CVD diamond growth heat dissipation cooling device and growth furnace

Abstract

The utility model relates to the technical field of cooling devices, in particular to a CVD (Chemical Vapor Deposition) diamond growth radiating and cooling device and a growth furnace. In order to solve the problems that an existing heat dissipation cooling device is poor in heat dissipation effect, energy consumption is improved, cooling treatment is difficult to carry out quickly, solidification failure of diamonds is possibly caused, and the structural stability of the diamonds is affected, the following technical scheme is provided: the cooling device comprises a bottom plate; the growth mechanism is used for growing the CVD diamond; the heat absorption mechanism is used for radiating and cooling the growth mechanism; the growth mechanism and the heat absorption mechanism are both arranged on the bottom plate. The cooling device can be used for cooling to ensure the growth efficiency and quality of the CVD diamond, is less in energy consumption, and can be used for rapidly cooling to realize the solidification of the diamond and ensure the stability of the diamond structure.

Description

Technical Field

[0001] The present application belongs to the technical field of CVD diamond production, and in particular relates to a CVD diamond growth heat dissipation cooling device and a growth furnace provided with the heat dissipation cooling device. Background Art

[0002] CVD diamond is a mixture of carbon-containing gas and hydrogen that is excited and decomposed at high temperature and pressure below standard atmospheric pressure to form plasma carbon atoms, which are deposited on the substrate to form polycrystalline diamond. CVD diamond needs to grow in a high temperature environment, but when the temperature is too high, the rate of decomposition and deposition of the carbon source gas increases, resulting in a too fast growth rate of the diamond film. This may lead to a decrease in the quality of the diamond film, and the appearance of overly large grains or uneven growth.

[0003] An existing CVD diamond growth heat dissipation cooling device can dissipate heat well through compressed air during the use of CVD diamond growth equipment, thereby cooling the equipment with too high temperature, ensuring that the temperature in the vacuum chamber will not rise too high and affect the normal growth efficiency and quality of diamonds, and avoid losses. However, we know that in the method of using gas for heat dissipation and cooling, due to the small specific heat capacity of gas, even if it adopts the method of compressing gas, there is still a problem of poor heat dissipation effect compared with liquid, and the addition of a compressor increases the energy consumption of heat dissipation and cooling. At the same time, after the CVD diamond growth is completed, it needs to be quickly cooled to solidify and stabilize the diamond structure. The existing heat dissipation cooling device is difficult to quickly cool the reaction chamber, which may cause the solidification failure of the diamond and affect the stability of the diamond structure. In view of this, the utility model proposes a CVD diamond growth heat dissipation cooling device, and also proposes a growth furnace provided with the heat dissipation cooling device. Summary of the invention

[0004] The present application provides a CVD diamond growth heat dissipation cooling device and a growth furnace equipped with the heat dissipation cooling device, which solves the technical problems in the prior art that the existing heat dissipation cooling devices have poor heat dissipation effect and increase energy consumption, are difficult to quickly perform temperature reduction treatment, may cause diamond solidification failure, and affect the stability of the diamond structure.

[0005] In order to solve at least one of the above technical problems, the technical solution adopted in this application is:

[0006] A CVD diamond growth heat dissipation cooling device, comprising:

[0007] include:

[0008] Base plate;

[0009] Growth mechanism, used for CVD diamond growth;

[0010] A heat absorbing mechanism, used for dissipating heat and cooling the growth mechanism;

[0011] The growing mechanism and the heat absorbing mechanism are both constructed on the bottom plate.

[0012] Furthermore, the growth mechanism includes a reaction tank installed on the top of the base plate, a sealing cover is provided on the top of the reaction tank, a microwave generator is also installed on the top of the sealing cover, a ventilation pipe is fixedly connected to the microwave generator, the ventilation pipe is connected to the inside of the reaction tank, and a substrate is also provided in the reaction tank.

[0013] Furthermore, the heat absorption mechanism includes a water tank arranged on one side of the reaction tank, the water tank is installed on the top of the base plate, one side of the water tank is connected to a delivery pipe, the water tank is connected to a first water pump through the delivery pipe, the output end of the first water pump is connected to a cooling component through the delivery pipe, the side of the cooling component away from the first water pump is also connected to a cooling pipe, and the cooling pipe is spirally arranged on the outer ring of the reaction tank.

[0014] Furthermore, one end of the cooling pipe away from the cooling component is connected to a cooling component, and the cooling component is also installed on the top of the base plate. A second water pump installed on the top of the base plate is also provided between the cooling component and the water tank. The input and output ends of the second water pump are respectively connected to the cooling component and the water tank through a delivery pipe.

