Universal vacuum clamp for wafer products

Abstract

The utility model discloses a general vacuum clamp for wafer products. The general vacuum clamp comprises a base body and a replaceable vacuum suction plate, a vacuum cavity is formed in the base body, and the vacuum cavity is communicated with a negative pressure device through a negative pressure channel; the vacuum suction plate is fixedly connected with the base body through a detachable connecting structure, a vacuum adsorption structure is arranged on the vacuum suction plate, and the vacuum adsorption structure comprises vacuum suction holes or / and vacuum suction grooves; the vacuum adsorption structure is communicated with the vacuum cavity; the vacuum suction plates are various, and the vacuum suction structures on the vacuum suction plates are different in layout. The universal vacuum clamp can be suitable for clamping by replacing assemblies according to workpieces of different models and sizes, and is good in universality.

Description

Technical Field

[0001] The utility model relates to a clamp, in particular to a universal vacuum clamp for wafer products. Background Art

[0002] Wafers are an important material in the current semiconductor industry. For example, wafer auxiliary carriers are used for sensor detection. Such wafer carriers need to be ground according to the arrangement of the sensor. Conventional wafers are available in different sizes, such as 12 inches (300mm), 8 inches (200mm), 4.9 inches (125mm), and 4 inches (100mm). For the processing of silicon wafers with an overall thickness of about 0.7mm, vacuum clamps are conventionally used.

[0003] From the production process point of view, wafer products have many specifications and models, different product features, and are updated quickly. If each model is equipped with a dedicated vacuum fixture, it is obviously not in line with production cost control and cannot meet the requirements of mass production. Utility Model Content

[0004] The utility model aims to overcome the above-mentioned problems and provide a universal vacuum clamp for wafer products. The universal vacuum clamp can replace components according to workpieces of different models and sizes, and is suitable for clamping, with good versatility.

[0005] The purpose of the utility model is achieved through the following technical solutions:

[0006] A universal vacuum fixture for wafer products, comprising a base substrate and a replaceable vacuum suction plate;

[0007] A vacuum chamber is provided on the base body, and the vacuum chamber is connected to the negative pressure device through a negative pressure channel;

[0008] The vacuum suction plate is fixedly connected to the base matrix via a detachable connecting structure, and a vacuum suction structure is provided on the vacuum suction plate, which includes vacuum suction holes and / or vacuum suction grooves; the vacuum suction structure is connected to the vacuum chamber; the vacuum suction plate is provided with multiple types and the layout of the vacuum suction structure on each vacuum suction plate is different.

[0009] The working principle of the universal vacuum chuck for the above wafer products is:

[0010] During operation, a vacuum suction plate with a corresponding vacuum adsorption structure is selected according to the shape of the wafer product; the vacuum suction plate is fixed to the base substrate through a detachable connection structure; the wafer product is placed on the vacuum suction plate, negative pressure is generated by a negative pressure device, and the negative pressure is transmitted to the vacuum suction holes and / or vacuum suction grooves through the vacuum chamber, and the wafer product is adsorbed on the vacuum suction plate by the vacuum suction holes and / or vacuum suction grooves.

[0011] When it is necessary to clamp other different wafer products, the current vacuum suction plate can be removed through the detachable connection structure and replaced with other vacuum suction plates, which has good versatility.

[0012] In a preferred embodiment of the present invention, an oblong hole is provided on the base body, and the base body is fixed on the workbench through the oblong hole via a T-type bracket.

[0013] A preferred solution of the utility model is that a vacuum channel is provided in the base matrix, one end of the vacuum channel is connected to the vacuum chamber, and the other end of the vacuum channel extends to the side of the base matrix and is connected to the straight-through quick-plug connector.

[0014] In a preferred embodiment of the present invention, two vacuum chambers are provided, and the two vacuum chambers are connected to the negative pressure device through independent negative pressure channels.

[0015] In a preferred embodiment of the present invention, at least two positioning pins are provided on the base substrate;

[0016] The vacuum suction plate is provided with a positioning groove matched with the positioning pin, so that the vacuum suction plate can be accurately placed on the base body, thereby completing the installation operation quickly.

