Chip processing equipment and system

Abstract

The utility model provides chip processing equipment and system, and relates to the technical field of semiconductors. The chip processing equipment comprises a main valve, a connecting pipeline and a furnace tube, the main valve is communicated with a furnace opening of the furnace tube through the connecting pipeline, and the main valve is further connected to an air outlet device; wherein the main valve is arranged at a position far away from the furnace mouth. The chip processing equipment and system have the advantages that the abnormal frequency and the maintenance frequency of the whole machine table are reduced, the production efficiency is improved, and the production cost is reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a chip processing device and system. Background Art

[0002] Semiconductor furnace tube is a heat source device that uses the principle of resistance heating. Its design structure is that a resistance wire is placed in a quartz tube. When electricity is applied, the resistance wire is heated, and then the heating gas in the quartz tube is heated and the sample is heated. Due to the high heating temperature, high precision, fast response speed and other characteristics of semiconductor furnace tubes, it is widely used in electronics, semiconductors, optoelectronics, medical and other fields.

[0003] When the semiconductor furnace tube is in use, it needs to be connected to the vacuum pipeline. In the process of building the vacuum pipeline, the main valve is a very important component and plays the role of a valve. The main valve controls the connection or disconnection of the entire vacuum pipeline.

[0004] At present, the main valve is generally set at the furnace mouth near the furnace tube. However, since the furnace tube itself is a heating device, the furnace mouth temperature is relatively high, which leads to serious aging of the internal components of the main valve. The abnormal frequency and PM frequency (preventive maintenance frequency) of the entire machine are high, and the cost of use is high.

[0005] In summary, the prior art has the problem that the main valve component is prone to aging. Utility Model Content

[0006] The purpose of the present application is to provide a chip processing device and system to solve the problem of easy aging of main valve components existing in the prior art.

[0007] In order to achieve the above purpose, the technical solution adopted in the embodiment of the present application is as follows:

[0008] On the one hand, an embodiment of the present application provides a chip processing device, the chip processing device comprising a main valve, a connecting pipeline and a furnace pipe, the main valve is connected to the furnace port of the furnace pipe through the connecting pipeline, and the main valve is also connected to the gas outlet device; wherein,

[0009] The main valve is arranged at a position far away from the furnace opening.

[0010] Optionally, the gas outlet device is a vacuum pump, and the vacuum pump is connected to the main valve.

[0011] Optionally, the chip processing equipment further comprises a particle trapping device, wherein the particle trapping device is disposed between the vacuum pump and the main valve and is connected to the vacuum pump and the main valve.

[0012] Optionally, the main valve is arranged above the particle trapping device.

[0013] Optionally, the connecting pipeline includes a first pipeline and a second pipeline, the main valve, the first pipeline, the second pipeline and the furnace port are connected in sequence, and the second pipeline is arranged in an arc shape.

[0014] Optionally, the connecting pipeline includes a first pipeline and a second pipeline, the main valve, the first pipeline, the second pipeline and the furnace port are connected in sequence, and the second pipeline is configured in an "L" shape.

[0015] Optionally, the first pipeline is configured to be in an “L” shape, and the first pipeline and the second pipeline are in opposite directions.

[0016] Optionally, the chip processing equipment further comprises a heat insulation layer, and the heat insulation layer is sleeved outside the connecting pipeline.

[0017] Optionally, the main valve comprises a main body and a main valve ring, and the main valve ring is arranged in the main body.

[0018] On the other hand, an embodiment of the present application further provides a chip processing system, which includes the above-mentioned chip processing equipment.

[0019] Compared with the prior art, this application has the following beneficial effects:

[0020] The present application provides a chip processing device and system, the chip processing device includes a main valve, a connecting pipeline and a furnace tube, the main valve is connected to the furnace port of the furnace tube through the connecting pipeline, and the main valve is also connected to the gas outlet device; wherein the main valve is arranged at a position away from the furnace port. Since the position of the main valve in the chip processing device provided by the present application is far away from the furnace port, the main valve can be kept away from the high temperature area, avoiding the serious problem of carbonization of the main valve component, thereby reducing the abnormal frequency and maintenance frequency of the entire machine, improving production efficiency, and reducing production costs.

