Structure for reducing conducted interference of EMC (Electro Magnetic Compatibility) of inductor

Abstract

The utility model relates to the technical field of inductor EMC (Electro Magnetic Compatibility), and discloses a structure for reducing conducted interference of inductor EMC, which comprises a circuit board substrate and a power supply shielding box which is arranged at the top of the circuit board substrate and is used for storing power supply elements, a filter is arranged on one side of the power supply shielding box, and the filter is arranged on the other side of the power supply shielding box. Three single-chip microcomputer shielding boxes used for storing single-chip microcomputers are fixed to the top of the circuit board substrate. The stabilizing mechanism is arranged at the bottom of the circuit board substrate and used for reducing shaking of the circuit board substrate, a bottom plate is fixed to the bottom of the stabilizing mechanism, and a limiting groove is formed in the inner wall of the bottom plate; the buffer mechanism is arranged in the limiting groove and is used for improving the stability of the substrate of the circuit board, so that the problem that electronic parts on the circuit board can generate some electromagnetic radiation or other side effects to cause mutual interference and influence the reliability of an electronic product is solved; and in a special oscillation environment, the circuit board is not stable enough, the EMC conduction of the inductor is influenced, and the signal transmission is not stable.

Description

Technical Field

[0001] The utility model relates to the technical field of inductor EMC, in particular to a structure for reducing inductor EMC conduction interference. Background Art

[0002] Inductive EMC conduction refers to the impact of the surrounding electromagnetic environment caused by the presence of inductive components in the circuit. Inductive components store and release energy in the circuit, which will generate a magnetic field. This magnetic field will affect other circuits or equipment. This is the EMC conduction of the inductor. In the design and use of electronic equipment, the impact of inductive EMC conduction needs to be considered to ensure that the equipment can work properly and meet electromagnetic compatibility standards. This may involve selecting suitable inductors, designing reasonable circuit layouts, and using filters and other methods to reduce the impact of inductive EMC conduction. In order to reduce the problem of inductive EMC conduction, a variety of measures can be taken to effectively reduce the problem of inductive EMC conduction, so that electronic equipment can operate in a good electromagnetic environment.

[0003] The lines and parts on the circuit board are becoming more and more dense. The electronic parts on the circuit board will more or less produce some electromagnetic radiation or other side effects, causing interference between each other and affecting the reliability of electronic products. Since the application range of inductive EMC conduction is wide, it is used in various environments, including some relatively oscillating environments. The circuit board is not stable enough when used in special environments, which in turn affects the inductive EMC conduction and causes unstable signal transmission. Utility Model Content

[0004] The purpose of the utility model is to provide a structure for reducing inductive EMC conduction interference to solve the problems raised in the above background technology.

[0005] To achieve the above object, the utility model provides the following technical solution: a structure for reducing inductive EMC conduction interference, including a circuit board substrate, and also including:

[0006] A power shielding box for storing power supply elements is arranged on the top of the circuit board substrate, a filter is arranged on one side of the power shielding box, and three single-chip shielding boxes for storing single-chips are fixed on the top of the circuit board substrate;

[0007] A stabilizing mechanism is arranged at the bottom of the circuit board substrate to reduce its shaking, a bottom plate is fixed to the bottom of the stabilizing mechanism, and a limiting groove is provided on the inner wall of the bottom plate;

[0008] A buffer mechanism is arranged inside the limiting groove to improve the stability of the circuit board substrate.

[0009] Preferably, the stabilizing mechanism comprises a connecting plate fixed to the bottom of the circuit board substrate, a first spring is fixed to the bottom of the connecting plate, and the first spring is fixed to the top of the bottom plate.

[0010] Preferably, a damping seat is provided inside the first spring, the damping seat is fixed to the top of the bottom plate, the inner wall of the damping seat is slidably connected with a damping rod, and the damping rod is fixed to the bottom of the circuit board substrate.

[0011] Preferably, the buffer mechanism comprises a limiting rod fixed to the inner wall of the limiting groove, and a second spring is slidably connected to the outer side of the limiting rod.

[0012] Preferably, moving blocks are fixed at both ends of the second spring, the inner wall of the moving block is rotatably connected to a pull rod, one end of the pull rod away from the moving block is rotatably connected to a top seat, and the top seat is fixed to the bottom of the connecting plate.

[0013] Preferably, a plurality of diodes are arranged on the top of the circuit board substrate, and two symmetrical capacitor bodies are fixed on both sides of the diodes.

