Semiconductor side pump water-cooling packaging heat sink

Abstract

The utility model discloses a semiconductor side pump water-cooling packaging heat sink, which comprises a semiconductor heat sink, radiating fins, a conductive copper-clad plate A, a conductive copper-clad plate B, a connecting electrode A, a connecting electrode B and a semiconductor stack array, the combined body of the heat dissipation fins is embedded in the semiconductor heat sink, the semiconductor stack array is attached to the upper portion of the combined body of the heat dissipation fins, and the conductive copper-clad plate A and the conductive copper-clad plate B are attached to the two vertical side faces of the semiconductor heat sink respectively; the upper ends of the connecting electrodes A and B are crimped on the side edge of the semiconductor stack array, and the lower edges of the connecting electrodes A and B are crimped on the outer surfaces of the conductive copper-clad plates A and B. The technical scheme has the advantages that the distance between the semiconductor pump source and the working medium can be adjusted according to needs; 1-5 groups of pump sources of a single unit can be compatible; a fin cooling mode is adopted, so that the heat dissipation requirements of multiple groups of semiconductor pumps can be met; and a side assembling and water passing structure is adopted, so that disassembly and assembly are convenient.

Description

Technical Field

[0001] The utility model relates to the technical field of laser accessories, in particular to a semiconductor side pump water-cooled package heat sink. Background Art

[0002] Laser is a special kind of light with the characteristics of monochromaticity, coherence and high brightness, and has been widely used in scientific research, medical treatment, industrial processing and other fields. The three elements of laser are working medium, pump source and resonant cavity, and the interaction of these three elements can produce laser.

[0003] Laser pumping is the action of energy transfer from the pump source to the laser gain medium. The energy is absorbed in the medium and produces excited states in the atoms. When the number of excited state particles exceeds the number of ground state particles, the particle population inversion of this medium can be achieved. In this case, the mechanism of stimulated emission can occur, and the working medium can be used as a laser or optical amplifier. From the above, it can be seen that the main function of the pump source is to provide an energy source for the laser working medium. Commonly used pump sources include xenon lamps, krypton lamps, electrical excitation, hot melt, semiconductors, etc. Among them, semiconductors have the advantages of high efficiency, long life, high beam quality, good stability, compact structure, etc. when used as pump sources. They are the second generation of laser pump sources. Semiconductor side array pumping is the best pumping method in high-power solid-state lasers. Utility Model Content

[0004] To this end, the utility model provides a semiconductor side pump water-cooled package heat sink to solve the above problems in the prior art. In order to achieve the above purpose, the utility model provides the following technical solutions: According to the first aspect of the utility model, a semiconductor side pump water-cooled package heat sink includes a semiconductor heat sink, heat dissipation fins, a conductive copper-clad laminate A, a conductive copper-clad laminate B, a connecting electrode A, a connecting electrode B and a semiconductor stack; the assembly of heat dissipation fins is embedded in the semiconductor heat sink, the semiconductor stack is attached to the assembly of heat dissipation fins, and the two vertical sides of the semiconductor heat sink are respectively attached to the conductive copper-clad laminate A and the conductive copper-clad laminate B; the upper ends of the connecting electrodes A and B are pressed against the side edges of the semiconductor stack, and the lower edges of the connecting electrodes A and B are pressed against the outer surfaces of the conductive copper-clad laminates A and B.

[0005] Furthermore, the top surface of the semiconductor heat sink is concave to form a strip groove, and water holes are respectively opened at both ends of the semiconductor heat sink in the length direction. The strip groove is connected with the two water holes to form a water channel, and the heat dissipation fins are embedded in the water channel.

[0006] Furthermore, the connecting electrode A is an L-shaped bending structure.

[0007] Furthermore, the connecting electrode B is an L-shaped bending structure.

[0008] Furthermore, the connecting electrodes A and B are symmetrically arranged with respect to the central symmetry plane of the semiconductor heat sink.