[0021] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1A schematic diagram of the structure of the processing equipment provided in an embodiment of the present application.

[0024] In the figure:

[0025] 110 - main valve; 111 - main body; 112 - main valve ring; 120 - connecting pipeline; 121 - first pipeline; 122 - second pipeline; 130 - particle trapping device. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0028] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0029] It should be noted that, in this document, relational terms such as first and second, etc. are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations.

[0030] In the description of the present application, it should be noted that the terms "upper", "lower", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0031] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0032] Chemical Vapor Deposition (CVD) is the most important thin film deposition method in the current semiconductor process. According to the pressure of chemical vapor deposition, chemical vapor deposition can be divided into atmospheric pressure chemical vapor deposition (APCVD) and low pressure chemical vapor deposition (LPCVD). Since low pressure chemical vapor deposition deposits thin films at a pressure below 0 Torr, the formed thin film has excellent step coverage and is currently a widely used deposition method.

[0033] For the commonly used furnace tube LPCVD equipment. The furnace tube itself is made of annealed quartz, and is heated by an external heating device. The reaction gas is sent into the furnace tube from the furnace door. The chip to be deposited is placed on a crystal boat made of quartz, and is placed in the appropriate position of the furnace tube along with the crystal boat for deposition. The waste gas left by the deposition reaction is discharged by a vacuum pump. In addition, a main valve (MainValve) 45 is set in the exhaust pipeline to control the opening and closing of the exhaust pipeline.

[0034] At present, in the whole furnace tube system, the bottom of the main valve is connected to the furnace port of the furnace tube. At the same time, the main valve is connected to the connecting pipeline, the connecting pipeline is also connected to the particle trapping device, and the particle trapping device is also connected to the air pump.

[0035] During the chemical vapor deposition reaction, there are many particles in the furnace tube caused by by-products and incomplete reaction gases. In order to prevent these particles from entering the air pump with the exhaust gas and causing blockage, a particle trapping device is set in the exhaust pipe to absorb the particles in the exhaust gas.

[0036] The main valve is set near the intersection. When exhaust gas is generated in the furnace tube, it enters the connecting pipeline through the main valve and is then adsorbed by the particle trap. In addition, since the particle trap needs to replace the internal components frequently, the particle trap needs to be placed away from the furnace mouth to facilitate the operator to operate and avoid the problem of difficulty in replacing or maintaining the particle trap due to the high temperature of the furnace mouth.

[0037] Since the main valve is located near the furnace mouth, its temperature is relatively high, which leads to serious crystallization of the main valve. At the same time, the important component in the main valve, the "main valve ring", is easily affected by high temperature, which leads to serious crystallization of the main valve ring and serious aging problems. Once the main valve or the main valve ring fails, it will cause internal leakage, that is, the furnace tube needs to maintain a certain pressure state when working. The main valve failure is likely to cause gas leakage, affecting the chip deposition effect.

[0038] On this basis, the main valve needs to be maintained, that is, to detect the crystallization and aging problems of the main valve, main valve ring and other components. The frequency of preventive maintenance is high, the labor cost is high, and it also affects the utilization rate of the equipment, resulting in relatively low production efficiency.

[0039] In view of this, in order to solve the above-mentioned problem, the present application provides a chip processing equipment, which alleviates the problem of easy aging of the main valve component by resetting the main valve position.

[0040] The following is an exemplary description of the chip processing equipment provided by this application:

[0041] As an alternative implementation, see Figure 1 The chip processing equipment includes a main valve 110, a connecting pipeline 120 and a furnace tube (not shown). The main valve 110 is connected to the furnace port of the furnace tube through the connecting pipeline 120, and the main valve 110 is also connected to the gas outlet device; wherein the main valve 110 is arranged at a position away from the furnace port.

[0042] Since the main valve 110 in the chip processing equipment provided by the present application is located away from the furnace mouth, the main valve 110 can be kept away from the high-temperature area, thereby avoiding serious carbonization and crystallization problems of the main valve 110 component, thereby reducing the abnormal frequency and maintenance frequency of the entire machine, improving production efficiency, and reducing production costs.

