Heat dissipation device for microelectronic component

Abstract

The utility model relates to the technical field of heat dissipation devices, and discloses a heat dissipation device for a microelectronic component, which comprises a heat conduction fixing plate, a heat conduction pad is arranged at the lower end of the heat conduction fixing plate, and a circuit board is arranged at the lower end of the heat conduction pad; the heat pipes are arranged at the upper end of the heat conduction fixing plate, the multiple heat pipes are distributed at equal intervals, the lower ends of the heat pipes penetrate through and extend to the lower end of the heat conduction fixing plate, heat dissipation fins are arranged at the upper end of the heat conduction fixing plate, and the heat dissipation fins are fixedly connected with the heat pipes; the heat dissipation fan is arranged at the upper ends of the heat dissipation fins, and the heat dissipation fan is fixedly connected with the heat dissipation fins; the air guide shells are arranged on the front side and the rear side outside the heat conduction fixing plate. The circuit board and the heat pipe are connected through the heat conduction pad structure, the heat conduction efficiency is improved, gaps are reduced, the other side of the circuit board is cooled in cooperation with the air guide shell, and the overall heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, in particular to a heat dissipation device for microelectronic components. Background Art

[0002] Microelectronic components are miniaturized electronic system chips and devices realized by microelectronic process technology. They are electronic components composed of tiny circuits that realize specific functions, and their size is usually in the micron level. There are many types of microelectronic devices, including but not limited to diodes, triodes, field effect transistors, thyristors, optoelectronic devices, sensors, memories, microcontrollers, digital signal processors, processors, communication chips, etc.

[0003] In the prior art, a heat conducting plate is usually used to fit a circuit board of microelectronic components. Heat is transferred to heat sink fins through the heat conducting plate. The heat sink fins are used in combination with a heat dissipation fan to exchange heat to achieve a heat dissipation effect. However, the heat conducting plate and the circuit board of the microelectronic components cannot be completely fitted due to the influence of the solder joints of the microelectronic components, resulting in a gap and reducing the heat dissipation efficiency. Therefore, a heat dissipation device for microelectronic components is proposed. Utility Model Content

[0004] 1. Technical issues to be solved

[0005] In view of the deficiencies of the prior art, the utility model provides a heat dissipation device for microelectronic components to solve the problem of low heat dissipation efficiency of the prior microelectronic components mentioned in the above background technology.

[0006] (II) Technical solution

[0007] To achieve the above purpose, the utility model provides the following technical solution: a heat dissipation device for microelectronic components, comprising:

[0008] A heat-conducting fixing plate, wherein a heat-conducting pad is disposed at the lower end of the heat-conducting fixing plate, and a circuit board is disposed at the lower end of the heat-conducting pad;

[0009] A heat pipe is arranged at the upper end of the heat-conducting fixed plate, a plurality of heat pipes are arranged, and the plurality of heat pipes are evenly distributed, the lower end of the heat pipe passes through and extends to the lower end of the heat-conducting fixed plate, a heat dissipation fin is arranged at the upper end of the heat-conducting fixed plate, and the heat dissipation fin is fixedly connected to the heat pipe;

[0010] A heat dissipation fan is arranged at the upper end of the heat dissipation fins, and the heat dissipation fan is fixedly connected to the heat dissipation fins;

[0011] The air guide shell is arranged at the front and rear sides of the exterior of the heat conduction fixing plate, and the air guide shell is fixedly connected to the heat conduction fixing plate.

[0012] Preferably, an air guide duct is provided inside the air guide shell, and two ends of the air guide duct are respectively located at the upper and lower sides of the circuit board.

[0013] Preferably, fixed side shells are provided on both left and right sides of the exterior of the heat-conducting fixed plate, and the fixed side shells are used to connect the heat dissipation device to the circuit board.

[0014] Preferably, fixing bolts are installed on both sides of the upper end of the fixed side shell, and the fixing bolts are connected to the fixed side shell through threaded fitting.

[0015] Preferably, the fixing bolt passes through the fixed side shell and extends to the upper end of the heat-conducting fixing plate, and the fixing bolt is used to press the heat-conducting fixing plate.

[0016] Preferably, anti-slip strips are provided on one side of the lower end of the interior of the fixed side shell close to the circuit board and on one side of the lower end of the heat-conducting fixing plate close to the circuit board, and the anti-slip strips are fixedly connected to the fixed side shell and the heat-conducting fixing plate, so that the anti-slip strips increase the friction between the fixed side shell and the heat-conducting fixing plate and the circuit board.

