Electroplating nozzle and electroplating device

Abstract

The utility model relates to an electroplating nozzle and an electroplating device, and belongs to the technical field of electroplating. The electroplating nozzle comprises a nozzle body and an anode body, a containing cavity is formed in the spray head body, a liquid outlet is formed in the spray head body, and the liquid outlet communicates with the containing cavity; at least part of the anode body is arranged in the containing cavity, and an annular spraying gap is defined by the anode body and the sprayer body. The annular spraying gap is communicated with the liquid outlet, and the sectional dimension of at least part of the nozzle body is gradually reduced in the spraying direction of the liquid outlet. According to the electroplating nozzle provided by the invention, the effect of gathering the electroplating liquid to the liquid outlet can be achieved by utilizing the annular spraying gap, so that the electroplating liquid flows more smoothly, the flow speed of the electroplating liquid is increased, and the electroplating efficiency is improved. And moreover, the flow path of the electroplating liquid can be limited through the annular spraying gap, so that the electroplating liquid is uniformly distributed on the periphery of the anode body, the flow speed of the electroplating liquid is more uniform, and the electroplating quality is improved.

Description

Technical Field

[0001] The present application relates to the field of electroplating technology, and in particular to an electroplating nozzle and an electroplating device. Background Art

[0002] Electroplating is a method of forming a coating by coating a specific material on the surface of the workpiece using the principle of electrolysis. In the electroplating process, the coating material or other insoluble material is generally used as the anode, the workpiece is used as the cathode, and the solution containing the cations of the coating material is used as the electroplating solution. The cations of the coating material are reduced on the surface of the workpiece to form a coating through the action of electric current.

[0003] At present, the plating solution is often added to the anode and cathode areas through a nozzle. However, the use of a nozzle to add the plating solution is prone to uneven contact between the plating solution and various parts of the anode, resulting in uneven plating solution flow rates at various parts of the anode surface. It may also cause the plating solution to be too dispersed on the surface of the workpiece to be plated, making it difficult to confine the plating solution to the area to be plated on the surface of the workpiece to be plated, resulting in plating solution loss. Especially in the scenario of high-speed electroplating, using the above-mentioned traditional nozzle to add the plating solution will not only affect the quality of electroplating, but also make the flow of the plating solution from the anode to the cathode not smooth, and the flow rate of the plating solution is limited, affecting the electroplating efficiency. Utility Model Content

[0004] The present application provides an electroplating nozzle and an electroplating device to solve at least part of the technical problems in the existing electroplating process, such as uneven distribution of electroplating solution, easy loss of electroplating solution, limited flow rate, and impact on electroplating quality and electroplating efficiency.

[0005] According to one aspect of the present application, there is provided an electroplating nozzle, comprising a nozzle body and an anode body; the nozzle body is formed with a accommodating cavity, the nozzle body is provided with a liquid outlet, and the liquid outlet is connected to the accommodating cavity; at least a portion of the anode body is arranged in the accommodating cavity and forms an annular injection gap with the nozzle body; the annular injection gap is connected to the liquid outlet, and the cross-sectional size of at least a portion of the nozzle body is gradually reduced along the injection direction of the liquid outlet.

[0006] According to the electroplating nozzle provided by the embodiment of the present application, an annular injection gap is formed between the anode body and the inner wall of the nozzle body, and the electroplating liquid can flow into the annular injection gap and be sprayed out from the liquid outlet through the annular injection gap. Since the cross-sectional dimensions of at least part of the nozzle body are gradually reduced along the injection direction of the liquid outlet, it is beneficial to tilt the annular injection gap relative to the liquid outlet, and the annular injection gap can play a role in converging the electroplating liquid to the liquid outlet, so that the flow of the electroplating liquid is smoother, which is beneficial to increase the flow rate of the electroplating liquid, thereby improving the electroplating efficiency. In addition, the flow path of the electroplating liquid can be restricted by the annular injection gap, so that the electroplating liquid is evenly distributed around the anode body, thereby making the flow rate of the electroplating liquid more uniform, which is beneficial to improve the electroplating quality.

