Thin film laser processing and waste material removing device and battery piece film pasting equipment

Abstract

The thin film laser processing and waste removing device comprises a thin film bearing table, and the table top is provided with a first processing area, a second processing area and a frame area; the first machining area is provided with first machining grooves and first adsorption holes, the first machining grooves are multiple grooves formed in parallel at intervals, and the first adsorption holes are formed in the two sides of the machining grooves; the second machining areas comprise second machining grooves surrounding the first machining areas, the second machining grooves are grooves, and second adsorption holes are formed between the adjacent second machining grooves corresponding to the two adjacent first machining areas; and the frame area is arranged on the periphery of the first machining area and the second machining area and comprises third adsorption holes formed in the circumferential direction. The bearing table is divided into the first machining area, the second machining area and the frame area, the positions of the cutting grooves and the adsorption holes are reasonably designed, thin film waste corresponding to a main grid can be effectively connected with external frame waste, independent treatment of the main grid waste is avoided, and the thin film waste can be effectively and rapidly removed.

Description

Technical Field

[0001] The present application relates to a device for laser processing thin films and residual waste material unloading and a cell film laminating device, belonging to the technical field of solar cells. Background Art

[0002] With the development of solar cell production technology, thin films are processed into corresponding patterns and attached to battery cells, which has been applied in solar cell processing technology.

[0003] As an application of this precision machining, the patterns on the film are complex and require high precision. How to complete the high-precision machining of the film pattern, attach it to the battery cell, and clean up the waste with complex shapes are technical problems that need to be solved urgently. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide a thin film laser processing and waste removal device and a solar cell film laminating device, which can process high-precision complex patterns on thin films and quickly and effectively remove waste to avoid the impact of waste on subsequent processes.

[0005] In one aspect of an embodiment of the present application, a thin film laser processing and waste removal device is provided, comprising a thin film carrier, a laser processing module and a waste removal device, wherein the thin film carrier is respectively located below the laser processing module and below the waste removal device, and performs thin film laser processing and thin film waste removal;

[0006] Wherein, the film support platform is a negative pressure support platform, which includes a table top with an adsorption through hole, and an adsorption cavity arranged inside the support platform and connected to the adsorption through hole and a vacuum generating device;

[0007] The table surface of the film bearing table is provided with a first processing area, a second processing area and a frame area;

[0008] A plurality of first processing areas, wherein the first processing areas are provided with first processing grooves and first adsorption holes, the first processing grooves are a plurality of grooves arranged in parallel at intervals, and the first adsorption holes are arranged on both sides of the processing grooves, wherein the plurality of first processing areas are arranged at intervals along the extension direction of the first processing grooves;

[0009] A second processing area includes a second processing groove surrounding the first processing area, and the second processing groove is a groove;

[0010] A second adsorption hole is provided between adjacent second processing grooves corresponding to two adjacent first processing areas;

[0011] The frame area is arranged outside the first processing area and the second processing area, and includes third adsorption holes arranged along the circumference of the table top.

[0012] Optionally, a thin film laser processing and waste removal device of the present application is provided in a second processing groove adjacent to the first processing area and perpendicular to the direction of the first processing groove, and a plurality of protrusions are arranged at intervals toward the adjacent first processing area.

[0013] Optionally, in a thin film laser processing and waste removal device of the present application, a second processing groove perpendicular to the direction of the first processing groove outside the first processing area of ​​the edge is provided with a plurality of protrusions facing the first processing area at intervals.

[0014] Optionally, a thin film laser processing and waste removal device of the present application comprises a plurality of first processing areas spaced apart parallel to the extension direction of the first processing groove to form a first processing area group; and a plurality of first processing area groups are spaced apart perpendicular to the direction of the first processing groove.

[0015] Optionally, in a thin film laser processing and waste removal device of the present application, the waste removal device comprises a waste removal suction cup, the waste removal suction cup comprises a suction cup body and a plurality of suction nozzle assemblies, an adsorption cavity is arranged inside the suction cup body, which is connected to a vacuum generating device, and the suction nozzle assembly is arranged on the suction cup body and is arranged downward to adsorb the waste film on the film supporting platform to remove it;

[0016] Among them, a plurality of suction nozzle assemblies are circumferentially arranged on the edge of the suction cup body, corresponding to the frame area of ​​the film supporting platform.

