Immersed phase change heat dissipation system

Abstract

The utility model relates to the field of liquid cooling heat dissipation, and particularly discloses an immersed phase change heat dissipation system which comprises a case and a liquid cooling box, an immersion space used for containing phase change cooling liquid is provided, and an opening is formed in the top of the liquid cooling box; the condensing plate is mounted on the liquid cooling box and seals the top opening; the heat exchanger is mounted on the box body and is communicated with the internal space of the condensation plate through a circulating pipeline; the circulating pump is arranged on the circulating pipeline and is used for realizing the circulation of condensate in the heat exchanger and the condensing plate; the heat exchanger comprises a radiator and a fan, the fan is located below the radiator, and the condensation plate is located below the fan. According to the scheme, the phase-change cooling liquid is adopted for cooling the main machine, the phase-change cooling liquid becomes steam after absorbing heat and then rises, the steam is condensed and falls back after encountering the condensation plate, and the condensation plate exchanges heat and recools through the heat exchanger. The heat exchanger is separated from the liquid cooling box, so that the space in the liquid cooling box is larger, the size of the liquid cooling box is smaller for chips with the same size, the required phase change cooling liquid is less, and the cost is lower.

Description

Technical Field

[0001] The present application relates to the field of liquid cooling and heat dissipation, and in particular to an immersion phase change heat dissipation system. Background Art

[0002] The CPU and other components of a computer will generate heat during high-speed operation. Heat dissipation is actually a heat transfer process, the purpose of which is to transfer the heat generated by the CPU to other media and control the CPU temperature within a stable range. According to the living environment, the heat of the CPU will eventually dissipate into the air. This process is computer heat dissipation.

[0003] Radiators are divided into active radiators and passive radiators. Passive radiators mainly rely on the heat conduction of the material itself, and their efficiency is generally not enough to meet the requirements. Therefore, the mainstream radiators on the market are active radiators.

[0004] Active radiator product types include: air cooling, liquid cooling, dry ice, liquid nitrogen and compressor cooling. The traditional mainstream method is air cooling. Since air cooling has low cost, but the air cooling effect is insufficient, high-end chassis now generally use liquid cooling. Liquid cooling is divided into immersion type, spray type and water cooling head method.

[0005] The technical problem of the present application is mainly aimed at the immersion liquid cooling method. The existing immersion cooling method is mainly carried out by pumping the coolant into the cooling radiator for circulation. The circulation path is long and the efficiency is low. Utility Model Content

[0006] In order to improve the above-mentioned problems, the present application provides an immersion phase change heat dissipation system.

[0007] The present application provides an immersion phase change heat dissipation system that adopts the following technical solution:

[0008] An immersion phase change heat dissipation system, characterized in that it includes a chassis,

[0009] A liquid cooling box, providing an immersion space for placing phase-change cooling liquid, and the top of the liquid cooling box is open;

[0010] A condensing plate, mounted on the liquid cooling box and sealing the top opening;

[0011] A heat exchanger is installed on the box body and communicated with the inner space of the condensing plate through a circulation pipeline;

[0012] The circulation pump is installed on the circulation pipeline to realize the circulation of the condensate in the heat exchanger and the condensation plate;

[0013] The heat exchanger comprises a cold row and a fan, wherein the fan is located below the cold row, and the condensing plate is located below the fan.

[0014] By adopting the above technical solution, firstly, the solution uses phase change coolant to cool the host. After absorbing heat, the phase change coolant turns into steam and rises. After encountering the condensation plate, it condenses and falls back. The condensation plate exchanges heat and recools through the heat exchanger. By separating the heat exchanger from the liquid cooling box, the space inside the liquid cooling box is larger. For the same volume of chips, the liquid cooling box is smaller, less phase change coolant is required, and the cost is lower.

[0015] Optionally, a first pressure relief valve is installed in the liquid cooling box.

[0016] By adopting the above technical solution, the first pressure relief valve is used as the final safety valve, and its pressure relief pressure is generally 2 standard atmospheric pressures.

