Rolling mechanism for wafer film pasting
By designing a rolling mechanism including a transverse shift module, a lifting module, an induction module and a pressure regulating device, the problem of unadjustable downward height and pressure of the existing rolling mechanism is solved, and the pressure constant during rolling is achieved Product safety.
Patent Information
- Application Number
- CN202323547219.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-25
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2033-12-25
AI Technical Summary
When the existing rolling mechanism rolls the wafer, the down pressure height and pressure cannot be adjusted, which can easily lead to product fragmentation.
A rolling mechanism including a transverse shift module, a transverse shift frame, a rolling unit and a pressure regulating device is designed. The rolling roller is driven down by the lifting component, and the rolling roller is driven horizontally by the lateral movement module. The induction component induces the downforce and transmits it to the pressure regulating device. The pressure regulating device adjusts the pressure when the downforce is too high to ensure constant downforce.
The constant pressure during rolling is achieved, the product is fragmented, the flatness and safety of the film is ensured, and the structure is simplified and the space is occupied.
Smart Images
Figure CN222451357U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor manufacturing, and in particular relates to a rolling mechanism for wafer film lamination. Background Art
[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, also known as a wafer.
[0003] As we all know, during the wafer processing, a protective film is usually attached to the surface of the wafer to protect the wafer when cutting. At present, after the wafer is attached, a specific rolling mechanism is needed to squeeze and fix the protective film and the wafer for subsequent cutting. When rolling, the existing rolling mechanism first presses the roller down to a fixed position, and then directly rolls the wafer surface to complete the fixation. However, the pressing height and pressure of the existing rolling mechanism are not adjustable, which can easily cause product breakage and needs to be solved urgently. Utility Model Content
[0004] The utility model aims to provide a rolling mechanism for wafer film lamination, so as to solve the problem that the pressing height and pressure of the conventional rolling mechanism in the prior art cannot be adjusted, which easily leads to product breakage.
[0005] To achieve this purpose, the utility model adopts the following technical solutions:
[0006] A rolling mechanism for wafer film bonding, comprising a lateral movement module, a lateral movement frame, a rolling unit and a pressure regulating device, wherein:
[0007] The driving end of the transverse movement module is connected to the transverse movement frame, and the rolling unit is installed on the transverse movement frame. The transverse movement module drives the transverse movement frame to reciprocate along the first direction to drive the rolling unit to move. The rolling unit includes a lifting component, at least one group of sensing components and a rolling roller. The lifting component is installed on the transverse movement frame, and the surface of the rolling roller is treated with rubber. The rolling roller is rotatably installed on the driving end of the lifting component along the second direction. The lifting component is configured to drive the rolling roller to reciprocate along the height direction. At least one group of the sensing components is connected to the lifting component. At least one group of the sensing components is used to sense the downward pressure of the rolling roller and transmit the information to the pressure regulating device. The pressure regulating device is configured to adjust the pressure when the downward pressure of the rolling roller is too large to ensure that the downward pressure value of the rolling roller is constant. The second direction is perpendicular to the first direction.
[0008] Furthermore, the lifting assembly includes a lifting drive and a lifting frame, both ends of the rolling roller along the second direction are rotatably mounted on the lifting frame through the rolling frame, the fixed end of the lifting drive is connected to the transverse frame, the movable end of the lifting drive is connected to the lifting frame, and the lifting drive drives the lifting frame to reciprocate along the height direction to drive the rolling roller to move.
[0009] Furthermore, the sensing components are arranged in two groups, and the two groups of sensing components are symmetrically arranged on both sides of the rolling roller along the second direction. Each group of sensing components includes a buffer, a sensing component and a limit component. The bottom end of the limit component is connected to the rolling frame, and the limit component has a limit step. The sensing component rests on the limit step. The first end of the buffer component is connected to the rolling frame, and the second end of the buffer component is connected to the sensing component. The sensing component is configured to cooperate with the buffer component to buffer the descent of the rolling roller when it senses that the downward pressure of the rolling roller is too large.