[0017] Optionally, in a thin film laser processing and waste removal device of the present application, a plurality of nozzle assemblies are circumferentially arranged at the edge of the suction cup body, corresponding to the frame area of ​​the film carrier platform;

[0018] One or more suction nozzle assemblies are disposed on the edge of the suction cup body, corresponding to the position between the film bearing table frame area and the adjacent second processing area;

[0019] And / or in the middle part of the suction cup body, a plurality of suction nozzle assemblies are correspondingly arranged between the second processing area groups adjacent to the film supporting platform.

[0020] Optionally, a thin film laser processing and waste removal device of the present application, the nozzle assembly includes a nozzle seat, a spring and a nozzle, the nozzle seat is installed in the fixing hole of the suction cup body, the nozzle and the spring are installed in the nozzle seat, and a guide hole is provided on the nozzle seat. After the nozzle is installed in the nozzle seat, the nozzle slides up and down under the action of the spring.

[0021] Optionally, in a thin film laser processing and waste removal device of the present application, the waste removal device further comprises a transverse movement assembly, the transverse movement assembly comprising a moving assembly, a supporting bracket, and a lifting cylinder;

[0022] The waste suction cup is installed on the lifting cylinder, the lifting cylinder is installed on the moving assembly, and the moving assembly is installed on the supporting bracket; the moving assembly drives the lifting cylinder and the waste suction cup to move back and forth repeatedly along the direction of the supporting bracket, and the lifting cylinder drives the waste suction cup to move up and down repeatedly;

[0023] The transverse moving component is arranged between the film bearing platform and the waste material unloading position, and the moving component reciprocates between the two.

[0024] Optionally, a thin film laser processing and waste removal device of the present application further comprises a waste transfer mechanism, and the waste transfer mechanism comprises a tape reeling and unreeling assembly;

[0025] The unwinding and rewinding assembly includes a material unwinding reel assembly, a waste material collecting reel assembly and an auxiliary shaft; the tape is wound on the material unwinding reel assembly, released from the material unwinding reel assembly, passes through the waste material discharge position, and is wound and recovered by the waste material collecting reel assembly, wherein the auxiliary shaft includes one or more to guide the moving path of the tape roll so that it passes through the waste material discharge position with the adhesive surface facing upward.

[0026] Optionally, in a thin film laser processing and waste removal device of the present application, the waste transfer mechanism also includes a sticky plate, and the sticky plate is arranged below the waste lower material level tape.

[0027] Another aspect of the embodiment of the present application provides a cell film laminating device, comprising the aforementioned thin film laser processing and waste removal device, wherein the film carrier is arranged on an interactive transmission device, the interactive transmission device comprises a frame, and an interactive module arranged on the frame and moving back and forth and up and down, the film carrier is arranged on the interactive module, and moves back and forth along the frame direction, passing through the processing position below the laser processing module, the waste removal position below the waste removal device, and the film laminating position below the cell film laminating assembly;

[0028] The cell film laminating assembly comprises a cell suction cup assembly arranged on a mechanical arm, and the mechanical arm drives the cell suction cup assembly to the film laminating position above the film supporting platform and leaves the film supporting platform;

[0029] Among them, when the laser-processed film is attached to the solar cell, the hollow part of the film corresponding to the first processing groove corresponds to the secondary grid of the solar cell; the part of the film corresponding to the adjacent first processing area and between two adjacent second processing grooves perpendicular to the direction of the first processing groove corresponds to the main grid of the solar cell; the part of the film corresponding to the protrusion corresponds to the solar cell welding pad.

[0030] Optionally, in a battery cell film laminating device of the present application, the movement direction of the moving component of the waste removal device and the movement direction of the robot arm of the battery cell film laminating component are perpendicular to the movement direction of the interactive module, and the material reeling and unreeling direction of the tape reeling and unreeling component of the waste transfer mechanism is parallel to the movement direction of the interactive module.

[0031] The thin film laser processing and waste removal device provided in the present application divides the film support platform into a first processing area, a second processing area and a frame area, and reasonably designs the positions of the cutting grooves and adsorption holes, so that the film can be processed corresponding to the battery cell, and the film waste corresponding to the main grid and the external frame waste can be effectively connected, avoiding the processing of separate main grid waste, which helps to effectively and quickly remove the film waste and avoid the influence of the waste on the subsequent processes.

