the second magnet unit MGU2 arranged alternately with the first magnet unit MGU1 in the second direction DR2.

[0156] Reference Figure 6B and Figure 6C In the third mode, the magnet units MGU having the same polarity direction may be aligned in the first direction DR1. For example, in the third mode, the alignment direction of the magnet units MGU may correspond to the first direction DR1. In the mask MM (refer to Figure 1 ) is parallel to the second direction DR2, the lower drive unit LDU can move to align the magnet unit MGU in the third mode. Figure 1 )'s extension direction intersects, thereby preventing the mask MM (refer to Figure 1 ) and the repulsive force generated locally between the magnet unit MGU.

[0157] Fig.6D and Fig. 6E The arrangement of the magnet unit MGU in the case where the first mode is changed to the second mode is shown.

[0158] Reference Fig.6D, in the process of changing the first mode to the second mode, the even-numbered upper drive units UDU of the first to seventh upper drive units UDU may move in a direction parallel to the first direction DR1. For example, the second upper drive unit UDU, the fourth upper drive unit UDU, and the sixth upper drive unit UDU may move in the first direction DR1, however, this is merely an embodiment. According to an embodiment, the second upper drive unit UDU, the fourth upper drive unit UDU, and the sixth upper drive unit UDU may move in a direction opposite to the first direction DR1 according to the magnet unit placement plane MUAP.

[0159] When the second upper drive unit UDU, the fourth upper drive unit UDU and the sixth upper drive unit UDU move in the first direction DR1, the upper blocking wall UDU-W of the second upper drive unit UDU, the fourth upper drive unit UDU and the sixth upper drive unit UDU can apply a force to push the second column magnet unit MGU, the fourth column magnet unit MGU and the sixth column magnet unit MGU in the first direction DR1. As a result, the arrangement of the second column magnet unit MGU, the fourth column magnet unit MGU and the sixth column magnet unit MGU can be changed toward the first direction DR1. Therefore, the magnet unit MGU at the uppermost position of the second column magnet unit MGU, the fourth column magnet unit MGU and the sixth column magnet unit MGU located in the first area A1 in the first mode can overlap with the second-first area A2-1 in the second mode.

[0160] In the second mode according to the movement of the second upper drive unit UDU, the fourth upper drive unit UDU, and the sixth upper drive unit UDU, the magnet units MGU arranged in the odd rows may include the first magnet units MGU1, and the magnet units MGU arranged in the even rows may include the second magnet units MGU2. For example, the first magnet unit MGU1 may correspond to the first row of magnet units MGU, the third row of magnet units MGU, the fifth row of magnet units MGU, and the seventh row of magnet units MGU, and the second magnet unit MGU2 may correspond to the second row of magnet units MGU, the fourth row of magnet units MGU, and the sixth row of magnet units MGU.

[0161] In the second mode, the first magnet unit MGU1 may be arranged alternately with the second magnet unit MGU2 in the first direction DR1. For example, each of the first to seventh columns of magnet units MGU overlapping the first to seventh upper drive units UDU to UDU, respectively, may correspond to the first magnet unit MGU1 and the second magnet unit MGU2 arranged alternately with the first magnet unit MGU1 in the first direction DR1.

[0162] Reference Fig. 6E, in the process of changing the first mode to the second mode, the odd-numbered upper drive units UDU from the first to the seventh upper drive units UDU may move in a direction parallel to the first direction DR1. For example, the first upper drive unit UDU, the third upper drive unit UDU, the fifth upper drive unit UDU, and the seventh upper drive unit UDU may move in the first direction DR1, however, this is merely an embodiment. According to an embodiment, the first upper drive unit UDU, the third upper drive unit UDU, the fifth upper drive unit UDU, and the seventh upper drive unit UDU may move in a direction opposite to the first direction DR1 according to the magnet unit placement plane MUAP.

[0163] When the first upper drive unit UDU, the third upper drive unit UDU, the fifth upper drive unit UDU and the seventh upper drive unit UDU move in the first direction DR1, the upper blocking wall UDU-W of the first upper drive unit UDU, the third upper drive unit UDU, the fifth upper drive unit UDU and the seventh upper drive unit UDU can apply a force to push the first column of magnet units MGU, the third column of magnet units MGU, the fifth column of magnet units MGU and the seventh column of magnet units MGU in the first direction DR1. As a result, the arrangement of the first column of magnet units MGU, the third column of magnet units MGU, the fifth column of magnet units MGU and the seventh column of magnet units MGU can be changed toward the first direction DR1. Therefore, the magnet unit MGU at the uppermost position of the first column of magnet units MGU, the third column of magnet units MGU, the fifth column of magnet units MGU and the seventh column of magnet units MGU located in the first area A1 in the first mode can overlap with the second-first area A2-1 in the second mode.

