Test equipment for semiconductor detection
By designing a test equipment for semiconductor detection and using sensor detectors and X-ray sensors to perform multiple detection, the problem of inefficient detection in the prior art is solved, and more efficient and accurate detection is achieved.
Patent Information
- Application Number
- CN202420875434.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-25
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-04-25
AI Technical Summary
The prior art cannot conduct all-round inspections and cannot perform multiple functions simultaneously, resulting in insufficiency of detection.
A testing equipment for semiconductor detection is designed to perform fixed detection of semiconductors through the movement of the pressure plate, and combined with a sensor detector, a microdetector and an X-ray sensor to achieve multiple detection and improve detection efficiency.
Multiple detection of semiconductors is realized, detection efficiency is improved, detection data is more accurate, and operation is simple and convenient.
Smart Images

Figure CN222461523U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of detection equipment, in particular to a test equipment for semiconductor detection. Background Art
[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous. Most electronic products, such as computers, mobile phones or digital recorders, have a very close relationship with semiconductors in their core units. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential semiconductor material in various applications.
[0003] In the existing document 202320359092.7, the product cannot be fully tested, and multiple functions cannot be tested during testing. Different equipment needs to be replaced during testing, which greatly reduces the detection efficiency. Therefore, the utility model proposes a test equipment for semiconductor testing to solve the problems existing in the prior art. Utility Model Content
[0004] In view of the above problems, the purpose of the utility model is to propose a test equipment for semiconductor detection, which performs fixed detection on the semiconductor by moving the pressure plate. The operation is simple and convenient, which improves the work efficiency to a certain extent. The utility model is provided with a sensor detector, a microscope detector and an X-ray sensor, which is beneficial for first detecting through the sensor detector during inspection, and then detecting again through the photosensitive sensor before data transmission, so that semiconductor problems can be detected more intuitively.
[0005] To achieve the purpose of the utility model, the utility model is implemented through the following technical solutions: a test equipment for semiconductor detection, including a box body, a detection box and a detection component, the detection box is fixedly installed on the top of the box body, and the detection component is movably installed inside the detection box. The semiconductor is placed inside the detection box and tested by the detection component. The detection component includes a detection table, a detection box, a first cylinder, a sensor detector, a second cylinder and a photosensitive sensor. The detection table is rotatably installed inside the detection box, the detection boxes are fixedly installed on both sides of the top of the detection table, and a semiconductor is placed inside the detection box. The first cylinder is fixedly installed on one side of the top of the detection box, and the output end of the first cylinder is connected to the sensor detector. The second cylinder is fixedly installed on the other side of the top of the detection box, and the output end of the second cylinder is connected to the photosensitive sensor. The first cylinder and the second cylinder are arranged on the same horizontal plane, and the sensor detector and the photosensitive sensor are arranged directly above the detection box.
[0006] A further improvement is that a rotating motor is fixedly installed inside the box, and the output end of the rotating motor is connected to the detection platform.
[0007] A further improvement is that a rotating column is rotatably mounted on one side of the detection box, a fixing plate is movably mounted on the inner side of the detection box, and a placement opening is opened on one side of the detection box.
[0008] A further improvement is that an alarm is fixedly installed on the top of the detection box, and a telescopic wire is connected to the outside of the alarm, and the telescopic wire is electrically connected to the sensor detector and the photosensitive sensor respectively.
[0009] A further improvement is that a ventilation hole is provided on one side of the detection box, mounting grooves are provided on both sides of the interior of the detection box, and fans are fixedly installed inside the mounting grooves.
[0010] A further improvement is that sliding blocks are fixedly installed on both sides of the detection platform, and sliding grooves are opened on both sides of the inside of the detection box, and the sliding grooves and the sliding blocks are adapted to each other.
[0011] A further improvement is that a box door is movably mounted on the front of the detection box, and a handle is fixedly mounted on the front of the box door.
[0012] The beneficial effects of the utility model are as follows: the utility model performs fixed detection of semiconductors by moving the pressure plate, and the operation is simple and convenient, which improves the work efficiency to a certain extent. The utility model is provided with a sensor detector, a microscope detector and an X-ray sensor, which is beneficial to first detect through the sensor detector during inspection, and then detect again through the light sensor before data transmission, so that problems with semiconductors can be detected more intuitively. Multiple detections are set on the same device, which greatly improves the detection efficiency and makes the detection data more accurate. The utility model is provided with a fan and a vent, which is beneficial to heat dissipation and ventilation when detecting semiconductor items, avoiding internal overheating affecting the detection, and making the data more accurate during detection. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor.