[0032] The thin film laser processing and waste removal device provided in the present application has a nozzle assembly for removing the waste suction cup, a border area of ​​the film supporting platform, and an area between adjacent second processing grooves that are arranged correspondingly to ensure that when removing the waste film, the waste will not flip, move, etc. and affect the effective film.

[0033] The thin film laser processing and waste removal device provided by the present application has a nozzle assembly configured as an elastic adsorption assembly, so that the thin film waste is adsorbed immediately and the waste removal effect is good.

[0034] The thin film laser processing and waste removal device provided in the present application, including the setting of the waste transfer mechanism, can complete the continuous removal of thin film waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 is a schematic top view of a battery cell film laminating device according to an embodiment of the present application;

[0037] Figure 2 This is an axial schematic diagram of a battery cell film laminating device according to an embodiment of the present application;

[0038] Figure 3 It is a schematic diagram of a tabletop of a film supporting table according to an embodiment of the present application;

[0039] Figure 4 is a schematic diagram of a tabletop of a film supporting table according to another embodiment of the present application;

[0040] Figure 5is a schematic diagram of a tabletop of a film supporting table according to another embodiment of the present application;

[0041] Figure 6 This is a schematic diagram of the structure of a waste removal device according to an embodiment of the present application.

[0042] Figure 7 It is a schematic structural diagram of a waste removal suction cup according to an embodiment of the present application. DETAILED DESCRIPTION

[0043] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.

[0044] In the description of this application, it should be noted that, unless otherwise specified and limited, the terms "inside", "outside", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the application is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0045] It should also be noted that, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0046] As an application in the field of solar cells, when processing thin films, thin films of similar size to silicon wafers are usually processed. The graphics to be processed include hollow graphics corresponding to the secondary grid of the solar cell (hereinafter referred to as the secondary grid graphics), which are usually multiple linear hollow graphics arranged in parallel along one direction; hollow graphics corresponding to the main grid of the solar cell (hereinafter referred to as the main grid graphics), which are usually strip-shaped hollow graphics arranged perpendicular to the secondary grid; hollow graphics corresponding to the soldering pad of the solar cell, which are usually square hollow graphics slightly wider than the main grid and arranged on the main grid (hereinafter referred to as the soldering pad graphics). The processing of the above graphics is completed by laser. Specifically, the hollow processing is carried out according to the above graphics, and it is attached to the solar cell so that the fine grid, main grid and soldering pad of the solar cell are exposed.

[0047] See also Figures 1 to 7 The utility model aims to provide a thin film laser processing and waste removal device that meets the above process, which includes a thin film carrier 100, a laser processing module 300 and a waste removal device 200. Figure 1 and Figure 2 , respectively, are a top view structural schematic diagram and an axial side structural schematic diagram of the thin film laser processing and waste removal device of the present application.

[0048] The film carrier 100 is a negative pressure carrier, on which the film to be processed is adsorbed and carried. The laser processing module 300 is arranged above the film carrier 100 to process the film to be processed to obtain a film including a processed pattern. This film is attached to the solar cell, exposing the secondary grid electrode, main grid electrode, pad, etc. of the solar cell. The waste removal device 200 is arranged above the film carrier 100 to remove the waste film. It can be understood that the waste film is the part other than the film attached to the solar cell.

[0049] Specifically, the film support platform 100 is a negative pressure support platform, which includes a table top with adsorption through holes, and an adsorption chamber (not shown in the figure) disposed inside the film support platform 100 and connected to the adsorption through holes and a vacuum generating device (not shown in the figure).

[0050] See also Figures 3 to 5 , is a structural schematic diagram of the table top of the film carrier table 100. A first processing area, a second processing area and a frame area are set on the table top. The first processing area corresponds to the sub-grid pattern, which includes a first processing groove 110 and a first adsorption hole 112, wherein the first processing groove 110 is a plurality of grooves arranged in parallel at intervals, corresponding to the sub-grid pattern. When the laser performs hollowing processing on the sub-grid pattern of the film, the setting of the first processing groove avoids direct irradiation of the laser on the table top; the first adsorption hole 112 is set on both sides of the processing groove, so that both sides of each sub-grid pattern have negative pressure adsorption, so as to fix the sub-grid pattern film. The first processing area includes multiple, which are arranged at intervals on the table top. In more detail, multiple first processing areas are arranged at intervals in the extension direction of the first processing groove 110, which is a first processing area group.

