Heat dissipation type voltage stabilizing diode

Abstract

The utility model relates to the technical field of voltage stabilizing diodes, and discloses a heat dissipation type voltage stabilizing diode which comprises a base and a top cover, a shell is fixedly arranged on the upper end face of the base, clamping seats are fixedly arranged on the two sides of the bottom end face of the inner wall of the shell, and a voltage stabilizing chip is embedded in the midpoint of the bottom end face of the inner wall of the shell. Pins are fixedly arranged at the positions, close to the lower ends, of the two sides of the outer wall of the voltage stabilizing chip, and a second heat conduction pad is embedded in the middle point of the bottom end in the shell. And a plurality of heat conduction blocks are fixedly arranged on the two sides of the bottom end in the shell correspondingly, an electrostatic adsorption pad is embedded in the midpoint of the upper end face of the base, and connecting inner pipes are embedded in the two sides of the lower end face of the base correspondingly. According to the utility model, not only can the heat dissipation effect of the voltage stabilizing diode be ensured, the overheating phenomenon of the voltage stabilizing diode during working be avoided, and the service life of the voltage stabilizing diode be prolonged, but also the exposed parts of the pins can be wrapped and protected for use.

Description

Technical Field

[0001] The utility model relates to the technical field of voltage stabilizing diodes, in particular to a heat dissipation type voltage stabilizing diode. Background Art

[0002] A voltage regulator diode is an electronic component, also known as a voltage regulator tube or voltage regulator diode. It is a PN junction diode with a specific voltage stability characteristic. The voltage regulator diode can maintain a stable voltage output within a certain voltage range and play a voltage stabilization role. It is widely used in electronic circuits for voltage stabilization, overvoltage protection, and voltage reference.

[0003] The existing patent (publication number: CN208622734U) discloses "a heat-dissipating voltage-stabilizing diode, which relates to the technical field of voltage-stabilizing diodes; an insulating film is wrapped on the outer wall of the voltage-stabilizing chip, the voltage-stabilizing chip is installed in the heat dissipation tube body, the lower end of the voltage-stabilizing chip is connected to two pins, the bottom of the voltage-stabilizing chip is encapsulated in the heat dissipation tube body through an insulating encapsulation layer, an upper pressure cover is fixedly installed on the upper end of the heat dissipation tube body, a plurality of air holes are arranged on the upper pressure cover, a plurality of through heat dissipation holes are arranged on the heat dissipation tube body, a packaging shell is fixedly installed on the outer side of the heat dissipation tube body, a plurality of vertical through-hole grooves 1 are arranged on the packaging shell, a plurality of horizontal hole grooves 2 are connected on the inner side wall of the hole groove 1, and the hole groove 2 penetrates the packaging shell; the utility model can achieve pressure resistance and heat dissipation, is easy to use, can extend the service life, saves time, and is easy to operate; at the same time, it has high strength after encapsulation and simple structure".

[0004] However, the utility model has the following problems: although the voltage-discharging diode proposed in the patent can ensure the heat dissipation effect during use to extend the service life, its pins are directly exposed to the outside. Long-term exposure to the outside is not only easy to cause damage to the pins when they are hit or collided, but also easy to adhere to a large amount of dust, which leads to poor contact of the voltage-discharging diode and even direct detachment of the pins, resulting in the voltage-discharging diode being unable to be used normally. Therefore, the utility model provides a heat-dissipating voltage-discharging diode to solve the problems raised in the above-mentioned background technology. Utility Model Content

[0005] The purpose of the utility model is to solve the shortcomings existing in the prior art, and to propose a heat dissipation type Zener diode, which can not only ensure the heat dissipation effect of the Zener diode, avoid overheating when the Zener diode is working, and extend the service life of the Zener diode, but also can wrap and protect the exposed part of the pin.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A heat dissipation type voltage regulator diode, comprising a base and a top cover, wherein a shell is fixedly arranged on the upper end surface of the base, and a holder is fixedly arranged on both sides of the bottom end surface of the inner wall of the shell, a voltage regulator chip is embedded at the midpoint of the bottom end surface of the inner wall of the shell, and pins are fixedly arranged at the lower ends of both sides of the outer wall of the voltage regulator chip, and a No. 2 thermal pad is embedded at the midpoint of the bottom end of the shell;

