Perovskite solar cell packaging structure

Abstract

The utility model belongs to the field of perovskite solar cells, and particularly discloses a perovskite solar cell packaging structure which packages a perovskite assembly through a first packaging layer, a barrier layer, an organic layer and a second packaging layer, thereby effectively preventing water and oxygen from entering the perovskite solar cell. The barrier layer made of the diamond-like material has better compactness, can ensure that the inorganic packaging film layer or external salts enter, and ensures that a barrier space has a better pressure level, so that water and oxygen in the super absorbent resin are not easy to diffuse, the packaging reliability is further ensured, and meanwhile, the subsequent film forming quality is ensured by modifying the surface of the organic layer; the water and oxygen blocking performance is improved; the metal doping amount in the barrier layer is gradually reduced towards the two sides in the horizontal direction of the perovskite assembly, and the metal element doping amount closer to the perovskite assembly is higher, so that the thermal conductivity and the bending resistance of the packaging layer can be improved, the internal stress of the barrier layer is reduced, and the bending resistance and the stability of the barrier layer are improved.

Description

Technical Field

[0001] The utility model belongs to the field of perovskite solar cells, and in particular relates to a perovskite solar cell packaging structure. Background Art

[0002] With the development of solar cell technology, improving energy conversion efficiency and reducing device costs are the key to large-scale application of solar cell technology. Compared with crystalline silicon cells, perovskite solar cells have the advantages of solution processing, abundant raw materials, and low production costs. The efficiency of a single cell in the laboratory can reach 25.7%, and the efficiency of a stacked cell combining perovskite cells and crystalline silicon cells can reach 32%, which makes perovskite cells or stacked cells containing perovskite cells expected to become a new generation of commercial photovoltaic cells.

[0003] Due to the unique properties of perovskite cells, their photoelectric conversion layer is easily affected by water vapor and undergoes irreversible decomposition and deterioration, thereby affecting the photoelectric conversion efficiency of the perovskite cell. Therefore, in order to ensure the outdoor service life of photovoltaic modules containing perovskite cells, the packaging of cells in photovoltaic modules becomes particularly important.

[0004] Most existing component packaging technologies use polymer materials for packaging, and their waterproof properties are difficult to meet the requirements of perovskite solar cells; high-temperature operations are often required during the packaging process, affecting the performance of perovskite solar cells; in addition, existing packaging materials generally release organic solvents during use, which easily react with perovskite solar cell materials and affect battery performance.

[0005] In view of this, this utility model is proposed. Utility Model Content

[0006] The purpose of the utility model is to overcome the shortcomings of the above-mentioned prior art and provide a perovskite solar cell packaging structure. The utility model encapsulates the perovskite component by arranging a first packaging layer, a barrier layer, an organic layer and a second packaging layer between the transparent conductive layer and the packaging cover plate, so as to effectively prevent water and oxygen from entering the perovskite solar cell. The barrier layer of diamond-like material has better density, which can ensure the entry of inorganic packaging film layer or external salts, and make the barrier space have better pressure level, so that water and oxygen in the highly absorbent resin are not easy to diffuse, thereby ensuring the packaging reliability, and modifying the surface of the organic layer to ensure the subsequent film quality, and improving the performance of blocking water and oxygen; the metal doping amount in the barrier layer gradually decreases toward both sides along the horizontal direction of the perovskite component, and the closer to the perovskite component, the higher the metal element doping amount, which can increase the thermal conductivity and bending resistance of the packaging layer, reduce the internal stress of the barrier layer, and improve the bending resistance and stability of the barrier layer.

[0007] The purpose of the utility model is to solve the problem through the following technical solutions:

[0008] The utility model provides a perovskite solar cell packaging structure, comprising a substrate, a transparent conductive layer, a perovskite component arranged on the surface of the transparent conductive layer, a packaging component for packaging the perovskite component, and a packaging cover plate arranged on the upper surface of the packaging component, characterized in that the packaging component comprises a first packaging layer, a barrier layer, an organic layer, and a second packaging layer stacked in sequence from bottom to top;

[0009] Among them, the first encapsulation layer wraps the upper surface and four side surfaces of the perovskite component and contacts the upper surface of the transparent conductive layer, and the four side surfaces of the second encapsulation layer extend from the lower surface of the encapsulation cover plate to the upper surface of the transparent conductive layer, and are used to completely wrap the perovskite component, the first encapsulation layer, the barrier layer and the organic layer.