[0051] The second processing area is arranged at the periphery of the first processing area, including a second processing groove 120 forming a closed figure at the periphery of the first processing area. Generally, the second processing groove 120 is a groove arranged around the first processing area. The part between two adjacent second processing grooves 120 arranged between two adjacent first processing areas and perpendicular to the direction of the first processing groove 110 corresponds to the main grid pattern. In some embodiments, the second processing groove 120 arranged between two adjacent first processing areas and perpendicular to the direction of the first processing groove 110 is provided with a plurality of protrusions 1201 facing the adjacent first processing areas at intervals. Generally, the protrusions 1201 of the adjacent second processing grooves 1201 are symmetrically arranged, and the two adjacent protrusions 1201 correspond to the pad pattern. In other embodiments, the second processing groove 120 perpendicular to the direction of the first processing groove 110 outside the edge of the first processing area is also provided with a plurality of protrusions 1201 facing the first processing area at intervals, corresponding to the pad pattern. It can be understood that, generally, the protrusion 1201 is arranged in a rectangular shape, corresponding to the pad pattern. Of course, the protrusion 1201 may also be other graphics as long as it corresponds to the pad graphics.

[0052] The setting of the second processing groove 120 avoids direct irradiation of the laser on the table. Preferably, second adsorption holes 122 are set between adjacent second processing grooves 120. The second adsorption holes 122 allow negative pressure adsorption on both sides of each second groove pattern to fix the main grid pattern film.

[0053] The frame area is arranged outside the first processing area and the second processing area, and includes third adsorption holes 132 arranged along the circumference of the table surface.

[0054] For details, see Figure 3 and Figure 4 , is a schematic diagram of the table surface of the film support table in two embodiments. The four second processing grooves 120 in the upper, lower, left and right of the first processing area are enclosed to form a long strip of closed graphics. The part between the second processing grooves 120 between two adjacent first processing areas corresponds to the main grid pattern, and its protrusion 1201 corresponds to the pad pattern. The second processing grooves 120 located outside the first processing areas at the left and right edges may or may not be provided with the protrusion 1201. Figure 3 and Figure 4 When the second processing groove 120 located at the edge is also provided with a protrusion 1201, both sides can also correspond to the pad pattern.

[0055] See also Figure 5 , is a schematic diagram of a tabletop of a film support table in another embodiment. For the convenience of display, Figure 5Details of the first processing area, such as the first processing groove and the first adsorption hole, are not shown. In this embodiment, a plurality of first processing areas are arranged at intervals parallel to the direction of the first processing groove 110 to form a first processing area group; a plurality of first processing area groups, for example, two, are arranged at intervals perpendicular to the direction of the first processing groove 110. A plurality of groups of second processing grooves 120 surround these first processing areas, and a second adsorption hole 122 is also arranged in the middle of the second processing grooves 120 between adjacent second processing area groups.

[0056] The film to be processed is adsorbed and placed on the supporting platform by the first adsorption hole 112, the second adsorption hole 122 and the third adsorption hole 132. During laser processing, the laser processing module 300 emits laser toward the supporting platform, and scans and ablates along the first processing groove 110 to form a secondary grid pattern; scans and ablates along the second processing groove 120 to form a main grid pattern between the second processing grooves 120 which are arranged in adjacent first processing areas and perpendicular to the direction of the first processing groove, and the protrusion 1201 between two adjacent second processing grooves 120 forms a pad pattern.

[0057] During the processing, the third adsorption hole 132 adsorbs the edge of the film, and the first adsorption holes 112 are distributed on both sides of the first processing groove 110, which can ensure that during the processing of the film corresponding to the secondary grid pattern, the film on both sides of the hollowing is adsorbed flatly; the second adsorption hole 122 can make the side edges of the film corresponding to the second processing groove 120 be adsorbed flatly during the laser scanning and cutting process, thereby avoiding the reduction of processing accuracy caused by film misalignment.