[0007] In order to make the distribution of the plating liquid more uniform, the structural form of the plating nozzle can be further optimized. In a further preferred scheme, the annular injection gap includes a first annular injection gap and a second annular injection gap, the width of the second annular injection gap is not less than the width of the first annular injection gap, the first annular injection gap is arranged between the second annular injection gap and the liquid outlet, the second annular injection gap is connected to the first annular injection gap, and the first annular injection gap is connected to the liquid outlet. Thus, before the plating liquid enters the first annular injection gap, the plating liquid will first flow through the second annular injection gap, and the distribution of the plating liquid will be preliminarily adjusted through the second annular injection gap, so that the flow rate of the plating liquid is increased and the distribution is more uniform.

[0008] In a further preferred embodiment, the extension direction of the second annular injection slit coincides with the extension direction of the first annular injection slit; or the extension direction of the second annular injection slit is parallel to the central axis of the liquid outlet. In this case, the electroplating liquid can flow more smoothly from the second annular injection slit into the first annular injection slit, so as to increase the flow rate of the electroplating liquid and thus improve the electroplating efficiency.

[0009] In a further preferred embodiment, the extension direction of the first annular injection slit is arranged to intersect with the injection direction of the liquid outlet. At this time, the first annular injection slit is arranged to be inclined relative to the liquid outlet, so that the electroplating liquid can be gathered to the liquid outlet by the first annular injection slit, so that the electroplating liquid flows more smoothly, thereby improving the flow rate of the electroplating liquid and the electroplating efficiency.

[0010] Furthermore, the structural form of the nozzle body itself can also be optimized. In an optional scheme, the nozzle body includes a nozzle front section, a nozzle middle section and a nozzle end section connected in sequence along the injection direction, and the nozzle front section, the nozzle middle section and the nozzle end section together form the accommodating cavity: the nozzle front section and the anode body together form a cache channel, and the nozzle end section is provided with the liquid outlet. After the nozzle body is configured to include the nozzle front section, the nozzle middle section and the nozzle end section, the cache channel formed by the nozzle front section and the anode body can be used to store the electroplating liquid, so as to continuously supply the electroplating liquid to the second annular injection gap and the first annular injection gap, thereby facilitating the maintenance of the electroplating efficiency.

[0011] In addition to the structural form of the electroplating nozzle, the size of the electroplating nozzle will also affect the electroplating efficiency and electroplating quality. In some optional schemes, the width of the first annular injection gap is greater than 10μm and less than or equal to 1000μm. In some optional schemes, the caliber of the liquid outlet is 10μm-1000μm. By controlling the size of the electroplating nozzle within the above-mentioned appropriate range, it is beneficial to further improve the electroplating quality and electroplating efficiency.

[0012] In a further preferred embodiment, at least part of the cross-sectional dimensions of the annular spraying gap are gradually reduced along the spraying direction of the liquid outlet. In this way, the annular spraying gap can be used to gather the electroplating liquid at the liquid outlet, so as to increase the flow rate of the electroplating liquid, and at the same time, it is beneficial to spray the electroplating liquid through the liquid outlet into the area to be electroplated on the surface of the workpiece to be plated, thereby playing the role of localized electroplating.

[0013] Furthermore, the structural form of the anode body itself can also be optimized. In some optional schemes, the nozzle body is surrounded by an opening; the anode body includes an anode body, a cover body and a connecting column, the cover body is used to block the opening and is provided with a liquid inlet, the anode body protrudes from one side of the cover body in the injection direction and is accommodated in the accommodating cavity, and the connecting column protrudes from the other side of the cover body in the injection direction and is used to connect the positive pole of the power supply. Thus, the entire anode body and the nozzle body can be assembled by connecting the cover body to the nozzle body, and the power supply is connected by using the connecting column, and the anode body cooperates with the electroplating solution and the workpiece to be plated to carry out the electroplating process. It can be seen that the anode body is set to include an anode body, a cover body and a connecting column, which is convenient for manufacturing and installation, and is conducive to reducing manufacturing costs and improving installation efficiency.

[0014] According to another aspect of the present application, an electroplating device is provided, comprising a power supply and any of the above electroplating nozzles, wherein the positive electrode of the power supply is connected to the anode body, and the negative electrode of the power supply is connected to the workpiece to be plated, so as to electroplate the workpiece to be plated. Due to the use of the above electroplating nozzle, the electroplating nozzle can increase the flow rate of the electroplating solution and make the distribution of the electroplating solution more uniform, thereby facilitating improving the electroplating efficiency and electroplating quality of the electroplating device.