[0017] Optionally, the liquid cooling box is connected to a secondary cooling chamber through a pressure relief pipe, a second pressure relief valve is installed on the pressure relief pipe, the secondary cooling chamber has a semiconductor refrigeration plate, the secondary cold chamber is connected to the liquid cooling box through a return pipe, the pressure relief pressure of the second pressure relief valve is less than the pressure relief pressure of the first pressure relief valve, the second pressure relief valve controls the semiconductor refrigeration plate through a controller and controls the semiconductor refrigeration plate to operate when the second pressure relief valve is opened, and the height of the return pipe is higher than the liquid level of the phase change coolant.

[0018] By adopting the above technical solution, the pressure relief pressure of the second pressure relief valve is generally 1.6 standard atmospheres. When the pressure in the liquid cooling box exceeds 1.6 standard atmospheres, steam enters the auxiliary cooling chamber, and the semiconductor refrigeration plate is powered on for cooling and then flows back to the liquid cooling box through the reflux pipe.

[0019] Optionally, a one-way valve is provided in the return pipe, and the one-way valve allows the phase change coolant to flow into the liquid cooling box only from the auxiliary cooling chamber.

[0020] Optionally, a surface of the condensation plate close to the phase-change coolant is an arc-shaped surface, a guide groove is provided on the arc-shaped surface, the guide groove includes a guide groove and a convergence groove, and the guide groove and the convergence groove are connected.

[0021] By adopting the above technical solution, the arc surface can increase the contact area, and secondly, the steam is gathered in the convergence groove through the drainage groove, which can accelerate the reflux.

[0022] Optionally, the semiconductor cooling sheet is arranged on a side close to the chassis, and a ventilation groove is provided on the chassis corresponding to the semiconductor cooling sheet.

[0023] By adopting the above technical solution, in this solution, only one side of the auxiliary cooling chamber close to the chassis is set as a semiconductor cooling plate, so that the semiconductor cooling plate can be kept away from the liquid cooling box, and a ventilation groove is set for heat dissipation of the semiconductor cooling plate.

[0024] Optionally, a battery is installed in the chassis, the battery supplies power to the semiconductor refrigeration plate, and the controller is installed in the chassis.

[0025] Optionally, a heat dissipation hole is provided on the chassis, and the heat dissipation hole is arranged close to the battery.

[0026] By adopting the above technical solution, since the liquid cooling box is sealed, more heat dissipation holes can be opened on the chassis to dissipate heat from the battery. Since the semiconductor cooling sheet is powered on only when the pressure in the liquid cooling box exceeds 1.6 standard atmospheric pressure, it does not need to be turned on frequently, so batteries can be used, and batteries can be used to dissipate heat even when the host is turned off. The batteries are also connected to the host power supply and charged when the host is turned on.

[0027] The second object is to provide: an immersion phase change heat dissipation system, comprising a chassis,

[0028] A liquid cooling box, providing an immersion space for placing phase-change cooling liquid, and the top of the liquid cooling box is open;

[0029] A condensing plate, mounted on the liquid cooling box and sealing the top opening;

[0030] The heat exchanger is installed on the box body and fits the condensing plate;

[0031] The heat exchanger comprises a cold row and a fan, wherein the cold row is located below the fan, and the condensation plate is located below the cold row.

[0032] The third object is to provide an immersion phase change heat dissipation system, comprising a chassis,

[0033] The liquid cooling box provides an immersion space for placing the phase-change cooling liquid, and the box body is closed;

[0034] Condensation plate, installed in the liquid cooling box;

[0035] A heat exchanger is installed on the box body and communicated with the inner space of the condensing plate through a circulation pipeline;

[0036] The circulation pump is installed on the circulation pipeline to realize the circulation of the condensate in the heat exchanger and the condensation plate;

[0037] The heat exchanger comprises a cold row and a fan, wherein the fan is located below the cold row, and the condensing plate is located below the fan.

