Mounting structure of heat radiator of switch and switch

Abstract

The utility model belongs to the field of heat dissipation of a switch, and particularly relates to an installation structure of a switch radiator and a switch, which comprises a case, a circuit board installed in the case and a radiator installed on the circuit board and used for radiating heat of a chip on the circuit board. The radiator comprises a fixed end and a movable end, the fixed end is fixedly mounted on the side wall of the case or the top of the partition plate, and the movable end is hinged to the fixed end through a rotating shaft; fasteners are arranged on the bottom plate of the case and located on the two sides of the chip, and avoiding through holes are formed in the positions, located on the fasteners, of the circuit board. The two sides of the movable end are provided with clamping grooves connected with the buckling pieces in a buckled mode, and foot pads are arranged at the corners of the lower surface of the movable end. According to the utility model, maintenance or re-coating of heat-conducting silicone grease is facilitated, the operation is simple and rapid, and the whole radiator does not need to be disassembled for operation.

Description

Technical Field

[0001] The utility model belongs to the field of heat dissipation of switches, in particular to a mounting structure of a switch radiator and a switch. Background Art

[0002] With the rapid development of electronic devices, the performance of electronic devices is getting higher and higher. The high integration of chips leads to high heat. If the heat generated by electronic devices is not dissipated in time, the temperature of the chip inside the electronic device will rise. Once the temperature continues to rise, it will affect the service life of the electronic device at the least, or directly burn the chip inside the electronic device at the worst.

[0003] At present, for electronic devices such as switches, aluminum alloy heat sinks and thermal grease are usually used to transfer the heat generated by the chip, and air cooling is used to achieve heat dissipation of the chip. However, the existing heat sink uses the mounting holes on all sides to fix the heat sink on the circuit board. This installation method requires the heat sink to be completely removed, re-applied with thermal grease, and then reinstalled when the heat sink needs to be maintained. Therefore, the current heat sink installation method has the problem of troublesome later maintenance operations. Utility Model Content

[0004] The utility model aims to solve the problem that the radiator has troublesome later maintenance operations. To this end, the utility model provides a switch radiator installation structure and a switch.

[0005] The technical solution adopted by the utility model to solve its technical problems is:

[0006] Provided is a mounting structure for a switch heat sink, comprising a chassis, a circuit board installed in the chassis, and a heat sink installed on the circuit board for dissipating heat from a chip on the circuit board; the heat sink comprises a fixed end and a movable end, the fixed end is fixedly installed on a side wall of the chassis or on the top of a partition, and the movable end is hingedly connected to the fixed end via a rotating shaft; snap fasteners are provided on both sides of the chip on the bottom plate of the chassis, and avoidance through holes are provided on the circuit board at the position of the snap fasteners; snap slots snap-connected to the snap fasteners are provided on both sides of the movable end, and pads are provided at the corners of the lower surface of the movable end.

[0007] Preferably, a heat dissipation fin is provided on the upper surface of the movable end, and a chip contact portion is provided on the lower surface corresponding to the chip, and thermal conductive silicone grease is applied on the chip contact portion.

[0008] Preferably, the snap fastener comprises an elastic plate and a protrusion arranged on one side of the elastic plate.

[0009] Preferably, the card slot is a rectangular or D-shaped through-type card slot.

[0010] Preferably, a silicone pad layer is provided on the foot.

[0011] Preferably, a positioning groove is further provided on the side wall or the top of the partition of the chassis for positioning and installing the fixed end of the radiator.

[0012] A switch is also provided which uses the mounting structure described in the above embodiment to mount a radiator.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows: the utility model designs the radiator as a fixed end and a movable end, the fixed end is fixedly mounted on the side wall of the chassis or the top of the partition, the movable end is hinged to the fixed end and is connected with a snap-on piece on the chassis; when installing, only the fixed end needs to be installed, and the movable end is fixed by a snap-on connection; when disassembling, the snap-on piece can be pushed out to make the movable end fall out, and the chip and the chip contact part of the radiator can be flipped upward to expose the chip, and then maintenance or re-application of thermal grease can be carried out; the operation is simple and quick, and there is no need to remove the entire radiator for operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0015] Figure 1 This is a top view of the installation structure of the radiator provided by the utility model;

[0016] Figure 2 yes Figure 1 AA section view provided;

[0017] Figure 3 It is a top view of the radiator provided by the utility model;

[0018] Figure 4 yes Figure 3 A side view of the radiator is provided;

[0019] Figure 5 yes Figure 3 Bottom view of the heat sink provided.

[0020] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0021] 1—chassis, 1.1—side wall or partition, 1.1.0—positioning groove, 2—circuit board, 2.0—avoidance through hole, 3—heat sink, 3.1—fixed end, 3.2—movable end, 3.2.0—card slot, 3.3—rotating shaft, 3.4—foot pad, 3.5—heat sink fin, 3.6—chip contact part, 3.7—silicone pad, 4—fastener, 4.1—elastic plate, 4.2—protrusion. DETAILED DESCRIPTION

[0022] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] In the description of the present utility model, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model; the terms "install", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal connection of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0025] In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0026] Embodiment 1

[0027] This embodiment provides a switch heat sink installation structure, as shown in the attached Figure 1 As shown, it includes a chassis 1, a circuit board 2 installed in the chassis, and a heat sink 3 installed on the circuit board for dissipating heat from a chip on the circuit board, wherein:

[0028] As attached Figure 1 and attached Figure 3 As shown, the radiator 3 includes a fixed end 3.1 and a movable end 3.2, the fixed end 3.1 is fixedly installed on the side wall of the chassis 1 or the top of the partition 1.1, and the specific installation method is: fixed installation is performed using screws, and the movable end 3.2 is hingedly connected to the fixed end 3.1 through a rotating shaft 3.3. This design enables the movable end to flip around the rotating shaft relative to the fixed end after the fixed end is installed.