[0015] Furthermore, the cooling assembly includes a cooling block connected to one end of the conveying pipe, a cooling groove is provided in the cooling block, and the cooling groove is arranged in a serpentine shape.

[0016] Furthermore, refrigeration plates are installed on both sides of the cooling block.

[0017] Furthermore, the cooling assembly includes multiple groups of cooling boxes arranged equidistantly, the cooling boxes are hollow, and connecting pipes are installed between two adjacent groups of cooling boxes to connect them. One end of the cooling pipe is fixedly connected to one side of the top group of cooling boxes, and the bottom group of cooling boxes is connected to the input end of the second water pump through a delivery pipe.

[0018] Furthermore, two groups of fixing plates are connected to both sides of the multiple groups of cooling boxes, and multiple groups of fans are installed on the two groups of fixing plates on the side away from the cooling components.

[0019] Furthermore, the reaction tank and the cooling tube are both made of copper.

[0020] A growth furnace is provided with the heat dissipation and cooling device as described above.

[0021] The CVD diamond growth heat dissipation cooling device designed by the present application has a simple structure and is safe and stable. It can reduce the temperature to ensure the growth efficiency and quality of CVD diamonds, consume less energy, and can quickly cool the diamonds to solidify while ensuring the stability of the diamond structure. The present application also proposes a growth furnace equipped with the heat dissipation cooling device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a three-dimensional diagram of a CVD diamond growth heat dissipation cooling device according to an embodiment of the present application;

[0023] Figure 2 yes Figure 1 Cross-sectional view in

[0024] Figure 3 is a cross-sectional view of a heat absorption mechanism according to an embodiment of the present application;

[0025] Figure 4 is a schematic diagram of a fan according to an embodiment of the present application.

[0026] In the figure:

[0027] 1. Bottom plate 2. Growth mechanism 21. Reaction tank

[0028] 22. Sealing cover 23. Microwave generator 24. Ventilation pipe

[0029] 25. base body 3. heat absorption mechanism 31. water tank

[0030] 32. Delivery pipe 33. First water pump 34. Cooling assembly

[0031] 341, cooling block 342, cooling tank 343, cooling plate

[0032] 35. Cooling pipe 36. Cooling assembly 361. Cooling box

[0033] 362, connecting pipe 363, fixing plate 364, fan

[0034] 37. Second water pump DETAILED DESCRIPTION

[0035] The present application is described in detail below with reference to the accompanying drawings and specific embodiments.

[0036] This embodiment provides a CVD diamond growth heat dissipation cooling device, such as Figure 1 and Figure 2As shown, it includes a base plate 1, and the base plate 1 is placed stably. A growth mechanism 2 for CVD diamond growth is installed on the top of the base plate 1. The growth mechanism 2 includes a reaction tank 21 installed on the top of the base plate 1, and the position of the reaction tank 21 is fixed. A sealing cover 22 is provided on the top of the reaction tank 21, and the sealing cover 22 is covered on the reaction tank 21 so that the reaction tank 21 is in a closed device, which is convenient for the reaction and growth of CVD diamond. A microwave generator 23 is also installed on the top of the sealing cover 22. The microwave generator 23 generates microwaves to facilitate the input of microwave energy, and a high-energy plasma environment will be generated to decompose the carbon source gas, thereby depositing a diamond film. A vent pipe 24 is fixedly connected to the microwave generator 23, and the vent pipe 24 is connected to the inside of the reaction tank 21. The vent pipe 24 is convenient for introducing carbon source gas into the reaction tank 21, and at the same time, the reaction tank 21 can be vacuumed to reduce the pressure to facilitate the growth of CVD diamond. A substrate 25 is also provided in the reaction tank 21, and the substrate 25 is used for CVD diamond deposition thereon.

