Bonded multilayer guide plate unit, probe head, probe seat, probe card and detection system

Abstract

The utility model relates to a bonding type multi-layer guide plate unit, probe head, probe seat, probe card and detection system, bonding type multi-layer guide plate unit includes at least one probe area and at least one non-probe area, the probe area is used for the penetration of a plurality of probes, bonding type multi-layer guide plate unit includes a plurality of guide plates and at least one adhesive layer, each guide plate comprises at least one joint surface and a plurality of through holes positioned in the at least one probe area, probes penetrate through the through holes of the guide plates, the joint surfaces of the guide plates are mutually bonded by the at least one adhesive layer, and the at least one adhesive layer is completely positioned in the at least one non-probe area; therefore, the bonding type multi-layer guide plate unit has good structural strength under the condition of large area, can avoid the problem of difficulty in drilling and size limitation of a locking combination mode, can avoid the influence of excessive glue on a probe, and can avoid the problems of excessive glue and horizontal deviation of the guide plate caused by adhesive.

Description

Technical Field

[0001] The utility model relates to a guide plate unit of a probe head of a probe card, in particular to an adhesive multi-layer guide plate unit, and a probe head, a probe seat, a probe card and a detection system comprising the adhesive multi-layer guide plate unit. Background Art

[0002] See also Fig.17 The conventional probe card 10 mainly includes a main circuit board 11, and a probe head 12 directly connected to the main circuit board 11 or indirectly connected to the main circuit board 11 through a space converter (not shown in the figure). The probe head 12 mainly includes a probe base 16 composed of an upper guide plate 13 and a lower guide plate 14 or composed of an upper guide plate 13, a middle guide plate 15 and a lower guide plate 14, and a plurality of probes 17 inserted into the probe base 16. The large-area probe card 10 is mainly used to detect multiple objects to be tested 18 at the same time to improve the detection efficiency and reduce the detection cost. Therefore, the probe head 12 of the large-area probe card 10 requires a large-area guide plate (i.e., upper and lower guide plates 13, 14 or upper, middle and lower guide plates 13, 15, 14) for inserting a large number of probes 17 corresponding to the multiple objects to be tested 18. In order to make the large-area guide plate have sufficient structural strength, the thickness of the guide plate also needs to be increased accordingly. However, if the guide plate is too thick, the depth-to-width ratio of the perforation will be too large, making the drilling process difficult. Summary of the invention

[0003] In view of the above problems, the utility model provides a multi-layer guide plate unit, which is composed of a plurality of stacked guide plates, so that the guide plates can be drilled separately first, and then the guide plates can be combined into a guide plate unit to avoid the problem of difficult drilling processing, and the guide plate unit can have good structural strength. However, regarding the combination of the guide plates, if they are combined by locking components such as bolts, there will be size limitations, depending on the size of the locking components and the area on the guide plates where the locking components can be set. If the guide plates are bonded by glue, the size limitations of the aforementioned locking combination method can be avoided, but attention should be paid to the setting position and amount of glue to avoid overflow of glue and affecting the surrounding probes, or causing horizontal deviation of the guide plates due to excessive glue.

[0004] In view of the above problems, the main purpose of the utility model is to provide a bonded multi-layer guide plate unit, which can have good structural strength in a large area, avoid the problem of difficult drilling and the size limitation of the locking combination method, and avoid overflow of glue affecting the probe.

[0005] In view of the above problems, another object of the present invention is to provide an adhesive multi-layer guide plate unit, which can avoid the problems of glue overflow and guide plate level deviation caused by glue.

[0006] In order to achieve the above-mentioned main purpose, the adhesive multi-layer guide plate unit provided by the utility model is used for a probe head of a detection system for functional testing of a device under test integrated on a semiconductor wafer. The adhesive multi-layer guide plate unit includes at least one probe area and at least one non-probe area, and the probe area is used to penetrate multiple probes. It is characterized in that the adhesive multi-layer guide plate unit includes: multiple guide plates, each of the guide plates includes at least one bonding surface, and multiple through holes located in the at least one probe area, for each of the probes to slidably pass through the through holes of each of the guide plates; at least one adhesive layer, which bonds the bonding surfaces of each of the guide plates to each other, and the at least one adhesive layer is completely located in the at least one non-probe area.

[0007] The adhesive multi-layer guide plate unit in the utility model is a multi-layer guide plate unit formed by bonding multiple guide plates to each other with an adhesive layer. Therefore, individual guide plates among the multiple guide plates can be drilled to form a perforation in the probe area, and then adhesive is applied to the non-probe area to form an adhesive layer, and then the guide plates are bonded into a guide plate unit. In this way, the problem of difficulty in drilling caused by the increase in thickness of a single guide plate for good structural strength can be avoided, and the size limitation of the locking combination method can be avoided. By stacking multiple layers of guide plates to achieve a considerable thickness, the guide plate unit has good structural strength in the case of a large area. Moreover, the guide plate unit can distinguish between a probe area and a non-probe area. No probe is provided in the non-probe area. The adhesive layer is completely located in the non-probe area to avoid overflow of glue and affect the probe. In this way, a guide plate unit is provided. Even if it is large-scaled for a large number of probes corresponding to multiple objects to be tested, it can ensure good structural strength of the guide plate unit on the one hand, and on the other hand, it can avoid the problem of difficulty in drilling and the size limitation of the locking combination method, and can avoid overflow of glue and affect the probe. Therefore, the utility model can improve the production efficiency and product quality of a large-area probe card, especially a guide plate in a probe head thereof.

[0008] Preferably, the bonded multi-layer guide plate unit comprises a plurality of probe areas arranged in a matrix, and a non-probe area located outside the plurality of probe areas.

