Semiconductor refrigeration assembly, refrigeration equipment and cooling clothes

Abstract

The utility model discloses a semiconductor refrigeration assembly, refrigeration equipment and cooling clothes, the semiconductor refrigeration assembly comprises a semiconductor refrigerator, a first heat exchanger and a second heat exchanger, the semiconductor refrigerator is provided with a first end face and a second end face which are opposite, the first heat exchanger is connected with the first end face in a welding or pasting mode, and the second heat exchanger is connected with the second end face in a welding or pasting mode. The second heat exchanger is connected with the second end face in a welded or pasted mode. According to the semiconductor refrigeration assembly, the refrigeration equipment and the cooling clothes, the problem that in the prior art, a semiconductor refrigeration system is low in refrigeration efficiency can be effectively solved, and meanwhile the semiconductor refrigeration assembly, the refrigeration equipment and the cooling clothes have the advantages of being reasonable in structural arrangement and high in refrigeration efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of cooling clothing, in particular to a semiconductor refrigeration component, a refrigeration device and a cooling clothing. Background Art

[0002] Semiconductor refrigeration uses the thermoelectric effect of materials, with semiconductor refrigerators as the core refrigeration components. By connecting cold-end and hot-end heat exchangers at the cold and hot ends of the semiconductor refrigerator to form a refrigeration system, the heat exchange between the hot-end heat exchanger and the ambient space and the cold-end heat exchanger to the load are realized. By adjusting the working voltage or current of the semiconductor refrigerator, the cooling capacity output by the semiconductor refrigerator can be controlled, which brings great convenience to users.

[0003] Compared with existing refrigeration systems, semiconductor refrigeration systems are significantly smaller and more portable, providing a more suitable application scenario for semiconductor refrigeration technology to regulate temperature in small spaces. Therefore, they are often used in outdoor scenarios where loads need to be cooled and cooled. Since semiconductor refrigeration systems are commonly used outdoors, in order to improve the overall portability of the equipment, the overall structure of the equipment is generally being further optimized and reduced in size. However, as the structure is compressed, the refrigeration effect of the equipment is also compressed, resulting in a problem of low refrigeration efficiency. Utility Model Content

[0004] The purpose of the utility model is to provide a semiconductor refrigeration component, refrigeration equipment and cooling clothing, which can effectively solve the problem of low refrigeration efficiency of semiconductor refrigeration systems in the prior art, and at the same time have the advantages of reasonable structural setting and high refrigeration efficiency.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A semiconductor refrigeration component includes a semiconductor refrigerator, a first heat exchanger and a second heat exchanger. The semiconductor refrigerator is provided with a first end face and a second end face opposite to each other. The first heat exchanger is welded or glued to the first end face, and the second heat exchanger is welded or glued to the second end face.

[0007] Preferably, the semiconductor refrigerator comprises a first substrate, a PN couple crystal grain and a second substrate connected in sequence, and the outer surface of the first substrate is the first end surface, and the outer surface of the second substrate is the second end surface;

[0008] The first substrate and the second substrate are any one of a metal substrate and a ceramic substrate.

[0009] Preferably, the metal substrate comprises an insulating layer and a metal substrate layer which are sequentially arranged from the inside to the outside, and the metal substrate layer is a copper layer or an aluminum layer.

[0010] Preferably, the ceramic substrate comprises a ceramic substrate layer and a metal cladding layer which are sequentially arranged from the inside to the outside, and the metal cladding layer is a copper layer or a molybdenum-manganese alloy layer.

[0011] Preferably, the ceramic substrate layer includes a plurality of ceramic substrates, and the plurality of ceramic substrates are spliced ​​together to form the ceramic substrate layer, and stress gaps are left between the ceramic substrates.

[0012] Preferably, the ceramic substrate and the hot ends of the PN couple crystal grains are bonded to each other.

[0013] Preferably, the area of ​​the ceramic substrate is ≥300cm 2 .

[0014] Preferably, the PN couple pair crystals are provided with a plurality of pairs, and the occupied area of ​​each pair of the PN couple pair crystals is 0.05-0.1 mm 2 .

[0015] Preferably, the first heat exchanger and the second heat exchanger have the same structure, and the first heat exchanger and the second heat exchanger are symmetrically arranged with respect to the semiconductor refrigerator.

[0016] Preferably, the semiconductor refrigerator is located at the center of the hot-end heat exchanger, and the hot-end heat exchanger is the first heat exchanger or the second heat exchanger.