[0009] Furthermore, a plurality of conductive areas A are arranged at intervals on the outer side surface of the conductive copper-clad laminate A, and the lower end of the connecting electrode A abuts against the conductive area A.

[0010] Furthermore, a plurality of conductive regions B are arranged at intervals on the outer side surface of the conductive copper-clad laminate B, and the lower end of the connecting electrode B abuts against the conductive region B.

[0011] Furthermore, the conductive area A is a rectangular sheet structure.

[0012] Furthermore, the conductive region B is a rectangular sheet structure.

[0013] Furthermore, it also includes fixing holes, the bottom planes of the two ends of the semiconductor heat sink in the length direction are recessed upwards into fixing holes, and the fixing holes at the two ends are symmetrically arranged.

[0014] The utility model has the following advantages: A semiconductor side pump water-cooled package heat sink of the utility model has the following advantages:

[0015] 1. The distance between the semiconductor pump source and the working medium can be adjusted as needed;

[0016] 2. Can be compatible with 1-5 sets of pump sources in a single unit;

[0017] 3. Fin cooling can meet the heat dissipation requirements of multiple semiconductor pumps;

[0018] 4. Adopt side assembly and water-through structure, which is convenient for disassembly and assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 An expanded structural diagram of a semiconductor side pump water-cooled package heat sink provided in some embodiments of the utility model.

[0020] Figure 2 A first-perspective stereoscopic structural diagram of a semiconductor side-pump water-cooled package heat sink provided in some embodiments of the utility model.

[0021] Figure 3 A second-angle stereoscopic structural diagram of a semiconductor side-pump water-cooled package heat sink provided in some embodiments of the utility model.

[0022] Figure 4 A side view of a semiconductor side pump water-cooled package heat sink provided in some embodiments of the present invention.

[0023] Figure 5AA cross-sectional view of a semiconductor side pump water-cooled package heat sink provided in some embodiments of the present invention.

[0024] Figure 6 A front view of a semiconductor side pump water-cooled package heat sink provided in some embodiments of the utility model.

[0025] Figure 7 A BB cross-sectional view of a semiconductor side pump water-cooled package heat sink provided in some embodiments of the present invention.

[0026] In the figure, 1. semiconductor heat sink, 2. heat dissipation fins, 3. conductive copper clad laminate A, 4. conductive copper clad laminate B, 5. connecting electrode A, 6. connecting electrode B, 7. strip groove, 8. water hole, 9. semiconductor stack, 10. water channel, 11. fixing hole. DETAILED DESCRIPTION

[0027] The following is a specific embodiment of the present invention. People familiar with the technology can easily understand the other advantages and functions of the present invention from the contents disclosed in this specification. Obviously, the described embodiment is a part of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] Example 1

[0029] like Figures 1 to 7 As shown, a semiconductor side pump water-cooled package heat sink in the embodiment of the first aspect of the utility model includes a semiconductor heat sink 1, heat dissipation fins 2, a conductive copper clad laminate A3, a conductive copper clad laminate B4, a connecting electrode A5, a connecting electrode B6 and a semiconductor stack 9; the assembly of the heat dissipation fins 2 is embedded in the semiconductor heat sink 1, the semiconductor stack 9 is attached to the top of the assembly of the heat dissipation fins 2, and the two vertical sides of the semiconductor heat sink 1 are respectively attached to the conductive copper clad laminate A3 and the conductive copper clad laminate B4; the upper ends of the connecting electrodes A5 and B6 are crimped to the side edges of the semiconductor stack 9, and the lower edges of the connecting electrodes A5 and B6 are crimped to the outer surfaces of the conductive copper clad laminates A3 and B4.