[0010] Furthermore, the lifting assembly also includes a lifting guide rail, which is laid on the lifting drive member along the height direction, and the lifting frame is slidably arranged on the lifting guide rail.
[0011] Furthermore, the transverse movement module includes a transverse movement drive member, a guide assembly and a fixed frame, the guide assembly is laid on the fixed frame along a first direction, the transverse movement frame can be slidably arranged on the guide assembly, the fixed end of the transverse movement drive member is connected to the fixed frame, and the driving end of the transverse movement drive member is connected to the transverse movement frame to drive the transverse movement frame to reciprocate on the guide assembly.
[0012] Furthermore, the pressure regulating device adopts a pressure regulating valve, which is arranged on one side of the fixing frame. The pressure regulating valve is configured to adjust the pressure when the downward pressure of the rolling roller is too large to ensure that the downward pressure value of the rolling roller is constant.
[0013] Furthermore, a drag chain is provided on one side of the fixing frame.
[0014] Compared with the prior art, the beneficial effects of the rolling mechanism for wafer film lamination are as follows: the product is rolled by adopting a lifting component to drive the rolling roller to descend, and then cooperating with a transverse movement module to drive the rolling roller to move transversely, the sensing component senses the downward pressure of the rolling roller, and transmits the information to the pressure regulating device, and the pressure regulating device adjusts the pressure when the downward pressure of the rolling roller is too large to ensure that the downward pressure value of the rolling roller is constant. Not only is the design ingenious and can ensure the constant pressure during rolling, but the surface of the rolling roller is rubber-coated, so that the product is evenly pressurized during the film lamination process, the film is flat, and the safety of the product is guaranteed, avoiding the phenomenon of product breakage when hard contact occurs; a buffer is added to effectively buffer the descent of the rolling roller, further avoiding the phenomenon of hard contact of the product; a lifting guide rail is added to further improve the stability of the lifting; the pressure regulating device adopts a pressure regulating valve, which is not only simple in structure and easy to operate, but also occupies little space. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate and understand the technical solutions in the embodiments of the present invention, the following briefly introduces the background technology of the present invention and the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.
[0016] Figure 1 It is a three-dimensional structural schematic diagram of a rolling mechanism for wafer film lamination provided by an embodiment of the utility model;
[0017] Figure 2 It is a top view schematic diagram of a rolling mechanism for wafer film lamination provided by an embodiment of the utility model;
[0018] Figure 3 It is a side view schematic diagram of a rolling mechanism for wafer lamination provided by an embodiment of the utility model. DETAILED DESCRIPTION
[0019] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.
[0020] In order to facilitate the understanding of the utility model, the utility model will be described more comprehensively with reference to the relevant drawings. The preferred embodiments of the utility model are given in the drawings. However, the utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thoroughly understood. It should be noted that when a component is referred to as "fixed to" another component, it can be directly on another component or there can also be a central component. When a component is considered to be "connected" to another component, it can be directly connected to another component or there may be a central component at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for illustrative purposes and are not intended to be the only implementation method. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by technicians in the technical field of the utility model. The terms used in the specification of the utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the utility model. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0021] See also Figures 1 to 3 As shown, in this embodiment, a rolling mechanism for wafer film bonding includes a traverse module 1, a traverse frame 2, a rolling unit and a pressure regulating device 3, wherein the driving end of the traverse module 1 is connected to the traverse frame 2, the rolling unit is installed on the traverse frame 2, and the traverse module 1 drives the traverse frame 2 to move along a first direction ( Figure 1 The rolling unit is moved back and forth in the second direction (X direction) to drive the rolling unit to move. The rolling unit includes a lifting component 4, at least one set of sensing components 5 and a rolling roller 6. The lifting component 4 is installed on the transverse frame 2. The surface of the rolling roller 6 is rubberized. The rolling roller 6 moves along the second direction ( Figure 1 The lifting assembly 4 is rotatably mounted on the driving end of the lifting assembly 4 (in the Y direction), and the lifting assembly 4 is configured to drive the rolling roller 6 to move back and forth in the height direction. At least one group of sensing components 5 is connected to the lifting assembly 4, and at least one group of sensing components 5 is used to sense the downward pressure of the rolling roller 6 and transmit the information to the pressure regulating device 3. The pressure regulating device 3 is configured to adjust the pressure when the downward pressure of the rolling roller 6 is too large to ensure that the downward pressure value of the rolling roller 6 is constant.