[0164] In the second mode according to the movement of the first upper drive unit UDU, the third upper drive unit UDU, the fifth upper drive unit UDU, and the seventh upper drive unit UDU, the magnet unit MGU of the odd-numbered rows may include the second magnet unit MGU2, and the magnet unit MGU of the even-numbered rows may include the first magnet unit MGU1. For example, the second magnet unit MGU2 may correspond to the first row of magnet units MGU, the third row of magnet units MGU, the fifth row of magnet units MGU, and the seventh row of magnet units MGU, and the first magnet unit MGU1 may correspond to the second row of magnet units MGU, the fourth row of magnet units MGU, and the sixth row of magnet units MGU.

[0165] In the second mode, the first magnet unit MGU1 may be arranged alternately with the second magnet unit MGU2 in the first direction DR1. For example, each of the first to seventh columns of magnet units MGU overlapping the first to seventh upper drive units UDU to UDU, respectively, may correspond to the first magnet unit MGU1 and the second magnet unit MGU2 arranged alternately with the first magnet unit MGU1 in the first direction DR1.

[0166] Reference Fig.6D and Fig. 6E In the second mode, the magnet units MGU may be aligned to have the same polarity direction in the second direction DR2. For example, in the second mode, the alignment direction of the magnet units MGU may correspond to the second direction DR2. Figure 1 ) is parallel to the first direction DR1, the upper drive unit UDU can move to align the magnet unit MGU in the second mode. Figure 1 )'s extension direction intersects, thereby preventing the mask MM (refer to Figure 1 ) and the repulsive force generated locally between the magnet unit MGU.

[0167] Fig. 6F Movement of the lower drive unit LDU to change the operation mode from the third mode to the first mode is schematically illustrated. Fig. 6F A state corresponding to the third mode converted from the first mode by moving the second lower driving unit LDU, the fourth lower driving unit LDU, and the sixth lower driving unit LDU in a direction opposite to the second direction DR2 is shown. Fig. 6F , the second lower driving unit LDU, the fourth lower driving unit LDU, and the sixth lower driving unit LDU may move in the second direction DR2 to change the third mode to the first mode again. Fig. 6F After the second lower driving unit LDU, the fourth lower driving unit LDU, and the sixth lower driving unit LDU move in the second direction DR2, the arrangement of the magnet unit MGU may correspond to Fig. 6A The arrangement of the magnet unit MGU is shown in .

[0168] Similarly, in the case where the previously moved upper drive unit UDU or lower drive unit LDU moves again in the direction opposite to the previous moving direction to switch the operation mode, the arrangement of the magnet unit MGU can be changed to the first mode (refer to Fig. 6A ). In a state where the arrangement of the magnet unit MGU corresponds to the first mode, the deposition device PDA (refer to Figure 1 ) of the mask MM (refer to Figure 1) to select the second mode or the third mode to move the upper drive unit UDU or the lower drive unit LDU. The arrangement of the magnet unit MGU can be easily changed to the first mode, the second mode or the third mode using the upper drive unit UDU and the lower drive unit LDU.

[0169] Fig. 7A and Figure 7B is a schematic cross-sectional view of a deposition apparatus PDA according to a disclosed embodiment.

[0170] Fig. 7A It is along Figure 1 Schematic cross-sectional view of the deposition device PDA taken along line II'. Figure 7B It is along Figure 1 Schematic cross-sectional view of the deposition device PDA taken along line II-II'. Figure 3 Different from the embodiment shown in Fig. 7A and Figure 7B The arrangement of the magnet units MGU shown in FIG. 1 may correspond to the third mode obtained by moving some of the lower drive units LDU (see FIG. 1 ). Figure 6B and Figure 6C ).

