Combined integrated circuit board

Abstract

The utility model relates to the technical field of circuit boards, and discloses a combined type integrated circuit board, which comprises a plurality of groups of circuit substrates which are horizontally and oppositely arranged, the upper and lower adjacent circuit substrates are integrally connected through a telescopic rod assembly which is arranged on a corner frame of the circuit substrates, and the telescopic rod assembly comprises a telescopic threaded sleeve. A first telescopic screw rod is screwed to the bottom of the telescopic screw sleeve, a second telescopic screw rod is screwed to the top of the telescopic screw sleeve, a first stop pressing ring is arranged at the bottom end of an arm rod of the first telescopic screw rod, and a second stop pressing ring is arranged at the top end of an arm rod of the second telescopic screw rod. According to the combined integrated circuit board provided by the utility model, the telescopic rod assembly is used as a supporting rod component of the upper and lower adjacent circuit substrates, and the circuit substrates can be subjected to interval-adjustable laminated installation work by using the telescopic adjustable performance of the telescopic rod assembly, so that the combined integrated circuit board can be more flexibly adapted to a field installation environment and can be connected and adapted to equipment.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a combined integrated circuit board. Background Art

[0002] With the rapid development of my country's information electronics industry, a good market environment has been provided for the rapid development of the printed circuit board industry. The continued growth in the output of electronic products such as electronic communication equipment, electronic computers, and household appliances has also provided a strong impetus for the rapid growth of the printed circuit board industry.

[0003] In the rapid development of the circuit board industry, there are more and more electrical components on the circuit board. As a result, the area occupied by the circuit board is getting larger and larger, and its installation environment is greatly limited. Therefore, more and more circuit boards are transformed into modular integrated circuit boards, such as a modular integrated circuit board disclosed by the China Patent Network (public announcement number CN211152326U). The modular integrated circuit board of this type of device is fixed and assembled together by four guide copper pillars, which reduces the space occupied by the plane and facilitates subsequent disassembly and assembly.

[0004] However, there are still some shortcomings in the above-mentioned patents and the combined integrated circuit boards adopted in the existing market: the existing method of stacking and assembling multiple groups of circuit boards in sequence using guide copper pillars can stack and assemble multiple groups of circuit boards in sequence to reduce the plane space occupied, but when assembled and used, only a single height of stacking and assembly can be performed, and its flexible installation adaptability on site is poor, and it is very easy to cause inconvenience in connecting the circuit board to the equipment. To this end, those skilled in the art provide a combined integrated circuit board to solve the problems raised in the above background technology. Utility Model Content

[0005] The main purpose of the utility model is to provide a modular integrated circuit board, which can effectively solve the problem of poor adaptability to flexible installation in the on-site environment of the existing modular integrated circuit board in the background technology.

[0006] To achieve the above object, the technical solution adopted by the utility model is: a combined integrated circuit board, comprising a plurality of groups of circuit substrates arranged horizontally and relatively, the upper and lower adjacent circuit substrates are connected as a whole through a telescopic rod assembly installed on the corner frame thereof, and a heat sink assembly is installed on the bottom plate of each group of circuit substrates;

[0007] The telescopic rod assembly includes a telescopic screw sleeve, a first telescopic screw is screwed onto the bottom of the telescopic screw sleeve, and a second telescopic screw is screwed onto the top of the telescopic screw sleeve, a first stop pressure ring is provided at the bottom end of the arm of the first telescopic screw, and a fastening bolt is provided in the middle of the gasket of the first stop pressure ring, a second stop pressure ring is provided at the top end of the arm of the second telescopic screw, and a fastening screw hole is provided in the middle of the gasket of the second stop pressure ring.

[0008] As a further solution of the present invention: the threads of the first telescopic screw and the second telescopic screw are arranged symmetrically in the forward and reverse directions relative to the screw barrel of the telescopic screw sleeve.

[0009] As a further solution of the utility model: the fastening bolt and the fastening screw hole are screwed and adapted to each other.