[0058] It should be noted that the first processing groove and the second processing groove are both grooves sunken into the inside of the table, and the protrusion means that it is close to the first processing area in the horizontal direction of the table. The first adsorption hole, the second adsorption hole and the third adsorption hole can be multiple and are evenly spaced according to the positions of the cutting groove and the frame.

[0059] After the processing is completed, the film corresponding to the first processing area is attached to the corresponding area of ​​the solar cell; the films corresponding to the remaining areas are waste and need to be removed.

[0060] By adopting the scheme of the present invention, the film corresponding to the border area is connected to the film corresponding in the middle of the adjacent second processing area, and a second adsorption hole is opened in the second area of ​​the table top to fix the film corresponding in the middle of the second processing area on the table top to prevent it from moving during laser processing and to prevent the film corresponding in the middle of the second processing area from sticking to the film corresponding to the first processing area, thereby ensuring the integrity and processing accuracy of the film processing.

[0061] The thin film laser processing and waste removal device provided in the present application divides the film support platform into a first processing area, a second processing area and a frame area, and reasonably designs the positions of the cutting grooves and adsorption holes, so that the film can be processed corresponding to the battery cell, and the film waste corresponding to the main grid and the external frame waste can be effectively connected, avoiding the processing of separate main grid waste, which helps to effectively and quickly remove the film waste and avoid the influence of the waste on the subsequent processes.

[0062] The laser processing module 300 is disposed above the support platform and may be a laser processing module 300 of the prior art, and may complete thin film ablation, cutting and other processing of the areas corresponding to the first processing groove 110 and the second processing groove 120 .

[0063] See also Figure 6 , which is a schematic diagram of the structure of the waste removal device 200. The waste removal device 200 is disposed above the film carrier 100 to remove film waste.

[0064] Specifically, the waste removal device 200 includes a waste suction cup 210, see Figure 7 , is a schematic diagram of the structure of the waste suction cup 210; the waste suction cup 210 includes a suction cup body 211 and a plurality of suction nozzle assemblies, the suction cup body 211 is provided with a suction chamber (not shown in the figure), which is connected to a vacuum generating device, and the suction nozzle assembly is arranged on the suction cup body 211 and arranged downward to suck the film waste on the film supporting platform 100 to remove it. In the present application, the suction nozzle assembly includes a suction nozzle seat 212, a spring 213 and a suction nozzle 214.

[0065] The suction cup body 211 can be designed into different shapes according to the shape of the waste. In other words, the structure of the suction cup body 211 and the position of the suction nozzle assembly need to correspond to the table area of ​​the aforementioned film carrier and the waste area of ​​the film. In the present application, a plurality of suction nozzle assemblies are circumferentially arranged at the edge of the suction cup body 211, corresponding to the frame area of ​​the film carrier 100, so as to adsorb the waste film located in the frame area. Since the film corresponding to the main grid is connected to this frame, all the waste can be adsorbed and removed together. Optionally, a suction nozzle assembly is also arranged corresponding to the adjacent second area to adsorb the film corresponding to the main grid. However, since the film here is usually narrow, it is difficult to arrange the suction nozzle assembly. Therefore, preferably, the edge of the suction cup body 211 corresponds to the position between the adjacent second processing areas of the frame area of ​​the film carrier 100, and the suction nozzle assembly is arranged accordingly. Preferably, the middle part of the suction cup body 211 corresponds to the adjacent second processing area group of the film carrier 100, and the suction nozzle assembly is also arranged accordingly.

[0066] Those skilled in the art will appreciate that there may be multiple nozzle assemblies, which are spaced apart according to the size of the waste film.

[0067] Since the shape of the film waste is complex, including the film in the border area and the film in the middle area of ​​the second processing area, and the film waste in the middle area is slender, and the amount of film waste in the middle area is large, suction nozzle assemblies are required at both ends of each middle waste area to ensure that when the film waste is removed, the waste will not flip, move, etc. and drive the film in the first processing area, and the suction nozzle needs to have a relatively high precision in height to ensure that the waste is sucked up at the first time. In order to ensure that the waste is adsorbed at the same time, the suction nozzle assembly is set to an elastic adsorption assembly.