[0010] Furthermore, four side surfaces of the organic layer extend to the upper surface of the first encapsulation layer, so as to wrap the barrier layer between the first encapsulation layer and the organic layer.

[0011] Furthermore, the organic layer is located directly above the barrier layer, and four side surfaces of the organic layer and the barrier layer are in contact with the inner surface of the second encapsulation layer.

[0012] Furthermore, the outer surface of the organic layer contacts the inner surface of the second encapsulation layer, and the four side surfaces of the organic layer extend to the upper surface of the transparent conductive layer, so as to completely wrap the perovskite component, the first encapsulation layer and the barrier layer.

[0013] Furthermore, the thickness of the first encapsulation layer is smaller than the thickness of the second encapsulation layer.

[0014] Further, the thickness of the first encapsulation layer is greater than or equal to 1 nm and less than or equal to 1 μm, and the thickness of the second encapsulation layer is greater than 1 nm and less than or equal to 10 μm.

[0015] Further, the thickness of the barrier layer is 50nm-1000nm;

[0016] The thickness of the organic layer is 20 nm-100 μm.

[0017] Furthermore, the barrier layer is prepared by any one of plasma enhanced chemical vapor deposition, high density electrochemical vapor deposition, inductively coupled plasma chemical vapor deposition, magnetron sputtering deposition, and pulsed laser deposition.

[0018] Further, the perovskite component is a normal perovskite component or an inverse perovskite component;

[0019] When the perovskite component is a positive type perovskite component, it includes, from top to bottom, a stacked back electrode layer, an electron transport layer, a perovskite light absorption layer, a hole transport layer and a transparent conductive substrate layer;

[0020] When the perovskite component is an inversion perovskite component, it includes, from top to bottom, a stacked back electrode layer, a hole transport layer, a perovskite light absorption layer, an electron transport layer and a transparent conductive substrate layer.

[0021] Furthermore, the thickness of the transparent conductive substrate layer is 80nm-400nm;

[0022] The thickness of the perovskite light absorbing layer is 80nm-500nm;

[0023] The thickness of the electron transport layer is 5nm-100nm.

[0024] Compared with the prior art, the utility model has the following beneficial effects:

[0025] 1. The utility model discloses a perovskite solar cell packaging structure, wherein the barrier layer uses diamond-like material, which has extremely high thermal conductivity and flexibility, and can also improve the heat dissipation performance of the packaging layer without environmental pollution. The content of metal elements and non-metal elements is 1wt% to 30wt%, and the ratio of the two is controlled to be 1:(2 to 4), which does not affect the low water and oxygen permeability of the diamond-like film itself, and can also fill the surface defects of the first packaging layer, thereby enhancing the ability of the overall structure to block external water and oxygen, and extending the service life of the perovskite solar cell.

[0026] 2. The utility model provides a perovskite solar cell packaging structure, in which the metal doping amount in the barrier layer gradually decreases toward both sides along the horizontal direction of the perovskite component, and the metal element doping amount of the barrier layer closer to the perovskite component is higher, which can not only increase the thermal conductivity and bending resistance of the packaging layer, but also maintain the stability of the packaging layer, which is beneficial to further reduce the internal stress of the barrier layer and improve the bending resistance of the barrier layer.

[0027] 3. The utility model discloses a perovskite solar cell packaging structure, which encapsulates the perovskite component by arranging a first packaging layer, a barrier layer, an organic layer and a second packaging layer between a transparent conductive layer and a packaging cover plate, thereby effectively preventing water and oxygen from entering the perovskite solar cell and isolating it from the external air environment. The barrier layer with a diamond-like structure has better compactness than the inorganic packaging film layer, which can ensure the entry of salts from the inorganic packaging film layer or the outside, and has a better pressure level in the barrier space, so that water and oxygen in the highly absorbent resin are not easy to diffuse, thereby ensuring the reliability of the packaging. The surface of the organic layer can also be modified to provide a flat surface for subsequent film formation, thereby ensuring the film formation quality and further improving the water and oxygen barrier performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings herein are incorporated into and constitute a part of this specification, and together with the description, are used to explain the principles of the present utility model.