[0014] Preferably, a decoupling capacitor is disposed on the top of the circuit board substrate, and an access terminal and a ground terminal are respectively disposed on the bottom of the decoupling capacitor.

[0015] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0016] The utility model can make the circuit board substrate run more stably in a vibration environment by setting a stabilizing mechanism, and will not shake due to environmental vibration, causing interference with the conducted signal, thereby improving the stability of signal transmission. By setting a power shielding box, the power supply can be covered inside, so that various radiations and working noises of the power supply are shielded inside the box, avoiding interference with other components. By setting a single-chip computer shielding box, the operation of the single-chip computer can be protected from interference from external electrical components. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of a preferred embodiment of the structure for reducing inductive EMC conduction interference provided by the utility model;

[0018] Figure 2 A schematic diagram of the structure of the bottom of the circuit board substrate provided by the utility model;

[0019] Figure 3 A schematic diagram of the structure of the stabilizing mechanism and the buffering mechanism provided by the utility model;

[0020] Figure 4 This is a schematic diagram of the structure inside the first spring provided by the utility model.

[0021] In the figure: 1. circuit board substrate; 2. power shielding box; 3. filter; 4. single-chip shielding box; 5. stabilizing mechanism; 51. connecting plate; 52. first spring; 53. damping seat; 54. damping rod; 6. bottom plate; 7. limiting groove; 8. buffer mechanism; 81. limiting rod; 82. second spring; 83. moving block; 84. pull rod; 85. top seat; 9. diode; 10. capacitor body; 11. decoupling capacitor; 12. access terminal; 13. ground terminal. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-4 As shown, a structure for reducing inductive EMC conducted interference includes a circuit board substrate 1, by which various inductive components can be installed; it also includes a power shielding box 2 arranged on the top of the circuit board substrate 1 for storing power components, by which the power shielding box 2 can store power and shield various radiations and working noises of the power supply; a filter 3 is arranged on one side of the power shielding box 2, by which the noise at the power supply end can be reduced, and the influence of noise on other components can be reduced; three single-chip shielding boxes 4 for storing single chips are fixed on the top of the circuit board substrate 1, by which Providing a single-chip shielding box 4 can protect the operation of the single-chip microcomputer from interference from external electrical components; a stabilizing mechanism 5 is provided at the bottom of the circuit board substrate 1 to reduce its shaking, and the circuit board substrate 1 can be made to operate more stably by providing the stabilizing mechanism 5; a bottom plate 6 is fixed to the bottom of the stabilizing mechanism 5, and the stabilizing mechanism 5 can be installed by providing the bottom plate 6; a limiting groove 7 is provided on the inner wall of the bottom plate 6, and a buffer mechanism 8 can be installed by providing the limiting groove 7; a buffer mechanism 8 is provided inside the limiting groove 7 to improve the stability of the circuit board substrate 1, and the stability of the circuit board substrate 1 can be improved by providing the buffer mechanism 8.

[0024] See also Figure 2 , Figure 3 and Figure 4As shown, the stabilizing mechanism 5 includes a connecting plate 51 fixed to the bottom of the circuit board substrate 1, and two symmetrical stabilizing mechanisms 5 can be connected by setting the connecting plate 51; a first spring 52 is fixed to the bottom of the connecting plate 51, and the first spring 52 can be set to achieve a shock-absorbing effect when the connecting plate 51 is pressed; the first spring 52 is fixed to the top of the bottom plate 6; a damping seat 53 is arranged inside the first spring 52, and the damping seat 53 is fixed to the top of the bottom plate 6, and the damping seat 53 can facilitate the damping rod 54 to slide inside it; the inner wall of the damping seat 53 is slidably connected with a damping rod 54, and the damping rod 54 is fixed to the bottom of the circuit board substrate 1, and the extension and retraction of the damping rod 54 can improve the stability of the extension and retraction of the first spring 52, thereby improving the shock-absorbing effect.

[0025] See also Figure 2 and Figure 3 As shown, the buffer mechanism 8 includes a limiting rod 81 fixed to the inner wall of the limiting groove 7, and the limiting rod 81 is provided to facilitate the extension and retraction of the second spring 82 on its outer side; the outer side of the limiting rod 81 is slidably connected with the second spring 82, and the stability of the circuit board substrate 1 during operation can be improved by providing the second spring 82; both ends of the second spring 82 are fixed with moving blocks 83, and the second spring 82 can be squeezed by providing the moving blocks 83; the inner wall of the moving block 83 is rotatably connected with a pull rod 84, and the moving block 83 and the top seat 85 can be connected by providing the pull rod 84; the end of the pull rod 84 away from the moving block 83 is rotatably connected with the top seat 85, and the top seat 85 is fixed to the bottom of the connecting plate 51, and the connecting plate 51 can be connected by providing the top seat 85.