[0010] As a further solution of the utility model: the top end of the support rod of the telescopic rod assembly is screwed with a top pressing screw seat that presses against the circuit substrate, and the bottom end of the support rod of the telescopic rod assembly is screwed with a bottom supporting screw seat that supports the circuit substrate.

[0011] As a further solution of the utility model: the heat sink assembly includes an insulating coating substrate and a heat sink substrate which are pressed against each other, and a plurality of heat sink fins are arranged on the bottom surface of the heat sink substrate.

[0012] As a further solution of the utility model: the bottom surface of the insulating coating substrate is arranged with multiple groups of heat-conducting fins, and the upper surface of the heat dissipation substrate is staggered with the heat dissipation fins and is provided with multiple groups of assembly sockets compatible with the heat-conducting fins.

[0013] As a further solution of the utility model: the insulating coating substrate and the heat-conducting fins are made of silicone material components, and the heat dissipation substrate and the heat dissipation fins are made of aluminum material components.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] 1. The modular integrated circuit board of the utility model utilizes the telescopic rod assembly as the support rod component of the upper and lower adjacent circuit substrates, and utilizes its telescopic and adjustable performance to perform stacked installation of the circuit substrates with adjustable spacing, so that it can more flexibly adapt to the on-site installation environment and be connected and adapted to the equipment.

[0016] 2. During the installation and use of the modular integrated circuit board of the utility model, the insulation coating of the circuit substrate by the heat sink assembly can prevent corrosion of the solder contacts by external dust, moisture, etc. At the same time, by utilizing the coating and heat conduction of the heat sink assembly, the mechanical heat generated by the operation of the circuit substrate can be evenly and efficiently conducted and dissipated, thereby ensuring the operating stability of the modular integrated circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the structure of a combined integrated circuit board of the utility model;

[0018] Figure 2 It is a plan view of a combined integrated circuit board of the utility model;

[0019] Figure 3 This is a structural schematic diagram of a heat sink assembly in a combined integrated circuit board of the utility model;

[0020] Figure 4 The utility model is a structural schematic diagram of a telescopic rod assembly in a combined integrated circuit board.

[0021] In the figure: 1. circuit substrate; 2. heat sink assembly; 21. insulation coating substrate; 22. heat conducting fins; 23. heat dissipation substrate; 24. assembly socket; 25. heat dissipation fins; 3. telescopic rod assembly; 31. telescopic screw sleeve; 32. first telescopic screw; 33. second telescopic screw; 34. second stop pressure ring; 35. first stop pressure ring; 36. fastening bolt; 37. fastening screw hole; 4. bottom support screw seat; 5. top pressure screw seat. DETAILED DESCRIPTION

[0022] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0023] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0024] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] Please refer to Figure 1-4 As shown, a combined integrated circuit board comprises a plurality of groups of circuit substrates 1 arranged horizontally opposite to each other, the upper and lower adjacent circuit substrates 1 are connected in one piece by a telescopic rod assembly 3 installed on the corner frame thereof, the telescopic rod assembly 3 comprises a telescopic screw sleeve 31, a first telescopic screw rod 32 is screwed on the bottom of the telescopic screw sleeve 31, and a second telescopic screw rod 33 is screwed on the top of the telescopic screw sleeve 31, the threads of the first telescopic screw rod 32 and the second telescopic screw rod 33 are arranged symmetrically in positive and negative directions relative to the screw barrel direction of the telescopic screw sleeve 31, by utilizing the positive and negative directions of the threads of the first telescopic screw rod 32 and the second telescopic screw rod 33 being arranged relative to each other, the two groups of telescopic screw rods can be symmetrically extended and pushed out by twisting the telescopic screw sleeve 31, and the support rod length of the telescopic rod assembly 3 can be adjusted and adapted, and then, under the bottom pressure of the first stop pressure ring 35 on the bottom circuit substrate 1 and the top support of the second stop pressure ring 34 on the top circuit substrate 1, the upper and lower relative circuit substrates 1 are kept at a suitable spacing height and installed in one piece, so as to adapt to the on-site installation environment more flexibly.