[0015] In summary, the electroplating nozzle and electroplating device provided in the present application have at least the following beneficial effects:

[0016] According to the electroplating nozzle provided by the embodiment of the present application, an annular injection gap is formed between the anode body and the inner wall of the nozzle body, and the electroplating liquid can flow into the annular injection gap and be sprayed out from the liquid outlet through the annular injection gap. Since the cross-sectional dimensions of at least part of the nozzle body are gradually reduced along the injection direction of the liquid outlet, it is beneficial to tilt the annular injection gap relative to the liquid outlet, and the annular injection gap can play a role in converging the electroplating liquid to the liquid outlet, so that the flow of the electroplating liquid is smoother, which is beneficial to increase the flow rate of the electroplating liquid, thereby improving the electroplating efficiency. In addition, the flow path of the electroplating liquid can be restricted by the annular injection gap, so that the electroplating liquid is evenly distributed around the anode body, thereby making the flow rate of the electroplating liquid more uniform, which is beneficial to improve the electroplating quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the specific implementation of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific implementation or the prior art description. Obviously, the drawings described below are some implementations of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A schematic diagram of the overall structure of the electroplating nozzle provided in an embodiment of the present application;

[0019] Figure 2 is a schematic cross-sectional structural diagram of an electroplating nozzle provided in an embodiment of the present application;

[0020] Figure 3 A schematic cross-sectional view of an electroplating nozzle provided in another embodiment of the present application;

[0021] Figure 4 for Figure 3 Schematic diagram of the enlarged structure of part A.

[0022] The reference numerals are as follows:

[0023] 100. Electroplating nozzle;

[0024] 110, nozzle body; 111, nozzle front section; 112, nozzle middle section; 113, nozzle end section; 114, accommodating chamber; 115, liquid outlet; 116, opening;

[0025] 120, anode body; 121, anode body; 122, cover body; 123, connecting column; 124, liquid inlet;

[0026] 130, first annular injection gap;

[0027] 140, second annular injection gap;

[0028] 150. Cache channel. DETAILED DESCRIPTION

[0029] In the description of the present application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear to indicate the orientation or position relationship, unless otherwise specified, they are understood to be based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application.

[0030] In addition, if there is a feature defined as "first" or "second", it is only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Features defined as "first" or "second" may explicitly or implicitly include at least one of the defined features. If there is a description of "plurality", the general meaning is to include at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0031] In this application, unless otherwise clearly specified and limited, the terms such as "installed", "connected", "connected", "fixed" and so on should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection, it can be a direct connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0032] In the description of this specification, if the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" appear, it means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0033] According to an embodiment of the present application, an electroplating device is provided, and the electroplating device is used to electroplating a coating on a workpiece to be plated, wherein the workpiece to be plated may be a mechanical part, an electronic part, a handicraft, etc. Based on the type of workpiece to be plated, the electroplating device can be used to electroplatingly form a protective layer on the surface of mechanical parts such as medical devices and packaging shells, and can also be used to plate copper on electronic parts such as printed circuit boards to improve conductivity and increase mechanical strength, and can also be used to electroplatingly form a decorative layer on the surface of handicrafts, etc., and can also be used to electroplatingly form grid lines on solar cells.

[0034] The electroplating device includes a power supply and an electroplating nozzle 100, wherein the positive electrode of the power supply is connected to the anode body 120 of the electroplating nozzle 100, and the negative electrode of the power supply is connected to the workpiece to be plated, so as to electroplate the workpiece. The electroplating device of the embodiment of the present application adopts the electroplating nozzle 100, and based on the structural design of the electroplating nozzle 100 itself, the flow rate of the electroplating solution during the electroplating process can be increased and the distribution of the electroplating solution can be made more uniform, thereby facilitating improving the electroplating efficiency and electroplating quality of the electroplating device.