[0171] Reference Fig. 7A and Figure 7B , the extension direction of the mask MM set in the deposition device PDA may be substantially parallel to the second direction DR2. Considering the extension direction of the mask MM, the lower driving unit LDU may move the magnet unit MGU so that the alignment direction of the magnet unit MGU is parallel to the first direction DR1. As a result, the repulsive force locally generated between the mask MM and the magnet unit MGU may be prevented, and the substrate SUB may be closely attached to the mask MM to prevent the substrate SUB from being separated.

[0172] Similarly, the extension direction of the mask MM disposed in the deposition apparatus PDA may be substantially parallel to the first direction DR1, and as shown in FIG. Fig.6D and Fig. 6E The upper driving unit UDU shown in FIG. 1 can move the magnet unit MGU so that the alignment direction of the magnet unit MGU is parallel to the second direction DR2. As a result, the repulsive force locally generated between the mask MM and the magnet unit MGU can be prevented, and the substrate SUB can be closely attached to the mask MM to prevent the substrate SUB from being separated.

[0173] As described above, the alignment of the magnet unit MGU can be easily and quickly changed according to various shapes of the mask MM. Therefore, defects in the deposition of the substrate SUB can be prevented, and the time and cost required for the deposition process can be reduced. Since the reliability of the deposition process is improved, the reliability of the display panel manufactured by the deposition process can be improved.

[0174] Figure 8 is a deposition apparatus PDA (see Figure 1 ) is a plan view of the display panel DP manufactured.

[0175] Reference Figure 8 The display panel DP may have a rectangular shape defined by short sides extending in the first direction DR1 and long sides extending in the second direction DR2 in a plan view, however, the shape of the display panel DP should not be limited to the rectangular shape. The display panel DP may include a display portion DA and a non-display portion NDA adjacent to (e.g., surrounding) the display portion DA.

[0176] The display panel DP may be a light-emitting display panel. For example, the display panel DP may be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of the organic light-emitting display panel may include an organic light-emitting material. The light-emitting layer of the quantum dot light-emitting display panel may include quantum dots or quantum rods. Hereinafter, an embodiment of the organic light-emitting display panel as the display panel DP will be described.

[0177] The display panel DP may include a plurality of pixels PX, a plurality of scan lines SL1 to SLm, a plurality of data lines DL1 to DLn, a plurality of emission lines EL1 to ELm, first and second control lines CSL1 and CSL2, first and second power lines PL1 and PL2, connection lines CNL, and a plurality of pads (or referred to as "pads") PD. Each of "m" and "n" may be a positive integer.

[0178] The pixels PX may be arranged in the display portion DA. The scan driver SDV and the emission driver EDV may be disposed in the non-display portion NDA adjacent to the long sides of the display panel DP. The data driver DDV may be disposed in the non-display portion NDA adjacent to one of the short sides of the display panel DP. In a plan view, the data driver DDV may be disposed adjacent to the lower end of the display panel DP.

[0179] The scan lines SL1 to SLm may extend in a first direction DR1 and may be connected to the pixels PX and the scan driver SDV. The data lines DL1 to DLn may extend in a second direction DR2 and may be connected to the pixels PX and the data driver DDV. The emission lines EL1 to ELm may extend in a direction parallel to the first direction DR1 and may be connected to the pixels PX and the emission driver EDV.

[0180] The first power line PL1 may extend in the second direction DR2 and may be disposed in the non-display portion NDA. The first power line PL1 may be disposed between the display portion DA and the emission driver EDV, however, the disclosure should not be limited thereto or thereby. According to an embodiment, the first power line PL1 may be disposed between the display portion DA and the scan driver SDV.

[0181] The connection line CNL may extend in the first direction DR1 and may be arranged in the second direction DR2. The connection line CNL may be connected to the first power line PL1 and the pixel PX. The first voltage may be applied to the pixel PX through the first power line PL1 and the connection line CNL connected to the first power line PL1.

[0182] The second power line PL2 may be disposed in the non-display portion NDA. The second power line PL2 may extend along a long side of the display panel DP and another short side of the display panel DP where the data driver DDV is not disposed. The second power line PL2 may be disposed outside the scan driver SDV and the emission driver EDV.

[0183] Although not shown in the drawings, the second power line PL2 may extend to the display portion DA and may be connected to the pixel PX. A second voltage having a level lower than that of the first voltage may be applied to the pixel PX through the second power line PL2.