[0026] A first stop pressure ring 35 is provided at the bottom end of the arm of the first telescopic screw 32, and a fastening bolt 36 is provided in the middle of the gasket of the first stop pressure ring 35, and a second stop pressure ring 34 is provided at the top end of the arm of the second telescopic screw 33, and a fastening screw hole 37 is opened in the middle of the gasket of the second stop pressure ring 34, and the fastening bolt 36 and the fastening screw hole 37 are screwed and adapted to each other. When the upper and lower relative circuit substrates 1 are stacked and installed in sequence, the combination of the telescopic screw sleeve 31, the first telescopic screw 32, and the second telescopic screw 33 can be screwed and fixed in sequence between the two groups of circuit substrates 1 opposite to each other by utilizing the screwing adaptation of the fastening bolt 36 and the fastening screw hole 37, so as to serve as a support guide rod for the upper and lower relative circuit substrates 1.

[0027] The top end of the support rod of the telescopic rod assembly 3 is screwed with a pressing screw seat 5 that presses against the circuit substrate 1, and the bottom end of the support rod of the telescopic rod assembly 3 is screwed with a bottom supporting screw seat 4 that supports the circuit substrate 1. After the multiple groups of circuit substrates 1 are assembled as one, the bottom supporting screw seat 4 is screwed and fixed to the fastening bolt 36 at the bottom of the telescopic rod assembly 3, and the pressing screw seat 5 is screwed and fixed to the fastening screw hole 37 at the top of the telescopic rod assembly 3, forming an upper and lower pressing stop state, and the stacked multiple groups of circuit substrates 1 are assembled and fixed as one to form a modular integrated circuit board.

[0028] A heat sink assembly 2 is installed on the bottom plate of each group of circuit substrates 1. The heat sink assembly 2 includes an insulating coated substrate 21 and a heat sink substrate 23 which are pressed against each other. A plurality of heat sink fins 25 are arranged on the bottom plate surface of the heat sink substrate 23. A plurality of heat conductive fins 22 are arranged on the bottom plate surface of the insulating coated substrate 21. A plurality of assembly sockets 24 which are matched with the heat conductive fins 22 are arranged on the upper plate surface of the heat sink substrate 23 in an offset manner from the heat conductive fins 25. By utilizing the plug-in matching between the heat conductive fins 22 and the assembly sockets 24, the insulating coated substrate 21 and the heat sink substrate 23 can be more widely contacted, thereby increasing their contact heat conduction area.

[0029] The insulating coating substrate 21 and the heat-conducting fins 22 are made of silicone material, and the heat dissipation substrate 23 and the heat dissipation fins 25 are made of aluminum material. By utilizing the closed coating and thermal conductivity of the insulating coating substrate 21 made of silicone material, the circuit substrate 1 is well sealed and coated to prevent external dust, impurities, etc. from corroding the welding joints of the circuit substrate 1, while uniformly conducting the mechanical heat generated by the circuit substrate 1. Then, under the good thermal conductivity of the heat dissipation substrate 23 and the heat dissipation fins 25 made of aluminum material, the mechanical heat is dissipated by thermal conduction and discharged in time to ensure the operating stability of the circuit substrate 1.