[0029] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0030] Figure 1 This is a cross-sectional schematic diagram of the first packaging structure of the perovskite solar cell packaging structure of the utility model;

[0031] Figure 2 This is a cross-sectional schematic diagram of a second packaging structure of the perovskite solar cell packaging structure of the utility model;

[0032] Figure 3 This is a cross-sectional schematic diagram of a third packaging structure of a perovskite solar cell packaging structure of the utility model;

[0033] in:

[0034] 1 is a substrate;

[0035] 2 is a transparent conductive layer;

[0036] 3 is a perovskite component;

[0037] 4 is a packaging component; 41 is a first packaging layer; 42 is a barrier layer; 43 is an organic layer; 44 is a second packaging layer;

[0038] 5 is a packaging cover. DETAILED DESCRIPTION

[0039] Here, exemplary embodiments will be described in detail, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the utility model. Instead, they are only examples of devices consistent with some aspects of the utility model as detailed in the attached claims.

[0040] It should be understood that the doping amount calculation process is described in detail using the doping amount of metal elements as an example, and the total doping amount of metal elements wt% = the total mass of elements in the barrier layer / the mass of the barrier layer. For example, if two metal elements are doped, the total doping amount of metal elements wt% = the total mass of the two elements in the barrier layer / the mass of the barrier layer. This method can be used to calculate the doping amount according to specific application scenarios, and the embodiments of the present invention are not described one by one here.

[0041] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0042] Example 1

[0043] See also Figures 1 to 3 The present embodiment provides a perovskite solar cell packaging structure, comprising a substrate 1, a transparent conductive layer 2, a perovskite component 3, a packaging component 4 and a packaging cover plate 5 arranged in sequence from bottom to top; wherein the perovskite component 3 can be a positive perovskite component in which a transparent conductive substrate layer, a hole transport layer, a perovskite light absorption layer, an electron transport layer and a back electrode layer are stacked in sequence from bottom to top, or an inverted perovskite component in which a transparent conductive substrate layer, an electron transport layer, a perovskite light absorption layer, a hole transport layer and a back electrode layer are stacked in sequence from bottom to top; the packaging component 4 comprises a first packaging layer 41, a barrier layer 42, an organic layer 43, and a second packaging layer 44 arranged in sequence from bottom to top.

[0044] The perovskite component 3 is composed of a transparent conductive substrate layer, a hole transport layer, a perovskite light absorption layer, an electron transport layer and a back electrode layer. The perovskite light absorption layer absorbs photons and generates electron-hole pairs. Since the exciton binding energy of the perovskite material is very small, such as the exciton binding energy of MAPbI3 is only 19±3meV, it can be separated into free carriers at room temperature. The free carriers generated are then transported by the hole transport layer and the electron transport layer materials respectively, and then collected by the electrodes to form current and then go to the external circuit to do work, completing the entire photoelectric conversion process. The working process can be roughly divided into: (1) generation and separation of excitons; (2) transmission of free carriers; (3) collection of carriers and generation of current; (4) also includes the accompanying carrier recombination process.

[0045] Specifically, the material of the transparent conductive substrate layer includes but is not limited to indium tin oxide (ITO), aluminum-doped zinc oxide (AZO), indium-doped zinc oxide (IZO), fluorine-doped tin oxide (FTO), indium tungsten oxide (IWO), indium cerium oxide (ICO), Ag nanowires, one or more, with a thickness of 80nm to 400nm. The thickness of the transparent conductive substrate layer set in this embodiment is 300nm; the material of the hole transport layer includes nickel oxide (NiOx), molybdenum sulfide (MoS), molybdenum oxide (MoO), copper sulfide (CuS), cuprous thiocyanate (CuSCN), PTAA, PEDOT or Sp One or more of iro-MeOTAD, a typical but non-limiting combination includes a combination of NiOx and MoS; the material of the perovskite light absorbing layer is a narrow bandgap perovskite light absorbing material, including a halide crystal with an ABX3 structure, wherein A is at least one of methylamine, methylamidine, and cesium, B is any one of Sn, Bi, Sb, Ge, Cu or Pb ions, and X is at least one of halogen F, Cl, Br, and I, and its thickness is 80nm to 500nm. The thickness of the perovskite light absorbing layer set in this embodiment is 300nm; the electron transport layer includes titanium dioxide (TiO2), oxygen One or more of tin oxide (SnO2), zinc peroxide (ZnO2), indium zinc oxide (IZO), tungsten trioxide (WO3), niobium pentoxide (Nb2O5), C60, PCBM fullerene and derivatives, perovskite-type oxide (BaSnO3) or azo compound (AZO), with a thickness of 5nm-100nm. The thickness of the electron transport layer set in this embodiment is 80nm; the material of the back electrode layer includes one or more of Au, Ag, Cu, Al, Cr, Mo, carbon material, fluorine-doped tin oxide, indium-doped tin oxide, aluminum-doped zinc oxide, boron-doped zinc oxide or aluminum-doped tin oxide.