[0017] In a preferred embodiment of the present invention, the detachable connection structure is provided with at least two groups and each group includes screws and screw holes;

[0018] The screw holes are arranged on the vacuum suction plate and the base body, and the screws pass through the screw holes of the vacuum suction plate and the base body to fix the vacuum suction plate.

[0019] In a preferred embodiment of the present invention, a sealing ring is provided between the vacuum suction plate and the base substrate, and the sealing ring surrounds the outer side of the vacuum chamber.

[0020] In a preferred embodiment of the present invention, a disassembly operation groove is provided on the side of the vacuum suction plate.

[0021] In a preferred embodiment of the utility model, a contoured positioning groove is provided on the vacuum suction plate; and the vacuum adsorption structure is arranged in the contoured positioning groove.

[0022] Furthermore, the vacuum adsorption structure is provided with a group of a plurality of concentric annular vacuum adsorption grooves and a through groove for connecting the plurality of vacuum adsorption grooves;

[0023] The vacuum adsorption structure also includes a vacuum through hole for connecting the vacuum adsorption groove with the vacuum cavity.

[0024] Furthermore, the contoured positioning grooves and the vacuum adsorption structures are provided in two groups, and each group of vacuum adsorption structures includes a plurality of concentric annular vacuum adsorption grooves and a through groove for connecting the plurality of vacuum adsorption grooves;

[0025] The vacuum adsorption structure also includes a vacuum through hole for connecting the vacuum adsorption groove with the vacuum cavity.

[0026] Furthermore, the sizes of the contoured positioning grooves of the two groups of vacuum adsorption structures are different.

[0027] Furthermore, the vacuum suction structure includes a plurality of groups of concentric arc-shaped vacuum suction grooves, a plurality of through grooves for connecting the vacuum suction grooves, and a plurality of groups of vacuum suction holes;

[0028] Each group of vacuum suction grooves includes a plurality of vacuum suction grooves distributed in a circumferential direction around the center of a circle; the number of vacuum suction grooves in different groups is the same or different;

[0029] The plurality of groups of vacuum suction holes are distributed in a circumferential direction around the center of the circle, and each group of vacuum suction holes includes a plurality of vacuum suction holes; the number of vacuum suction holes in different groups is the same or different.

[0030] Furthermore, avoidance grooves for avoiding specific features of the product are provided between the vacuum suction grooves.

[0031] Compared with the prior art, the utility model has the following beneficial effects:

[0032] The universal vacuum clamp of the utility model can be used for clamping by replacing the vacuum suction plate according to workpieces of different models and sizes, and has good universality. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of the three-dimensional structure of the first embodiment of the universal vacuum clamp for wafer products of the utility model.

[0034] Figure 2 It is a schematic diagram of the three-dimensional structure of the base matrix of the utility model.

[0035] Figure 3 It is a schematic diagram of the three-dimensional structure of the second embodiment of the vacuum suction plate of the utility model.

[0036] Figure 4 It is a schematic diagram of the three-dimensional structure of the third embodiment of the universal vacuum clamp for wafer products of the utility model. DETAILED DESCRIPTION

[0037] In order to enable those skilled in the art to better understand the technical solution of the utility model, the utility model is further described below in conjunction with embodiments and drawings, but the implementation methods of the utility model are not limited thereto.

[0038] Example 1

[0039] See also Figure 1-2 The universal vacuum clamp for wafer products of this embodiment includes a base substrate 1 and a replaceable vacuum suction plate 2. A vacuum chamber 1-1 is provided on the base substrate 1, and the vacuum chamber 1-1 is connected to the negative pressure device through a negative pressure channel; wherein, two vacuum chambers 1-1 are provided, and the two vacuum chambers 1-1 are connected to the negative pressure device through independent negative pressure channels respectively.

[0040] See also Figure 1-2 The vacuum suction plate 2 is fixedly connected to the base substrate 1 through a detachable connecting structure, and a contour positioning groove 2-1 is provided on the vacuum suction plate 2; a vacuum adsorption structure is provided on the vacuum suction plate 2, and the vacuum adsorption structure is arranged in the contour positioning groove 2-1; the vacuum adsorption structure is connected to the vacuum chamber 1-1; the vacuum suction plate 2 is provided with multiple types and the layout of the vacuum adsorption structure on each vacuum suction plate 2 is different.