[0017] Preferably, the hot end heat exchanger comprises a heat sink, and the heat sink is connected to the hot end surface of the semiconductor refrigerator by welding or gluing, and the hot end surface is the first end surface or the second end surface;

[0018] The shape of the heat sink is any one of circular, square, oval and rectangular.

[0019] Preferably, the heat sink is in a rectangular shape, the length of the heat sink is L, and the width of the heat sink is D, then:

[0020] L / D≤2.

[0021] A refrigeration device using the semiconductor refrigeration component;

[0022] It also includes a shell, the shell is provided with an air inlet, a cooling outlet and a heat dissipation outlet; the semiconductor refrigeration assembly is installed inside the shell;

[0023] The first end surface is the cold end surface of the semiconductor refrigerator, the second end surface is the hot end surface of the semiconductor refrigerator, and the first heat exchanger is arranged close to the cooling outlet, and the second heat exchanger is arranged close to the heat dissipation outlet.

[0024] A cooling suit using the above refrigeration device;

[0025] It also includes a body structure, the refrigeration device is installed on the body structure, the refrigeration outlet is located inside the body structure, and the air inlet and the heat dissipation outlet are located outside the body structure.

[0026] The technical solution provided by the embodiment of the utility model may have the following beneficial effects:

[0027] The semiconductor refrigerator in this technical solution and the heat exchangers at both ends adopt a welding or pasting joint structure, which ensures the effective connection between the semiconductor refrigerator and the heat exchanger, and further ensures that the cold and heat generated in the semiconductor refrigerator can be directly and effectively output, avoiding the loss of cold and heat in the mechanical connection structure, solving the problem of low refrigeration efficiency of semiconductor refrigeration systems in the prior art, and has the advantages of reasonable structural setting and high refrigeration efficiency. In addition, the omission of the mechanical connection structure is also conducive to reducing the risk of thermal short circuit between the cold end and the hot end of the semiconductor refrigerator caused by the mechanical connection structure, improving the cooling capacity and conversion efficiency of the semiconductor refrigeration component, and at the same time improving the consistency and stability of product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 The utility model is a schematic structural diagram of a semiconductor refrigeration component.

[0029] Figure 2 It is a schematic diagram of the hierarchical structure in one embodiment of a semiconductor refrigeration component of the utility model.

[0030] Figure 3 It is a schematic diagram of the hierarchical structure in another embodiment of a semiconductor refrigeration component of the utility model.

[0031] Figure 4 The utility model is a structural schematic diagram of a refrigeration device.

[0032] Among them: semiconductor refrigerator 1, PN electric couple crystal grain 11, metal substrate 12, insulating layer 121, metal substrate layer 122, ceramic substrate 13, ceramic substrate layer 131, metal cladding layer 132, first heat exchanger 2, heat sink 21, second heat exchanger 3, shell 4, air inlet 41, cooling outlet 42, heat dissipation outlet 43. DETAILED DESCRIPTION

[0033] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0034] The present technical solution provides a semiconductor refrigeration component, including a semiconductor refrigerator 1, a first heat exchanger 2 and a second heat exchanger 3, wherein the semiconductor refrigerator 1 is provided with a first end face and a second end face opposite to each other, the first heat exchanger 2 is welded or glued to the first end face, and the second heat exchanger 3 is welded or glued to the second end face.

[0035] Since semiconductor refrigeration systems are commonly used outdoors, in order to improve the overall portability of the device, the overall structure of the device is generally developing towards a trend of being further optimized and reduced in size. However, as the structure is compressed, the refrigeration effect of the device is also compressed, resulting in a problem of low refrigeration efficiency. Based on this, this technical solution proposes a semiconductor refrigeration component, such as Figure 1-3 As shown, it can effectively solve the problem of low refrigeration efficiency of semiconductor refrigeration systems in the prior art, and at the same time has the advantages of reasonable structural setting and high refrigeration efficiency.

[0036] Specifically, Figure 1 As shown, the semiconductor refrigeration assembly proposed in this scheme includes a first heat exchanger 2, a semiconductor refrigerator 1, and a second heat exchanger 3 connected in sequence. It should be noted that the semiconductor refrigerator 1 of this scheme is made using the Peltier effect, which refers to the phenomenon that when a direct current passes through a galvanic couple composed of two semiconductor materials, one end of the galvanic couple absorbs heat and the other end releases heat; in other words, the semiconductor refrigerator 1 is made of two semiconductor materials to form a hot end and a cold end, the cold end continuously absorbs heat to achieve cooling, and the hot end continuously releases heat to achieve heat dissipation.