[0046] The substrate 1 and the packaging cover plate 5 can be any one of ultra-white glass plate, tempered glass plate, stainless steel plate, titanium foil, polyethylene terephthalate plate or polyethylene naphthalate plate. Specifically, they can be selected according to different perovskite components 3.

[0047] The transparent conductive layer 2 is generally disposed on the substrate 1 by chemical vapor deposition.

[0048] The barrier layer 42 is disposed between the organic layer 43 and the first encapsulation layer 41. Figure 1 As shown, the barrier layer 42 can be encapsulated between the organic layer 43 and the first encapsulation layer 41, and the four sides of the barrier layer 42 can be covered by the organic layer 43; Figure 2 As shown, the four sides of the barrier layer 42, the organic layer 43, and the first encapsulation layer 41 may also be set to have the same length and stacked together in sequence; Figure 3As shown, the barrier layer 42 and the four sides of the first encapsulation layer 41 can also be completely covered by the organic layer 43; in a specific implementation environment, different encapsulation structures can be selected according to actual needs.

[0049] The barrier layer 42 is a diamond-like layer doped with metal elements and non-metal elements, wherein the doped metal elements may be one or more of copper, aluminum, molybdenum, chromium, titanium or aluminum, and the non-metal elements may be one or more of silicon, nitrogen or fluorine, wherein the content of metal elements and non-metal elements is 1wt% to 30wt%, and the ratio of metal elements to non-metal elements is 1:(2 to 4). In this embodiment, the content of metal elements is set to 8wt%, and the content of non-metal elements is set to 24wt%, and the ratio of the two is 1:3; the amount of metal doping in the barrier layer 42 gradually decreases along the horizontal direction of the perovskite component 3 toward the surroundings. Specifically, in the barrier layer 42, in the horizontal direction, the lower the metal element content is toward the side, and in the vertical direction, the closer the metal element content is to the perovskite component 3, the higher the metal element content is; the thickness of the barrier layer 42 is 50nm-100nm, and the thickness of the barrier layer 42 set in this embodiment is 80nm.

[0050] The barrier layer 42 is prepared by any one of plasma enhanced chemical vapor deposition (PECVD), high density electrochemical vapor deposition (HDPCVD), inductively coupled plasma chemical vapor deposition (ICPCVD), magnetron sputtering deposition, and pulsed laser deposition.

[0051] The organic layer 43 is one or more of acrylate, hexamethyldisiloxane, polyacrylate, polycarbonate, acrylic resin, polystyrene compounds or polyester compounds, and the thickness of the organic layer 43 is set to 20nm-100μm. In this embodiment, the thickness of the organic layer 43 is 50μm.

[0052] The organic layer 43 may be manufactured by any method including spin coating, screen printing, slit spin coating, dispensing or inkjet printing.

[0053] The first encapsulation layer 41 and the second encapsulation layer 44 are one or more of zirconate, aluminum oxide, silicon nitride, silicon carbonitride, graphene, zirconium dioxide, zinc peroxide, silicon oxide or titanium dioxide. Specifically, the composition of the first encapsulation layer 41 and the second encapsulation layer 44 can be the same or different, that is, the final material of the first encapsulation layer 41 and the second encapsulation layer 44 can be the same or different.

[0054] The above-mentioned first encapsulation layer 41 and the second encapsulation layer 44 are prepared by chemical vapor deposition (CVD) or atomic deposition, wherein the thickness of the first encapsulation layer 41 is less than the thickness of the second encapsulation layer 44, and the thickness of the first encapsulation layer 41 is greater than or equal to 1 nm and less than or equal to 1 μm, and the thickness of the second encapsulation layer 44 is greater than 1 nm and less than or equal to 10 μm, so that the barrier layer 42 can better serve the perovskite component 3 and improve the photoelectric conversion efficiency of the perovskite component 3. In this embodiment, the thickness of the first encapsulation layer 41 is 300 nm, and the thickness of the second encapsulation layer 44 is 500 nm.