[0029] The fixing method of the active end is as follows: Figure 1 and attached Figure 2 As shown, snap fasteners 4 are provided on both sides of the chip on the bottom plate of the chassis 1, and avoidance holes 2.0 are provided on the circuit board 2 at the position of the snap fasteners 4. The snap fasteners 4 pass through the avoidance holes 2.0 and are exposed above the circuit board 2; card slots 3.2.0 snap-connected to the snap fasteners 4 are provided on both sides of the movable end 3.2, and the movable end 3.2 is snap-connected to the card slots 3.2.0 through the snap fasteners 4. In order to ensure the stability of the radiator, pads 3.4 are provided at the corners of the lower surface of the movable end 3.2, and the pads 3.4 are used to fill the gap between the circuit board 2 and the radiator 3.

[0030] Preferably, as attached Figure 3 To Attachment Figure 5 As shown, the upper surface of the movable end 3.2 is provided with a heat dissipation fin 3.5, and the lower surface thereof is provided with a chip contact portion 3.6 corresponding to the chip, and the chip contact portion 3.6 is coated with thermal grease (not shown in the figure). A layer of thermal grease is coated on the chip contact portion of the heat sink 3, and after the movable end of the heat sink is fixed by snapping, the chip contact portion is connected to the chip through the thermal grease, and the heat generated by the chip is transferred to the heat sink by the thermal grease.

[0031] Preferably, as attached Figure 2 As shown, the snap fastener 4 includes an elastic plate 4.1 and a protrusion 4.2 provided on one side of the elastic plate, the upper surface of the protrusion is an inclined surface, and the lower surface is a horizontal surface. The card slot 3.2.0 is a rectangular or D-shaped through-type card slot. When the radiator is pressed down, the protrusion of the elastic plate receives pressure to bend the elastic plate to one side until the radiator passes through the protrusion, and the snap fastener is reset, and the protrusion is used to limit the card slot. When it needs to be disassembled, just manually pry open the snap fastener.

[0032] In this embodiment, the radiator is designed to be composed of a fixed end and a movable end. The fixed end is fixedly mounted on the side wall of the chassis or the top of the partition, and the movable end is hinged to the fixed end and connected with a snap-on piece on the chassis. When installing, only the fixed end needs to be installed, and the movable end is fixed by a snap-on connection. When disassembling, the snap-on piece can be pushed to make the movable end come out, and the chip and the chip contact part of the radiator can be flipped upward to expose the chip and the chip contact part of the radiator, so that maintenance or re-application of thermal grease can be carried out. The operation is simple and quick, and there is no need to remove the entire radiator for operation.

[0033] Embodiment 2

[0034] Based on the first embodiment, as shown in the attached Figure 2 and attached Figure 4 As shown, in this embodiment, a silicone pad layer 3.7 is provided on the foot 3.4, and the elasticity of the silicone pad layer is utilized to make the snap connection between the snap member and the snap slot more reliable.

[0035] Embodiment 3

[0036] Based on the first or second embodiment, as shown in the attached Figure 1 As shown, in this embodiment, a positioning groove 1.1.0 is further provided on the top of the side wall or partition 1.1 of the chassis 1 for positioning and installing the fixed end 3.1 of the radiator 3. This design can quickly locate the installation position of the radiator.

[0037] The above-mentioned installation structure is used to install the radiator to form a new switch.

[0038] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A switch heat sink installation structure, comprising a chassis, a circuit board installed in the chassis, and a heat sink installed on the circuit board for dissipating heat from a chip on the circuit board; characterized in that: The radiator comprises a fixed end and a movable end, wherein the fixed end is fixedly mounted on the side wall of the chassis or the top of the partition, and the movable end is hingedly connected to the fixed end via a rotating shaft; The bottom plate of the chassis is provided with snap fasteners on both sides of the chip, and the circuit board is provided with avoidance through holes at the positions of the snap fasteners; the two sides of the movable end are provided with card slots snap-connected with the snap fasteners, and the corners of the lower surface of the movable end are provided with pads.

2. The installation structure of the switch heat sink according to claim 1, characterized in that: The upper surface of the movable end is provided with a heat dissipation fin, and the lower surface thereof is provided with a chip contact portion corresponding to the chip, and the chip contact portion is coated with thermal conductive silicone grease.

3. The installation structure of the switch heat sink according to claim 1, characterized in that: The buckle comprises an elastic plate and a protrusion arranged on one side of the elastic plate.

4. The installation structure of the switch heat sink according to claim 1, characterized in that: The card slot is a rectangular or D-shaped through-type card slot.

5. The installation structure of the switch heat sink according to claim 1, characterized in that: A silica gel cushion layer is arranged on the pad foot.

6. The installation structure of the switch heat sink according to claim 1, characterized in that: The side wall or the top of the partition of the chassis is also provided with a positioning groove for positioning and installing the fixed end of the radiator.

7. A switch, characterized in that: The radiator is installed using the installation structure described in any one of claims 1 to 6.

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