[0035] Figure 1 A schematic diagram of the overall structure of the electroplating nozzle provided in an embodiment of the present application; Figure 2 is a schematic cross-sectional structural diagram of an electroplating nozzle provided in an embodiment of the present application; Figure 3 A schematic cross-sectional view of an electroplating nozzle provided in another embodiment of the present application; Figure 4 for Figure 3 Schematic diagram of the enlarged structure of part A.

[0036] Please refer to Figures 1 to 4 The electroplating nozzle 100 provided in the embodiment of the present application at least includes a nozzle body 110 and an anode body 120 .

[0037] The nozzle body 110 forms the outer profile of the electroplating nozzle 100, and a receiving chamber 114 for receiving the electroplating liquid is formed therein. The nozzle body 110 is also provided with a liquid outlet 115, which is connected to the receiving chamber 114, and is used to discharge the electroplating liquid in the receiving chamber 114, and allows the electroplating liquid to contact the workpiece to be plated to form a plating layer on the workpiece to be plated.

[0038] Exemplarily, the liquid outlet 115 can be a cylindrical through hole, and the two ends of the liquid outlet 115 are respectively connected to the accommodating cavity 114 and the external environment of the nozzle body 110. It should be understood that in addition to the case shown in the drawings, the liquid outlet 115 can also be a rectangular through hole, a triangular through hole, an elliptical through hole, etc.

[0039] The anode body 120 is used to electrically connect to the positive electrode of the power supply. At least part of the anode body 120 is disposed in the accommodating cavity 114 of the nozzle body 110 and there is a gap between the anode body 120 and the nozzle body 110, so that at least part of the anode body 120 and the nozzle body 110 form an annular injection gap. Specifically, when the anode body 120 is placed in the accommodating cavity 114, an annular injection gap is formed between the outer wall of the anode body 120 and the inner wall of the nozzle body 110, and the annular injection gap is roughly annular and surrounds the outer circumference of the anode body 120.

[0040] The annular injection gap between the anode body 120 and the nozzle body 110 is actually a part of the accommodating cavity 114 . The annular injection gap is connected to the liquid outlet 115 . The cross-sectional dimensions of at least part of the nozzle body 110 are gradually reduced along the injection direction of the liquid outlet 115 .

[0041] Exemplarily, the spraying direction of the liquid outlet 115 may be in the vertical direction, that is, the direction of gravity, so that the electroplating liquid can flow out through the liquid outlet 115 by its own gravity, which is beneficial to increase the flow rate of the electroplating liquid.

[0042] Through the above structural design, when the electroplating nozzle 100 is used for electroplating operation, the electroplating liquid needs to be injected into the accommodating cavity 114 of the nozzle body 110, and the electroplating liquid can flow into the annular injection gap and be ejected from the liquid outlet 115 through the annular injection gap. Since the cross-sectional dimensions of at least part of the nozzle body 110 are gradually reduced along the injection direction of the liquid outlet 115, it is beneficial to tilt the annular injection gap relative to the liquid outlet 115, and the annular injection gap can play a role in converging the electroplating liquid to the liquid outlet 115, so that the electroplating liquid flows more smoothly, which is beneficial to increase the flow rate of the electroplating liquid, thereby improving the electroplating efficiency. In addition, the flow path of the electroplating liquid can be restricted by the annular injection gap, so that the electroplating liquid is evenly distributed around the anode body 120, ensuring that the flow rate of the electroplating liquid at various locations around the liquid outlet 115 is as close as possible, so that the flow rate of the electroplating liquid is more uniform, which is beneficial to improve the uniformity of electroplating and ensure the quality of electroplating. It can be seen that the electroplating nozzle 100 provided in the embodiment of the present application can be applicable to high-speed electroplating equipment and has good prospects in practical applications.

[0043] As a further preferred implementation scheme, based on the above scheme, the specific embodiments of the present application may also include one or more of the following additions or combinations.

[0044] In order to make the electroplating liquid more evenly distributed, the structure of the electroplating nozzle 100 may be further optimized.

[0045] In some optional embodiments, the annular injection gap includes a first annular injection gap 130 and a second annular injection gap 140, that is, the anode body 120 is arranged to form a first annular injection gap 130 and a second annular injection gap 140 with the nozzle body 110. The width of the second annular injection gap 140 is not less than the width of the first annular injection gap 130, the first annular injection gap 130 is arranged between the second annular injection gap 140 and the liquid outlet 115, the second annular injection gap 140 is connected to the first annular injection gap 130, and the first annular injection gap 130 is connected to the liquid outlet 115. The flow rate and distribution of the electroplating solution can be preliminarily adjusted through the second annular injection gap 140, which is conducive to further increasing the flow rate of the electroplating solution and making the electroplating solution more evenly distributed.