[0008] A plurality of heat-conducting blocks are fixedly arranged on both sides of the bottom end of the shell, an electrostatic adsorption pad is embedded at the midpoint of the upper end surface of the base, connecting inner tubes are embedded on both sides of the lower end surface of the base, and dust-proof outer tubes are threadedly sleeved inside the two connecting inner tubes, a heat sink is embedded inside the top cover, and a No. 1 heat-conducting pad is fixedly arranged at the lower end of the top cover;

[0009] Through the above technical solution, not only can the installation and fixation of the Zener diode be completed quickly, but also the heat exchange effect of the internal and external air can be fully guaranteed, and the heat dissipation effect can be guaranteed. At the same time, the pins can be protected and electrostatically guided to reduce the adhesion of dust on the outside of the pins, damage caused by accidental collisions, and reduce electrostatic interference on the surface of the pins.

[0010] Furthermore, the top cover is fixed to the upper end of the shell by a plurality of bolts, and the plurality of bolts are respectively arranged on both sides of the upper end surface of the top cover;

[0011] The above technical solution is conducive to the rapid installation and removal of the top cover, and has a simple structure and is easy to use.

[0012] Furthermore, heat dissipation holes are provided on both sides and at the front and rear ends of the outer wall of the shell, and the plurality of heat-conducting blocks penetrate the outer side of the shell;

[0013] The above technical solution is helpful to ensure the exchange and heat dissipation of the airflow inside the shell and the external airflow.

[0014] Furthermore, the plurality of heat-conducting blocks are connected to the second heat-conducting pad, and the second heat-conducting pad is connected to the lower end surface of the voltage-stabilizing chip;

[0015] Through the above technical solution, the heat of the voltage stabilizing chip can be quickly conducted to improve the heat dissipation effect.

[0016] Furthermore, the upper end of the heat sink penetrates the upper end surface of the top cover, and the No. 1 thermal pad is connected to the lower end surface of the heat sink and to the upper end surface of the voltage regulator chip;

[0017] Through the above technical solution, the heat conduction of the voltage stabilizing chip is improved and the heat dissipation of the voltage stabilizing chip is accelerated.

[0018] Furthermore, the two pins are respectively embedded in the two card seats and penetrate the lower end surface of the base, and the two pins are respectively penetrated in the two dustproof outer tubes;

[0019] Through the above technical solution, the dust-proof outer tube can be used to wrap and protect the part of the pin exposed to the outside, thereby reducing dust adhesion and collision wear.

[0020] Furthermore, mounting holes are provided at the front and rear ends of both sides of the upper end surface of the base, and rubber rings are fixedly provided at the lower ends of the mounting holes at the front and rear ends of both sides of the lower end surface of the base;

[0021] The above technical solution is helpful to increase the friction with the installation surface during installation.

[0022] The utility model has the following beneficial effects:

[0023] 1. The utility model proposes a heat dissipation type voltage regulator diode, which can prevent the voltage regulator chip and the pins from shaking by embedding the voltage regulator chip into the shell and clamping the pins on both sides, and the upper and lower ends of the voltage regulator chip are respectively connected to two thermal pads and connected to a thermal block and a heat sink in contact with the outside air, so that the heat generated by the voltage regulator chip can be quickly guided and dissipated. At the same time, the outer wall of the shell is provided with heat dissipation holes, and the setting of the heat dissipation holes can ensure the flow exchange of internal and external air, thereby ensuring the heat dissipation effect of the voltage regulator diode.

[0024] 2. The utility model proposes a heat dissipation type voltage regulator diode, in which the pins are passed through the base and are located inside the connecting inner tube and the dustproof outer tube of the base. Since the dustproof outer tube thread is arranged in the connecting inner tube, the dustproof outer tube can extend outward, thereby completing the wrapping protection of the pins exposed to the outside, reducing the dust adhesion on the pin surface and the external collision damage. At the same time, the pins pass through the electrostatic adsorption pad, and the electrostatic adsorption pad can achieve a certain degree of electrostatic adsorption effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the shaft side structure of the utility model;

[0026] Figure 2 It is a schematic diagram of the front section structure of the utility model;

[0027] Figure 3 For the utility model Figure 2 A schematic diagram of the structure at A;

[0028] Figure 4 For the utility model Figure 2 Enlarged schematic diagram of the structure at B.