[0055] Specifically, when packaging the perovskite component 3, the packaging method includes the following steps:

[0056] S1: providing a substrate 1, stacking a transparent conductive layer 2 and a perovskite component 3 on the substrate 1 in sequence from bottom to top, and then forming a first encapsulation layer 41 on the perovskite component 3;

[0057] S2: forming a barrier layer 42 on the first encapsulation layer 41 in S1;

[0058] S3: forming an organic layer 43 on the barrier layer 42 formed in S2;

[0059] S4: forming a second encapsulation layer 44 on the outer surface of the overall structure formed in S3;

[0060] S5: a packaging cover plate 5 is disposed on the upper surface of the second packaging layer 44 formed in S4.

[0061] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention.

[0062] It should be understood that the present invention is not limited to the above-described contents, and various modifications and changes can be made without departing from its scope. The scope of the present invention is limited only by the appended claims.

Claims

1. A perovskite solar cell packaging structure, comprising a substrate (1), a transparent conductive layer (2), a perovskite component (3) arranged on the surface of the transparent conductive layer (2), a packaging component (4) for packaging the perovskite component (3), and a packaging cover plate (5) arranged on the upper surface of the packaging component (4), which are stacked in sequence from bottom to top, characterized in that: The packaging component (4) comprises a first packaging layer (41), a barrier layer (42), an organic layer (43) and a second packaging layer (44) which are stacked in sequence from bottom to top; The first encapsulation layer (41) wraps the upper surface and four side surfaces of the perovskite component (3) and contacts the upper surface of the transparent conductive layer (2); the four side surfaces of the second encapsulation layer (44) extend from the lower surface of the encapsulation cover plate (5) to the upper surface of the transparent conductive layer (2), and are used to completely wrap the perovskite component (3), the first encapsulation layer (41), the barrier layer (42) and the organic layer (43).

2. The perovskite solar cell packaging structure according to claim 1, characterized in that: The four side surfaces of the organic layer (43) extend to the upper surface of the first encapsulation layer (41), and are used to wrap the barrier layer (42) between the first encapsulation layer (41) and the organic layer (43).

3. The perovskite solar cell packaging structure according to claim 1, characterized in that: The organic layer (43) is located directly above the barrier layer (42), and the four side surfaces of the organic layer (43) and the barrier layer (42) are in contact with the inner surface of the second encapsulation layer (44) around them.

4. The perovskite solar cell packaging structure according to claim 1, characterized in that: The outer surface of the organic layer (43) contacts the inner surface of the second encapsulation layer (44), and the four side surfaces of the organic layer (43) extend to the upper surface of the transparent conductive layer (2), so as to completely encapsulate the perovskite component (3), the first encapsulation layer (41) and the barrier layer (42).

5. The perovskite solar cell packaging structure according to any one of claims 1 to 4, characterized in that: The thickness of the first encapsulation layer (41) is smaller than the thickness of the second encapsulation layer (44).

6. The perovskite solar cell packaging structure according to claim 5, characterized in that: The thickness of the first encapsulation layer (41) is greater than or equal to 1 nm and less than or equal to 1 μm, and the thickness of the second encapsulation layer (44) is greater than 1 nm and less than or equal to 10 μm.

7. The perovskite solar cell encapsulation structure according to claim 5, characterized in that: The thickness of the barrier layer (42) is 50nm-1000nm; The thickness of the organic layer (43) is 20 nm-100 μm.

8. The perovskite solar cell encapsulation structure according to claim 7, characterized in that: The barrier layer (42) is prepared by any one of plasma enhanced chemical vapor deposition, high density electrochemical vapor deposition, inductively coupled plasma chemical vapor deposition, magnetron sputtering deposition, and pulsed laser deposition.

9. The perovskite solar cell packaging structure according to claim 5, characterized in that: The perovskite component (3) is a normal perovskite component or an inverse perovskite component; When the perovskite component (3) is a positive type perovskite component, it comprises, from top to bottom, a stacked back electrode layer, an electron transport layer, a perovskite light absorption layer, a hole transport layer and a transparent conductive substrate layer; When the perovskite component (3) is an inverse perovskite component, it comprises, from top to bottom, a stacked back electrode layer, a hole transport layer, a perovskite light absorption layer, an electron transport layer and a transparent conductive substrate layer.

10. The perovskite solar cell packaging structure according to claim 9, characterized in that: The thickness of the transparent conductive substrate layer is 80nm-400nm; The thickness of the perovskite light absorbing layer is 80nm-500nm; The thickness of the electron transport layer is 5nm-100nm.

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