Chamfering grinding wheel with reinforcing layer

Abstract

The utility model provides a chamfering grinding wheel with a reinforcing layer, and relates to the technical field of grinding wheel manufacturing, the chamfering grinding wheel comprises a base body, the base body is provided with a mounting hole, and the base body is made of aluminum alloy; the grinding layer is arranged on the periphery of the base body, the grinding layer is formed by sequentially connecting a plurality of diamond layers and a plurality of metal reinforcing layers, the metal reinforcing layers are arranged on the two end faces of the grinding layer, and the thickness of the metal reinforcing layers arranged on the two end faces of the grinding layer is larger than the thickness of the metal reinforcing layers between the diamond layers. Chamfering grooves are formed in the outer side walls of the diamond layers, and the metal reinforcing layer is a copper-tin alloy layer. In the using process of a traditional chamfering grinding wheel, edges of a grinding layer are prone to being damaged when encountering external force, chamfering grooves are damaged, and the machining efficiency and the overall service life are affected. The metal reinforcing layer is arranged in the grinding layer, so that the chamfering groove can be protected, the machining efficiency of the grinding wheel can be improved, and the overall service life of the grinding wheel can be prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of grinding wheel manufacturing, in particular to a chamfering grinding wheel with a reinforcement layer. Background Art

[0002] Grinding wheels, also known as bonded abrasives, are the most important type of abrasives in grinding processing. Chamfering grinding wheels are widely used in semiconductor processing industries such as sapphire wafers, silicon carbide wafers, and silicon wafers. In the process of processing semiconductors, it is necessary to chamfer the edges of the sliced ​​semiconductors to improve the mechanical strength and machinability of the semiconductor slices, so as to facilitate further processing of the semiconductor slices.

[0003] Since the grinding layer of the chamfering grinding wheel has some characteristics such as high hardness and high brittleness, the problem of grinding layer bumping during transmission and use is inevitable, which will cause the edge of the grinding layer to be damaged and the chamfering groove to be destroyed, reducing the efficiency of grinding wheel processing and the overall life. Utility Model Content

[0004] The utility model aims to overcome the defects of the existing production process and provides a chamfering grinding wheel with a reinforcement layer to improve the overall strength of the grinding layer of the chamfering grinding wheel and avoid the damage of the edge of the grinding layer to damage the chamfering groove and affect the use of the chamfering grinding wheel.

[0005] In order to achieve the above purpose and other purposes, the utility model is implemented by including the following technical solutions: The utility model provides a chamfering grinding wheel with a reinforcement layer, and the chamfering grinding wheel includes:

[0006] A base, wherein a mounting hole is provided at the center of the base, and the base is made of aluminum alloy;

[0007] A grinding layer is arranged on the periphery of the substrate. The grinding layer is formed by connecting multiple diamond layers and multiple metal reinforcement layers in sequence. The metal reinforcement layers are located at both end surfaces of the grinding layer. Chamfered grooves are arranged on the outer side walls of the multiple diamond layers. The metal reinforcement layer is a copper-tin alloy layer.

[0008] In some embodiments, the grinding layer is bonded to the substrate by conductive adhesive, the thickness E of the substrate is consistent with the thickness C of the grinding layer at the bonding point, the thickness C of the grinding layer is 10mm-25mm, the outer diameter of the grinding layer is 150mm-210mm, and the width D of the grinding layer is 4mm-6mm.

[0009] In some embodiments, the metal reinforcement layer is a copper-tin-titanium alloy, and the conductive adhesive is an organic silicon conductive adhesive.

[0010] In some embodiments, the diamond layer includes a metal bond and diamond grains, and the diamond grains are embedded in the metal bond.

[0011] In some embodiments, the metal binder is a copper-tin alloy.

[0012] In some embodiments, the thickness of the metal reinforcement layer set on both end surfaces of the grinding layer is 0.8mm-5mm, the thickness of the metal reinforcement layer between the diamond layers is 0.6mm-2mm, and the thickness of the metal reinforcement layer set on both end surfaces of the grinding layer is greater than the thickness of the metal reinforcement layer between the diamond layers.

[0013] In some embodiments, the thickness of the metal reinforcement layer is greater than the thickness of the diamond layer.

[0014] In some embodiments, the total thickness of the metal reinforcement layer is 60-70% of the total thickness of the grinding layer.

[0015] In some embodiments, the thickness of the diamond layer is 0.8 mm-3 mm, the thickness of the diamond layer is greater than or equal to the opening size of the chamfer groove, the chamfer groove includes a T-shaped groove and an R-shaped groove, and the number of the diamond layers is multiple.

[0016] In some embodiments, bumps are disposed on the diamond layer.