[0046] Specifically, when the anode body 120 is placed in the accommodating cavity 114, in the direction from far to near the liquid outlet 115, a second annular injection gap 140 and a first annular injection gap 130 are sequentially formed between the outer wall of the anode body 120 and the inner wall of the nozzle body 110, and the second annular injection gap 140 and the first annular injection gap 130 are both roughly annular and surround the outer periphery of the anode body 120. Therefore, by sequentially arranging the first annular injection gap 130 and the second annular injection gap 140, before the electroplating solution enters the first annular injection gap 130, the electroplating solution will first flow through the second annular injection gap 140, and the distribution of the electroplating solution is preliminarily adjusted through the second annular injection gap 140, so that the distribution of the electroplating solution is more uniform, which is conducive to improving the quality of electroplating.

[0047] Furthermore, the width of the second annular injection slit 140 is not less than the width of the first annular injection slit 130, wherein the width is the distance between the outer wall of the anode body 120 and the inner wall of the nozzle body 110. In particular, when the width of the second annular injection slit 140 is greater than the width of the first annular injection slit 130, the flow rate of the electroplating solution will increase after the electroplating solution flows from the second annular injection slit 140 into the first annular injection slit 130, which is beneficial to improve the electroplating efficiency.

[0048] In some optional embodiments, the extension direction of the first annular injection gap 130 is arranged to intersect with the injection direction of the liquid outlet 115. Figure 3 and Figure 4 , from the perspective of the figure, the direction b is the extension direction of the first annular injection slit 130, the direction a is the injection direction of the liquid outlet 115, that is, the direction in which the plating solution flows out from the liquid outlet 115, and the directions b and a are arranged to intersect, that is, the extension direction of the first annular injection slit 130 is arranged obliquely relative to the injection direction of the liquid outlet 115. At this time, it is convenient to use the first annular injection slit 130 to gather the plating solution to the liquid outlet 115, so that the plating solution flows more smoothly, thereby improving the flow rate of the plating solution and the electroplating efficiency, and playing a role in localized deposition.

[0049] In some optional embodiments, the extension direction of the second annular injection gap 140 coincides with the extension direction of the first annular injection gap 130. Figure 2The extension direction of the second annular injection gap 140 can be the same as the extension direction of the first annular injection gap 130. At this time, the connection between the second annular injection gap 140 and the first annular injection gap 130 is smoothly transitioned, and the extension direction of the second annular injection gap 140 and the extension direction of the first annular injection gap 130 are both arranged to intersect with the injection direction of the liquid outlet 115, so that the plating liquid can flow more smoothly from the second annular injection gap 140 to the first annular injection gap 130, so as to increase the flow rate of the plating liquid, thereby improving the electroplating efficiency.

[0050] It is understandable that the extension direction of the second annular injection slit 140 may not be parallel to the extension direction of the first annular injection slit 130 .

[0051] In some other optional embodiments, the extension direction of the second annular injection gap 140 is parallel to the central axis of the liquid outlet 115. Figure 3 and Figure 4 The extension direction of the second annular injection gap 140 and the central axis of the liquid outlet 115 are both in the vertical direction, that is, the direction of gravity. Therefore, when the electroplating liquid enters the second annular injection gap 140, it can rely on its own gravity to flow through the second annular injection gap 140 quickly, which helps to increase the flow rate of the electroplating liquid and thus improve the electroplating efficiency.

[0052] Furthermore, the structure of the nozzle body 110 itself can be optimized.