[0029] Legend:

[0030] 1. Base; 2. Mounting hole; 3. Heat conductive block; 4. Top cover; 5. Heat sink; 6. Heat dissipation hole; 7. Shell; 8. Pins; 9. Voltage stabilizer chip; 10. No. 1 thermal pad; 11. Card holder; 12. Electrostatic adsorption pad; 13. No. 2 thermal pad; 14. Rubber ring; 15. Dust-proof outer tube; 16. Connecting inner tube. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] Example

[0033] Reference Figure 1-4 , an embodiment provided by the utility model:

[0034] A heat dissipation type voltage regulator diode comprises a base 1 and a top cover 4, a shell 7 is fixedly arranged on the upper end surface of the base 1, a holder 11 is fixedly arranged on both sides of the bottom end surface of the inner wall of the shell 7, a voltage regulator chip 9 is embedded at the midpoint of the bottom end surface of the inner wall of the shell 7, pins 8 are fixedly arranged at both sides of the outer wall of the voltage regulator chip 9 near the lower end, and a second thermal pad 13 is embedded at the midpoint of the bottom end of the shell 7, wherein the second thermal pad 13 adopts a thermal putty pad TGP6000PT series to ensure good thermal conductivity;

[0035] A plurality of heat-conducting blocks 3 are fixedly arranged on both sides of the bottom end of the shell 7, and an electrostatic adsorption pad 12 is embedded at the midpoint of the upper end surface of the base 1, wherein the electrostatic adsorption pad 12 adopts anti-static silica gel, model JW-820EB; the anti-static silica gel can reduce the static electricity on the outer surface of the pin 8 and reduce interference; connecting inner tubes 16 are embedded on both sides of the lower end surface of the base 1, and dust-proof outer tubes 15 are threadedly sleeved inside the two connecting inner tubes 16, a heat sink 5 is embedded in the top cover 4, and a No. 1 thermal pad 10 is fixedly arranged at the lower end of the top cover 4, and the No. 1 thermal pad 10 adopts a thermally conductive silica gel sheet, model XK-P80.

[0036] Specifically, according to the above embodiment, the top cover 4 is fixed to the upper end of the housing 7 by a plurality of bolts, and the plurality of bolts are respectively arranged on both sides of the upper end surface of the top cover 4. When installing the top cover 4, the bolts can be passed through the holes at the upper end by using an installation tool and fixed to the upper end of the housing 7 to complete the quick installation of the top cover 4. When disassembling, the bolts can be removed to complete the disassembly.

[0037] Specifically, according to the above-mentioned embodiment, heat dissipation holes 6 are provided on both sides and at the front and rear ends of the outer wall of the shell 7, and the plurality of heat-conducting blocks 3 pass through the outer side of the shell 7. The plurality of heat-conducting blocks 3 are connected to the No. 2 heat-conducting pad 13, and the No. 2 heat-conducting pad 13 is connected to the lower end face of the voltage-stabilizing chip 9. The upper end of the heat sink 5 passes through the upper end face of the top cover 4, and the No. 1 heat-conducting pad 10 is connected to the lower end face of the heat sink 5 and to the upper end face of the voltage-stabilizing chip 9. The heat-conducting pad can promote the heat conduction of the high-temperature components that generate heat to the heat-conducting blocks 3 and the heat sink 5 effectively, and the heat energy is quickly conducted to the heat-conducting blocks 3 and the heat sink 5, and the heat energy is directly dissipated to the outside, and the rapid heat dissipation is achieved through air convection cooling, so as to avoid overheating of the voltage-stabilizing diode when it is working, thereby effectively extending the service life of the voltage-stabilizing diode.

