Novel intelligent door lock control mainboard

Abstract

The utility model relates to an electronic door lock, in particular to a novel intelligent door lock control mainboard which comprises a control mainboard body, a mounting box is sleeved outside the control mainboard body, and pouring sealant is filled in the mounting box. The bottom of the mounting box is connected with a heat dissipation fixing piece with a J-shaped hollow section, a plurality of fans are fixedly arranged at one end of the heat dissipation fixing piece, an air supply outlet is formed in the other end of the heat dissipation fixing piece and located above the horizontal plane of the upper surface of the mounting box, and a plurality of air supply holes are formed in the side wall, adjacent to the bottom of the mounting box, of the heat dissipation fixing piece; according to the utility model, vibration can be effectively buffered, heat dissipation conditions are enhanced, the service life of equipment is prolonged, loosening or separation of electrical devices is avoided, and normal use of the device is ensured.

Description

Technical Field

[0001] The utility model relates to an electronic door lock, in particular to a novel intelligent door lock control mainboard. Background Art

[0002] Smart door locks are widely accepted by the market for their fast unlocking and key-free convenience. Smart door locks contain a control motherboard for controlling the lock body. The existing control motherboard is fixed inside the shell of the smart door lock. When people open and close the door, they open and close the door body at will and generally do not control the force, causing the door body to often hit the door frame or wall with great force, thereby causing the smart door lock to vibrate. During long-term use, the control motherboard fixedly installed inside the smart door lock will also vibrate, causing the electrical components on the existing control motherboard to become loose or detached, affecting the normal use of the door lock. At the same time, since the existing control motherboard is installed inside a closed shell with a closed space and the internal air does not flow, a large amount of heat generated during the operation of the control motherboard causes the internal temperature to rise. Long-term operation in a high-temperature environment accelerates the aging of electrical components and shortens the service life of the control motherboard.

[0003] Therefore, there is an urgent need for a new type of door lock control mainboard, which can effectively buffer vibration, enhance heat dissipation conditions, extend the service life of the equipment, avoid loosening or detachment of electrical components, and ensure the normal use of the device. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides a new intelligent door lock control mainboard, which can effectively buffer vibration, enhance heat dissipation conditions, extend the service life of the equipment, avoid loosening or detachment of electrical components, and ensure the normal use of the device.

[0005] The utility model adopts the following technical solutions:

[0006] A novel intelligent door lock control mainboard comprises a control mainboard body, an outer cover of the control mainboard body is provided with an installation box, and the installation box is filled with potting glue; a heat dissipation fixture with a J-shaped hollow structure is connected to the bottom of the installation box, a plurality of fans are fixedly provided at one end of the heat dissipation fixture, and an air supply port is opened at the other end, the air supply port is located above the horizontal plane of the upper surface of the installation box, and a plurality of air supply holes are opened on the side wall of the heat dissipation fixture adjacent to the bottom of the installation box.

[0007] Furthermore, the outer side of the heat dissipation fixture is provided with a first fixing plate fixed to the installation box and a second fixing plate for fixing to the outside world; the installation box and the first fixing plate are fixedly connected by bolts, and rubber buffers with hollow circular ring structures are provided on the upper and lower surfaces of the installation box on the bolt sleeves.

[0008] Furthermore, an MCU module and a temperature sensing module are provided on the main body of the control motherboard. The MCU module is electrically connected to the temperature sensing module and the fan respectively. The temperature sensing module sets a threshold value. The MCU module controls the fan speed by linking the temperature sensing module and the fan.

[0009] Preferably, in order to enhance control accuracy and save energy consumption, the fan adopts a servo fan, the MCU module is STM8S003F3P6, the potting glue is a flame retardant thermal conductive potting glue, the thermal conductivity is 2-3W / mK, and the flame retardant level is V-0. A plurality of baffles are provided in the lateral direction of the upper surface of the installation box.

[0010] From the above description of the structure of the utility model, it can be seen that compared with the prior art, the utility model has the following advantages: 1. The control main board of the utility model is fixed on the installation box, and the installation box is filled with potting glue. The upper and lower surfaces of the installation box are provided with rubber buffers fixed on the first fixing plate of the heat dissipation fixing member, and fixed on the housing of the smart door lock through the second fixing plate, thereby alleviating the vibration of the control main board when the door body is opened and closed, avoiding the loosening or detachment of the electrical components on the control main board, and extending the service life of the device; 2. The utility model uses a J-shaped heat dissipation fixing member and a fan to enable the wind body to realize the flow of air on the upper and lower surfaces of the installation box through the air supply port and the air supply hole, thereby realizing the heat dissipation, reducing the ambient temperature, and ensuring the service life of the device. At the same time, the temperature is monitored by setting a temperature sensing module. Through the linkage control of the MCU module, the temperature sensing module and the fan, the higher the ambient temperature, the MCU module controls the speed of the fan to achieve rapid heat dissipation and improve the energy utilization efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 The utility model is a three-dimensional schematic diagram Figure 1 ;

[0012] Figure 2 The utility model is a three-dimensional schematic diagram Figure 2 ;

[0013] Figure 3 The utility model is a three-dimensional schematic diagram Figure 3 ;

[0014] Figure 4 This is a three-dimensional schematic diagram of the utility model Figure 1 ;

[0015] Figure 5 This is a three-dimensional schematic diagram of the utility model Figure 2 ;

[0016] Figure 6 This is a three-dimensional schematic diagram of the utility model Figure 3 ;

[0017] Figure 7 This is a three-dimensional schematic diagram of the utility model Figure 4 ;

[0018] Explanation of the reference numerals: main board body -1, MCU module -11, temperature sensing module -12, mounting box -2, heat dissipation fixture -3, fan -31, air outlet -32, air supply hole -33, first fixing plate -4, second fixing plate -5, rubber buffer -6, baffle -7. DETAILED DESCRIPTION

[0019] The specific implementation of the present utility model is described below with reference to the accompanying drawings.