[0053] In some optional embodiments, the nozzle body 110 includes a nozzle front section 111, a nozzle middle section 112 and a nozzle end section 113 connected in sequence along the injection direction, and the nozzle front section 111, the nozzle middle section 112 and the nozzle end section 113 together form a receiving chamber 114: the nozzle front section 111 and the anode body 120 together form a cache channel 150, the nozzle end section 113 is provided with a liquid outlet 115 and together with the anode body 120, forms a first annular injection gap 130, and the nozzle middle section 112 and the anode body 120 together form a second annular injection gap 140. Since the internal volume of the cache channel 150 is relatively large, it can store an appropriate amount of electroplating solution, which facilitates the continuous supply of electroplating solution into the second annular injection gap 140 and the first annular injection gap 130, thereby avoiding large fluctuations in the flow rate of the electroplating solution, which is conducive to maintaining a stable flow rate of the electroplating solution, thereby ensuring the quality and efficiency of electroplating.

[0054] In some optional embodiments, the cross-sectional dimensions of the nozzle end section 113 are gradually tapered along the injection direction, that is, the cross-sectional area of ​​the nozzle end section 113 on the horizontal plane gradually decreases along the injection direction, which is conducive to forming a first annular injection gap 130 between the nozzle end section 113 and the anode body 120 that intersects with the injection direction of the liquid outlet 115.

[0055] For example, refer to Figure 3 A cache channel 150 is formed between the nozzle front section 111 and the anode body 120, wherein the nozzle front section 111 is in the shape of a hollow cylinder, and the corresponding anode body 120 is in the shape of a solid cylinder, so that the cache channel 150 is a hollow cylindrical cavity surrounding the outer periphery of the anode body 120. A second annular injection gap 140 is formed between the nozzle middle section 112 and the anode body 120, wherein the nozzle middle section 112 is in the shape of a hollow cylinder, and the corresponding anode body 120 is in the shape of a solid cylinder, so that the second annular injection gap 140 is a hollow cylindrical cavity surrounding the outer periphery of the anode body 120, and the radial dimension of the second annular injection gap 140 is smaller than the radial dimension of the cache channel 150. The first annular injection gap 130 is formed between the nozzle end section 113 and the anode body 120, wherein the nozzle end section 113 is in the shape of a hollow cone, and the corresponding anode body 120 is in the shape of a solid cone, so that the first annular injection gap 130 is a hollow cone-shaped cavity surrounding the outer periphery of the anode body 120. The liquid outlet 115 is arranged at the bottom end of the first annular injection gap 130. Thus, by designing the structure of the nozzle body 110 as described above, the electroplating solution can flow quickly and evenly through the first annular injection gap 130, so as to improve the flow rate and distribution uniformity of the electroplating solution, thereby improving the electroplating efficiency and electroplating quality. In addition, setting the first annular injection gap 130 in a cone shape reduces the difficulty of processing, and also makes the electroplating solution flow more smoothly, which can effectively prevent the problem of liquid accumulation at the liquid outlet 115. At the same time, since the first annular injection gap 130 and the corresponding anode body 120 are both conical, the end of the anode body 120 can be as close to the liquid outlet 115 as possible, so that the anode body 120 can be as close to the surface of the workpiece to be plated as possible during the electroplating process, so as to constrain the electric field lines, realize confined electroplating, and reduce the loss of electroplating solution.

[0056] In addition to the structural form of the electroplating nozzle 100 , the size of the electroplating nozzle 100 will also affect the electroplating efficiency and electroplating quality.

[0057] In some optional embodiments, the width of the first annular injection slit 130 is greater than 10 μm and less than or equal to 1000 μm, preferably 20 μm-1000 μm. For example, the width of the first annular injection slit 130 can be 11 μm, 15 μm, 20 μm, 30 μm, 40 μm, 50 μm, 80 μm, 100 μm, 200 μm, 500 μm, 800 μm, 1000 μm or any value greater than 10 μm and less than or equal to 1000 μm. Under the above-mentioned suitable width range, the electroplating solution can effectively increase the flow rate after passing through the first annular injection slit 130, which is conducive to improving the electroplating efficiency.