[0017] The utility model provides a chamfering grinding wheel with a reinforcement layer. Compared with the prior art, the utility model has the following beneficial effects: a metal reinforcement layer is provided in the grinding layer of the chamfering grinding wheel, and both end faces and the outer circle of the grinding layer can be protected during use and transportation to avoid damage to the edge edges, which can protect the chamfering groove and is beneficial to improving the processing efficiency and overall life of the chamfering grinding wheel. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 Shown is the overall structure diagram of the chamfering grinding wheel of the utility model.

[0020] Figure 2 Shown is a cross-sectional view of the chamfering grinding wheel of the utility model.

[0021] Figure 3 Display of the utility model Figure 2 Enlarged view of point A.

[0022] Figure 4 Display of the utility model Figure 2Enlarged view of point A.

[0023] Figure 5 It is shown in one embodiment of the present utility model Figure 3 Enlarged view of point B.

[0024] Figure 6 It is shown in one embodiment of the present utility model Figure 3 Enlarged view of point B.

[0025] Figure 7 It is shown in one embodiment of the present utility model Figure 3 Enlarged view of point B.

[0026] In the figure: 1-substrate, 2-grinding layer, 21-metal reinforcement layer, 22-diamond layer, 23-chamfered groove, 241-first bump, 242-second bump, 3-mounting hole, 4-metal binder, 5-diamond abrasive grains. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0028] like Figures 1 to 6 As shown, the utility model provides a chamfering grinding wheel with a reinforcement layer. A metal reinforcement layer 21 is arranged in the grinding layer 2 of the chamfering grinding wheel, and the metal reinforcement layer 21 can play a role in protecting the chamfering groove.

[0029] like Figure 1 and Figure 2 As shown, in one embodiment, the chamfering grinding wheel includes a substrate 1, which is a cylinder. A mounting hole 3 is provided at the center of the substrate 1. The substrate 1 is made of aluminum alloy, specifically hard aluminum alloy 2A12.

[0030] like Figure 1 and Figure 2 and Figure 4As shown, in one embodiment, the chamfering grinding wheel includes a grinding layer 2, which is arranged on the periphery of the substrate 1, the inner diameter of the grinding layer 2 is larger than the outer diameter of the substrate 1, the grinding layer 2 and the substrate 1 are bonded by conductive glue, the conductive glue is silicone conductive glue, the thickness E of the substrate 1 is consistent with the thickness C of the grinding layer 2 at the bonding point, the thickness C of the grinding layer 2 is 10mm-25mm, the outer diameter of the grinding layer 2 is 150mm-210mm, and the width D of the grinding layer 2 is 4mm-6mm.

[0031] like Figure 3 As shown, in one embodiment, the grinding layer 2 is formed by connecting a plurality of metal reinforcement layers 21 and a plurality of diamond layers 22 in sequence, the two end surfaces of the grinding layer 2 are metal reinforcement layers 21 , and the metal reinforcement layers 21 are filled between the diamond layers 22 .

[0032] like Figure 3 As shown, in one embodiment, the thickness of the metal reinforcement layer 21 arranged on the two end surfaces of the grinding layer 2 is 0.8mm-5mm, the thickness of the metal reinforcement layer 21 between the diamond layers 22 is 0.6mm-2mm, the thickness of the metal reinforcement layer 21 arranged on the two end surfaces of the grinding layer 2 is greater than the thickness of the metal reinforcement layer 21 between the diamond layers 22, and the total thickness of the metal reinforcement layer 21 is 60-70% of the total thickness of the grinding layer 2. The metal reinforcement layer 21 filled on the two end surfaces of the grinding layer 2 and between the diamond layers 22 is used to prevent edge damage and protect the chamfer groove 23.

[0033] like Figure 3 As shown, in one embodiment, the thickness of the diamond layer 22 is 0.8mm-3mm, a chamfered groove 23 is provided on the outer wall of the diamond layer 22, the thickness of the diamond layer 22 is greater than or equal to the opening size of the chamfered groove 23, the number of the diamond layers 22 is multiple, and the thickness of the metal reinforcement layer 21 is greater than the thickness of the diamond layer 22.

[0034] like Figure 3 As shown, in one embodiment, the cross-sectional shape of the chamfered groove 23 can be a T-shaped groove or an R-shaped groove, and the number of the chamfered grooves 23 is consistent with the number of the diamond layers 22.

[0035] like Figure 5 As shown, in one embodiment, first bumps 241 are provided on the top and bottom walls of the diamond layer 22. The purpose of the first bumps 241 is to clamp the diamond layer 22 and the metal reinforcement layer 21 together and expand the contact area to increase the bonding strength.

[0036] like Figure 6As shown, in one embodiment, second bumps 242 are provided on the top and bottom walls of the diamond layer 22. The purpose of the second bumps 242 is to clamp the diamond layer 22 and the metal reinforcement layer 21 and expand the contact area to increase the bonding strength.