[0068] See also Figure 7 Specifically, the nozzle seat 212 of the nozzle assembly is installed in the fixing hole of the suction cup body 211, the nozzle 214 and the spring 213 are installed in the nozzle seat 212, and the nozzle seat 212 is provided with a guide hole. After the nozzle 214 is installed in the nozzle seat 212, under the action of the spring 213, the nozzle 214 can slide up and down smoothly, thereby ensuring that all waste materials are sucked up at the first time, and the nozzle 214 can return to the initial position after each movement.

[0069] As a preferred solution, the waste removal device 200 of the present application also includes a lateral movement component that drives the waste suction cup 210 to move above the film carrier 100 and descend to the film carrier 100 so as to absorb and remove the film waste. Specifically, the lateral movement component includes a moving component 230, a supporting bracket 220, and a lifting cylinder 240. The waste suction cup 210 is installed on the lifting cylinder 240, the lifting cylinder 240 is installed on the moving component 230, and the moving component 230 is installed on the supporting bracket 220. The moving component 230 carries the lifting cylinder 240 and the waste suction cup 210 to repeatedly move back and forth along the direction of the supporting bracket 220, and the lifting cylinder 240 drives the waste suction cup 210 to repeatedly move back and forth in the up and down directions. The moving component 230 drives the lifting cylinder 240 and the waste suction cup 210 to reach above the film supporting platform 100, and the lifting cylinder 240 drives the waste suction cup 210 to descend, and the suction nozzle assembly of the waste suction cup 210 contacts the waste film on the film supporting platform 100. At this time, the negative pressure of the second adsorption hole 122 and the third adsorption hole 132 of the film supporting platform is released, and the suction nozzle assembly of the waste suction cup 210 adsorbs the waste film, and the lifting cylinder 240 drives the waste suction cup 210 to rise. The moving component 230 drives the lifting cylinder 240 and the waste suction cup 210 to move to the waste unloading position to release the waste film. It can be understood that the moving assembly 230 is disposed between the film carrying platform 100 and the waste material discharge position, and the moving assembly 230 reciprocates between the two.

[0070] The thin film laser processing and waste removal device provided in the present application has a nozzle assembly for removing the waste suction cup, a border area of ​​the film supporting platform, and an area between adjacent second processing grooves that are arranged correspondingly to ensure that when removing the waste film, the waste will not flip, move, etc. and affect the effective film.

[0071] The thin film laser processing and waste removal device provided by the present application has a nozzle assembly configured as an elastic adsorption assembly, so that the thin film waste is adsorbed immediately and the waste removal effect is good.

[0072] Furthermore, in order to complete the continuous removal of film waste, the film laser processing and waste removal device of the present application also includes a waste transfer mechanism 400, which includes a tape reel assembly, and the reel assembly includes a material unwinding reel assembly 410, a waste collection reel assembly 420 and an auxiliary shaft 430. The tape is wound on the material unwinding reel assembly 410, released from the material unwinding reel assembly 410, passes through the waste discharge position, and is rewound and recovered by the waste collection reel assembly 420. The auxiliary shaft 430 may include one or more to guide the moving path of the tape roll so that the tape passes through the waste discharge position with the adhesive surface facing upward.

[0073] As mentioned above, when the waste suction cup 210 reaches the waste material discharge position, the lifting cylinder 240 drives the waste suction cup 210 to descend to the tape at the waste material discharge position, and the waste suction cup 210 releases the negative pressure, and the film waste is adhered to the tape. The waste suction cup 210 moves again to the top of the film support platform 100, and when the waste suction cup 210 absorbs the next film waste, the unwinding roll assembly 410 releases another section of tape, and at the same time, the waste collection roll assembly 420 winds a section of tape, so that a new section of tape reaches the waste material discharge position, so as to adhere to the next film waste.

[0074] As a preferred solution, the waste transfer mechanism 400 also includes an adhesive plate 440, which is arranged at the waste lower material position, below the tape, to provide support for the tape, and its surface is smooth and flat to better adhere to the film waste.

[0075] The present application discloses a thin film laser processing and waste removal device. In order to realize continuous processing, the film carrier table 100 is a movable platform that can move back and forth. The laser processing module 300 and the waste removal device 200 are arranged on its moving path. The position below the laser processing module 300 is the processing position, and the position below the waste removal device 200 is the waste removal position. Laser processing and waste removal are performed at this work station respectively.