[0038] In summary, the present application includes at least one of the following beneficial technical effects: heat dissipation is performed by using liquid cooling + semiconductor cooling plate supplementary cooling, the system is stable, and the first pressure relief valve is used as the final safety valve, which is safe and reliable. The design of separating the heat exchanger from the liquid cooling box is adopted, and the space inside the liquid cooling box is larger. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application;

[0040] Figure 2 This is the structural diagram behind the hidden chassis;

[0041] Figure 3 yes Figure 1 A longitudinal cross-sectional view of

[0042] Figure 4 It is a bottom view of the condensation plate;

[0043] Figure 5 is a partial schematic diagram of Example 4;

[0044] Figure 6 is a partial schematic diagram of Example 5;

[0045] Figure 7 It is a partial schematic diagram of Example 6.

[0046] Figure numerals: 1. chassis; 11. ventilation groove; 12. heat dissipation hole; 2. liquid cooling box; 21. first pressure relief valve; 3. condensation plate; 31. arc surface; 321. drainage groove; 322. convergence groove; 4. heat exchanger; 4. radiator; 5. fan; 61. circulation pipe; 62. circulation pump; 7. auxiliary cold chamber; 71. semiconductor refrigeration plate; 72. return pipe; 73. second pressure relief valve; 73. controller; 74. pressure relief pipe; 75. one-way valve; 8. battery; 9. cover plate; 91. heat dissipation port. DETAILED DESCRIPTION

[0047] The following is combined with Figure 1-7 This application is described in further detail.

[0048] The embodiment of the present application discloses an immersion phase change heat dissipation system.

[0049] Embodiment 1: An immersion phase change heat dissipation system, comprising a chassis 1, a liquid cooling box 2, a condensing plate 3, and a heat exchanger 4. The liquid cooling box 2 is placed in the chassis 1, and the liquid cooling box 2 provides an immersion space for placing the phase change coolant, and the top of the liquid cooling box 2 is open. The phase change coolant is generally a fluorinated liquid, and the boiling point of the fluorinated liquid is 58°C, so it is easy to vaporize. The condensing plate 3 is installed on the liquid cooling box 2, and the top opening is closed. The heat exchanger 4 is installed on the top of the chassis 1 and is flush with the upper end surface of the chassis 1. A cover plate 9 is installed on the upper end of the chassis 1 by screws, and a heat dissipation port 91 is opened on the cover plate 9.

[0050] The heat exchanger 4 is composed of a cold row 4 and a fan 5. The main body of the cold row 4 is a copper tube that is bent back and forth, and a heat dissipation fin is fixed on the copper tube. The fan 5 is located between the cold row 4 and the condensation plate 3, and the fan 5 is spaced apart from the condensation plate 3. The interior of the condensation plate 3 is hollow, and the circulation pipe 61 is connected to the internal space of the condensation plate 3. The circulation pump 62 is installed above the condensation plate 3. One of the interfaces of the circulation pump 62 is connected to the interface on the condensation plate 3, and the other interface is connected to the interface on the cold row 4 through the circulation pipe 61. The circulation pump 62 is used to realize the circulation of the condensate in the heat exchanger 4 and the condensation plate 3. The condensate here is generally water, and it can also be a hydrocarbon coolant like a silicone coolant, which is viscous at room temperature. The fan 5 blows the heat on the cold row 4 outward through the heat dissipation port 91, and the purpose of enhancing heat dissipation is achieved by increasing the air flow rate.

[0051] A first pressure relief valve 21 is installed in the liquid cooling box 2. The liquid cooling box 2 is connected to the auxiliary cooling chamber 7 through a pressure relief pipe 74, and a second pressure relief valve 73 is installed on the pressure relief pipe 74. The auxiliary cooling chamber 7 has a semiconductor cooling plate 71. The semiconductor cooling plate 71 is arranged on a side close to the chassis 1, and the auxiliary cooling chamber 7 is connected to the liquid cooling box 2 through a return pipe 72. The pressure relief pressure of the second pressure relief valve 73 is less than the pressure relief pressure of the first pressure relief valve 21. The second pressure relief valve 73 controls the semiconductor cooling plate 71 through the controller 73 and controls the semiconductor cooling plate 71 to work when the second pressure relief valve 73 is opened. The height of the return pipe 72 is higher than the liquid level of the phase change coolant and is inclined. The second pressure relief valve 73 is a solenoid valve, which sends an electrical signal to the controller 73 when it is opened, and the controller 73 controls the battery 8 to energize the semiconductor cooling plate 71. A one-way valve 75 is arranged in the return pipe 72, and the one-way valve 75 allows the phase change coolant to flow into the liquid cooling box 2 only from the auxiliary cooling chamber 7.