[0017] (III) Beneficial effects

[0018] Compared with the prior art, the utility model provides a heat dissipation device for microelectronic components, which has the following beneficial effects:

[0019] The utility model transfers heat to the heat-conducting fixing plate through the circuit board via the thermally conductive pad, and the thermal conductivity between the circuit board and the thermally conductive fixing plate is improved by the thermally conductive pad, and the gap is filled, and the heat is transferred to the heat pipe through the thermally conductive pad, and the heat pipe transfers the heat to the heat sink for dispersion, and the heat dissipation fan is started, and the heat dissipation fan generates an airflow, which flows from the outside toward the inside of the heat dissipation fins and is discharged from the blades of the heat dissipation fan, so as to exchange heat. At the same time, under the guidance of the air guide shell, the air on the other side of the circuit board enters the air guide shell under the action of the airflow and is discharged, thereby dissipating the heat on the other side of the circuit board, thereby improving the overall heat dissipation efficiency and solving the problems raised in the background technology. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of the utility model;

[0021] Figure 2 It is a schematic diagram of the structure of the utility model;

[0022] Figure 3 It is a schematic diagram of the structure of the utility model.

[0023] In the figure: 1. heat-conducting fixing plate; 2. heat pipe; 3. heat-dissipating fins; 4. air guide shell; 5. circuit board; 6. anti-slip strip; 7. thermal pad; 8. fixed side shell; 9. fixing bolts; 10. cooling fan; 11. air duct. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] The utility model provides a technical solution, a heat dissipation device for microelectronic components, see Figure 1 , Figure 2 and Figure 3 ,include:

[0026] A heat-conducting fixing plate 1, a heat-conducting pad 7 is arranged at the lower end of the heat-conducting fixing plate 1, and a circuit board 5 is arranged at the lower end of the heat-conducting pad 7;

[0027] The heat pipe 2 is arranged at the upper end of the heat-conducting fixed plate 1. A plurality of heat pipes 2 are arranged, and the plurality of heat pipes 2 are evenly distributed. The lower end of the heat pipe 2 passes through and extends to the lower end of the heat-conducting fixed plate 1. The upper end of the heat-conducting fixed plate 1 is provided with a heat dissipation fin 3, and the heat dissipation fin 3 is fixedly connected to the heat pipe 2.

[0028] The cooling fan 10 is disposed at the upper end of the cooling fin 3, and the cooling fan 10 is fixedly connected to the cooling fin 3;

[0029] The air guide shell 4 is disposed at the front and rear sides of the exterior of the heat-conducting fixing plate 1 , and the air guide shell 4 is fixedly connected to the heat-conducting fixing plate 1 .

[0030] When in use, the circuit board 5 transfers heat to the heat-conducting fixing plate 1 through the heat-conducting pad 7. The heat-conducting pad 7 improves the thermal conductivity between the circuit board 5 and the heat-conducting fixing plate 1, fills the gap, and the heat is transferred to the heat pipe 2 through the heat-conducting pad 7. The heat pipe 2 transfers the heat to the heat dissipation fins 3 for dispersion. The heat dissipation fan 10 is started, and the heat dissipation fan 10 generates airflow. The airflow flows from the outside to the inside of the heat dissipation fins 3 and is discharged from the blades of the heat dissipation fan 10 to exchange heat. At the same time, under the guidance of the air guide shell 4, the air on the other side of the circuit board 5 enters the air guide shell 4 under the action of the airflow and is discharged, thereby dissipating the heat on the other side of the circuit board 5. It should be noted that in order to save space and highlight the innovative elements of this patent, such as microelectronic components, circuit boards 5, heat dissipation fins 3, heat dissipation fans 10 and other conventional equipment, they are not repeated in this patent.

[0031] See also Figure 1 and Figure 3 An air guide duct 11 is disposed inside the air guide shell 4 , and two ends of the air guide duct 11 are respectively located at the upper and lower sides of the circuit board 5 .

[0032] See also Figure 1 and Figure 2 A fixed side shell 8 is provided on both left and right sides of the exterior of the heat-conducting fixed plate 1 , and the fixed side shell 8 is used to connect the heat dissipation device with the circuit board 5 .