[0037] like Figure 5 and Figure 6 As shown, in one embodiment, there is a certain width between two adjacent bumps of the first bump 241 and the second bump 242 and the width cannot exceed the opening size of the chamfered groove 23 , and the opening size of the chamfered groove 23 is smaller than the thickness of the diamond layer 22 .

[0038] like Figure 7 As shown, in one embodiment, the diamond layer 22 includes a metal binder 4 and diamond abrasive particles 5. The diamond abrasive particles 5 are embedded in the metal binder 4. The material of the metal binder 4 is a copper-tin alloy. This embodiment is beneficial to increasing the working strength of the diamond layer.

[0039] The material of the metal reinforcement layer 21 is a copper-tin alloy layer, specifically a copper-tin-titanium alloy. In order to enhance the stability of the structure, a copper-tin-titanium alloy can be further used as the metal reinforcement layer. The tin and titanium metals therein can form covalent bonds with diamond, carbon, silicon and other elements in the silicone conductive adhesive. The model of the copper-tin alloy is C14415, the model of the copper-tin-titanium alloy is CuSn19Ti10, and the model of the silicone conductive adhesive is SH6540U, SH65650U, etc.

[0040] The working principle of an embodiment of the utility model is as follows:

[0041] First, the metal reinforcement layer 21 and the diamond layer 22 are combined in sequence and bonded with a conductive adhesive to form a grinding layer 2, and the grinding layer 2 is bonded to the substrate 1. Finally, the mounting hole 3 opened on the substrate 1 is connected to the chamfering device, and the chamfering groove 23 is used to chamfer the crystal.

[0042] In the description of the present utility model, it should be noted that when an element is referred to as being "fixed on" or "set on" another element, it can be directly on the other element or indirectly set on the other element; when an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0043] It should be understood that the terms "height", "up", "down", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0044] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0045] In the description of this specification, the description with reference to the terms "one embodiment", "certain embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0046] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions under which this application can be implemented. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size should still fall within the scope of the technical content disclosed in this application without affecting the effects and purposes that can be achieved by this application.

[0047] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A chamfering grinding wheel with a reinforcement layer, characterized in that: The chamfering grinding wheel comprises: A base, wherein a mounting hole is provided at the center of the base, and the base is made of aluminum alloy; A grinding layer is arranged on the periphery of the substrate. The grinding layer is formed by connecting multiple diamond layers and multiple metal reinforcement layers in sequence. The metal reinforcement layers are located at both end surfaces of the grinding layer. Chamfered grooves are arranged on the outer side walls of the multiple diamond layers. The metal reinforcement layer is a copper-tin alloy layer.

2. The chamfering grinding wheel according to claim 1, characterized in that: The grinding layer is bonded to the substrate by conductive adhesive, the thickness E of the substrate is consistent with the thickness C of the grinding layer at the bonding point, the thickness C of the grinding layer is 10mm-25mm, the outer diameter of the grinding layer is 150mm-210mm, and the width D of the grinding layer is 4mm-6mm.

3. The chamfering grinding wheel according to claim 2, characterized in that: The metal reinforcement layer is copper-tin-titanium alloy, and the conductive adhesive is organic silicon conductive adhesive.

4. The chamfering grinding wheel according to claim 1, characterized in that: The diamond layer includes a metal binder and diamond abrasive grains, and the diamond abrasive grains are embedded in the metal binder.

5. The chamfering grinding wheel according to claim 4, characterized in that: The metal binder is a copper-tin alloy.

6. The chamfering grinding wheel according to claim 1, characterized in that: The thickness of the metal reinforcement layer arranged at both end surfaces of the grinding layer is 0.8mm-5mm, the thickness of the metal reinforcement layer between the diamond layers is 0.6mm-2mm, and the thickness of the metal reinforcement layer arranged at both end surfaces of the grinding layer is greater than the thickness of the metal reinforcement layer between the diamond layers.

7. The chamfering grinding wheel according to claim 1, characterized in that: The thickness of the metal reinforcement layer is greater than the thickness of the diamond layer.

8. The chamfering grinding wheel according to claim 1, characterized in that: The total thickness of the metal reinforcement layer is 60-70% of the total thickness of the grinding layer.

9. The chamfering grinding wheel according to claim 1, characterized in that: The thickness of the diamond layer is 0.8 mm-3 mm, the thickness of the diamond layer is greater than or equal to the opening size of the chamfer groove, the chamfer groove includes a T-shaped groove and an R-shaped groove, and the number of the diamond layers is multiple.

10. The chamfering grinding wheel according to claim 1, characterized in that: The diamond layer is provided with bumps.

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