[0076] Please continue to see Figure 1 and Figure 2The present application also provides a cell film laminating device including the above-mentioned thin film laser processing and waste removal device. When the film carrier 100 moves, it also passes through the laminating position to laminate the film on the cell conveyed above it. Specifically, the laminating position is arranged behind the processing position. More preferably, it is arranged behind the waste removal position. The waste film is removed first, and then the cell laminating is performed to avoid the influence of the waste on the cell laminating.

[0077] Specifically, the cell film laminating device of the present application also includes a cell film laminating assembly 500, which includes a cell suction cup assembly 520 disposed on a mechanical arm 510, which absorbs and transfers the cell to the film carrier 100, and places the cell on the film carrier 100, so that the film is attached to the cell, and then the cell suction cup assembly 520 on the mechanical arm 510 removes the attached cell. Figure 2 , the robot arm 510 is a transverse robot arm.

[0078] Preferably, one side of the film is sticky, and when it is placed on the film support platform 100, the sticky side faces upwards and the side of the battery cell to be bonded faces downwards, thus completing the bonding.

[0079] Furthermore, in order to achieve continuous processing of the film and waste removal, the film carrier 100 of the present application is arranged on the interactive conveying device 10, which is a prior art, and includes a frame 11, and an interactive module 12 arranged on the frame 11 and moving back and forth and up and down. The film carrier 100 is arranged on this interactive module 12 and reciprocates along the direction of the frame, passing under the laser processing module 300 (processing position) and under the waste removal device 200 (waste removal position), wherein the waste removal suction cup 210 of the waste removal device 200 reciprocates above the waste removal position and above the waste unloading position.

[0080] See also Figure 1 and Figure 2 , Figure 1 In the figure, the solid arrows indicate the moving directions of the waste removal device 200 , the waste transfer mechanism 400 , and the actuators of the cell film assembly 500 , and the hollow arrows indicate the reciprocating moving directions of the film carrier 100 . Figure 2 The arrows indicate the horizontal and vertical movement directions of the film carrier 100. The movement direction of the moving component 230 of the waste removal device 200 and the movement direction of the transverse manipulator of the cell film assembly are perpendicular to the movement direction of the interactive module, and the material reeling and unreeling direction of the tape reeling and unreeling assembly of the waste transfer mechanism 400 is parallel to the movement direction of the interactive module. With this arrangement, the processing process of the equipment is smoother and interference-free, and the equipment is compact and practical.

[0081] The above description is only an embodiment of the present application and is not intended to limit the protection scope of the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A thin film laser processing and waste removal device, comprising a thin film carrier, a laser processing module and a waste removal device, characterized in that: The film carrier is located below the laser processing module and below the waste removal device to perform film laser processing and film waste removal; Wherein, the film support platform is a negative pressure support platform, which includes a table with an adsorption through hole, and an adsorption cavity arranged inside the film support platform and connected to the adsorption through hole and a vacuum generating device; The table surface of the film bearing table is provided with a first processing area, a second processing area and a frame area; A plurality of first processing areas, wherein the first processing areas are provided with first processing grooves and first adsorption holes, the first processing grooves are a plurality of grooves arranged in parallel at intervals, and the first adsorption holes are arranged on both sides of the processing grooves, wherein the plurality of first processing areas are arranged at intervals along the extension direction of the first processing grooves; A second processing area includes a second processing groove surrounding the first processing area, and the second processing groove is a groove; A second adsorption hole is provided between adjacent second processing grooves corresponding to two adjacent first processing areas; The frame area is arranged outside the first processing area and the second processing area, and includes third adsorption holes arranged along the circumference of the table top.

2. The thin film laser processing and waste removal device according to claim 1, characterized in that: The second processing groove is arranged in the adjacent first processing area and perpendicular to the direction of the first processing groove, and a plurality of protrusions facing the adjacent first processing area are arranged at intervals.

3. The thin film laser processing and waste removal device according to claim 2, characterized in that: A second processing groove perpendicular to the direction of the first processing groove outside the first processing area of ​​the edge is provided with a plurality of protrusions facing the first processing area at intervals.

4. The thin film laser processing and waste removal device according to claim 1, characterized in that: A plurality of first processing regions arranged at intervals parallel to the extending direction of the first processing groove form a first processing region group; a plurality of first processing region groups are arranged at intervals perpendicular to the direction of the first processing groove.