[0037] For further information, see Figure 1 The cooling device includes a heat absorbing mechanism 3 for dissipating heat and helping to cool the growth mechanism 2, and the heat absorbing mechanism 3 is also installed on the top of the bottom plate 1. The heat absorbing mechanism 3 includes a water tank 31 arranged on one side of the reaction tank 21, and the water tank 31 is used to hold a coolant to cool the reaction tank 21. The water tank 31 is installed on the top of the bottom plate 1, and the position of the water tank 31 is fixed. A delivery pipe 32 is connected to one side of the water tank 31, and the water tank 31 is connected to a first water pump 33 through the delivery pipe 32. The first water pump 33 extracts the coolant in the water tank 31 through the delivery pipe 32. The output end of the first water pump 33 is connected to a cooling component 34 through the delivery pipe 32. The cooling component 34 is used to cool the passing coolant to make it a low-temperature state, which is convenient for cooling the reaction tank 21. The cooling component 34 is also connected to a cooling pipe 35 on the side away from the first water pump 33, and the coolant cooled by the cooling component 34 is filled in the cooling pipe 35. The cooling tube 35 is spirally arranged on the outer ring of the reaction tank 21. The reaction tank 21 and the cooling tube 35 are both constructed of copper, which is convenient for the low-temperature coolant to take away the heat in the reaction tank 21 when flowing to achieve the purpose of rapid cooling. The cooling tube 35 is connected to the cooling component 36 at one end away from the cooling component 34. The setting of the cooling component 36 facilitates the natural cooling of the coolant, reduces the cooling burden of the cooling component 34, and reduces the overall energy consumption. The cooling component 36 is also installed on the top of the bottom plate 1. A second water pump 37 installed on the top of the bottom plate 1 is also provided between the cooling component 36 and the water tank 31. The input end and the output end of the second water pump 37 are respectively connected to the cooling component 36 and the water tank 31 through the delivery pipe 32. The second water pump 37 is used to inject the water in the cooling component 36 into the water tank 31 for recycling and energy saving.

[0038] Furthermore, if Figure 3and Figure 4 As shown, the cooling device also includes a cooling assembly 34 including a cooling block 341 connected to one end of the delivery pipe 32, a cooling groove 342 is provided in the cooling block 341, and the cooling groove 342 is serpentinely arranged. The serpentine arrangement allows the coolant to obtain a larger contact area when passing through, thereby facilitating the cooling of the coolant. Both sides of the cooling block 341 are equipped with refrigeration plates 343, which are used to reduce the temperature of the coolant flowing through the cooling groove 342, so that the temperature of the coolant becomes extremely low, so that the heat collar in the reaction tank 21 can be taken away faster when flowing through the cooling pipe 35, thereby achieving rapid cooling. The cooling assembly 36 includes a plurality of groups of equidistantly arranged cooling boxes 361, and the cooling boxes 361 are hollowly arranged. The arrangement of the cooling boxes 361 can effectively increase the contact area with the air when the coolant is filled in the cooling boxes 361. Since the coolant has just been discharged from the cooling pipe 35, it has a certain amount of heat, which is convenient for naturally cooling the coolant and reducing energy consumption. A connecting pipe 362 is installed between two adjacent groups of cooling boxes 361 to make them connected. The multi-layer setting is also convenient for cooling, and the temperature gradually decreases from top to bottom. One end of the cooling pipe 35 is fixedly connected to one side of the top group of cooling boxes 361, and the bottom group of cooling boxes 361 is connected to the input end of the second water pump 37 through the delivery pipe 32. After starting, the delivery pipe 32 can drive the cooling liquid in the multiple groups of cooling boxes 361 to flow synchronously, and after cooling, it is transported to the water tank 31 for recycling. Two groups of fixing plates 363 are fixedly connected to both sides of the multiple groups of cooling boxes 361, which are used to fix the positions between the multiple groups of cooling boxes 361. Multiple groups of fans 364 are also installed on the two groups of fixing plates 363 away from the cooling assembly 34. The fans 364 are used to drive the air flow, so that the air can pass between the two groups of cooling boxes 361, help the cooling liquid in the cooling boxes 361 to cool down, and speed up the cooling speed and effect.

[0039] In this embodiment, when the CVD diamond in the reaction tank 21 is growing, when the temperature is too high, the first water pump 33 and the second water pump 37 are started synchronously, and the first water pump 33 extracts and delivers the coolant in the water tank 31 through the delivery pipe 32. The coolant passes through the delivery pipe 32 to the cooling groove 342 opened in the cooling block 341, and then flows through the cooling pipe 35 to take away the heat in the reaction tank 21, and cools the reaction tank 21. After that, the coolant discharged from the cooling pipe 35 has a higher temperature due to heat absorption. After being injected into the cooling box 361, the contact area with the air is increased, and the multi-layer cooling box 361 is set to achieve natural cooling of the coolant in the cooling box 361. After the fan 364 is started, air flows over the surface of the cooling box 361, which speeds up the cooling speed and effect of the coolant therein. Finally, the coolant approaching room temperature is extracted by the second water pump 37 and re-injected into the water tank 31 for recycling. The cooling liquid is cooled by natural cooling, which reduces energy consumption and effectively maintains the temperature in the reaction tank 21 so that it does not become too high to affect the growth of CVD diamond.