[0030] In the above embodiment, it should be noted that, during installation, the conductive copper clad laminate A3 and the conductive copper clad laminate B4 are respectively crimped onto the two side surfaces of the semiconductor heat sink 1, the assembly of the heat dissipating fins 2 is embedded on the top of the semiconductor heat sink 1, and the semiconductor stack 9 is crimped onto the top of the assembly of the heat dissipating fins 2. Then, the top end of the connecting electrode A5 is clamped onto the side edge of the semiconductor stack 9, and the lower end of the connecting electrode A5 is abutted onto the outer side surface of the conductive copper clad laminate A3. The top end of the connecting electrode B6 is clamped onto the side edge of the semiconductor stack 9, and the lower end of the connecting electrode B6 is abutted onto the outer side surface of the conductive copper clad laminate B4.

[0031] The technical effects achieved by the above embodiments are as follows: through a semiconductor side pump water-cooled packaged heat sink in this embodiment, the distance between the semiconductor pump source and the working medium can be adjusted as needed; it can be compatible with 1-5 groups of pump sources in a single unit; the fin cooling method is adopted to meet the heat dissipation requirements of multiple groups of semiconductor pumps; the side assembly and water-through structure are adopted to facilitate disassembly and assembly.

[0032] Example 2

[0033] like Figures 1 to 7 As shown, a semiconductor side pump water-cooled package heat sink includes all the contents of Example 1. In addition, the top surface of the semiconductor heat sink 1 is recessed to form a strip groove 7, and water holes 8 are respectively opened at both ends of the length direction of the semiconductor heat sink 1. The strip groove 7 is connected with the two water holes 8 to form a water channel 10, and the heat dissipation fins 2 are embedded in the water channel 10.

[0034] The technical effect achieved by the above embodiment is: by providing the water channel 10, cooling water is effectively provided to the heat dissipation fins 2, thereby improving the heat dissipation performance.

[0035] Example 3

[0036] like Figures 1 to 7 As shown, a semiconductor side pump water-cooled package heat sink includes all the contents of Example 2, except that the connecting electrode A5 is an L-shaped bending structure.

[0037] Optionally, the connecting electrode B6 is an L-shaped bending structure.

[0038] Optionally, the connecting electrode A5 and the connecting electrode B6 are symmetrically arranged about the central symmetry plane of the semiconductor heat sink 1 .

[0039] Specifically, a barb portion is provided at the top of the L-shaped bending structure connecting the electrode A5 and the electrode B6 , and the barb portion is engaged in a groove opened at the top edge of the semiconductor stack 9 .

[0040] The technical effects achieved by the above embodiments are as follows: by setting the connecting electrode A5 and the connecting electrode B6 as an L-shaped bending structure, the stability of the installation of the connecting electrode A5 and the connecting electrode B6 is ensured; by providing the tops of the connecting electrode A5 and the connecting electrode B6 with barbs, the falling-off of the connecting electrode A5 and the connecting electrode B6 is effectively avoided.

[0041] Example 4

[0042] like Figures 1 to 7 As shown, a semiconductor side pump water-cooled package heat sink includes all the contents of Example 3. In addition, a plurality of conductive areas A are arranged at intervals on the outer side of the conductive copper clad board A3, and the lower end of the connecting electrode A5 abuts against the conductive area A.

[0043] Optionally, a plurality of conductive regions B are arranged at intervals on the outer side surface of the conductive copper clad laminate B4 , and the lower end of the connecting electrode B6 abuts against the conductive region B.

[0044] Optionally, the conductive region A is a rectangular sheet structure. In addition, the conductive region A may also be other shapes.

[0045] Optionally, the conductive region B is a rectangular sheet structure. In addition, the conductive region B may also be other shapes.

[0046] The technical effects achieved by the above embodiments are as follows: by setting a plurality of conductive regions A, effective contact and conduction with the lower end of the connecting electrode A5 is achieved; by setting a plurality of conductive regions B, effective contact and conduction with the lower end of the connecting electrode B6 is achieved.