[0184] The first control line CSL1 may be connected to the scan driver SDV and may extend toward the lower end of the display panel DP in a plan view. The second control line CSL2 may be connected to the emission driver EDV and may extend toward the lower end of the display panel DP in a plan view. The data driver DDV may be disposed between the first control line CSL1 and the second control line CSL2.

[0185] The pad PD may be disposed on the display panel DP. The pad PD may be disposed closer to the lower end of the display panel DP than the data driver DDV. The data driver DDV, the first power line PL1, the second power line PL2, the first control line CSL1, and the second control line CSL2 may be connected to the pad PD. The data lines DL1 to DLn may be connected to the data driver DDV, and the data driver DDV may be connected to the pad PD corresponding to the data lines DL1 to DLn.

[0186] Although not shown in the drawings, a timing controller for controlling the operation of the scan driver SDV, the data driver DDV, and the emission driver EDV and a voltage generator for generating the first voltage and the second voltage may be provided on the printed circuit board. The timing controller and the voltage generator may be connected to the corresponding pad PD through the printed circuit board.

[0187] The scan driver SDV may generate a plurality of scan signals, and the scan signals may be applied to the pixels PX through the scan lines SL1 to SLm. The data driver DDV may generate a plurality of data voltages, and the data voltages may be applied to the pixels PX through the data lines DL1 to DLn. The emission driver EDV may generate a plurality of emission signals, and the emission signals may be applied to the pixels PX through the emission lines EL1 to ELm.

[0188] The pixel PX may receive a data voltage in response to the scan signal. The pixel PX may emit light having brightness corresponding to the data voltage in response to the emission signal, and thus, an image may be displayed. The emission time of the pixel PX may be controlled by the emission signal.

[0189] Fig. 9 yes Figure 8 Schematic cross-sectional view of a pixel PX shown in FIG.

[0190] Reference Figure 8 and Fig. 9 , the pixel PX may be disposed on the base substrate BS and may include a transistor TR and a light emitting element OLED. For example, Fig. 9 One transistor TR is shown in FIG. 4 , however, the pixel PX may include a plurality of transistors and at least one capacitor to drive the light emitting element OLED.

[0191] The light emitting element OLED may include a first electrode AE, a second electrode CE, a hole control layer HCL, an electron control layer ECL, and a light emitting layer EML. The first electrode AE ​​may be an anode electrode, and the second electrode CE may be a cathode electrode.

[0192] The display part DA may include a light emitting area PA corresponding to each pixel PX and a non-light emitting area NPA surrounding the light emitting area PA. The light emitting element OLED may be disposed in the light emitting area PA.

[0193] The base substrate BS may include a flexible plastic substrate. For example, the base substrate BS may include transparent polyimide (PI). The buffer layer BFL may be disposed on the base substrate BS, and the buffer layer BFL may be an inorganic layer.

[0194] The semiconductor pattern may be disposed on the buffer layer BFL. The semiconductor pattern may include polysilicon, however, the disclosure should not be limited thereto or thereby. According to an embodiment, the semiconductor pattern may include amorphous silicon or metal oxide.

[0195] The semiconductor pattern may be doped with an N-type dopant or a P-type dopant. The semiconductor pattern may include a high-doping region and a low-doping region. The high-doping region may have a greater conductivity than the low-doping region and may be substantially used as a source electrode and a drain electrode of the transistor TR. The low-doping region may substantially correspond to an active region (or channel) of the transistor TR.

[0196] The source S, active area A, and drain D of the transistor TR may be formed of a semiconductor pattern. A first insulating layer INS1 may be disposed on the semiconductor pattern. A gate G of the transistor TR may be disposed on the first insulating layer INS1. In a cross-sectional view, the gate G may overlap the active area A. A second insulating layer INS2 may be disposed on the gate G. A third insulating layer INS3 may be disposed on the second insulating layer INS2.

[0197] The connection electrode CNE may be disposed between the transistor TR and the light emitting element OLED to connect the transistor TR to the light emitting element OLED. The connection electrode CNE may include a first connection electrode CNE1 and a second connection electrode CNE2.

[0198] The first connection electrode CNE1 may be disposed on the third insulating layer INS3 and may be connected to the drain D via a first contact hole CH1 defined through the first insulating layer INS1, the second insulating layer INS2, and the third insulating layer INS3. The fourth insulating layer INS4 may be disposed on the first connection electrode CNE1. The fifth insulating layer INS5 may be disposed on the fourth insulating layer INS4.