[0014] Figure 1 It is a front cross-sectional view of the utility model;
[0015] Figure 2 This is a front schematic diagram of the detection box of the utility model;
[0016] Figure 3 It is a schematic diagram of the detection box of the utility model.
[0017] Among them: 1. Box body; 2. Test box; 3. Test table; 4. Test box; 5. First cylinder; 6. Sensor detector; 7. Second cylinder; 8. Photo sensor; 9. Rotating motor; 10. Rotating column; 11. Fixing plate; 12. Placement opening; 13. Alarm; 14. Telescopic wire; 15. Ventilation opening; 16. Mounting slot; 17. Fan; 18. Slider; 19. Slide slot; 20. Box door; 21. Handle. DETAILED DESCRIPTION
[0018] The following will be combined with the drawings in the practical embodiment to clearly and completely describe the technical solution in the practical embodiment. Obviously, the described embodiment is only a part of the embodiment of the practical, not all of the embodiments. Based on the embodiment in the practical, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this practical.
[0019] In the description of this utility model, it should be noted that, unless otherwise clearly specified and limited, the terms installation, connection and connection should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0020] according to Figure 1 , Figure 2 , Figure 3 As shown, this embodiment provides a test device for semiconductor detection, including a box body 1, a detection box 2 and a detection component. The detection box 2 is fixedly installed on the top of the box body 1, and the detection component is movably installed inside the detection box 2. By placing the semiconductor inside the detection box 2, the detection component is used for testing. The detection component includes a detection table 3, a detection box 4, a first cylinder 5, a sensor detector 6, a second cylinder 7 and a photosensitive sensor 8. The detection table 3 is rotatably installed inside the detection box 2, and the detection boxes 4 are fixedly installed on both sides of the top of the detection table 3. A semiconductor is placed inside the detection box 4. By placing the semiconductor inside the detection box 4, the detection box 2 A first cylinder 5 is fixedly installed on one side of the top of the part, and the output end of the first cylinder 5 is connected to the sensor detector 6. After being fixed, the first cylinder 5 is driven to drive the sensor detector 6 to descend for detection. A second cylinder 7 is fixedly installed on the other side of the top of the detection box 2, and the output end of the second cylinder 7 is connected to the photosensitive sensor 8. The first cylinder 5 and the second cylinder 7 are arranged on the same horizontal plane, and the sensor detector 6 and the photosensitive sensor 8 are arranged directly above the detection box 4. After the photosensitive sensor 8 is driven to descend by the second cylinder 7, data is transmitted after the semiconductor is re-detected, and the problems of the semiconductor can be detected more intuitively, making the detected data more accurate.
[0021] A rotating motor 9 of model Y90S-2 is fixedly installed inside the box 1. The output end of the rotating motor 9 is connected to the detection table 3. The rotating motor 9 drives the detection table 3 to rotate, which facilitates the detection of the two groups of detection boxes 4 and greatly improves the detection efficiency.
[0022] A rotating column 10 is rotatably installed on one side of the detection box 2, and a fixed plate 11 is movably installed on the inner side of the detection box 2. The fixed plate 11 is moved by rotating the rotating column 10 to fix the semiconductor for subsequent detection. A placement port 12 is provided on one side of the detection box 2. The placement port 12 is provided to facilitate the placement and removal of semiconductors.
[0023] An alarm 13 is fixedly installed on the top of the detection box 2, and a telescopic wire 14 is connected to the outside of the alarm 13. The telescopic wire 14 is electrically connected to the sensor detector 6 and the photosensitive sensor 8 respectively. The setting of the alarm 13 is convenient for reporting the qualified status of the semiconductor.
[0024] A vent 15 is provided on one side of the detection box 2, and the interior of the detection box 2 is ventilated through the vent 15. Installation grooves 16 are provided on both sides of the interior of the detection box 2, and a fan 17 is fixedly installed on the inner side of the installation groove 16. The fan 17 is driven to dissipate heat for the semiconductor to prevent internal overheating from affecting the detection.