[0052] The chassis 1 is provided with ventilation grooves 11 corresponding to the semiconductor cooling sheet 71, and a grille is fixed in the ventilation grooves 11 to strengthen the chassis 1. A battery 8 is installed in the chassis 1, and the battery 8 supplies power to the semiconductor cooling sheet 71. The controller 73 is installed in the chassis 1. The use of the battery can dissipate heat even when the host is turned off. The battery is also connected to the host power supply and charged when the host is turned on. The chassis 1 is provided with heat dissipation holes 12, and the heat dissipation holes 12 are arranged close to the battery 8. In this embodiment, the heat dissipation holes 12 are long strip holes extending along the height direction of the chassis 1. One is arranged on each of the two opposite sides of the chassis 1.

[0053] The side of the condensation plate 3 close to the phase change coolant (i.e., the lower end surface of the condensation plate 3) is an arc surface 31, and a guide groove is provided on the arc surface 31. The guide groove includes a guide groove 321 and a convergence groove 322. The guide groove 321 is connected to the convergence groove 322. The guide groove 321 is a strip groove, and the convergence groove 322 is a circular groove. The diameter of the convergence groove 322 is greater than the width of the guide groove 321. A part of the guide groove 321 is radially distributed.

[0054] This solution uses phase-change coolant to cool the main engine. After absorbing heat, the phase-change coolant turns into steam and rises. After encountering the condensing plate 3, it condenses and falls back. The condensing plate 3 exchanges heat and cools again through the heat exchanger 4. The bottom of the condensing plate 3 has a guide groove to accelerate the reflux of the phase-change coolant. The pressure relief pressure of the second pressure relief valve 73 is generally 1.6 standard atmospheres. When the pressure in the liquid cooling box 2 exceeds 1.6 standard atmospheres, the steam enters the auxiliary cold chamber 7, and the semiconductor refrigeration plate 71 is powered on for cooling and then flows back to the liquid cooling box 2 through the reflux pipe 72. The first pressure relief valve 21 is used as the final safety valve, and its pressure relief pressure is generally 2 standard atmospheres.

[0055] Embodiment 2: The difference from Embodiment 1 is that the storage battery 8 is eliminated, and the semiconductor refrigeration plate 71 is electrically connected to the host power supply through a normally open switch. When the pressure in the liquid cooling box 2 exceeds 1.6 standard atmospheric pressures, the controller 73 controls the normally open switch to close to realize power-on.

[0056] Embodiment 3: The difference from Embodiment 1 is that the storage battery 8 and the auxiliary cooling chamber 7 are eliminated. Thus, when the pressure in the liquid cooling box 2 exceeds the set value, the first pressure relief valve 21 or the second pressure relief valve 73 is directly opened. In this case, generally only one pressure relief valve is required.

[0057] Example 4: Figure 5 The difference from the embodiment 1 is that the arc surface 31 at the bottom of the condensing plate 3 is removed, and the bottom is open, and no condensate is provided in the condensing plate 3 and the cold row 4. After the fluorinated liquid in the liquid cooling box 2 is vaporized, it passes through the condensing plate 3 and enters the cold row 4 and then circulates itself, and the circulation pump 62 can be removed.

[0058] Embodiment 5, as Figure 6 The difference from Example 1 is that the condensing plate 3 and the radiator 4 are attached together, the fan 5 is located above the radiator 4, the circulation pipe 61 and the circulation pump 62 are eliminated, and the condensing plate 3 and the radiator 4 perform heat exchange by attaching together (similar to plate exchange).