[0041] See also Figure 1-2 The vacuum adsorption structure is provided with a group of concentric annular vacuum adsorption grooves 2-2 and a through groove 2-3 for connecting the multiple vacuum adsorption grooves 2-2; the vacuum adsorption structure also includes a vacuum through hole 2-4 for connecting the vacuum adsorption grooves 2-2 with the vacuum chamber 1-1.

[0042] See also Figure 1-2 The base body 1 is provided with an oblong hole 1-2, and the oblong hole 1-2 fixes the base body 1 on the workbench through a T-type bracket.

[0043] See also Figure 2 A vacuum channel 1-3 is provided on the base substrate 1, one end of the vacuum channel 1-3 is connected to the vacuum chamber 1-1, and the other end of the vacuum channel 1-3 extends to the side of the base substrate 1 and is connected to the straight-through quick-connect connector 3.

[0044] See also Figure 2 The base body 1 is provided with at least two positioning pins 4; the vacuum suction plate 2 is provided with positioning grooves that cooperate with the positioning pins 4. In this way, the vacuum suction plate 2 is conveniently placed on the base body 1 accurately, thereby quickly completing the installation operation.

[0045] See also Figure 1-2 The detachable connection structure is provided with at least two groups and each group includes screws and screw holes 5; the screw holes 5 are provided on the vacuum suction plate 2 and the base substrate 1, and the screws pass through the screw holes 5 of the vacuum suction plate 2 and the base substrate 1 to fix the vacuum suction plate 2.

[0046] See also Figure 2A sealing ring 6 is provided between the vacuum suction plate 2 and the base substrate 1, and the sealing ring 6 surrounds the outer side of the vacuum chamber 1-1.

[0047] See also Figure 1-2 The side of the vacuum suction plate 2 is provided with a disassembly operation groove 2-5.

[0048] See also Figure 1-2 The working principle of the universal vacuum clamp for wafer products of this embodiment is as follows:

[0049] During operation, a vacuum suction plate 2 with a corresponding vacuum adsorption structure is selected according to the shape of the wafer product; the vacuum suction plate 2 is fixed to the base substrate 1 through a detachable connection structure; the wafer product is placed on the vacuum suction plate 2, and negative pressure is generated by a negative pressure device, and the negative pressure is transmitted to the vacuum suction groove 2-2 through the vacuum chamber 1-1, and the wafer product is adsorbed on the vacuum suction plate 2 by the vacuum suction groove 2-2.

[0050] When it is necessary to clamp other different wafer products, the current vacuum suction plate 2 can be removed through the detachable connection structure and replaced with other vacuum suction plates 2, which has good versatility.

[0051] Example 2

[0052] See also Figure 3 Different from Example 1, the contoured positioning groove 2-1 and the vacuum adsorption structure of this embodiment are provided with two groups, each group of vacuum adsorption structure includes a plurality of concentric annular vacuum adsorption grooves 2-2 and a through groove 2-3 for connecting the plurality of vacuum adsorption grooves 2-2; the vacuum adsorption structure also includes a vacuum through hole 2-4 for connecting the vacuum adsorption groove 2-2 with the vacuum chamber 1-1.

[0053] Furthermore, the sizes of the contoured positioning grooves 2 - 1 of the two groups of vacuum adsorption structures are different.

[0054] Example 3

[0055] See also Figure 4 , different from Examples 1 and 2, the vacuum suction structure of this embodiment includes multiple groups of concentric arc-shaped vacuum suction grooves 2-2, multiple through grooves 2-3 for connecting the vacuum suction grooves 2-2, and multiple groups of vacuum suction holes 2-6; each group of vacuum suction grooves 2-2 includes multiple vacuum suction grooves 2-2 distributed in the circumferential direction around the center of the circle; the number of vacuum suction grooves 2-2 in different groups is the same or different; the multiple groups of vacuum suction holes 2-6 are distributed in the circumferential direction around the center of the circle, and each group of vacuum suction holes 2-6 includes multiple vacuum suction holes 2-6; the number of vacuum suction holes 2-6 in different groups is the same or different.