[0058] In some optional embodiments, the caliber of the liquid outlet 115 is 10 μm-1000 μm. For example, the caliber of the liquid outlet 115 can be 10 μm, 15 μm, 20 μm, 30 μm, 40 μm, 50 μm, 80 μm, 100 μm, 200 μm, 500 μm, 800 μm, 1000 μm or any value between 10 μm-1000 μm. Exemplarily, the liquid outlet 115 can be a substantially cylindrical through hole, and the caliber of the liquid outlet 115 is the diameter of the cylindrical through hole. By controlling the diameter of the liquid outlet 115 to be equivalent to the width of the first annular jet gap 130, it is beneficial to guide the electroplating liquid in the first annular jet gap 130 to flow smoothly into the liquid outlet 115 and out through the liquid outlet 115, thereby improving the electroplating efficiency. It can also play a role in constraining and optimizing the electric field lines, so as to help control the line shape of the electric field lines, thereby improving the electroplating forming accuracy, which is particularly suitable for high-speed fine electroplating scenarios.

[0059] Furthermore, in a further optional embodiment, the diameter of the liquid outlet 115 is not greater than the width of the first annular injection gap 130. In this case, the flow rate of the electroplating solution can be further increased through the liquid outlet 115, so as to improve the electroplating efficiency.

[0060] When the electroplating nozzle 100 is used for electroplating, the distance between the liquid outlet 115 and the workpiece to be plated will also affect the electroplating effect. In some optional embodiments, the distance between the liquid outlet 115 and the workpiece to be plated is set to 10μm-1000μm. For example, the distance between the liquid outlet 115 and the workpiece to be plated can be 10μm, 15μm, 20μm, 30μm, 40μm, 50μm, 80μm, 100μm, 200μm, 500μm, 800μm, 1000μm or any value between 10μm-1000μm. By controlling the distance between the liquid outlet 115 and the workpiece to be plated within the above-mentioned appropriate range, the electroplating liquid flowing out of the liquid outlet 115 can be confined to a certain area on the surface of the workpiece to be plated, which is the diffusion range of the electroplating liquid on the surface of the workpiece to be plated, that is, the area to be electroplated. Moreover, at this time, the distance between the anode body 120 and the surface of the workpiece to be plated is appropriate, so that the electric field lines can be constrained, and then the area where electroplating occurs on the surface of the workpiece to be plated can be constrained, which is conducive to fine electroplating in the area to be plated on the surface of the workpiece to be plated. In addition, under the above-mentioned smaller spacing range, since the flow rate of the electroplating solution is also faster, the current density will be larger, thereby reducing the loss of liquid, and realizing electroplating operation at a larger current density. At the same time, due to the oxygen evolution at the anode, a large number of positively charged ions will remain, which can be quickly migrated to the cathode through the electroplating solution flow, that is, the electroplated workpiece and the surplus negatively charged ions are neutralized, thereby weakening the influence of the electric field.

[0061] In some optional embodiments, at least part of the cross-sectional dimensions of the annular spraying slit are gradually reduced along the spraying direction of the liquid outlet 115. Exemplarily, the cross-sectional dimensions of the first annular spraying slit 130 are gradually reduced along the spraying direction of the liquid outlet 115, so that the first annular spraying slit 130 can be used to gather the electroplating liquid at the liquid outlet 115, so as to increase the flow rate of the electroplating liquid, and at the same time, it is beneficial to spray the electroplating liquid into the to-be-plated area on the surface of the to-be-plated workpiece through the liquid outlet 115, so as to play a role in localized electroplating.

[0062] Furthermore, the structure of the anode body 120 itself can be optimized.

[0063] In some optional embodiments, the nozzle body 110 is surrounded by an opening 116; the anode body 120 includes an anode body 121, a cover 122 and a connecting column 123, the cover 122 is used to block the opening 116 and is provided with a liquid inlet 124, the anode body 121 protrudes from one side of the cover 122 in the injection direction and is accommodated in the accommodating cavity 114, and the connecting column 123 protrudes from the other side of the cover 122 in the injection direction and is used to connect the positive pole of the power supply. Thus, the entire anode body 120 and the nozzle body 110 can be assembled by connecting the cover 122 to the nozzle body 110, and the power supply is connected by using the connecting column 123, and the anode body 121 cooperates with the electroplating solution and the workpiece to be plated to carry out the electroplating process. It can be seen that the anode body 120 is set to include the anode body 121, the cover 122 and the connecting column 123, which is convenient for manufacturing and installation, and is conducive to reducing manufacturing costs and improving installation efficiency.