[0025] Slide blocks 18 are fixedly installed on both sides of the testing platform 3, and slide grooves 19 are opened on both sides of the inside of the testing box 2. The slide grooves 19 and the slide blocks 18 are adapted to each other. The setting of the slide blocks 18 and the slide grooves 19 facilitates the rotation of the testing platform 3.
[0026] A box door 20 is movably mounted on the front of the testing box 2, and a handle 21 is fixedly mounted on the front of the box door 20. The box door 20 can be opened by pulling the handle 21 to facilitate placing or taking out semiconductors for use.
[0027] When the semiconductor detection test equipment is used, the semiconductor is placed inside the detection box 2 and tested through the detection component. The semiconductor is placed inside the detection box 4 and then fixed. The first cylinder 5 is driven to drive the sensor detector 6 to descend for detection. The second cylinder 7 is driven to drive the photosensitive sensor 8 to descend. After the semiconductor is detected again, data is transmitted. The problem of the semiconductor can be detected more intuitively, and the detection data is more accurate. The detection table 3 is driven to rotate by the rotating motor 9 to facilitate the detection of the two groups of detection boxes 4, which greatly improves the detection efficiency. The movable rotating column 10 drives the fixed plate 11 to move to fix the semiconductor for subsequent testing. The placement port 12 is provided to facilitate the placement and removal of the semiconductor. The alarm 13 is provided to facilitate reporting on the qualified status of the semiconductor. The semiconductor is cooled by driving the fan 17. The interior of the test box 2 is ventilated through the vent 15 to prevent internal overheating from affecting the test. The slider 18 and the slide groove 19 are provided to facilitate the rotation of the test table 3. The handle 21 is pulled to open the box door 20 to facilitate the placement or removal of the semiconductor.
[0028] The above shows and describes the basic principles, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.
Claims
1. A semiconductor testing device, comprising a housing (1), a testing box (2) and a testing assembly, characterized in that: A detection box (2) is fixedly installed above the box body (1), and a detection assembly is movably installed inside the detection box (2), the detection assembly comprising a detection platform (3), a detection box (4), a first cylinder (5), a sensor detector (6), a second cylinder (7) and a photosensitive sensor (8). The detection platform (3) is rotatably installed inside the detection box (2), and detection boxes (4) are fixedly installed on both sides of the top of the detection platform (3). A semiconductor is placed inside the detection box (4). A first cylinder (5) is fixedly installed on one side of the top of the detection box (2), and the output end of the first cylinder (5) is connected to the sensor detector (6). A second cylinder (7) is fixedly installed on the other side of the top of the detection box (2), and the output end of the second cylinder (7) is connected to the photosensitive sensor (8). The first cylinder (5) and the second cylinder (7) are arranged on the same horizontal plane, and the sensor detector (6) and the photosensitive sensor (8) are arranged directly above the detection box (4).
2. A semiconductor testing device according to claim 1, characterized in that: A rotating motor (9) is fixedly installed inside the box (1), and the output end of the rotating motor (9) is connected to the detection platform (3).
3. A semiconductor testing device according to claim 1, characterized in that: A rotating column (10) is rotatably mounted on one side of the detection box (2), a fixed plate (11) is movably mounted on the inner side of the detection box (2), and a placement opening (12) is opened on one side of the detection box (2).
4. A semiconductor testing device according to claim 1, characterized in that: An alarm (13) is fixedly installed on the top of the detection box (2), and a telescopic wire (14) is connected to the outside of the alarm (13), and the telescopic wire (14) is electrically connected to the sensor detector (6) and the photosensitive sensor (8) respectively.
5. The semiconductor testing device according to claim 1, characterized in that: A ventilation opening (15) is provided on one side of the detection box (2), mounting grooves (16) are provided on both sides of the interior of the detection box (2), and a fan (17) is fixedly installed inside the mounting groove (16).
6. The semiconductor testing device according to claim 1, characterized in that: Slide blocks (18) are fixedly mounted on both sides of the detection platform (3), and slide grooves (19) are provided on both sides of the interior of the detection box (2), and the slide grooves (19) and the slide blocks (18) are adapted to each other.
7. The semiconductor testing device according to claim 1, characterized in that: A box door (20) is movably mounted on the front of the detection box (2), and a handle (21) is fixedly mounted on the front of the box door (20).
Citation Information
Patent Citations
Clamping tool for semiconductor detection
CN219590372U