[0038] Specifically, according to the above embodiment, the two pins 8 are respectively embedded in the two holders 11 and penetrate the lower end surface of the base 1, and the two pins 8 are respectively penetrated in the two dust-proof outer tubes 15. That is, when in use, by rotating the dust-proof outer tube 15, since the dust-proof outer tube 15 is threadedly sleeved with the connecting inner tube 16, the dust-proof outer tube 15 continuously extends outward during the rotation process, and at this time, the extended dust-proof outer tube 15 wraps the exposed part of the outer wall of the pin 8, thereby completing the protection effect of the pin 8.

[0039] Specifically, according to the above embodiment, mounting holes 2 are provided on both sides of the upper end surface of the base 1 near the front end and the rear end, and rubber rings 14 are fixedly provided on both sides of the lower end surface of the base 1 near the front end and the rear end at the lower end of the mounting holes 2 .

[0040] Working principle: When in use, first embed the voltage stabilizing chip 9 and the pin 8 into the shell 7 and embed the pin 8 into the holder 11 on both sides to complete the clamping and fixing. At this time, fix the top cover 4 with bolts and the shell 7, so that the upper and lower ends of the voltage stabilizing chip 9 are respectively connected to the two thermal pads, so as to use the thermal block 3 and the heat sink 5 for convection heat exchange with the outside air. At the same time, the dustproof outer tube 15 can be rotated to extend outward from the connecting inner tube 16, and in the process of extending outward, the outer pin 8 is exposed to the outside to achieve the wrapping protection effect.

[0041] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A heat dissipation type voltage regulator diode, comprising a base (1) and a top cover (4), characterized in that: A shell (7) is fixedly arranged on the upper end surface of the base (1), and a card seat (11) is fixedly arranged on both sides of the bottom end surface of the inner wall of the shell (7), a voltage stabilizing chip (9) is embedded at the midpoint of the bottom end surface of the inner wall of the shell (7), and pins (8) are fixedly arranged on both sides of the outer wall of the voltage stabilizing chip (9) near the lower end, and a No. 2 thermal pad (13) is embedded at the midpoint of the inner bottom end of the shell (7); A plurality of heat-conducting blocks (3) are fixedly arranged on both sides of the bottom end of the shell (7); an electrostatic adsorption pad (12) is embedded at the midpoint of the upper end surface of the base (1); connecting inner tubes (16) are embedded on both sides of the lower end surface of the base (1); dust-proof outer tubes (15) are threadedly sleeved inside the two connecting inner tubes (16); a heat sink (5) is embedded inside the top cover (4); and a No. 1 heat-conducting pad (10) is fixedly arranged at the lower end of the top cover (4).

2. The heat dissipation type voltage regulator diode according to claim 1, characterized in that: The top cover (4) is fixed to the upper end of the housing (7) by means of a plurality of bolts, and the plurality of bolts are respectively arranged on both sides of the upper end surface of the top cover (4).

3. The heat dissipation type voltage regulator diode according to claim 1, characterized in that: Heat dissipation holes (6) are provided on both sides and at the front and rear ends of the outer wall of the shell (7), and the plurality of heat-conducting blocks (3) penetrate the outer side of the shell (7).

4. The heat dissipation type voltage regulator diode according to claim 1, characterized in that: The plurality of heat-conducting blocks (3) are all connected to a No. 2 heat-conducting pad (13), and the No. 2 heat-conducting pad (13) is connected to the lower end surface of the voltage-stabilizing chip (9).

5. The heat dissipation type voltage regulator diode according to claim 1, characterized in that: The upper end of the heat sink (5) passes through the upper end surface of the top cover (4), and the No. 1 thermal pad (10) is connected to the lower end surface of the heat sink (5) and to the upper end surface of the voltage stabilizing chip (9).

6. The heat dissipation type voltage regulator diode according to claim 1, characterized in that: The two pins (8) are respectively embedded in the two holders (11) and penetrate the lower end surface of the base (1); the two pins (8) are respectively penetrated in the two dustproof outer tubes (15).

7. The heat dissipation type voltage regulator diode according to claim 1, characterized in that: Mounting holes (2) are provided on both sides of the upper end surface of the base (1) near the front end and near the rear end, and rubber rings (14) are fixedly provided on both sides of the lower end surface of the base (1) near the front end and near the rear end at the lower ends of the mounting holes (2).

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