[0199] The second connection electrode CNE2 may be disposed on the fifth insulating layer INS5. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 via a second contact hole CH2 defined through the fourth insulating layer INS4 and the fifth insulating layer INS5. The sixth insulating layer INS6 may be disposed on the second connection electrode CNE2. Each of the first to sixth insulating layers INS1 to INS6 may be an inorganic layer or an organic layer.

[0200] The first electrode AE ​​may be disposed on the sixth insulating layer INS6. The first electrode AE ​​may be connected to the second connection electrode CNE2 via a third contact hole CH3 defined through the sixth insulating layer INS6. A pixel defining layer PDL may be disposed on the first electrode AE ​​and the sixth insulating layer INS6 to expose a portion of the first electrode AE. The pixel defining layer PDL may be provided with an opening PX_OP defined therethrough to expose the portion of the first electrode AE.

[0201] The hole control layer HCL may be disposed on the first electrode AE ​​and the pixel defining layer PDL. The hole control layer HCL may be commonly disposed in the emission area PA and the non-emission area NPA. The hole control layer HCL may include a hole transport layer and a hole injection layer.

[0202] The light emitting layer EML may be disposed on the hole control layer HCL. The light emitting layer EML may be disposed in a region corresponding to the opening PX_OP. The light emitting layer EML may include an organic material and / or an inorganic material. The light emitting layer EML may generate light having one of red, green, and blue colors.

[0203] The electron control layer ECL may be disposed on the light emitting layer EML and the hole control layer HCL. The electron control layer ECL may be commonly disposed in the light emitting area PA and the non-light emitting area NPA. The electron control layer ECL may include an electron transport layer and an electron injection layer.

[0204] The second electrode CE may be disposed on the electronic control layer ECL. The second electrode CE may be commonly disposed throughout the pixel PX. Each layer from the buffer layer BFL to the light emitting element OLED may be referred to as a pixel layer.

[0205] The thin film encapsulation layer TFE may be disposed on the light emitting element OLED. The thin film encapsulation layer TFE may be disposed on the second electrode CE and cover the pixel PX. The thin film encapsulation layer TFE may include at least two inorganic layers and an organic layer disposed between the inorganic layers. The inorganic layer may protect the pixel PX from moisture and oxygen. The organic layer may protect the pixel PX from foreign matter such as dust particles.

[0206] A first voltage may be applied to the first electrode AE ​​via the transistor TR, and a second voltage having a level lower than that of the first voltage may be applied to the second electrode CE. Holes and electrons injected into the light emitting layer EML may be recombined to generate excitons, and the light emitting element OLED may emit light by returning the excitons from an excited state to a ground state.

[0207] Fig.10 It is shown Fig. 9 A schematic cross-sectional view of a deposition process of a display panel shown in FIG.

[0208] The layers from the base substrate BS to the first electrode AE ​​may correspond to the substrate SUB (refer to Figure 1 ), however, the disclosure should not be limited thereto or thereby. According to an embodiment, the substrate SUB (refer to Figure 1 ) may vary depending on the object formed by the deposition process.

[0209] The mask MM may be arranged to face the substrate SUB (see Figure 1) to form the light emitting layer EML through a deposition process. The mask MM may be disposed adjacent to the substrate SUB.

[0210] The deposition material DPM may be a gaseous material used in a deposition process of the display panel. For example, the deposition material DPM may be a gaseous material forming the light emitting layer EML of the display device. The deposition material DPM may be provided on the substrate SUB (refer to Figure 1 ). The deposition material DPM can be used on the substrate SUB (refer to Figure 1 ) is formed on a light-emitting layer EML.

[0211] The above description is an example of the disclosed technical features, and those skilled in the art will be able to make various modifications and changes. Therefore, the above disclosed embodiments can be implemented individually or in combination with each other.

[0212] Therefore, the embodiments disclosed in the disclosure are not intended to limit the disclosed technical spirit, but to describe the disclosed technical spirit, and the scope of the disclosed technical spirit is not limited by these embodiments. The disclosed protection scope should be interpreted by the attached claims, and should be interpreted as all technical spirits within the equivalent scope are included in the disclosed scope.

