Diamond wire bus cold drawing device
By designing the diamond wire busbar cold drawing device, using the spherical contact and adjustment structure design, combined with the cold drawing technology, the problems of degradation of mechanical properties and low production efficiency of tungsten wire caused by traditional thermal drawing methods are solved, and diamond cutting lines are realized Efficient cutting and long life.
Patent Information
- Application Number
- CN202420707223.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-08
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-04-08
AI Technical Summary
The traditional tungsten wire drawing method adopts thermal drawing technology, which causes changes in the internal structure of the tungsten wire, affects the mechanical properties, and has high energy consumption and low production efficiency, making it difficult to meet the requirements of high-precision cutting.
A cold drawing device for diamond wire bus is designed, using spherical contact between the mold and the connecting block, and adjusting the relative position of the mold and diamond wire bus through the adjustment structure. The cold drawing technology is used to control temperature changes and ensure the busbar Structural stability and line diameter uniformity.
It effectively avoids the internal stress concentration problem caused by uneven stress during the pulling process of the busbar, ensures the uniformity and stability of the line diameter, and improves the cutting performance and service life of the diamond cutting line.
Smart Images

Figure CN222447732U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the field of diamond cutting wire manufacturing, in particular to a diamond wire busbar cold drawing device. Background Art
[0002] Diamond cutting wire, as an important cutting tool in the modern industrial field, is widely used in the cutting process of polysilicon slices, single crystal silicon, crystal rods, sapphire, magnetic materials and ceramic materials in the photovoltaic field. Diamond cutting wire is made by uniformly consolidating diamond micropowder particles on a high-strength steel wire matrix with a certain distribution density. It has many advantages such as high cutting efficiency, low cost and no pollution.
[0003] In the manufacturing process of diamond cutting wire, the selection of mother wire is particularly critical. As a high-quality mother wire material, tungsten wire has a thinner diameter, which can significantly reduce the loss of silicon material and improve the cutting quality of silicon wafers. In addition, tungsten wire also has excellent flexibility, tensile strength, heat resistance, wear resistance, oxidation resistance and fatigue resistance.
[0004] Traditional tungsten wire drawing methods mostly use hot drawing technology. Although hot drawing can soften the tungsten wire by heating, thereby reducing the drawing force, the heating process will cause changes in the internal structure of the tungsten wire, thereby affecting its mechanical properties; at the same time, the hot drawing process consumes a lot of energy and has low production efficiency; and when the tungsten wire diameter is too small, the stress of the hot-drawn tungsten wire is poor, which is difficult to meet the requirements of high-precision cutting.
[0005] During the drawing process, since the mold is used in a hot state, the accuracy of the mold frame (mold fixing device) is inconvenient to adjust in the heated state. The tungsten wire is subjected to uneven force in all directions after passing through the mold. The thinner the tungsten wire, the greater the impact on the equipment accuracy, which makes the tungsten wire prone to uneven stress.
[0006] When the wire diameter is greater than 0.071mm, the hot drawing equipment can easily produce tungsten wire with uniform stress. However, when the wire diameter is less than 0.071mm, or even reaches 0.036mm, the stress of the tungsten wire of the hot drawing equipment is likely to deteriorate due to the small wire diameter, and the equipment mold frame is extremely difficult to adjust in the heated state. Utility Model Content
[0007] The utility model aims to provide a diamond wire busbar cold drawing device to solve the problem of internal stress of the diamond wire busbar during the drawing process, ensure the uniformity and stability of the wire diameter, and thus improve the cutting performance and service life of the diamond cutting wire.
[0008] In order to achieve the above-mentioned purpose, the specific technical scheme of a diamond wire busbar cold drawing device of the utility model is as follows:
[0009] A diamond wire busbar cold drawing device comprises a die, a connecting block for mounting the die, and a die frame adjustably connected to the connecting block;
[0010] The connecting block and the mold frame are connected by an adjusting structure. The connection between the connecting block and the mold is in spherical contact. The relative angle between the two is adjusted by the adjusting structure to achieve the relative position adjustment of the mold and the diamond wire busbar. The diamond wire busbar passes through the mold frame, the connecting block and the drawing hole of the mold in sequence to complete the change of wire diameter.
[0011] As a further improvement of the utility model, a concave connecting groove is provided on one side of the mold frame facing the connecting block, and a first connecting hole for the diamond wire busbar to pass through is provided in the connecting groove;
[0012] The connection block is provided with a connection protrusion corresponding to the connection groove, the connection groove matches the size of the connection protrusion, the connection protrusion abuts in the connection groove, and the connection protrusion is provided with a second communication hole corresponding to the first communication hole.