[0037] Furthermore, compared with the mechanical connection structure of the prior art, since the semiconductor refrigerator 1 and the heat exchangers (2, 3) at both ends of the present invention adopt a welding or pasting connection structure, the effective connection between the semiconductor refrigerator 1 and the heat exchanger is ensured, thereby ensuring that the cold and heat generated in the semiconductor refrigerator 1 can be directly and effectively output, avoiding the loss of cold and heat in the mechanical connection structure, solving the problem of low cooling efficiency of the semiconductor refrigeration system in the prior art, and having the advantages of reasonable structural setting and high cooling efficiency.

[0038] Furthermore, the omission of the mechanical connection structure is also beneficial to reduce the risk of thermal short circuit between the cold end and the hot end of the semiconductor refrigerator 1 caused by the mechanical connection structure, improve the cooling capacity and conversion efficiency of the semiconductor refrigeration component, and at the same time improve the consistency and stability of product quality.

[0039] It should be noted that the welding connection in this scheme refers to the semiconductor refrigerator 1 and the two heat exchangers that can be welded with conventional solder to form an integrated semiconductor refrigeration component, while the adhesive connection refers to the semiconductor refrigerator 1 and the two heat exchangers that can be cured with conventional thermal conductive adhesive to form an integrated semiconductor refrigeration component.

[0040] Further, the semiconductor refrigerator 1 comprises a first substrate, a PN couple crystal grain 11 and a second substrate connected in sequence, and the outer surface of the first substrate is the first end surface, and the outer surface of the second substrate is the second end surface;

[0041] The first substrate and the second substrate are any one of a metal substrate 12 and a ceramic substrate 13 .

[0042] Furthermore, the semiconductor refrigerator 1 in the present embodiment includes a first substrate, a PN couple crystal 11 and a second substrate which are sequentially connected. For the convenience of further detailed description, the first substrate is designated as a cooling end and the second substrate is designated as a heat dissipation end.

[0043] When the semiconductor refrigerator 1 of this solution is working, current is passed through the PN couple crystal grain 11. When the current flows through the PN couple crystal grain 11, the heat generated by the current is transferred from the first substrate to the second substrate, so the first substrate starts to cool and the second substrate starts to dissipate heat. During the cooling process of the first substrate, the cold energy generated by the first substrate will gradually be transferred to the first heat exchanger 2, thereby achieving the effect of cooling and cooling.

[0044] In a preferred embodiment of the present technical solution, both the first substrate and the second substrate can be any one of a metal substrate 12 and a ceramic substrate 13. That is, the first substrate and the second substrate can be both a metal substrate 12 and a ceramic substrate 13; in addition, when the first substrate is a metal substrate 12, the second substrate can be a ceramic substrate 13; and when the first substrate is a ceramic substrate 13, the second substrate can be a metal substrate 12. It should be noted that the specific choice of the first substrate and the second substrate can be selected according to the actual application scenario of the semiconductor refrigeration component, such as the comprehensive consideration of the two perspectives of heat transfer matching and cost performance.

[0045] To further explain, the metal substrate 12 includes an insulating layer 121 and a metal substrate layer 122 which are sequentially arranged from the inside to the outside, and the metal substrate layer 122 is a copper layer or an aluminum layer.

[0046] like Figure 2 As shown, the metal substrate 12 used in this solution includes at least a two-layer structure, and the material of the metal substrate layer 122 is preferably copper or aluminum.

[0047] To further explain, the ceramic substrate 13 includes a ceramic substrate layer 131 and a metal cladding layer 132 which are sequentially arranged from the inside to the outside, and the metal cladding layer 132 is a copper layer or a molybdenum-manganese alloy layer.

[0048] like Figure 3 As shown, the ceramic substrate 13 used in this solution includes at least a two-layer structure, and the material of the metal cladding layer 132 is preferably copper or molybdenum-manganese alloy.

[0049] To further explain, the ceramic substrate layer 131 includes a plurality of ceramic substrates, and the ceramic substrate layer 131 is formed by splicing the plurality of ceramic substrates, and stress gaps are left between the ceramic substrates.

