Tooling based on lead-out type pin device gold removing and tin coating process

Abstract

The utility model relates to a tool based on a lead-out type pin device gold removing and tin coating process, the whole tool is of a T-shaped structure, and the tool comprises a device body T-shaped protection tool, a device sealing cover T-shaped protection tool and a closed hinge; the device body T-shaped protection tool is a tool lower cover; the tool lower cover comprises a lower cover and a positioning column; the lower cover is provided with a protection cavity of the device body; the device sealing cover T-shaped protection tool is a tool upper cover, and the tool upper cover comprises an upper cover, a limiting hole and a closing hinge which are connecting mechanisms of the device body T-shaped protection tool and the device sealing cover T-shaped protection tool. According to the tool for the gold removing and tin coating process, the problem of the gold removing and tin coating process of lead-out type pin gold-plated devices under the condition of a small quantity and multiple varieties is solved; meanwhile, under the condition that the requirement for the gold removing and tin coating precision of the device pin is high, effective protection on the device and personnel safety can be achieved, and the repair difficulty that bridging is likely to be generated after tin coating is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of gold removal and tin plating technology of electronic components, in particular to a tooling based on the gold removal and tin plating technology of lead-out pin components. Background Art

[0002] Due to the increasing demand for highly integrated and miniaturized domestic components, especially in integrated circuit boards in the aviation and aerospace fields, more and more units are using gold-plated pin components.

[0003] In order to prevent the "gold brittleness" phenomenon, domestic and foreign aviation and aerospace standards stipulate that the pins of gold-plated components must be treated with gold removal and tin plating before they can be soldered to the PCB board with Sn63Pn37 solder. Lead-out pin devices are generally SOP and QFP packaging devices. They are typical components with gold-plated pins on two or four sides. Their pins have small pin spacing, thin pins, and are easy to deform. The following difficulties exist in gold removal and tin plating:

[0004] 1) It is unsafe to remove gold and tin directly by hand using a tin pot without special tools;

[0005] 2) Manual tinning depends on the proficiency of the operator. The tinning accuracy cannot be effectively controlled for short pins, resulting in low production efficiency;

[0006] 3) The pad density is high and the spacing is small, and gold removal and tin plating are prone to bridges, which is not conducive to rework.

[0007] 4) The equipment has high tin plating cost and is not suitable for small quantities and multiple varieties.

[0008] Designing a simple and effective gold removal and tin plating process method is of great significance to improving personnel operation safety and the consistency of device gold removal and tin plating effects. Utility Model Content

[0009] In order to solve the above technical problems, the utility model provides a tooling based on the gold removal and tin plating process of the lead-out pin device, the tooling is a T-shaped structure as a whole, including: a T-shaped protective tooling of the device body, a T-shaped protective tooling of the device cover and a closing hinge; the T-shaped protective tooling of the device body is a tooling lower cover; the tooling lower cover includes: a lower cover and a positioning column; the lower cover is provided with a protective cavity of the device body, and the convex grooves on the left and right sides of the protective cavity are symmetrical and have the same thickness;

[0010] The device cover T-shaped protection tooling is a tooling upper cover, the width of which is equal to the tooling lower cover, and the tooling upper cover comprises: an upper cover, a limiting hole, the device cover plate provided on the upper cover is aligned with the contour of the position of the protection cavity of the lower cover, and the device cover plate avoids the grooves on the left and right sides with symmetrical thickness; the tooling upper cover is provided with limiting holes, and the limiting holes correspond to the positions of the positioning columns one by one;

[0011] The closing hinge is a connecting mechanism between the T-shaped protective tooling of the device body and the T-shaped protective tooling of the device cover; a U-shaped groove is provided at the tail end of the T-shaped protective tooling of the device body, wherein symmetrical mounting ear holes of the closing hinge are provided at the bottom of the groove cavity of the U-shaped groove, so that the closing hinge and the U-shaped groove at the tail end of the T-shaped protective tooling of the device body can be detachably installed by means of locking screws.

[0012] In one embodiment of the utility model, a U-shaped groove is also provided at the tail end of the device cover T-shaped protective tooling, and symmetrical mounting ear holes for closing hinges are provided at the bottom of the groove cavity, so that the closing hinge and the U-shaped groove at the tail end of the device cover T-shaped protective tooling can be detachably installed by locking screws.

[0013] In one embodiment of the utility model, the depth of the U-shaped groove at the tail end of the T-shaped protection tooling of the cover and the U-shaped groove at the tail end of the T-shaped protection tooling of the device body corresponds to the thickness of the closing hinge, so that the T-shaped tooling body protection and the cover protection tooling can be fitted and hinged after the closing hinge is closed.

[0014] In one embodiment of the utility model, both the device body T-shaped protection fixture and the device cover T-shaped protection fixture are provided with limited positioning columns and limited holes, which correspond to each other one by one, so that the upper and lower sides of the pins are tinned uniformly when the pins are de-golded and tinned.

[0015] In one embodiment of the utility model, the materials of the device body T-shaped protective tooling and the device cover T-shaped protective tooling are high temperature resistant and antistatic synthetic stone materials, so that the tooling is thermally stable during gold removal and tin plating, and the device is safe to contact.