[0013] As a further improvement of the present invention, the abutment between the connecting protrusion and the connecting groove is spherical contact.
[0014] As a further improvement of the present invention, the height of the connecting protrusion is greater than the depth of the connecting groove, the connecting protrusion abuts against the connecting groove, and there is a certain gap between the mold frame and the connecting block.
[0015] As a further improvement of the utility model, the mold frame is provided with a plurality of first adjustment holes, the connecting block is correspondingly provided with second adjustment holes, the adjustment structure is an adjustment bolt, the first adjustment hole and the second adjustment hole have internal threads, and the adjustment bolt passes through the first adjustment hole and then passes through the gap into the corresponding second adjustment hole.
[0016] As a further improvement of the present invention, the number of the first adjustment holes and the number of the second adjustment holes are respectively four, which are distributed on the surfaces of the mold frame and the connecting block in the shape of four end corners of a square.
[0017] As a further improvement of the utility model, the first connecting hole and the second connecting hole are arranged cocentrically with the drawing hole of the mold, and the diamond wire busbar passes through the first connecting hole, the second connecting hole and the drawing hole of the mold in sequence to complete the change of wire diameter.
[0018] Beneficial effects:
[0019] The cold drawing device of the utility model adopts a spherical contact design between the die and the connecting block, and realizes flexible adjustment of the relative angle between the two through the adjustment structure. This design enables the force direction and angle of the diamond wire busbar to be accurately controlled according to actual needs during the drawing process, thereby effectively avoiding the internal stress concentration problem caused by uneven force during the drawing process of the busbar.
[0020] The adjustable connection design between the die frame and the connection block allows the position and angle of the die to be easily adjusted according to the wire diameter and material of the busbar. This high degree of adjustability not only ensures the accuracy of busbar drawing, but also enables the device to adapt to busbar drawing operations of different specifications and requirements, improving the versatility and practicality of the device.
[0021] The cold drawing technology is used, which can more effectively control the temperature change of the busbar and avoid the internal stress change caused by temperature change compared with the traditional hot drawing method. At the same time, the cold drawing technology can also ensure the structural stability and wire diameter uniformity of the busbar during the drawing process, further improving the stress effect of the busbar. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Figure 1 This is a schematic structural diagram of a diamond wire busbar cold drawing device of the utility model;
[0023] Figure 2 It is a schematic diagram of the wire outlet surface of the mold of the utility model;
[0024] Figure 3 It is a schematic diagram of the AA section;
[0025] Explanation of the markings in the figure: 10, mold; 11, drawing hole; 20, mold frame; 21, connecting groove; 22, first connecting hole; 23, first adjustment hole; 30, connecting block; 31, connecting protrusion; 32, second connecting hole; 33, second adjustment hole; 40, adjustment structure; 50, gap; 60, spherical contact. DETAILED DESCRIPTION
[0026] In order to deepen the understanding of the present invention, the present invention will be further described in detail below in conjunction with embodiments and drawings. The embodiments are only used to explain the present invention and do not constitute a limitation on the protection scope of the present invention.
[0027] Implementation example:
[0028] like Figure 1As shown, a cold drawing device for a diamond wire busbar is provided, wherein a die frame 20 plays the role of fixing and supporting a die 10, and the die 10 is mounted on a connecting block 30, and the connecting block 30 and the die frame 20 are connected by an adjustment structure 40. The die 10 is used to draw the diamond wire busbar to meet the predetermined wire diameter requirement. The connecting block 30 plays the role of connecting the die 10 and the die frame 20, and can adjust the angle of the die 10 to meet different drawing requirements. The die frame 20 is used to support and fix the connecting block 30 and the die 10 to ensure the stability of the entire drawing process.
[0029] like Figure 2-3 As shown, a concave connection groove 21 is provided on one side of the mold frame 20 facing the connection block 30, and a first connecting hole 22 for the diamond wire busbar to pass through is provided in the connection groove 21. This design enables the diamond wire busbar to pass through the mold frame smoothly, providing convenience for subsequent drawing operations.
[0030] The connection block 30 is provided with a connection protrusion 31 at a position corresponding to the connection groove 21. The connection groove 21 matches the connection protrusion 31 in size, so that the connection protrusion 31 can be tightly abutted in the connection groove 21. This connection method not only ensures the stability between the connection block 30 and the mold frame 20, but also makes the entire device compact and easy to operate. At the same time, the connection protrusion 31 is provided with a second communication hole 32 corresponding to the first communication hole 22, ensuring that the diamond wire busbar can smoothly pass through the connection block.
