Mold cooling device for rubber sealing ring production
By designing a mold cooling device including a slide chute, a hydraulic telescopic rod and a semiconductor refrigeration plate, the problems of low loading and unloading efficiency and burning at high temperatures of the mold are solved, and efficient cooling and safe operation of the mold are achieved.
Patent Information
- Application Number
- CN202421145249.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-24
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2034-05-24
AI Technical Summary
It is inconvenient to load and unload the mold under high temperature conditions, and the existing cooling device is inefficient in operation and has a risk of burns.
A mold cooling device including a cooling box and a stable base is designed. The combination of a slide chute and a hydraulic telescopic rod is used to achieve efficient loading and unloading of the mold through the design of the moving frame and the feeding port, and the semiconductor refrigeration plate and The radiator cooperates to achieve rapid cooling and cooling.
It improves the efficiency of loading and unloading of molds, reduces the labor intensity of operators, reduces the risk of scalding, and ensures rapid cooling and treatment of molds.
Smart Images

Figure CN222431380U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of rubber sealing ring production technology, in particular to a mold cooling device for rubber sealing ring production. Background Art
[0002] The rubber seal is an annular cover composed of one or more parts, fixed on a ring or washer of the bearing and in contact with another ring or washer or forming a narrow labyrinth gap to prevent the leakage of lubricating oil and the intrusion of foreign objects. The mold used for the production of rubber seals is to put the rubber material into the hopper of the mold, and then use the pressure of the press to shape the rubber material into the required seal.
[0003] However, during the mold manufacturing process, the mold has an extremely high temperature, which makes it impossible for the operator to carry out the next processing step on the mold, and it needs to be cooled down. The existing rubber sealing ring mold cooling device includes a cooling box, the mold is placed in the cooling box, and then it is sprayed with low-temperature water or cooled by circulating water. However, the molds are not consistent in size. When placing or taking out the mold from the cooling box, it needs to be manually clamped and loaded and unloaded accurately, which leads to low loading and unloading efficiency, and the high temperature of the mold is easy to cause scalding. Therefore, a rubber sealing ring production mold cooling device that is convenient for loading and unloading is needed. Utility Model Content
[0004] The technical problem to be solved by the utility model is that it is inconvenient to load and unload materials under the condition of high temperature of the mold, and a mold cooling device for rubber sealing ring production which is convenient for loading and unloading materials is provided.
[0005] In order to solve the above technical problems, the technical solution provided by the utility model is: a mold cooling device for rubber sealing ring production, comprising a cooling box body and a stable base, the cooling box body is arranged in the center of the top surface of the stable base, a cooling frame is arranged at the bottom end of the cooling box body, a fixed groove connected to the cooling box body is penetrated in the center of the stable base, a semiconductor refrigeration plate connected to the inside of the cooling frame is arranged in the fixed groove, a slide groove is penetrated through the top wall of the cooling box body, a slider extending into the cooling box body is slidably arranged in the slide groove, a hydraulic telescopic rod is fixedly arranged on the bottom surface of the slider, a movable frame which can extend into the cooling frame is connected to the bottom end of the hydraulic telescopic rod, a feeding port for matching with the movable frame is connected to the right side wall of the cooling box body, a heat conducting plate is fixedly arranged in the cooling frame, and a heat conducting block connected to the heat conducting plate is connected to the top surface of the semiconductor refrigeration plate.
[0006] As an improvement, the bottom surface of the movable frame is evenly connected with a plurality of ventilation holes to facilitate cold air to enter the movable frame to cool the mold.
[0007] As an improvement, a group of connecting plates located on both sides of the slide groove are symmetrically provided on the top surface of the cooling box body, and a threaded rod is rotatably provided between the connecting plates. The threaded rod is matched with a threaded connection and a threaded moving block fixedly connected to the top surface of the slider is provided to achieve stable left and right movement of the moving frame to cooperate with loading and unloading operations.
[0008] As an improvement, a driving motor for driving the threaded rod is fixedly provided on the right outer wall of the connecting plate, and the driving motor is used to control the movement of the moving frame.
[0009] As an improvement, a radiator close to the hot end of the semiconductor refrigeration plate is fixedly provided at the bottom end of the fixed groove. The radiator can assist the work of the semiconductor refrigeration plate and cooperate to promote the heat dissipation of the semiconductor refrigeration plate.
[0010] As an improvement, a plurality of observation windows are fixedly embedded in the front outer wall of the cooling box, and the observation windows are convenient for operators to observe the interior of the cooling box and facilitate the switching operation of electrical components.