[0016] The above-mentioned technical scheme of the utility model has the following advantages compared with the prior art: the tooling of the gold removal and tin plating process described in the utility model solves the problem of gold removal and tin plating process of lead-out pin gold-plated devices in small quantities and multiple varieties; at the same time, when the precision of gold removal and tin plating of device pins is high, it can also achieve effective protection of device and personnel safety, reduce dependence on the proficiency of operators, reduce the difficulty of rework caused by bridging after tin plating, and thus improve the reliability of product electrical connections. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to make the content of the utility model more clearly understood, the utility model is further described in detail below based on specific embodiments of the utility model in combination with the accompanying drawings.

[0018] Figure 1 It is a schematic diagram of the tooling structure of the utility model based on the gold removal and tin plating process of the lead-out pin device;

[0019] Figure 2 It is a structural schematic diagram of the T-shaped protective tooling of the device body of the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the device cover T-shaped protective tooling of the utility model;

[0021] Figure 4 It is a cross-sectional schematic diagram of the tooling of the utility model after overall assembly.

[0022] As shown in the figure, 1. lower cover, 11. protective cavity, 2. positioning column, 3. upper cover, 31. device cover plate, 4. limiting hole, 5. closing hinge. DETAILED DESCRIPTION

[0023] like Figure 1 and Figure 2 As shown, this embodiment provides a tooling for the gold removal and tin plating process of the lead-out pin device, and the tooling is a T-shaped structure as a whole, including: a T-shaped protective tooling for the device body, a T-shaped protective tooling for the device cover, and a closing hinge 5; the T-shaped protective tooling for the device body is a tooling lower cover; the tooling lower cover includes: a lower cover 1 and a positioning column 2; the lower cover 1 is provided with a protective cavity 11 of the device body, and the convex grooves on the left and right sides of the protective cavity 11 are symmetrical and have the same thickness;

[0024] like Figure 3 The device cover T-shaped protection tooling shown is a tooling upper cover, and the width of the tooling upper cover is equal to the tooling lower cover, and the tooling upper cover includes: an upper cover 3, a limiting hole 4, and the device cover plate 31 provided on the upper cover 3 is aligned with the contour of the position of the protection cavity 11 of the lower cover 1, and the device cover plate 31 avoids the grooves on the left and right sides and has the same symmetrical thickness; the tooling upper cover is provided with a limiting hole 4, and the limiting hole 4 corresponds to the position of the positioning column 2 one by one;

[0025] like Figure 4 As shown, the closing hinge 5 is a connecting mechanism between the device body T-shaped protective tooling and the device cover T-shaped protective tooling; a U-shaped groove is provided at the tail end of the device body T-shaped protective tooling, wherein symmetrical mounting ear holes of the closing hinge 5 are provided at the bottom of the groove cavity of the U-shaped groove, so that the closing hinge 5 and the U-shaped groove at the tail end of the device body T-shaped protective tooling can be detachably installed by locking screws.

[0026] A U-shaped groove is also provided at the tail end of the device cover T-shaped protective tooling, and symmetrical mounting ear holes for the closing hinge 5 are provided at the bottom of the groove cavity, so that the closing hinge 5 and the U-shaped groove at the tail end of the device cover T-shaped protective tooling can be detachably installed by locking screws.

[0027] The depths of the U-shaped grooves at the rear ends of the cover T-shaped protection tooling and the device body T-shaped protection tooling correspond to the thickness of the closing hinge 5, so that the T-shaped tooling body protection and the cover protection tooling can be fitted and hinged after the closing hinge 5 is closed.

[0028] The device body T-shaped protection fixture and the device cover T-shaped protection fixture are both provided with limited positioning columns 2 and limited holes 4, which correspond to each other one by one, so that the upper and lower sides of the pins are tinned uniformly when the pins are de-golded and tinned.

[0029] The materials of the device body T-shaped protection tooling and the device cover T-shaped protection tooling are high temperature resistant anti-static synthetic stone materials, so that the tooling is thermally stable during gold removal and tin plating, and the device is safe to contact.

[0030] At the same time, based on the tooling of the gold removal and tin plating process of the lead-out pin device described in this embodiment, a gold removal and tin plating process method suitable for the lead-out pin device can also be provided, which is used to realize the gold removal and tin plating operation of the solderable area of ​​the lead-out pin device, including the following steps:

[0031] Step 1: Customize the T-shaped tinning tooling for lead-out pin devices according to the actual size of the lead-out pin devices;

[0032] Step 2: The device is clamped by a T-type fixture and the flux is applied;

[0033] Step 3: The device is clamped by T-type tooling to remove gold and tin;

[0034] Step 4: Clean the components after gold removal and tin plating.

[0035] Preferably, step 2 specifically includes: placing the device to be de-goldened and tin-plated in a T-shaped tin-plating tooling protective cavity, closing the hinges, pressing the upper and lower surfaces of the device pins together, and completing precise control of the flux coating on the pin tin-plating area.

[0036] Preferably, the amount of flux applied is controlled by a tooling limiter, and the coating time is 1 to 2 seconds.