[0031] During installation, the connection protrusion 31 extends into the connection groove 21 to achieve smooth contact, and the contact surface is a spherical contact 60. This spherical contact design allows the relative angle between the connection block 30 and the mold frame 20 to be flexibly adjusted, thereby achieving precise control of the relative position of the mold 10 and the diamond wire busbar. This design not only improves the flexibility of the device, but also makes the drawing process more stable and reliable.
[0032] The height of the connecting protrusion 31 is greater than the depth of the connecting groove 21, so that when the connecting protrusion 31 abuts against the connecting groove 21, there is a certain gap 50 between the mold frame 20 and the connecting block 30. This gap 50 provides space for subsequent adjustment operations, so that the adjustment bolt can pass through the mold frame 20 and the connecting block 30 to achieve a tight connection between the two.
[0033] In this embodiment, the adjustment structure 40 is an adjustment bolt. In order to achieve accurate adjustment of the relative position between the connection block 30 and the mold frame 20, the mold frame 20 is provided with a first adjustment hole 23, and the connection block is correspondingly provided with a second adjustment hole 33. The first adjustment hole 23 and the second adjustment hole 33 are provided with internal threads, so that the adjustment bolt can pass through the first adjustment hole 23 and then enter the corresponding second adjustment hole 33 through the gap 50. By rotating the adjustment bolt, the relative position between the connection block and the mold frame can be finely adjusted to meet different drawing requirements.
[0034] In this embodiment, the number of the first adjustment holes 23 and the second adjustment holes 33 are respectively 4, which are distributed on the surface of the mold frame 20 and the connecting block 30 in the shape of four square corners, and the diagonal lines are 90 degrees. This distribution method allows the adjustment bolts to be evenly stressed, and through fine-tuning in four directions, the mold usage accuracy is improved, and the stress of the diamond wire generatrix is improved.
[0035] The first connecting hole 22 and the second connecting hole 32 are arranged cocentrically with the drawing hole 11 of the die, ensuring that the diamond wire busbar can maintain a stable stress state during the drawing process, avoiding the generation of internal stress of the busbar due to uneven stress. The diamond wire busbar passes through the first connecting hole 22, the second connecting hole 32 and the drawing hole 11 in sequence to complete the change of wire diameter, realizing precise drawing adjustment.
[0036] It is understood that the present invention is described by some embodiments, and those skilled in the art are aware that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the scope of protection of the present invention.
Claims
1. A diamond wire busbar cold drawing device, characterized in that: It comprises a mold, a connecting block for mounting the mold, and a mold frame adjustably connected to the connecting block; The connecting block and the mold frame are connected by an adjusting structure. The connection between the connecting block and the mold is in spherical contact. The relative angle between the two is adjusted by the adjusting structure to achieve the relative position adjustment of the mold and the diamond wire busbar. The diamond wire busbar passes through the mold frame, the connecting block and the drawing hole of the mold in sequence to complete the change of wire diameter.
2. The cold drawing device for diamond wire busbar according to claim 1, characterized in that: The mold frame is provided with a concave connection groove on one side facing the connection block, and a first connecting hole for the diamond wire busbar to pass through is provided in the connection groove; The connection block is provided with a connection protrusion corresponding to the connection groove, the connection groove matches the size of the connection protrusion, the connection protrusion abuts in the connection groove, and the connection protrusion is provided with a second communication hole corresponding to the first communication hole.
3. The cold drawing device for diamond wire busbar according to claim 2, characterized in that: The connection protrusion and the connection groove are in spherical contact.
4. The diamond wire busbar cold drawing device according to claim 3, characterized in that: The height of the connecting protrusion is greater than the depth of the connecting groove, the connecting protrusion abuts against the connecting groove, and there is a certain gap between the mold frame and the connecting block.
5. The cold drawing device for diamond wire busbar according to claim 4, characterized in that: The mold frame is provided with a plurality of first adjustment holes, and the connecting block is correspondingly provided with second adjustment holes. The adjustment structure is an adjustment bolt, and the first adjustment hole and the second adjustment hole have internal threads. The adjustment bolt passes through the first adjustment hole and then passes through the gap to enter the corresponding second adjustment hole.
6. The diamond wire busbar cold drawing device according to claim 5, characterized in that: The number of the first adjustment holes and the number of the second adjustment holes are respectively four, and they are distributed on the surfaces of the mold frame and the connecting block in the shape of four end corners of a square.
7. The diamond wire busbar cold drawing device according to claim 2, characterized in that: The first connecting hole and the second connecting hole are arranged cocentrically with the drawing hole of the mold, and the diamond wire busbar passes through the first connecting hole, the second connecting hole and the drawing hole of the mold in sequence to complete the change of wire diameter.