5. A thin film laser processing and waste removal device according to any one of claims 1 to 4, characterized in that: The waste removal device comprises a waste suction cup, which comprises a suction cup body and a plurality of suction nozzle assemblies. The suction cup body is provided with a suction cavity which is connected to a vacuum generating device. The suction nozzle assembly is arranged on the suction cup body and is arranged downward to absorb the waste film on the film supporting platform to remove it. Among them, a plurality of suction nozzle assemblies are circumferentially arranged on the edge of the suction cup body, corresponding to the frame area of ​​the film supporting platform.

6. The thin film laser processing and waste removal device according to claim 5, characterized in that: A plurality of nozzle assemblies are circumferentially arranged at the edge of the suction cup body, corresponding to the frame area of ​​the film carrying platform; One or more suction nozzle assemblies are disposed on the edge of the suction cup body, corresponding to the position between the film bearing table frame area and the adjacent second processing area; And / or in the middle part of the suction cup body, a plurality of suction nozzle assemblies are correspondingly arranged between the second processing area groups adjacent to the film supporting platform.

7. The thin film laser processing and waste removal device according to claim 5, characterized in that: The nozzle assembly includes a nozzle seat, a spring and a nozzle. The nozzle seat is installed in the fixing hole of the suction cup body. The nozzle and the spring are installed in the nozzle seat. A guide hole is arranged on the nozzle seat. After the nozzle is installed in the nozzle seat, the nozzle slides up and down under the action of the spring.

8. The thin film laser processing and waste removal device according to claim 5, characterized in that: The waste removal device further includes a transverse movement assembly, which includes a moving assembly, a supporting bracket, and a lifting cylinder; The waste suction cup is installed on the lifting cylinder, the lifting cylinder is installed on the moving assembly, and the moving assembly is installed on the supporting bracket; the moving assembly drives the lifting cylinder and the waste suction cup to move back and forth repeatedly along the direction of the supporting bracket, and the lifting cylinder drives the waste suction cup to move up and down repeatedly; The transverse moving component is arranged between the film bearing platform and the waste material unloading position, and the moving component reciprocates between the two.

9. The thin film laser processing and waste removal device according to claim 8, characterized in that: The thin film laser processing and waste removal device also includes a waste transfer mechanism, and the waste transfer mechanism includes a tape reeling and unreeling assembly; The unwinding and rewinding assembly includes a material unwinding reel assembly, a waste material collecting reel assembly and an auxiliary shaft; the tape is wound on the material unwinding reel assembly, released from the material unwinding reel assembly, passes through the waste material discharge position, and is wound and recovered by the waste material collecting reel assembly, wherein the auxiliary shaft includes one or more to guide the moving path of the tape roll so that it passes through the waste material discharge position with the adhesive surface facing upward.

10. The thin film laser processing and waste removal device according to claim 9, characterized in that: The waste material transfer mechanism also includes a material adhesive plate, which is arranged below the waste material lower material level tape.

11. A cell film laminating device, comprising the thin film laser processing and waste removal device according to any one of claims 1 to 10, characterized in that: The film carrier is arranged on the interactive transmission device, which includes a frame, and an interactive module arranged on the frame and moving back and forth and up and down. The film carrier is arranged on the interactive module and moves back and forth along the frame direction, passing through the processing position under the laser processing module, the waste removal position under the waste removal device, and the film pasting position under the battery cell film pasting assembly; The cell film laminating assembly comprises a cell suction cup assembly arranged on a mechanical arm, and the mechanical arm drives the cell suction cup assembly to the film laminating position above the film supporting platform and leaves the film supporting platform; Among them, when the laser-processed film is attached to the solar cell, the hollow part of the film corresponding to the first processing groove corresponds to the secondary grid of the solar cell; the part of the film corresponding to the adjacent first processing area and between two adjacent second processing grooves perpendicular to the direction of the first processing groove corresponds to the main grid of the solar cell; the part of the film corresponding to the protrusion corresponds to the solar cell welding pad.

12. The cell film laminating device according to claim 11, characterized in that: The moving direction of the moving component of the waste removal device and the moving direction of the robot of the battery cell film assembly are perpendicular to the moving direction of the interactive module, and the reeling and unreeling direction of the tape reeling and unreeling assembly of the waste transfer mechanism is parallel to the moving direction of the interactive module.

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