[0037] Preferably, step 3 specifically includes: after gold plating and tin plating for lead-out pin devices, some pin solder bridges are reworked; pins that do not need to be tinned are protected by local pin protection tooling, and a temperature-controlled electric soldering iron with an ultra-fine soldering iron tip is used, the soldering iron is set at 280-320°C, and a tin-absorbing tape is added, and each absorption time is 2-3s to remove excess solder remaining on the pins.

[0038] Preferably, step 3 specifically includes: closing the device body tooling and the cover in a T-shaped hinge to achieve pressing of the upper and lower surfaces of the device pins, holding the rear end of the T-shaped tooling to tin the lead pins at both ends in the tin pot respectively, so as to accurately control the amount of tin liquid applied to the pin tinning area, thereby realizing the gold removal tinning process method.

[0039] Preferably, the T-shaped tooling has a pot lowering angle of 0 to 15°, the tin pot is set at 260 to 280° C., and the tinning time is 2 to 4 seconds.

[0040] Preferably, step 4 specifically includes: removing the protective tooling from the device after gold plating, placing it in a container filled with anhydrous ethanol, the liquid is required to immerse the device, soaking for 2 to 3 minutes, and then using an anti-static brush to clean the pins to remove excess materials and flux residues; after cleaning, taking out the connector and letting it stand for 5 to 8 minutes to dry.

[0041] The tooling and gold removal and tin plating process described in this embodiment include customizing a T-shaped tin plating tooling for lead-out pin devices; clamping the device T-shaped tooling for flux coating, and clamping the device T-shaped tooling for gold removal and tin plating; completing the final purpose of gold removal and tin plating by cleaning the device after gold removal and tin plating; it can not only meet the consistency of tin plating size and position according to requirements, solve the problem of being unable to achieve effective protection of device and personnel safety, and relying on the proficiency of the operator, but also can perform gold removal and tin plating on multiple devices at one time, and the closing of the tooling hinge can realize rapid device placement and removal, thereby reducing costs and improving production efficiency.

[0042] Obviously, the above embodiments are merely examples for the purpose of clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the scope of protection of the invention of the utility model.

Claims

1. A tooling for the gold removal and tin plating process of lead-out pin devices, the tooling is a T-shaped structure as a whole, characterized in that: include: Device body T-shaped protection fixture, device cover T-shaped protection fixture and closing hinge (5); The T-shaped protective tooling of the device body is the lower cover of the tooling; The tooling lower cover comprises: a lower cover (1) and a positioning column (2); the lower cover (1) is provided with a protective cavity (11) for the device body, and the convex grooves on the left and right sides of the protective cavity (11) are symmetrical and have the same thickness; The device cover T-shaped protection tooling is a tooling upper cover, the width of the tooling upper cover is equal to the tooling lower cover, and the tooling upper cover comprises: an upper cover (3), a limiting hole (4), the device cover plate (31) provided on the upper cover (3) is aligned with the contour of the position of the protection cavity (11) of the lower cover (1), and the device cover plate (31) avoids the grooves on the left and right sides to have the same symmetrical thickness; the tooling upper cover is provided with a limiting hole (4), and the limiting hole (4) corresponds to the position of the positioning column (2) one by one; The closing hinge (5) is a connecting mechanism between the device body T-shaped protection tooling and the device cover T-shaped protection tooling; a U-shaped groove is provided at the rear end of the device body T-shaped protection tooling, wherein symmetrical mounting ear holes of the closing hinge (5) are provided at the bottom of the groove cavity of the U-shaped groove, so that the closing hinge (5) and the U-shaped groove at the rear end of the device body T-shaped protection tooling can be detachably mounted by means of locking screws.

2. The tooling for the gold removal and tin plating process according to claim 1 is characterized in that: A U-shaped groove is also provided at the tail end of the device cover T-shaped protective tooling, and symmetrical mounting ear holes for the closing hinge (5) are provided at the bottom of the groove cavity of the U-shaped groove, so that the closing hinge (5) and the U-shaped groove at the tail end of the device cover T-shaped protective tooling can be detachably mounted by means of locking screws.

3. The tooling for the gold removal and tin plating process according to claim 2 is characterized in that: The depths of the U-shaped groove at the rear end of the cover T-shaped protection tooling and the U-shaped groove at the rear end of the device body T-shaped protection tooling correspond to the thickness of the closing hinge (5) so that after the closing hinge (5) is closed, the T-shaped tooling body protection and the cover protection tooling are fitted and hinged.

4. The tooling for the gold removal and tin plating process according to claim 1 is characterized in that: The device body T-shaped protection fixture and the device cover T-shaped protection fixture are both provided with limited positioning columns (2) and limited holes (4), which correspond to each other, so that the upper and lower sides of the pins are tinned uniformly when the pins are de-golded and tinned.

5. The tooling for the gold removal and tin plating process according to claim 4 is characterized in that: The materials of the device body T-shaped protection tooling and the device cover T-shaped protection tooling are high temperature resistant anti-static synthetic stone materials, so that the tooling is thermally stable during gold removal and tin plating, and the device is safe to contact.

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