[0030] The working principle of the utility model is as follows: when assembling the modular integrated circuit board as a whole, the spacing between the upper and lower relative circuit substrates 1 can be pre-adjusted and calibrated based on the on-site installation environment to better adapt to the on-site installation wiring, etc., and then the two sets of telescopic screws can be symmetrically extended and pushed out by twisting the telescopic screw sleeve 31 to adjust and adapt the support rod length of the telescopic rod assembly 3, and then the first stop pressure ring 35 presses the bottom circuit substrate 1 and the second stop pressure ring 34 supports the top circuit substrate 1, so that the upper and lower relative circuit substrates 1 are installed as a whole with a suitable spacing height, and then when the upper and lower relative circuit substrates 1 are stacked and installed in sequence, By using the screwing adaptation of the fastening bolt 36 and the fastening screw hole 37, the combination of the telescopic screw sleeve 31, the first telescopic screw rod 32, and the second telescopic screw rod 33 can be screwed and fixed in sequence between the two groups of circuit substrates 1 facing each other up and down, as a supporting guide rod for the circuit substrates 1 facing each other up and down. Further, after the multiple groups of circuit substrates 1 are assembled as one, the bottom support screw seat 4 is screwed and fixed on the fastening bolt 36 at the bottom of the telescopic rod assembly 3, and the top pressure screw seat 5 is screwed and fixed on the fastening screw hole 37 at the top of the telescopic rod assembly 3, forming an upper and lower pressing stop state, and the stacked multiple groups of circuit substrates 1 are assembled and fixed as one, forming an integrated integrated circuit board;

[0031] Later, during the operation of the combined integrated circuit board, the circuit substrate 1 can be sealed and coated by utilizing the closed coating and heat conduction of the insulating coating substrate 21 made of silicone material, while the mechanical heat generated by the circuit substrate 1 can be evenly conducted. Then, under the good thermal conductivity of the heat dissipation substrate 23 and the heat dissipation fins 25 made of aluminum material, the mechanical heat can be conducted and dissipated in time to ensure the operational stability of the combined integrated circuit board.

[0032] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A modular integrated circuit board, characterized in that: It comprises a plurality of groups of circuit substrates (1) arranged horizontally and relatively to each other, wherein the circuit substrates (1) adjacent to each other are connected in one piece via a telescopic rod assembly (3) mounted on their corner frames, and a heat sink assembly (2) is mounted on the bottom plate of each group of circuit substrates (1); The telescopic rod assembly (3) comprises a telescopic screw sleeve (31), the bottom of the telescopic screw sleeve (31) is screwed with a first telescopic screw rod (32), and the top of the telescopic screw sleeve (31) is screwed with a second telescopic screw rod (33), the bottom end of the arm of the first telescopic screw rod (32) is provided with a first stop pressure ring (35), and the middle part of the gasket of the first stop pressure ring (35) is provided with a fastening bolt (36), the top end of the arm of the second telescopic screw rod (33) is provided with a second stop pressure ring (34), and the middle part of the gasket of the second stop pressure ring (34) is provided with a fastening screw hole (37).

2. A modular integrated circuit board according to claim 1, characterized in that: The threads of the first telescopic screw (32) and the second telescopic screw (33) are arranged symmetrically in forward and reverse directions relative to the screw barrel direction of the telescopic screw sleeve (31).

3. A modular integrated circuit board according to claim 1, characterized in that: The fastening bolt (36) and the fastening screw hole (37) are screwed and adapted to each other.

4. A modular integrated circuit board according to claim 1, characterized in that: The top end of the support rod of the telescopic rod assembly (3) is screwed with a top pressing screw seat (5) that is pressed against the circuit substrate (1), and the bottom end of the support rod of the telescopic rod assembly (3) is screwed with a bottom supporting screw seat (4) that is supported against the circuit substrate (1).

5. The combined integrated circuit board according to claim 1, characterized in that: The heat dissipation plate assembly (2) comprises an insulating coating substrate (21) and a heat dissipation substrate (23) which are pressed against each other, and a plurality of groups of heat dissipation fins (25) are arranged on the bottom plate surface of the heat dissipation substrate (23).

6. A modular integrated circuit board according to claim 5, characterized in that: The bottom surface of the insulating coating substrate (21) is provided with a plurality of groups of heat-conducting fins (22), and the upper surface of the heat-dissipating substrate (23) is provided with a plurality of groups of assembly sockets (24) adapted to the heat-conducting fins (22) arranged in a staggered manner with the heat-dissipating fins (25).

7. A modular integrated circuit board according to claim 6, characterized in that: The insulating coating substrate (21) and the heat-conducting fins (22) are made of silicone material, and the heat dissipation substrate (23) and the heat dissipation fins (25) are made of aluminum material.

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