[0043] Figure 1 In the embodiment, the pipe openings are connected and sealed with each other. For example, the figure shows a plurality of pipe openings, each of which is connected and sealed with the opposite pipe opening. For example, pipe opening A1 is connected and sealed with pipe opening B1, pipe opening A2 is connected and sealed with pipe opening B2, and pipe opening A3 is connected and sealed with pipe opening B3. Meanwhile, pipe opening C is used to connect the furnace opening of the furnace tube. Figure 1 As is known from the structure shown, the furnace port of the furnace tube is connected to the main valve 110 via a connecting pipeline 120 .

[0044] As an implementation method, the connecting pipeline 120 includes a first pipeline 121 and a second pipeline 122, and the main valve 110, the first pipeline 121, the second pipeline 122 and the furnace port are connected in sequence. Since the main valve 110 is moved away from the position close to the furnace port, the second pipeline 122 is used here to achieve the connection between the first pipeline 121 and the furnace port, which does not increase too much cost.

[0045] Since the opening A2 of the first pipeline 121 is horizontal and the furnace mouth of the furnace tube (connected to the pipe mouth C) is vertical, when the second pipeline 122 is used for switching, in one embodiment, the second pipeline 122 is set to an arc shape, and in another embodiment, the second pipeline 122 is set to an "L" shape.

[0046] Furthermore, the first pipeline 121 may also be configured to be in an "L" shape, and the first pipeline 121 and the second pipeline 122 are oriented in opposite directions. The directions described in the present application are opposite, and the directions to the "L"-shaped corners are opposite, such as Figure 1 In the figure, the "L"-shaped corner of the first pipeline 121 (position D in the figure) is facing upward, while the "L"-shaped corner of the second pipeline 122 (position E in the figure) is facing downward. The two are opposite, which makes it more convenient to connect the furnace tube and furnace mouth.

[0047] Since the first pipeline 121 and the second pipeline 122 are used to discharge exhaust gas, and the temperature of the exhaust gas is relatively high, the temperature of the first pipeline 121 and the second pipeline 122 is also relatively high. On this basis, in order to prevent maintenance personnel from getting burned, the chip processing equipment also includes a heat insulation layer, which is mounted on the outside of the connecting pipeline 120.

[0048] It should be noted that the gas outlet device described in the present application is a vacuum pump, which is connected to the main valve 110, and the exhaust gas in the furnace tube can be discharged through the gas outlet device.

[0049] When the chemical vapor deposition reaction is carried out, there are many particles in the furnace tube generated by by-products and unreacted reaction gases. If these particles enter the pump with the exhaust gas, they will cause blockage and affect the life of the pump. To avoid this situation, the chip processing equipment also includes a particle trapping device 130. The particle trapping device 130 is arranged between the vacuum pump and the main valve 110, and is connected to the vacuum pump and the main valve 110. This application does not elaborate on the specific structure of the particle trapping device 130. For example, multiple layers of blades are installed in the particle trapping device 130 to absorb particles in the exhaust gas. At the same time, a filter is arranged in the exhaust pipe near the vacuum pump to further filter out particles in the exhaust gas.

[0050] Since the particle trapping device 130 is generally arranged at a position far away from the furnace opening, and the main valve 110 is relatively heavy, as an implementation method, the main valve 110 can be arranged above the particle trapping device 130. By arranging the main valve 110 above the particle trapping device 130, on the one hand, it can be ensured that the main valve 110 is located far away from the furnace opening in the horizontal direction. On the other hand, the height of the main valve 110 can be increased, thereby making the distance between the main valve 110 and the furnace opening in the vertical direction larger. The distance between the main valve 110 and the furnace opening is related to the horizontal distance and the vertical distance. When the horizontal distance and the vertical distance are increased, the distance between the main valve 110 and the furnace opening can be significantly increased, thereby preventing the main valve 110 from being affected by high temperature.

[0051] The present application does not limit the structure of the main valve 110, which includes a main body 111 and a main valve ring 112, which is disposed in the main body 111. By disposing the main valve 110 at a location away from the high temperature of the furnace mouth, the crystallization and aging problems of the main body 111 and the main valve ring 112 can be effectively prevented.