[0059] Embodiment 6: Figure 7 , which is different from Example 1, is that the top opening of the liquid cooling box 1 is closed by a cover plate, and the condensing plate 3 is located inside the liquid cooling box 1 .

[0060] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;

[0061] Secondly: In the drawings of the embodiments disclosed in the present utility model, only the structures related to the embodiments disclosed in the present utility model are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present utility model can be combined with each other;

[0062] Finally: The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present utility model should be included in the protection scope of the present utility model.

[0063] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An immersion phase change heat dissipation system, characterized in that: Including chassis, A liquid cooling box, providing an immersion space for placing phase-change cooling liquid, and the top of the liquid cooling box is open; A condensing plate, mounted on the liquid cooling box and sealing the top opening; A heat exchanger is installed on the box body and communicated with the inner space of the condensing plate through a circulation pipeline; The circulation pump is installed on the circulation pipeline to realize the circulation of the condensate in the heat exchanger and the condensation plate; The heat exchanger comprises a cold row and a fan, wherein the fan is located below the cold row, and the condensing plate is located below the fan.

2. The immersion phase change heat dissipation system according to claim 1, characterized in that: A first pressure relief valve is installed in the liquid cooling box.

3. The immersion phase change heat dissipation system according to claim 1, characterized in that: The liquid cooling box is connected to a secondary cooling chamber through a pressure relief pipe, a second pressure relief valve is installed on the pressure relief pipe, the secondary cooling chamber has a semiconductor refrigeration plate, the secondary cooling chamber is connected to the liquid cooling box through a return pipe, the pressure relief pressure of the second pressure relief valve is less than the pressure relief pressure of the first pressure relief valve, the second pressure relief valve controls the semiconductor refrigeration plate through a controller and controls the semiconductor refrigeration plate to work when the second pressure relief valve is opened, and the height of the return pipe is higher than the liquid level of the phase change coolant.

4. The immersion phase change heat dissipation system according to claim 3, characterized in that: A one-way valve is arranged in the return pipe, and the one-way valve allows the phase-change coolant to flow into the liquid cooling box only from the auxiliary cooling chamber.

5. The immersion phase change heat dissipation system according to claim 1, characterized in that: The side of the condensation plate close to the phase-change coolant is an arc-shaped surface, and a guide groove is provided on the arc-shaped surface. The guide groove includes a guide groove and a convergence groove, and the guide groove and the convergence groove are connected.

6. The immersion phase change heat dissipation system according to claim 3, characterized in that: The semiconductor cooling sheet is arranged on a side close to the chassis, and ventilation grooves are provided on the chassis corresponding to the semiconductor cooling sheet.

7. The immersion phase change heat dissipation system according to claim 3, characterized in that: A storage battery is installed in the chassis, and the storage battery supplies power to the semiconductor refrigeration plate. The controller is installed in the chassis.

8. The immersion phase change heat dissipation system according to claim 7, characterized in that: The chassis is provided with heat dissipation holes, and the heat dissipation holes are arranged close to the battery.

9. An immersion phase change heat dissipation system, characterized in that: Including chassis, A liquid cooling box, providing an immersion space for placing phase-change cooling liquid, and the top of the liquid cooling box is open; A condensing plate, mounted on the liquid cooling box and sealing the top opening; The heat exchanger is installed on the box body and fits the condensing plate; The heat exchanger comprises a cold row and a fan, wherein the cold row is located below the fan, and the condensation plate is located below the cold row.

10. An immersion phase change heat dissipation system, characterized in that: Including chassis, The liquid cooling box provides an immersion space for placing the phase-change cooling liquid, and the box body is closed; Condensation plate, installed in the liquid cooling box; A heat exchanger is installed on the box body and communicated with the inner space of the condensing plate through a circulation pipeline; The circulation pump is installed on the circulation pipeline to realize the circulation of the condensate in the heat exchanger and the condensation plate; The heat exchanger comprises a cold row and a fan, wherein the fan is located below the cold row, and the condensing plate is located below the fan.

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