[0011] As an improvement, the front outer wall of the cooling box is provided with a control panel located at the bottom of the observation window. The setting of the control panel facilitates the operator to control the electrical components.
[0012] The advantages of the utility model compared with the prior art are: the movable frame can be pushed to move left and right through the setting of the slide groove, so that the mold can be conveniently placed in the movable frame through the loading port, and then the mold in the movable frame is pushed close to the cooling frame through the setting of the hydraulic telescopic rod. After cooling, the hydraulic telescopic rod contracts and pushes the movable frame to the loading port position through the slide groove, so that the mold can be unloaded through the clamp, thereby improving the loading and unloading efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is the first stereoscopic diagram of a mold cooling device for producing a rubber sealing ring according to the utility model.
[0014] Figure 2 This is a second stereoscopic view of a mold cooling device for producing a rubber sealing ring according to the utility model.
[0015] Figure 3 It is a third stereoscopic view of a mold cooling device for producing a rubber sealing ring according to the utility model.
[0016] Figure 4 The utility model is a cross-sectional stereoscopic diagram of a mold cooling device for producing a rubber sealing ring.
[0017] As shown in the figure: 1. Cooling box; 2. Stable base; 3. Cooling frame; 4. Fixed groove; 5. Semiconductor refrigeration plate; 6. Slide groove; 7. Slider; 8. Hydraulic telescopic rod; 9. Moving frame; 10. Loading port; 11. Heat conduction plate; 12. Heat conduction block; 13. Ventilation hole; 14. Connecting plate; 15. Threaded rod; 16. Threaded moving block; 17. Drive motor; 18. Radiator; 19. Observation window; 20. Control panel. DETAILED DESCRIPTION
[0018] The utility model is further described in detail below in conjunction with the accompanying drawings.
[0019] Embodiment 1
[0020] Combined with Figure 1 and 3 -4, a mold cooling device for rubber sealing ring production, comprising a cooling box 1 and a stable base 2, wherein the cooling box 1 is arranged at the center of the top surface of the stable base 2, a cooling frame 3 is arranged at the bottom end of the cooling box 1, a slide groove 6 is penetrated through the top wall of the cooling box 1, a slider 7 extending into the cooling box 1 is slidably arranged in the slide groove 6, a hydraulic telescopic rod 8 is fixedly arranged on the bottom surface of the slider 7, a movable frame 9 which can be extended into the cooling frame 3 is connected to the bottom end of the hydraulic telescopic rod 8, and a feeding port 10 matching the movable frame 9 is connected to the right wall of the cooling box 1;
[0021] Through the above structure, the movable frame 9 is pushed out of the loading port 10, the mold to be cooled is placed in the movable frame 9, and then the movable frame 9 is retracted into the cooling box 1, and the hydraulic telescopic rod 8 is started to push the movable frame 9 into the cooling frame 3 to cool the mold in the movable frame 9;
[0022] A plurality of observation windows 19 are fixedly embedded in the outer wall of the front side of the cooling box 1, and a control panel 20 is provided at the bottom of the observation window 19 on the outer wall of the front side of the cooling box 1. A fixed groove 4 connected to the cooling box 1 is provided through the center of the stable base 2, and a semiconductor refrigeration plate 5 connected to the inside of the cooling frame 3 is provided in the fixed groove 4, and a heat sink 18 close to the hot end of the semiconductor refrigeration plate 5 is fixed at the bottom end of the fixed groove 4, and a heat conducting plate 11 is fixed in the cooling frame 3, and a heat conducting block 12 connected to the heat conducting plate 11 is connected to the top surface of the semiconductor refrigeration plate 5, and a plurality of ventilation holes 13 are evenly connected to the bottom surface of the movable frame 9;
[0023] Through the above structure, after observing through the observation window 19 that the moving frame 9 enters the cooling frame 3, the operator controls the opening of the semiconductor refrigeration plate 5 and the radiator 18 through the control panel 20, and the cooling of the semiconductor refrigeration plate 5 is transmitted to the cooling frame 3 through the cooperation of the heat conductive block 12 and the heat conductive plate 11, and the cold air enters the moving frame 9 through the ventilation hole 13 to cool the mold, and the radiator 18 assists the work of the semiconductor refrigeration plate 5 and cooperates to promote the heat dissipation of the semiconductor refrigeration plate 5.