[0022] It can be seen that the lifting component 4 is used to drive the rolling roller 6 to descend, and then the transverse module 1 is used to drive the rolling roller 6 to move transversely to roll the product. The sensing component 5 senses the downward pressure of the rolling roller 6 and transmits the information to the pressure regulating device 3. The pressure regulating device 3 adjusts the pressure when the downward pressure of the rolling roller 6 is too large to ensure that the downward pressure value of the rolling roller 6 is constant. Not only is the design ingenious and can ensure constant pressure during rolling, but the surface of the rolling roller 6 is coated with rubber, so that the product is evenly pressurized during the film pasting process, the film pasting is smooth, and the safety of the product is guaranteed to avoid the phenomenon of product breakage during hard contact.
[0023] As an embodiment, the lifting assembly 4 includes a lifting drive member 40 and a lifting frame 41. Both ends of the rolling roller 6 along the second direction are rotatably mounted on the lifting frame 41 through the rolling frame 7. The fixed end of the lifting drive member 40 is connected to the transverse moving frame 2, and the movable end of the lifting drive member 40 is connected to the lifting frame 41. The lifting drive member 40 drives the lifting frame 41 to reciprocate along the height direction to drive the rolling roller 6 to move.
[0024] As an embodiment, the sensing component 5 is provided in two groups, and the two groups of sensing components 5 are symmetrically arranged on both sides of the rolling roller 6 along the second direction, and each group of sensing components 5 includes a buffer 50, a sensing component 51 and a limit component 52, the bottom end of the limit component 52 is connected to the rolling frame 7, the limit component 52 has a limit step, the sensing component 51 abuts on the limit step, the bottom end of the buffer 50 is connected to the rolling frame 7, and the top end of the buffer 50 is connected to the sensing component 51, and the sensing component 51 is configured to cooperate with the buffer 50 to buffer the descent of the rolling roller 6 when it senses that the downward pressure of the rolling roller 6 is too large.
[0025] It can be seen that the additional buffer member 50 can effectively buffer the descent of the rolling roller 6 and further avoid the phenomenon of hard contact of the product.
[0026] As an implementation manner, the buffer member 50 is a pressure spring, and the sensing member 51 is a pressure sensor.
[0027] As an implementation manner, the lifting assembly 4 further includes a lifting guide rail 42 , which is laid on the lifting drive member 40 along the height direction, and the lifting frame 41 is slidably disposed on the lifting guide rail 42 .
[0028] Obviously, adding the lifting guide rail 42 further improves the stability of the lifting.
[0029] As an embodiment, the transverse module 1 includes a transverse driving member 10, a guide assembly 11 and a fixed frame 12. The guide assembly 11 is laid on the fixed frame 12 along a first direction. The transverse frame 2 can be slidably arranged on the guide assembly 11. The fixed end of the transverse driving member 10 is connected to the fixed frame 12. The driving end of the transverse driving member 10 is connected to the transverse frame 2 to drive the transverse frame 2 to reciprocate on the guide assembly 11.
[0030] As an embodiment, the guide assembly 11 includes two guide rails that are arranged in parallel and at intervals.
[0031] As an implementation mode, the pressure regulating device 3 adopts a pressure regulating valve, and the pressure regulating valve is arranged on one side of the fixed frame 12. The pressure regulating valve is configured to adjust the pressure when the downward pressure of the rolling roller 6 is too large to ensure that the downward pressure value of the rolling roller 6 is constant. Obviously, the pressure regulating device 3 adopts a pressure regulating valve, which is not only simple in structure and easy to operate, but also occupies little space.
[0032] As an implementation manner, a drag chain 8 is provided on one side of the fixing frame 12 .