[0050] The cooling capacity of the semiconductor refrigerator 1 is proportional to the logarithm of the PN couple to the grain 11. At the same time, it is limited by the thermal conductivity of the ceramic substrate, the heat flux density of the hot end of the semiconductor refrigerator 1, and the integration process level of the PN couple to the grain. The integration of the PN couple to the grain 11 in the semiconductor refrigerator 1 has certain limitations, so the cooling capacity of the semiconductor refrigerator 1 is positively correlated with the substrate area, that is, the larger the cooling capacity of the semiconductor refrigerator 1, the larger the substrate area. When a large-area substrate is welded to a heat exchanger, a large stress will be generated inside the semiconductor refrigerator 1.

[0051] As for the ceramic substrate layer 131, it is relatively brittle and it is difficult to effectively reduce the influence of the internal pressure of the semiconductor refrigerator 1 on the product stability like the metal substrate layer 122 with better toughness. Therefore, in order to effectively release the internal stress of the ceramic substrate 13 and improve the stability and reliability of the semiconductor refrigerator 1 during operation, the present solution makes the ceramic substrate layer 131 in the ceramic substrate 13 be spliced ​​by several ceramic substrates, and leaves a stress gap (not shown in the figure) between the ceramic substrates for releasing the internal stress, and at the same time, the metal coating layer 132 is coated on its outer surface, so as to obtain a complete ceramic substrate 13.

[0052] It should be noted that the more ceramic substrates there are per unit area, the smaller the internal stress of the ceramic substrate 13 is, and the greater the stability and reliability of the semiconductor refrigerator 1 during operation. However, it should be noted that the number of ceramic substrates in the ceramic substrate 13 needs to be selected based on the actual application scenario of the semiconductor refrigeration component, such as the size of the internal stress and the circuit direction in the semiconductor refrigerator 1.

[0053] To further illustrate, the ceramic substrate and the hot end of the PN couple crystal grain 11 are bonded to each other.

[0054] Since condensed water may accumulate at the cold end of the semiconductor refrigerator 1 during operation, in order to avoid the accumulation of condensed water affecting the normal operation of the PN couple pair of crystal grains 11, the present scheme preferably applies the stress structure scheme of the ceramic substrate 13 to the hot end of the PN couple pair of crystal grains 11 to further improve the stability and reliability of the operation of the semiconductor refrigerator 1.

[0055] Further, the area of ​​the ceramic substrate is ≥300cm 2 .

[0056] In a more preferred embodiment of the present technical solution, the minimum area of ​​the single-chip ceramic substrate is optimized to take into account both the production difficulty and the reliability of the semiconductor refrigerator 1.

[0057] Further, the PN couple pair of crystal grains 11 are provided with a plurality of pairs, and each pair of the PN couple pair of crystal grains 11 occupies an area of ​​0.05 to 0.1 mm. 2 .

[0058] In another more preferred embodiment of the present technical solution, the integration degree of the PN couple pair crystal grains 11 is optimized to take into account both the cooling capacity and integration difficulty of the semiconductor refrigerator 1 .

[0059] It is further explained that the first heat exchanger 2 and the second heat exchanger 3 have the same structure, and the first heat exchanger 2 and the second heat exchanger 3 are symmetrically arranged with respect to the semiconductor refrigerator 1 .

[0060] In addition, in order to avoid the semiconductor refrigeration component from generating internal stress during welding, pasting or operation due to the asymmetric mechanical structure, thereby affecting the stability of the product, the present solution also adopts a symmetrical heat exchanger structure for the first heat exchanger 2 and the second heat exchanger 3 to further improve the stability and reliability of the semiconductor refrigerator 1.

[0061] To further explain, the semiconductor refrigerator 1 is located at the center of the hot end heat exchanger, and the hot end heat exchanger is the first heat exchanger 2 or the second heat exchanger 3 .

[0062] According to semiconductor refrigeration theory, the cooling capacity of semiconductor refrigerator 1 is Q c for:

[0063] Q c =N(α p -α n )IT c -K(T h -T c )-0.5I 2 R i ,

[0064] Among them, N, αp , α n , I, K, T h , T c , R i They are the number of PN couple grains, the Seebeck coefficient of p-type material, the Seebeck coefficient of n-type material, the operating current, the thermal conductivity of the refrigerator, the hot end temperature, the cold end temperature and the internal resistance of the semiconductor refrigerator 1. The cooling coefficient (or conversion efficiency) is cop = Q c / P i , where P i is the electrical input power of the semiconductor refrigerator 1. It can be seen that the cooling capacity and cooling efficiency of the semiconductor refrigerator 1 are both related to the hot end temperature T of the semiconductor refrigerator 1. h When other parameters are relatively fixed, T h The smaller the temperature, the lower the hot end temperature of the semiconductor refrigerator 1. c The larger the cop, the better the cooling effect. Therefore, one solution to increase the cooling capacity of the refrigeration system is to reduce the hot end temperature T of the semiconductor refrigerator 1. h , and reduce the hot end temperature T h The most direct way is to improve the heat dissipation effect of the semiconductor refrigerator 1. Therefore, in order to improve the heat dissipation effect of the semiconductor refrigerator 1, the present solution also attaches the semiconductor refrigerator 1 to the center of the hot end heat exchanger.

[0065] Further, the hot end heat exchanger includes a heat sink 21, and the heat sink 21 is connected to the hot end surface of the semiconductor refrigerator 1 by welding or bonding, and the hot end surface is the first end surface or the second end surface;

[0066] The heat sink 21 may be in any one of a circular, square, oval and rectangular shape.

[0067] Furthermore, in order to ensure the heat dissipation effect of the semiconductor refrigerator 1, the present solution also optimizes the shape of the heat sink 21 in the hot end heat exchanger to take into account the heat dissipation effect and processing difficulty of the heat exchanger. In some embodiments, the present solution further optimizes the shape of the heat sink 21 to be circular or square.

[0068] To further illustrate, the heat sink 21 is in a rectangular shape, the length of the heat sink 21 is L, and the width of the heat sink 21 is D, then:

[0069] L / D≤2.

[0070] In other embodiments, if the heat sink 21 must be made into a rectangular shape due to processing conditions or installation position limitations, the slight defects caused by the shape of the heat sink 21 can be overcome by optimizing the aspect ratio of the heat sink 21 .

[0071] A refrigeration device using the semiconductor refrigeration component;

[0072] It also includes a shell 4, the shell 4 is provided with an air inlet 41, a cooling outlet 42 and a heat dissipation outlet 43; the semiconductor refrigeration assembly is installed inside the shell 4;

[0073] The first end surface is the cold end surface of the semiconductor refrigerator 1 , the second end surface is the hot end surface of the semiconductor refrigerator 1 , and the first heat exchanger 2 is arranged close to the cooling outlet 42 , and the second heat exchanger 3 is arranged close to the heat dissipation outlet 43 .

[0074] The present application also provides a refrigeration device, such as Figure 4 As shown, it includes the semiconductor refrigeration component and the housing 4 mentioned in the above scheme. Exemplarily, when the refrigeration device is working, the semiconductor refrigeration component is energized, and the first end surface of the semiconductor refrigerator 1 starts to cool, and the second end surface starts to generate heat.

[0075] As the first end face is cooled, since the first heat exchanger 2 is connected to the first end face, heat conduction occurs between the two, and the cold energy generated by the first end face will be conducted to the first heat exchanger 2. When air enters the interior of the refrigeration device from the air inlet 41, it will carry the cold energy on the first heat exchanger 2, be discharged from the refrigeration outlet 42, and be delivered to the load connected to the refrigeration device.

[0076] As the second end surface generates heat, since the second heat exchanger 3 is connected to the second end surface and there is a heat conduction connection between the two, the heat generated by the second end surface will be conducted to the second heat exchanger 3. When air enters the interior of the refrigeration device from the air inlet 41, it will carry the heat on the second heat exchanger 3 and be discharged from the refrigeration device from the heat dissipation outlet 43.

[0077] A cooling suit using the above refrigeration device;

[0078] The garment body structure is also included, the refrigeration device is installed on the garment body structure, the refrigeration outlet 42 is located inside the garment body structure, and the heat dissipation outlet 43 is located outside the garment body structure.

[0079] For people who work continuously in outdoor environments without air conditioning, especially in high temperature environments, such as police officers standing guard in hot summer weather, construction workers working under the scorching sun, or maintenance personnel performing related maintenance work outdoors at high altitudes, they often have to overcome various discomforts caused by high temperatures to continue working for a period of time. When working in high temperature conditions wearing ordinary clothes, people will sweat, and sweat will migrate to the surface of clothes through diffusion and transmission, and some heat will be taken away by sweat evaporation. However, the evaporation source provided by sweat evaporation is limited, so the heat taken away is also limited. Especially when working continuously for a period of time in a high temperature environment, ordinary clothes cannot achieve the effect of cooling within a certain period of time.