[0033] See also Figure 1 Fixing bolts 9 are installed on both sides of the upper end of the fixed side shell 8, and the fixing bolts 9 are connected to the fixed side shell 8 through threaded cooperation.

[0034] See also Figure 1 The fixing bolts 9 penetrate through the fixed side shell 8 and extend to the upper end of the heat-conducting fixing plate 1 , and the fixing bolts 9 are used to press the heat-conducting fixing plate 1 .

[0035] See also Figure 1 and Figure 2 Anti-slip strips 6 are provided on the side of the lower end of the fixed side shell 8 close to the circuit board 5 and on the side of the lower end of the heat-conducting fixing plate 1 close to the circuit board 5, and the anti-slip strips 6 are fixedly connected to the fixed side shell 8 and the heat-conducting fixing plate 1. The anti-slip strips 6 increase the friction between the fixed side shell 8, the heat-conducting fixing plate 1 and the circuit board 5.

[0036] In this solution: the circuit board 5 transfers heat to the heat-conducting fixing plate 1 through the thermal pad 7, and the thermal pad 7 improves the thermal conductivity between the circuit board 5 and the heat-conducting fixing plate 1, fills the gap, and the heat is transferred to the heat pipe 2 through the thermal pad 7, and the heat pipe 2 transfers the heat to the heat dissipation fins 3 for dispersion, and the cooling fan 10 is started, and the cooling fan 10 generates an airflow, which flows from the outside to the inside of the heat dissipation fins 3 and is discharged from the blades of the cooling fan 10 to exchange heat. At the same time, under the guidance of the air guide shell 4, the air on the other side of the circuit board 5 enters the air guide shell 4 under the action of the airflow and is discharged, thereby dissipating the heat on the other side of the circuit board 5, and the fixing bolt 9 can be rotated to achieve the effect of pushing the heat-conducting fixing plate 1 to squeeze the thermal pad 7, thereby improving the tightness of the connection between the thermal pad 7 and the circuit board 5.

[0037] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation device for microelectronic components, characterized in that: include: A heat-conducting fixing plate (1), wherein a heat-conducting pad (7) is arranged at the lower end of the heat-conducting fixing plate (1), and a circuit board (5) is arranged at the lower end of the heat-conducting pad (7); A heat pipe (2) is arranged at the upper end of the heat-conducting fixed plate (1), a plurality of heat pipes (2) are arranged, and the plurality of heat pipes (2) are evenly distributed, the lower end of the heat pipe (2) penetrates and extends to the lower end of the heat-conducting fixed plate (1), a heat dissipation fin (3) is arranged at the upper end of the heat-conducting fixed plate (1), and the heat dissipation fin (3) is fixedly connected to the heat pipe (2); A heat dissipation fan (10) is arranged at the upper end of the heat dissipation fins (3), and the heat dissipation fan (10) is fixedly connected to the heat dissipation fins (3); The air guide shell (4) is arranged on the front and rear sides of the exterior of the heat-conducting fixing plate (1), and the air guide shell (4) is fixedly connected to the heat-conducting fixing plate (1).

2. A heat dissipation device for microelectronic components according to claim 1, characterized in that: An air guide channel (11) is provided inside the air guide shell (4), and two ends of the air guide channel (11) are respectively located on the upper and lower sides of the circuit board (5).

3. A heat dissipation device for microelectronic components according to claim 1, characterized in that: Fixed side shells (8) are provided on both left and right sides of the exterior of the heat-conducting fixed plate (1).

4. A heat dissipation device for microelectronic components according to claim 3, characterized in that: Fixing bolts (9) are installed on both sides of the upper end of the fixed side shell (8), and the fixing bolts (9) are connected to the fixed side shell (8) through threaded matching.

5. A heat dissipation device for microelectronic components according to claim 4, characterized in that: The fixing bolt (9) passes through the fixed side shell (8) and extends to the upper end of the heat-conducting fixing plate (1).

6. A heat dissipation device for microelectronic components according to claim 4, characterized in that: Anti-slip strips (6) are provided on the side of the lower end of the fixed side shell (8) close to the circuit board (5) and the side of the lower end of the heat-conducting fixed plate (1) close to the circuit board (5), and the anti-slip strips (6) are fixedly connected to the fixed side shell (8) and the heat-conducting fixed plate (1).

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