[0047] Example 5

[0048] like Figures 1 to 7 As shown, a semiconductor side pump water-cooled package heat sink includes all the contents of Example 4, and in addition, also includes fixing holes 11. The bottom planes at both ends of the length direction of the semiconductor heat sink 1 are recessed upward into the fixing holes 11, and the fixing holes 11 at both ends are symmetrically arranged.

[0049] For example, the fixing hole 11 is a stepped hole, and each end of the semiconductor heat sink 1 is provided with two fixing holes 11 distributed on the left and right, the upper part of the stepped hole is a semicircular notch, and the lower part of the stepped hole is a circular through hole.

[0050] The technical effect achieved by the above embodiment is that by setting the fixing holes 11 , the semiconductor heat sink 1 is effectively fixedly installed.

[0051] In the description of the present invention, it should be understood that the terms "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0052] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0053] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0054] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0055] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

[0056] In the description of this specification, the description with reference to the terms "embodiment one", "embodiment two", "example", "specific example", or "some examples" means that the specific method, device or feature described in conjunction with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, methods, devices or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0057] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor side pump water-cooled package heat sink, characterized in that: The invention comprises a semiconductor heat sink (1), a heat dissipation fin (2), a conductive copper-clad laminate A (3), a conductive copper-clad laminate B (4), a connecting electrode A (5), a connecting electrode B (6) and a semiconductor stack (9); the heat dissipation fin (2) assembly is embedded in the semiconductor heat sink (1), the semiconductor stack (9) is attached to the top of the heat dissipation fin (2) assembly, and the two vertical side surfaces of the semiconductor heat sink (1) are attached to the conductive copper-clad laminate A (3) and the conductive copper-clad laminate B (4) respectively; the upper ends of the connecting electrodes A (5) and B (6) are pressed onto the side edges of the semiconductor stack (9), and the lower edges of the connecting electrodes A (5) and B (6) are pressed onto the outer surfaces of the conductive copper-clad laminates A (3) and B (4).

2. The semiconductor side pump water-cooled package heat sink according to claim 1, characterized in that: The top surface of the semiconductor heat sink (1) is concave to form a strip groove (7), and water holes (8) are respectively opened at both ends of the length direction of the semiconductor heat sink (1), and the strip groove (7) is connected with the two water holes (8) to form a water channel (10), and the heat dissipation fins (2) are embedded in the water channel (10).

3. The semiconductor side pump water-cooled package heat sink according to claim 1, characterized in that: The connecting electrode A (5) is an L-shaped bending structure.

4. The semiconductor side pump water-cooled package heat sink according to claim 3, characterized in that: The connecting electrode B (6) is an L-shaped bending structure.

5. The semiconductor side pump water-cooled package heat sink according to claim 4, characterized in that: The connecting electrode A (5) and the connecting electrode B (6) are symmetrically arranged with respect to the central symmetry plane of the semiconductor heat sink (1).

6. The semiconductor side pump water-cooled package heat sink according to claim 1, characterized in that: The outer side surface of the conductive copper-clad laminate A (3) is provided with a plurality of conductive areas A at intervals, and the lower end of the connecting electrode A (5) abuts against the conductive area A.

7. The semiconductor side pump water-cooled package heat sink according to claim 6, characterized in that: The outer side surface of the conductive copper-clad laminate B (4) is provided with a plurality of conductive areas B at intervals, and the lower end of the connecting electrode B (6) abuts against the conductive area B.

8. The semiconductor side pump water-cooled package heat sink according to claim 7, characterized in that: The conductive area A is a rectangular sheet structure.

9. The semiconductor side pump water-cooled package heat sink according to claim 7, characterized in that: The conductive area B is a rectangular sheet structure.

10. The semiconductor side pump water-cooled package heat sink according to claim 1, characterized in that: It also comprises fixing holes (11), the bottom planes of the two ends of the semiconductor heat sink (1) in the length direction are recessed upwards into the fixing holes (11), and the fixing holes (11) at the two ends are symmetrically arranged.

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