[0064] For example, refer to Figure 1 and Figure 2 , Figure 3 , the anode body 120 runs through the entire nozzle body 110. Specifically, one end of the anode body 121 is connected to the cover body 122, and the other end extends into the bottom of the accommodating cavity 114. The cover body 122 is a roughly circular structure, which is used to connect with the opening 116 on the nozzle body 110 and block the opening 116 to prevent the electroplating solution in the accommodating cavity 114 from leaking from the opening 116. A liquid inlet 124 is provided on the cover body 122, and the liquid inlet 124 can be, for example, a circular through hole, for allowing the electroplating solution to be injected into the accommodating cavity 114. The connecting column 123 is arranged on the side of the cover body 122 away from the anode body 121 and protrudes from the surface of the cover body 122. The connecting column 123 can be connected to the positive pole of the power supply through a wire. Among them, the anode body 121, the cover body 122 and the connecting column 123 can be integrally formed, or separately formed and connected as a whole by welding or the like. Therefore, when assembling the nozzle body 110 and the anode body 120 , the entire anode body 120 can be installed by simply connecting the cover body 122 to the opening 116 of the nozzle by welding or the like, and the installation efficiency is high.

[0065] It is understandable that in other optional embodiments, the liquid inlet 124 may not be disposed on the cover 122. For example, the liquid inlet 124 may also be disposed on the nozzle body 110, and the electroplating solution may be injected into the accommodating chamber 114 through the liquid inlet 124.

[0066] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Those skilled in the art can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. An electroplating nozzle, characterized in that: It includes a nozzle body and an anode body; The nozzle body is formed with a receiving cavity, and the nozzle body is provided with a liquid outlet, and the liquid outlet is communicated with the receiving cavity; At least part of the anode body is disposed in the accommodating cavity and forms an annular injection gap with the nozzle body; The annular injection gap is connected to the liquid outlet, and the cross-sectional dimensions of at least part of the nozzle body are gradually reduced along the injection direction of the liquid outlet.

2. The electroplating nozzle according to claim 1, characterized in that: The annular injection gap includes a first annular injection gap and a second annular injection gap, the width of the second annular injection gap is not less than the width of the first annular injection gap, the first annular injection gap is arranged between the second annular injection gap and the liquid outlet, the second annular injection gap is connected to the first annular injection gap, and the first annular injection gap is connected to the liquid outlet.

3. The electroplating nozzle according to claim 2, characterized in that: The extension direction of the second annular injection slit coincides with the extension direction of the first annular injection slit; or An extension direction of the second annular injection gap is parallel to a central axis of the liquid outlet.

4. The electroplating nozzle according to claim 3, characterized in that: The extension direction of the first annular spraying gap is arranged to intersect with the spraying direction of the liquid outlet.

5. The electroplating nozzle according to claim 2, characterized in that: The nozzle body comprises a nozzle front section, a nozzle middle section and a nozzle end section which are sequentially connected along the spraying direction, and the nozzle front section, the nozzle middle section and the nozzle end section together form the accommodating cavity: The front section of the nozzle and the anode body together form a buffer channel, and the rear section of the nozzle is provided with the liquid outlet.

6. The electroplating nozzle according to any one of claims 2 to 5, characterized in that: The width of the first annular injection gap is greater than 10 μm and less than or equal to 1000 μm.

7. The electroplating nozzle according to any one of claims 1 to 5, characterized in that: The diameter of the liquid outlet is 10 μm-1000 μm.

8. The electroplating nozzle according to any one of claims 1 to 5, characterized in that: The cross-sectional dimensions of at least part of the annular injection gap are gradually reduced along the injection direction of the liquid outlet.

9. The electroplating nozzle according to any one of claims 1 to 5, characterized in that: The nozzle body is surrounded by an opening; The anode body includes an anode body, a cover body and a connecting column, wherein the cover body is used to seal the opening and is provided with a liquid inlet, the anode body protrudes from one side of the cover body in the injection direction and is accommodated in the accommodating cavity, and the connecting column protrudes from the other side of the cover body in the injection direction and is used to connect the positive pole of the power supply.

10. An electroplating device, characterized in that: It comprises a power source and the electroplating nozzle according to any one of claims 1 to 9, wherein the positive pole of the power source is connected to the anode body, and the negative pole of the power source is connected to the workpiece to be plated, so as to electroplate the workpiece to be plated.

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