Claims

1. A deposition device, characterized in that: The deposition device comprises: Mask frame; A plurality of masks are arranged on the mask frame; a first plate, disposed on the mask; a second plate, disposed on the first plate; A plurality of upper drive units are disposed between the first plate and the second plate; a plurality of lower driving units disposed between the plurality of upper driving units and the first plate; and A plurality of magnet units are respectively arranged in the magnet unit accommodating spaces, wherein: The plurality of upper driving units extend in a first direction and are arranged in a second direction crossing the first direction, The plurality of lower driving units extend in the second direction and are arranged in the first direction, Each of the plurality of upper driving units includes an upper support and a plurality of upper blocking walls provided on a lower surface of the upper support, Each of the plurality of lower driving units includes a lower support and a plurality of lower blocking walls provided on an upper surface of the lower support, and Each of the magnet unit accommodating spaces is a space between the plurality of upper barrier walls adjacent to each other in the first direction and the plurality of lower barrier walls adjacent to each other in the second direction.

2. The deposition device according to claim 1, characterized in that: Each of the plurality of upper driving units independently moves in a direction parallel to the first direction, and The plurality of magnet units overlapped with the plurality of upper driving units in a plane are moved in the direction parallel to the first direction by moving the plurality of upper driving units.

3. The deposition device according to claim 2, characterized in that: A guide rail is formed on a lower surface of the second plate, a guide groove extending in the first direction is defined on the guide rail, and A guide groove combining member is formed on a first surface of the plurality of upper driving units to move along the guide rail.

4. The deposition device according to claim 1, characterized in that: Each of the plurality of lower driving units independently moves in a direction parallel to the second direction, and The plurality of magnet units overlapped with the plurality of lower driving units in a plane are moved in the direction parallel to the second direction by moving the plurality of lower driving units.

5. The deposition device according to claim 4, characterized in that: A guide rail is formed on an upper surface of the first plate, a guide groove extending in the second direction is defined on the guide rail, and A guide groove combining member is formed on first surfaces of the plurality of lower driving units to move along the guide rail.

6. The deposition device according to claim 1, characterized in that: The plurality of magnet units include a first magnet unit and a second magnet unit having a polarity direction different from that of the first magnet unit, The plurality of upper driving units and the plurality of lower driving units operate in a first mode, a second mode, or a third mode, and In the first mode, the first magnet units and the second magnet units are alternately arranged in the first direction and the second direction.

7. The deposition device according to claim 6, characterized in that changing the first mode to the second mode by moving the plurality of upper drive units, In the second mode, magnet units of the same type among the first magnet units and the second magnet units are arranged in the second direction, and In the second mode, the first magnet units and the second magnet units are alternately arranged in the first direction.

8. The deposition device according to claim 7, characterized in that: The plurality of masks extend in the first direction and are arranged in the second direction.

9. The deposition device according to claim 6, characterized in that: changing the first mode to the third mode by moving the plurality of lower driving units, In the third mode, the same type of magnet units among the first magnet units and the second magnet units are arranged in the first direction, and In the third mode, the first magnet units and the second magnet units are alternately arranged in the second direction.

10. The deposition device according to claim 9, characterized in that The plurality of masks extend in the second direction and are arranged in the first direction.

11. The deposition device according to claim 1, characterized in that: The plurality of upper driving units include a magnetic substance.

12. The deposition device according to claim 11, characterized in that The magnetic substance is metal.

13. The deposition device according to claim 11, characterized in that The plurality of magnet units are respectively attached to the plurality of upper driving units stacked in a plane through attractive forces caused by magnetic forces of the plurality of upper driving units.

14. The deposition device according to claim 1, characterized in that The plurality of lower driving units are made of a non-magnetic material.

15. The deposition device according to claim 1, characterized in that The first plate comprises a cooling plate.

16. The deposition device according to claim 1, characterized in that The first plate includes an electrostatic chuck.

17. The deposition apparatus according to claim 1, characterized in that The deposition device also includes: A drive unit connected to the second plate, Wherein, the driving unit moves in a direction parallel to a third direction, and the third direction intersects each of the first direction and the second direction.

18. The deposition apparatus according to claim 1, characterized in that Each of the plurality of magnet units has a cubic shape.

19. The deposition apparatus according to claim 1, characterized in that The plurality of upper barrier walls are arranged at regular intervals in the first direction.

20. The deposition apparatus according to claim 1, characterized in that The plurality of lower barrier walls are arranged at regular intervals in the second direction.

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