[0020] See 1 to Figure 7 A new type of intelligent door lock control motherboard includes a control motherboard body 1, a mounting box 2 is arranged on the outer cover of the control motherboard body 1, and the mounting box 2 is filled with potting glue; a heat dissipation fixing piece 3 with a J-shaped hollow structure is connected to the bottom of the mounting box 2, a plurality of fans 31 are fixedly arranged at one end of the heat dissipation fixing piece 3, and an air supply port 32 is opened at the other end, and the air supply port 32 is located above the horizontal plane of the upper surface of the mounting box 2, and a plurality of air supply holes 33 are opened on the side wall of the heat dissipation fixing piece 3 adjacent to the bottom of the mounting box 2, and wind is ejected from the air supply port 32 and the air supply hole 33 to take away the heat on the surface of the potting glue, and at the same time, the wind delivered by the air supply hole 33 is also conducive to the air flow inside the intelligent door lock, thereby reducing the ambient temperature.

[0021] See also Figures 1 to 7 The outer side of the heat dissipation fixing member 3 is provided with a first fixing plate 4 fixed to the installation box 2 and a second fixing plate 5 for fixing to the outside world; the installation box 2 and the first fixing plate 4 are fixedly connected by bolts, and the upper and lower surfaces of the installation box 2 are provided with a rubber buffer 6 in a hollow ring structure on the bolt sleeve; the installation box 2 is installed on the first fixing plate 4, and the rubber buffer 6 is provided to reduce the vibration of the installation box 2 when the door body is opened and closed. At the same time, the potting glue filled in the installation box 2 further reduces the vibration of the control main board to avoid loosening or detachment of electrical components.

[0022] In order to improve the cooling efficiency and the utilization rate of energy, an MCU module 11 and a temperature sensing module 12 are provided on the control main board body 1. The MCU module 11 is electrically connected to the temperature sensing module 12 and the fan 31 respectively. The temperature sensing module 12 sets a threshold value. The MCU module 11 controls the rotation speed of the fan 31 by linking the temperature sensing module 12 and the fan 31. As the temperature rises, the rotation speed of the fan 31 is increased. At the same time, in order to enhance the control accuracy and save energy consumption, the fan 31 adopts a servo fan, the MCU module 11 is STM8S003F3P6, and the potting glue is a flame retardant heat-conductive potting glue, the thermal conductivity of which is 2-3W / mK, and the flame retardant level is V-0. A plurality of baffles 7 are provided in the lateral direction on the upper surface of the mounting box 2, and the potting glue is further clamped by the setting of the baffles 7.

[0023] Working principle: The utility model installs the control main board body 1 only in the installation box 2, and the installation box 2 is fixed on the heat dissipation fixing part 3 through the rubber buffer 6. At the same time, the installation box 2 is filled with potting glue to buffer the vibration of the control main board and extend the service life; at the same time, by setting the fan 31, the air flow is strengthened to take away the heat generated by the control main board, reduce the temperature, and further extend the service life of the device.

[0024] The above is only a specific implementation method of the utility model, but the design concept of the utility model is not limited to this. Any non-substantial changes to the utility model using this concept shall be deemed as an infringement of the protection scope of the utility model.

Claims

1. A new type of intelligent door lock control motherboard, including a control motherboard body, characterized by: The control main board main body is provided with an installation box, and the installation box is filled with potting glue; the bottom of the installation box is connected to a heat dissipation fixture with a J-shaped hollow structure, one end of the heat dissipation fixture is fixed with a plurality of fans, and the other end is provided with an air supply port, the air supply port is located above the horizontal plane of the upper surface of the installation box, and a plurality of air supply holes are provided on the side wall of the heat dissipation fixture adjacent to the bottom of the installation box.

2. According to claim 1, the novel intelligent door lock control mainboard is characterized in that: The outer side of the heat dissipation fixing piece is provided with a first fixing plate fixed to the installation box and a second fixing plate for fixing to the outside world; the installation box and the first fixing plate are fixedly connected by bolts, and the upper and lower surfaces of the installation box are provided with rubber buffers with a hollow circular ring structure on the outer sleeves of the bolts.

3. A new type of intelligent door lock control mainboard according to claim 1 or 2, characterized in that: The control mainboard body is provided with an MCU module and a temperature sensing module, and the MCU module is electrically connected to the temperature sensing module and the fan respectively.

4. A novel intelligent door lock control mainboard according to claim 1 or 2, characterized in that: The fan is a servo fan.

5. According to claim 3, the novel intelligent door lock control mainboard is characterized in that: The MCU module is STM8S003F3P6.

6. According to claim 4, the novel intelligent door lock control mainboard is characterized in that: The potting glue is a flame retardant thermal conductive potting glue, the thermal conductivity of which is 2-3W / mK and the flame retardant level is V-0 level.

7. A novel intelligent door lock control mainboard according to claim 1, 2 or 6, characterized in that: A plurality of baffles are arranged in the transverse direction on the upper surface of the installation box.

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