[0040] After the CVD diamond is grown, it needs to be cooled quickly. At this time, the two refrigeration plates 343 can be started. The refrigeration plates 343 cool the coolant flowing through the cooling tank 342 to a very low temperature, so that more heat can be taken away when passing through the cooling tube 35, achieving the effect of quickly cooling the reaction tank 21. The temperature of the coolant discharged from the cooling tube 35 is still high. After the cooling effect of the cooling component 36, it enters the water tank 31, so that the temperature of the coolant that the refrigeration plate 343 needs to cool is always close to room temperature, which reduces the workload of the refrigeration plate 343 and ensures the rapid cooling of the CVD diamond, so that the grown CVD diamond is successfully solidified and the structure of the diamond is stable.

[0041] A growth furnace is provided with the heat dissipation cooling device as described above, wherein the heat dissipation cooling device is arranged outside the furnace body and independently of the furnace body.

[0042] The present application designs a CVD diamond growth heat dissipation cooling device, which has a simple structure, is safe and stable, can cool down to ensure the growth efficiency and quality of CVD diamond, consumes less energy, and can quickly cool down to achieve diamond solidification while ensuring the stability of the diamond structure. The present application also proposes a growth furnace equipped with the heat dissipation cooling device.

[0043] The above detailed description of the embodiments of the present application is only a preferred embodiment of the present application and cannot be considered to limit the scope of implementation of the present application. All equivalent changes and improvements made within the scope of the present application should still fall within the scope of the patent coverage of the present application.

Claims

1. A CVD diamond growth heat dissipation cooling device, characterized in that: include: Base plate; Growth mechanism, used for CVD diamond growth; A heat absorbing mechanism, used for dissipating heat and cooling the growth mechanism; The growing mechanism and the heat absorbing mechanism are both constructed on the bottom plate.

2. A CVD diamond growth heat dissipation cooling device according to claim 1, characterized in that: The growth mechanism includes a reaction tank installed on the top of the bottom plate, a sealing cover is provided on the top of the reaction tank, a microwave generator is also installed on the top of the sealing cover, a ventilation pipe is fixedly connected to the microwave generator, the ventilation pipe is connected to the inside of the reaction tank, and a substrate is also provided in the reaction tank.

3. A CVD diamond growth heat dissipation cooling device according to claim 2, characterized in that: The heat absorption mechanism includes a water tank arranged on one side of the reaction tank, the water tank is installed on the top of the bottom plate, one side of the water tank is connected to a delivery pipe, the water tank is connected to a first water pump through the delivery pipe, the output end of the first water pump is connected to a cooling component through the delivery pipe, the side of the cooling component away from the first water pump is also connected to a cooling pipe, and the cooling pipe is spirally arranged on the outer ring of the reaction tank.

4. A CVD diamond growth heat dissipation cooling device according to claim 3, characterized in that: The end of the cooling pipe away from the cooling component is connected to the cooling component, and the cooling component is also installed on the top of the base plate. A second water pump installed on the top of the base plate is also provided between the cooling component and the water tank. The input end and the output end of the second water pump are respectively connected to the cooling component and the water tank through a delivery pipe.

5. A CVD diamond growth heat dissipation cooling device according to claim 3, characterized in that: The cooling assembly comprises a cooling block connected to one end of the conveying pipe. A cooling groove is provided in the cooling block, and the cooling groove is arranged in a serpentine shape.

6. A CVD diamond growth heat dissipation cooling device according to claim 5, characterized in that: Refrigeration plates are installed on both sides of the cooling block.

7. A CVD diamond growth heat dissipation cooling device according to claim 4, characterized in that: The cooling assembly includes multiple groups of cooling boxes arranged equidistantly, and the cooling boxes are hollow. Connecting pipes are installed between two adjacent groups of cooling boxes to connect them. One end of the cooling pipe is fixedly connected to one side of the top group of cooling boxes, and the bottom group of cooling boxes is connected to the input end of the second water pump through a delivery pipe.

8. A CVD diamond growth heat dissipation cooling device according to claim 7, characterized in that: Two groups of fixing plates are connected to both sides of the multiple groups of cooling boxes, and multiple groups of fans are also installed on the two groups of fixing plates on the side away from the cooling components.

9. A CVD diamond growth heat dissipation cooling device according to claim 3, characterized in that: The reaction tank and the cooling tube are both made of copper.

10. A growth furnace, characterized in that: The device is provided with a heat dissipation cooling device as described in any one of claims 1 to 9.

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