[0026] See also Figure 1 As shown, a plurality of diodes 9 are arranged on the top of the circuit board substrate 1. The diodes 9 can be used to control the current and play a role in regulating the current; two symmetrical capacitor bodies 10 are fixed on both sides of the diodes 9. The charges can be stored by the capacitor bodies 10 and released when needed; a decoupling capacitor 11 is arranged on the top of the circuit board substrate 1. A more stable power supply can be provided by the decoupling capacitor 11, and the noise of the component coupled to the power supply end can also be reduced, which can indirectly reduce the influence of the noise of the component on other components; an access terminal 12 and a ground terminal 13 are respectively arranged at the bottom of the decoupling capacitor 11.

[0027] Working principle: The worker connects the power supply in the power shielding box 2 to start the circuit board substrate 1, and the components on the circuit board substrate 1 start to operate accordingly. When the circuit board substrate 1 is in a relatively vibrating environment, the shaking caused by the vibration is relatively large, which affects the transmission of component signals. At this time, when the circuit board substrate 1 shakes, the first spring 52 and the top seat 85 will be pressed through the connecting plate 51. Due to the expansion and contraction of the first spring 52 and the rotation of the pull rod 84 driven by the top seat 85, the moving block 83 squeezes the second spring 82 to expand and contract, thereby improving the shock absorbing and buffering effect of the circuit board substrate 1, making it work more stably and less susceptible to interference.

[0028] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A structure for reducing inductive EMC conducted interference, comprising a circuit board substrate (1), characterized in that: Also includes: A power shielding box (2) for storing power supply elements is arranged on the top of the circuit board substrate (1), a filter (3) is arranged on one side of the power shielding box (2), and three single-chip shielding boxes (4) for storing single-chips are fixed on the top of the circuit board substrate (1); A stabilizing mechanism (5) is arranged at the bottom of the circuit board substrate (1) to reduce its shaking, a bottom plate (6) is fixed to the bottom of the stabilizing mechanism (5), and a limiting groove (7) is provided on the inner wall of the bottom plate (6); A buffer mechanism (8) is arranged inside the limiting groove (7) and is used to improve the stability of the circuit board substrate (1).

2. The structure for reducing inductive EMC conduction interference according to claim 1, characterized in that: The stabilizing mechanism (5) comprises a connecting plate (51) fixed to the bottom of the circuit board substrate (1), a first spring (52) is fixed to the bottom of the connecting plate (51), and the first spring (52) is fixed to the top of the bottom plate (6).

3. The structure for reducing inductive EMC conduction interference according to claim 2, characterized in that: A damping seat (53) is arranged inside the first spring (52), and the damping seat (53) is fixed to the top of the bottom plate (6). The inner wall of the damping seat (53) is slidably connected to a damping rod (54), and the damping rod (54) is fixed to the bottom of the circuit board substrate (1).

4. The structure for reducing inductive EMC conduction interference according to claim 1, characterized in that: The buffer mechanism (8) comprises a limiting rod (81) fixed to the inner wall of the limiting groove (7), and a second spring (82) is slidably connected to the outer side of the limiting rod (81).

5. The structure for reducing inductive EMC conduction interference according to claim 4, characterized in that: A moving block (83) is fixed at both ends of the second spring (82), the inner wall of the moving block (83) is rotatably connected to a pull rod (84), and one end of the pull rod (84) away from the moving block (83) is rotatably connected to a top seat (85), and the top seat (85) is fixed to the bottom of the connecting plate (51).

6. The structure for reducing inductive EMC conduction interference according to claim 1, characterized in that: A plurality of diodes (9) are arranged on the top of the circuit board substrate (1), and two symmetrical capacitor bodies (10) are fixed on both sides of the diodes (9).

7. The structure for reducing inductive EMC conducted interference according to claim 1, characterized in that: A decoupling capacitor (11) is arranged on the top of the circuit board substrate (1), and an access terminal (12) and a ground terminal (13) are respectively arranged on the bottom of the decoupling capacitor (11).

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