[0052] The applicant has verified through practice and compared the prior art with the present application, and obtained the following Table 1:

[0053]

[0054] Table 1

[0055] Among them, taking two furnace tube equipment as an example, the main valve 110 needs to be frequently disassembled in the prior art. It can be seen from the table that the prior art requires 240 hours of inspection and maintenance every year, resulting in the risk of damage to the components in the main valve 110 (such as bellows). When the main valve 110 components are damaged, the main valve 110 will be unusable, and a new main valve 110 will cost nearly 200,000 yuan.

[0056] On the other hand, through the improvement of the main valve 110 setting position in this application, the existing maintenance frequency is reduced to 15 days / unit, 24 times per year, 5 hours of double manpower is saved per time, 120 hours is saved per year, and half of the labor cost is saved. At the same time, since the maintenance frequency is reduced, the production time of the equipment can be greatly increased, which is beneficial to the output of the enterprise.

[0057] In summary, the present application arranges the main valve 110 above the particle trapping device 130, increases the distance from the furnace mouth in both the horizontal and vertical directions, avoids the influence of the high temperature of the furnace mouth on the main valve 110, reduces the maintenance frequency and maintenance cost of the entire chip processing equipment, and achieves the purpose of improving enterprise benefits.

[0058] Based on the above implementation method, an embodiment of the present application also provides a chip processing system, which includes the above chip processing equipment.

[0059] In summary, the present application provides a chip processing device and system, the chip processing device includes a main valve 110, a connecting pipeline 120 and a furnace tube, the main valve 110 is connected to the furnace port of the furnace tube through the connecting pipeline 120, and the main valve 110 is also connected to the gas outlet device; wherein, the main valve 110 is arranged at a position away from the furnace port. Since the position of the main valve 110 in the chip processing device provided by the present application is far away from the position of the furnace port, the main valve 110 can be kept away from the high temperature area, avoiding the problem of serious carbonization of the main valve 110 device, thereby reducing the abnormal frequency and maintenance frequency of the entire machine, improving production efficiency, and reducing production costs.

[0060] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0061] It will be apparent to those skilled in the art that the present application is not limited to the details of the exemplary embodiments described above, and that the present application can be implemented in other specific forms without departing from the spirit or essential features of the present application. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present application. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A chip processing equipment, characterized in that: The chip processing equipment comprises a main valve, a connecting pipeline and a furnace tube, wherein the main valve is connected to the furnace port of the furnace tube through the connecting pipeline, and the main valve is also connected to the gas outlet device; wherein, The main valve is arranged at a position far away from the furnace opening.

2. The chip processing equipment according to claim 1, characterized in that: The gas outlet device is a vacuum pump, and the vacuum pump is connected to the main valve.

3. The chip processing equipment according to claim 2, characterized in that: The chip processing equipment further comprises a particle trapping device, which is arranged between the vacuum pump and the main valve and is communicated with the vacuum pump and the main valve.

4. The chip processing equipment according to claim 3, characterized in that: The main valve is arranged on the particle trapping device.

5. The chip processing equipment according to claim 1, characterized in that: The connecting pipeline includes a first pipeline and a second pipeline. The main valve, the first pipeline, the second pipeline and the furnace port are connected in sequence. The second pipeline is arranged in an arc shape.

6. The chip processing equipment according to claim 1, characterized in that: The connecting pipeline includes a first pipeline and a second pipeline. The main valve, the first pipeline, the second pipeline and the furnace port are connected in sequence, and the second pipeline is set in an "L" shape.

7. The chip processing equipment according to claim 5 or 6, characterized in that: The first pipeline is configured to be in an "L" shape, and the first pipeline and the second pipeline are in opposite directions.

8. The chip processing equipment according to claim 1, characterized in that: The chip processing equipment further comprises a heat insulation layer, and the heat insulation layer is sleeved outside the connecting pipeline.

9. The chip processing equipment according to claim 1, characterized in that: The main valve comprises a main body and a main valve ring, and the main valve ring is arranged in the main body.

10. A chip processing system, characterized in that: The chip processing system comprises the chip processing equipment according to any one of claims 1 to 9.

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