[0033] When the above-mentioned rolling mechanism for wafer film lamination is working: the lifting drive part 40 drives the lifting part to descend until the rolling roller 6 contacts the film laminating platform, the buffer part 50 buffers the descent of the rolling roller 6, and the sensing parts 51 on both sides sense the descent of the rolling roller 6 and transmit the signal to the pressure regulating device 3, and then the transverse driving part 10 drives the transverse frame 2 to move along the first direction to roll the film on the surface of the wafer. When the downward pressure is too large, the pressure regulating device 3 adjusts the downward pressure according to the specified pressure value to make the pressure value acting on the wafer surface constant.
[0034] The above embodiments are only to illustrate the basic principles and characteristics of the present invention. The present invention is not limited by the above embodiments. Without departing from the spirit and scope of the present invention, the present invention may be subject to various changes and modifications, which are within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.
Claims
1. A rolling mechanism for wafer film bonding, characterized in that: The rolling mechanism for wafer film bonding includes a lateral movement module, a lateral movement frame, a rolling unit and a pressure regulating device, wherein: The driving end of the transverse movement module is connected to the transverse movement frame, and the rolling unit is installed on the transverse movement frame. The transverse movement module drives the transverse movement frame to reciprocate along the first direction to drive the rolling unit to move. The rolling unit includes a lifting component, at least one group of sensing components and a rolling roller. The lifting component is installed on the transverse movement frame, and the surface of the rolling roller is treated with rubber. The rolling roller is rotatably installed on the driving end of the lifting component along the second direction. The lifting component is configured to drive the rolling roller to reciprocate along the height direction. At least one group of the sensing components is connected to the lifting component. At least one group of the sensing components is used to sense the downward pressure of the rolling roller and transmit the information to the pressure regulating device. The pressure regulating device is configured to adjust the pressure when the downward pressure of the rolling roller is too large to ensure that the downward pressure value of the rolling roller is constant. The second direction is perpendicular to the first direction.
2. The rolling mechanism for wafer film bonding according to claim 1, characterized in that: The lifting assembly includes a lifting drive member and a lifting frame, both ends of the rolling roller along the second direction are rotatably mounted on the lifting frame through the rolling frame, the fixed end of the lifting drive member is connected to the transverse frame, the movable end of the lifting drive member is connected to the lifting frame, and the lifting drive member drives the lifting frame to reciprocate along the height direction to drive the rolling roller to move.
3. The rolling mechanism for wafer film bonding according to claim 2, characterized in that: The sensing components are arranged in two groups, and the two groups of sensing components are symmetrically arranged on both sides of the rolling roller along the second direction. Each group of sensing components includes a buffer, a sensing component and a limit component. The bottom end of the limit component is connected to the rolling frame, and the limit component has a limit step. The sensing component rests on the limit step. The first end of the buffer component is connected to the rolling frame, and the second end of the buffer component is connected to the sensing component. The sensing component is configured to cooperate with the buffer component to buffer the descent of the rolling roller when it senses that the downward pressure of the rolling roller is too large.
4. The rolling mechanism for wafer film bonding according to claim 2, characterized in that: The lifting assembly further comprises a lifting guide rail, wherein the lifting guide rail is laid on the lifting drive member along a height direction, and the lifting frame is slidably arranged on the lifting guide rail.
5. The rolling mechanism for wafer film bonding according to claim 1, characterized in that: The transverse movement module includes a transverse movement driving member, a guide assembly and a fixed frame. The guide assembly is laid on the fixed frame along a first direction, and the transverse movement frame can be slidably arranged on the guide assembly. The fixed end of the transverse movement driving member is connected to the fixed frame, and the driving end of the transverse movement driving member is connected to the transverse movement frame to drive the transverse movement frame to reciprocate on the guide assembly.
6. The rolling mechanism for wafer film bonding according to claim 5, characterized in that: The pressure regulating device adopts a pressure regulating valve, which is arranged on one side of the fixing frame. The pressure regulating valve is configured to adjust the pressure when the downward pressure of the rolling roller is too large to ensure that the downward pressure value of the rolling roller is constant.
7. The rolling mechanism for wafer film bonding according to claim 5, characterized in that: A drag chain is arranged on one side of the fixing frame.