[0024] Embodiment 2
[0025] Based on the first embodiment, combined with the attached Figure 2 As shown, a group of connecting plates 14 located on both sides of the slide groove 6 are symmetrically arranged on the top surface of the cooling box body 1, and a threaded rod 15 is rotatably arranged between the connecting plates 14. A threaded moving block 16 fixedly connected to the top surface of the slider 7 is matched with a thread connection on the threaded rod 15 to achieve stable left and right movement of the moving frame 9. A driving motor 17 for driving the threaded rod 15 is fixedly arranged on the right outer wall of the connecting plate 14;
[0026] Through the above structure, after the cooling operation, the driving motor 17 controls the threaded rod 15 to rotate, so that the threaded moving block 16 moves to the right until the right side of the moving frame 9 moves out of the loading frame, and the mold that has been cooled in the moving frame 9 can be taken out using a clamp to complete the cooling operation.
[0027] During the specific implementation of the utility model, the driving motor 17 is first started, so that the threaded moving block 16 moves to the right under the rotation of the threaded rod 15, and the moving frame 9 is pushed out of the loading port 10 under the cooperation of the slider 7 and the slide slot 6, and the mold that needs to be cooled is placed in the moving frame 9, and then the driving motor 17 drives the threaded rod 15 to rotate in the opposite direction, and the moving frame 9 is retracted into the cooling box 1, and the hydraulic telescopic rod 8 is started to push the moving frame 9 into the cooling frame 3, and the mold in the moving frame 9 is cooled. After observing that the moving frame 9 enters the cooling frame 3 through the observation window 19, the operator controls the opening of the semiconductor refrigeration plate 5 and the radiator 18 through the control panel 20, and the refrigeration of the semiconductor refrigeration plate 5 is transmitted to the cooling frame 3 through the cooperation of the heat conducting block 12 and the heat conducting plate 11, and the cold air enters the moving frame 9 through the ventilation hole 13 to cool the mold, and the radiator 18 assists the work of the semiconductor refrigeration plate 5 and cooperates to promote the heat dissipation of the semiconductor refrigeration plate 5;
[0028] After the cooling operation, the driving motor 17 controls the threaded rod 15 to rotate forward, so that the threaded moving block 16 moves to the right until the right side of the moving frame 9 moves out of the loading frame, and the mold that has been cooled in the moving frame 9 can be taken out using a clamp to complete the cooling operation.
[0029] The above description of the utility model and its implementation methods is not restrictive. The drawings show only one implementation method of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the protection scope of the utility model.
Claims
1. A mold cooling device for rubber sealing ring production, comprising a cooling box (1) and a stable base (2), wherein the cooling box (1) is arranged at the center of the top surface of the stable base (2), a cooling frame (3) is arranged at the bottom end of the cooling box (1), a fixing groove (4) connected to the cooling box (1) is arranged in the center of the stable base (2), a semiconductor refrigeration plate (5) connected to the inside of the cooling frame (3) is arranged in the fixing groove (4), and the characteristics are: The top wall of the cooling box (1) is penetrated by a slide groove (6), a slider (7) extending into the cooling box (1) is slidably provided in the slide groove (6), a hydraulic telescopic rod (8) is fixedly provided on the bottom surface of the slider (7), a movable frame (9) which can extend into the cooling frame (3) is connected to the bottom end of the hydraulic telescopic rod (8), a loading port (10) cooperating with the movable frame (9) is connected to the right wall of the cooling box (1), a heat conducting plate (11) is fixedly provided in the cooling frame (3), and a heat conducting block (12) connected to the heat conducting plate (11) is connected to the top surface of the semiconductor refrigeration plate (5).
2. A mold cooling device for rubber sealing ring production according to claim 1, characterized in that: The bottom surface of the movable frame (9) is evenly connected with a plurality of ventilation holes (13).
3. A mold cooling device for rubber sealing ring production according to claim 1, characterized in that: The top surface of the cooling box (1) is symmetrically provided with a group of connecting plates (14) located on both sides of the slide groove (6), and a threaded rod (15) is rotatably provided between the connecting plates (14). The threaded rod (15) is matched with a threaded connection to be provided with a threaded moving block (16) fixedly connected to the top surface of the slider (7).
4. A mold cooling device for rubber sealing ring production according to claim 3, characterized in that: A driving motor (17) for driving the threaded rod (15) is fixedly provided on the right outer wall of the connecting plate (14).
5. The mold cooling device for rubber sealing ring production according to claim 1 is characterized in that: A heat sink (18) close to the hot end of the semiconductor refrigeration plate (5) is fixedly arranged at the bottom end of the fixing groove (4).
6. The mold cooling device for rubber sealing ring production according to claim 1 is characterized in that: A plurality of observation windows (19) are fixedly embedded in the front outer wall of the cooling box body (1).
7. A mold cooling device for rubber sealing ring production according to claim 6, characterized in that: The front outer wall of the cooling box (1) is provided with a control panel (20) located at the bottom end of the observation window (19).