[0080] Therefore, in order to meet the needs of users, especially those working outdoors in high temperatures, the present application also provides a cooling garment, including the refrigeration device and the garment body structure (not shown in the figure) mentioned in the above scheme, so that the refrigeration outlet 42 of the refrigeration device is facing the inside of the garment body structure, so that the cold air output through the refrigeration outlet 42 takes away part of the heat generated by the human body, thereby realizing continuous cycle refrigeration and cooling of the cooling garment, thereby improving the user experience.

[0081] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0082] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps described in these embodiments do not limit the scope of the utility model. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0083] In the description of the present utility model, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present utility model; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0084] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0085] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0086] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0087] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. A semiconductor refrigeration component, characterized in that: The semiconductor refrigerator comprises a first heat exchanger and a second heat exchanger, wherein the semiconductor refrigerator is provided with a first end face and a second end face opposite to each other, the first heat exchanger is connected to the first end face by welding or gluing, and the second heat exchanger is connected to the second end face by welding or gluing; The first heat exchanger and the second heat exchanger have the same structure, and the first heat exchanger and the second heat exchanger are symmetrically arranged with respect to the semiconductor refrigerator.

2. A semiconductor refrigeration assembly according to claim 1, characterized in that: The semiconductor refrigerator comprises a first substrate, a PN couple crystal grain and a second substrate connected in sequence, wherein the outer surface of the first substrate is the first end surface, and the outer surface of the second substrate is the second end surface; The first substrate and the second substrate are any one of a metal substrate and a ceramic substrate.

3. A semiconductor refrigeration assembly according to claim 2, characterized in that: The metal substrate comprises an insulating layer and a metal substrate layer which are sequentially arranged from the inside to the outside, and the metal substrate layer is a copper layer or an aluminum layer.

4. A semiconductor refrigeration assembly according to claim 2, characterized in that: The ceramic substrate comprises a ceramic substrate layer and a metal cladding layer which are sequentially arranged from the inside to the outside, and the metal cladding layer is a copper layer or a molybdenum-manganese alloy layer.

5. A semiconductor refrigeration assembly according to claim 4, characterized in that: The ceramic substrate layer includes a plurality of ceramic substrates, which are spliced ​​together to form the ceramic substrate layer, and stress gaps are left between the ceramic substrates.

6. A semiconductor refrigeration assembly according to claim 5, characterized in that: The ceramic substrate and the hot ends of the PN couple crystal grains are bonded to each other.

7. A semiconductor refrigeration assembly according to claim 5, characterized in that: The area of ​​the ceramic substrate is ≥300cm 2 .

8. A semiconductor refrigeration assembly according to claim 2, characterized in that: The PN couple crystal grains are provided with a plurality of pairs, and each pair of the PN couple crystal grains occupies an area of ​​0.05 to 0.1 mm 2 .

9. A semiconductor refrigeration assembly according to claim 1, characterized in that: The semiconductor refrigerator is located at the center of the hot end heat exchanger, and the hot end heat exchanger is the first heat exchanger or the second heat exchanger.

10. A semiconductor refrigeration assembly according to claim 9, characterized in that: The hot end heat exchanger comprises a heat sink, and the heat sink is connected to the hot end surface of the semiconductor refrigerator by welding or gluing, and the hot end surface is the first end surface or the second end surface; The shape of the heat sink is any one of circular, square, oval and rectangular.

11. A semiconductor refrigeration assembly according to claim 10, characterized in that: The shape of the heat sink is a rectangle, the length of the heat sink is L, and the width of the heat sink is D. Then: L / D≤2.

12. A refrigeration device, characterized in that: Use the semiconductor refrigeration component according to any one of claims 1 to 11; It also includes a shell, the shell is provided with an air inlet, a cooling outlet and a heat dissipation outlet; the semiconductor refrigeration assembly is installed inside the shell; The first end surface is the cold end surface of the semiconductor refrigerator, the second end surface is the hot end surface of the semiconductor refrigerator, and the first heat exchanger is arranged close to the cooling outlet, and the second heat exchanger is arranged close to the heat dissipation outlet.

13. A cooling suit, characterized in that: Use of the refrigeration device according to claim 12; It also includes a body structure, the refrigeration device is installed on the body structure, the refrigeration outlet is located inside the body structure, and the heat dissipation outlet is located outside the body structure.

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