[0056] Furthermore, an avoidance groove 2-7 for avoiding specific features of the product is provided between the vacuum suction grooves 2-2.

[0057] Example 4

[0058] Different from the above embodiment, the vacuum suction grooves may also have other layouts.

[0059] The above is a preferred implementation mode of the present invention, but the implementation mode of the present invention is not limited by the above content. Any other changes, modifications, substitutions, combinations, and simplifications made without departing from the spirit and principle of the present invention should be equivalent replacement methods and are included in the protection scope of the present invention.

Claims

1. A universal vacuum chuck for wafer products, characterized in that: It includes a base matrix and a replaceable vacuum suction plate; A vacuum chamber is provided on the base body, and the vacuum chamber is connected to the negative pressure device through a negative pressure channel; The vacuum suction plate is fixedly connected to the base matrix via a detachable connecting structure, and a vacuum suction structure is provided on the vacuum suction plate, which includes vacuum suction holes and / or vacuum suction grooves; the vacuum suction structure is connected to the vacuum chamber; the vacuum suction plate is provided with multiple types and the layout of the vacuum suction structure on each vacuum suction plate is different.

2. The universal vacuum chuck for wafer products according to claim 1, characterized in that: A vacuum channel is arranged in the base body, one end of the vacuum channel is communicated with the vacuum chamber, and the other end of the vacuum channel extends to the side of the base body and is connected with the straight-through quick-connect connector.

3. The universal vacuum chuck for wafer products according to claim 1, characterized in that: The vacuum chambers are provided with two, and the two vacuum chambers are connected with the negative pressure device through independent negative pressure channels respectively.

4. The universal vacuum chuck for wafer products according to claim 1, characterized in that: At least two positioning pins are provided on the base substrate; The vacuum suction plate is provided with a positioning groove which cooperates with the positioning pin.

5. The universal vacuum chuck for wafer products according to claim 1, characterized in that: The detachable connection structure is provided with at least two groups and each group includes screws and screw holes; The screw holes are arranged on the vacuum suction plate and the base body, and the screws pass through the screw holes of the vacuum suction plate and the base body to fix the vacuum suction plate.

6. The universal vacuum chuck for wafer products according to claim 1, characterized in that: The vacuum suction plate is provided with a contoured positioning groove; the vacuum adsorption structure is arranged in the contoured positioning groove.

7. The universal vacuum chuck for wafer products according to claim 6, characterized in that: The vacuum adsorption structure is provided with a group of multiple concentric annular vacuum adsorption grooves and a through groove for connecting the multiple vacuum adsorption grooves; The vacuum adsorption structure also includes a vacuum through hole for connecting the vacuum adsorption groove with the vacuum cavity.

8. The universal vacuum chuck for wafer products according to claim 6, characterized in that: The contoured positioning grooves and vacuum adsorption structures are provided in two groups, and each group of vacuum adsorption structures includes a plurality of concentric annular vacuum adsorption grooves and a through groove for connecting the plurality of vacuum adsorption grooves; The vacuum adsorption structure also includes a vacuum through hole for connecting the vacuum adsorption groove with the vacuum cavity; The sizes of the contoured positioning grooves of the two groups of vacuum adsorption structures are different.

9. The universal vacuum chuck for wafer products according to claim 6, characterized in that: The vacuum suction structure includes a plurality of groups of concentric arc-shaped vacuum suction grooves, a plurality of through grooves for connecting the vacuum suction grooves, and a plurality of groups of vacuum suction holes; Each group of vacuum suction grooves includes a plurality of vacuum suction grooves distributed in a circumferential direction around the center of a circle; the number of vacuum suction grooves in different groups is the same or different; The plurality of groups of vacuum suction holes are distributed in a circumferential direction around the center of the circle, and each group of vacuum suction holes includes a plurality of vacuum suction holes; the number of vacuum suction holes in different groups is the same or different.

10. The universal vacuum chuck for wafer products according to any one of claims 1 to 9, characterized in that: Avoidance grooves for avoiding specific features of the product are arranged between the vacuum suction grooves.

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