[0009] Thus, the probe area can be centrally arranged in the central area of ​​the guide plate unit, and the peripheral area of ​​the guide plate unit becomes the non-probe area. This not only clearly separates the probe area from the non-probe area, making it difficult for the adhesive in the non-probe area to affect the probe, but also allows the adhesive to be distributed over a large area in such a non-probe area to achieve a good bonding effect.

[0010] Preferably, the bonded multi-layer guide plate unit comprises a plurality of probe areas and a plurality of non-probe areas which are distributed alternately, and the plurality of probe areas and the plurality of non-probe areas are arranged in a matrix.

[0011] Therefore, such a guide plate unit is suitable for simultaneously testing non-adjacent devices under test (DUT) (commonly known as DUT jumping), and there is a non-probe area between every two probe areas where adhesive can be set, which can achieve a good bonding effect.

[0012] Preferably, the bonded multi-layer guide plate unit comprises a plurality of non-probe areas arranged in a matrix, and a probe area, wherein the probe area is distributed in a grid shape around the plurality of non-probe areas and between the non-probe areas.

[0013] Thus, the probes can be distributed in a grid pattern to form a plurality of non-probe areas surrounded by the probes, so that the adhesive can be distributed more evenly to achieve a good bonding effect.

[0014] Preferably, the bonding surface of the guide plate of the adhesive multilayer guide plate unit includes a first bonding surface and a second bonding surface bonded to each other, the first bonding surface contains at least one bump located in the at least one non-probe area, the second bonding surface is a plane, and the bump on the first bonding surface is bonded to the second bonding surface by an adhesive layer.

[0015] Thus, one of the two bonding surfaces that are bonded to each other can be a plane, and the other side can be convex in the non-probe area relative to the probe area. In this way, the adhesive can be applied to the bump first, and then the bump is connected to the plane. This method can make the position of setting the adhesive more clear and further avoid the problem of glue overflow.

[0016] Preferably, the joining surface of the guide plate of the adhesive multi-layer guide plate unit includes a first joining surface and a second joining surface that are bonded to each other, the first joining surface contains at least one protrusion located in the at least one non-probe area, and the second joining surface contains at least one groove located in the at least one non-probe area, and the protrusion of the first joining surface is bonded to the groove of the second joining surface by an adhesive layer.

[0017] Thus, one side of the two bonding surfaces that are bonded to each other can be convex relative to the probe area in the non-probe area, and vice versa, the other side can be concave relative to the probe area in the non-probe area. In this way, the adhesive can be applied to the convex block first, and then the convex block is connected to the groove. This method can make the position of setting the adhesive more clear and further avoid the problem of glue overflow. Moreover, when the bonding surfaces are bonded, the adhesive is located in the groove, which makes it less likely to overflow to the probe area. In addition, the two bonding surfaces have a corresponding concave and convex interlocking structure, which makes assembly alignment easier.

[0018] Preferably, the joint surface of the guide plate of the adhesive multi-layer guide plate unit includes a first joint surface and a second joint surface that are bonded to each other, and at least one of the first joint surface and the second joint surface is provided with at least one guide groove in the non-probe area, and the at least one guide groove defines a fabric glue area, and the at least one guide groove is located between the fabric glue area and the probe area, and the adhesive layer is located in the fabric glue area.

[0019] Thus, the adhesive can be first applied to the adhesive application area, and then the first and second joint surfaces can be bonded to each other. This method can make the position of setting the adhesive more clear and further avoid the problem of adhesive overflow. In addition, the adhesive can slightly exceed the adhesive application area and flow into the guide groove. At this time, the guide groove will prevent the adhesive from further spreading, so it can be more ensured that the adhesive will not overflow to the probe area and affect the probe.

[0020] Preferably, the at least one diversion ditch includes a closed diversion ditch which is enclosed in a circle.

[0021] Therefore, the closed guide groove can play a good adhesive blocking effect, thereby preventing adhesive overflow.

[0022] Preferably, the at least one guide groove includes a plurality of discontinuous guide grooves, and the plurality of discontinuous guide grooves are discontinuously arranged in a circle.

[0023] Therefore, the gaps between the intermittent diversion grooves can still be used for glue to flow through, which can slightly expand the distribution range of the glue and produce a good bonding effect. At the same time, the intermittent diversion grooves can still effectively block the glue and achieve the effect of avoiding glue overflow.

[0024] Preferably, the at least one guide groove includes at least one inner guide groove forming a circle, and at least one outer guide groove surrounding the at least one inner guide groove.

[0025] Therefore, the inner and outer guide grooves can play a better adhesive blocking effect than a single circle guide groove. The inner and outer guide grooves can be closed guide grooves or discontinuous guide grooves as described above, and can be configured according to needs.

[0026] Preferably, the at least one guide groove includes a plurality of inner guide grooves intermittently forming a circle, and a plurality of outer guide grooves intermittently surrounding the plurality of inner guide grooves, there is a gap between every two adjacent inner guide grooves, and the position of the outer guide groove corresponds to the gap.

[0027] Thus, the inner and outer guide grooves complement each other. When the adhesive is applied within the range surrounded by the inner guide grooves, the gaps between the inner guide grooves can still allow the adhesive to flow through, which can slightly expand the adhesive distribution range and produce a good bonding effect. At the same time, the outer guide grooves can effectively prevent the adhesive from excessively diffusing outward because their positions correspond to the gaps in the inner guide grooves. Similarly, when the adhesive is applied outside the range surrounded by the outer guide grooves, the gaps between the outer guide grooves can still allow the adhesive to flow inward, and the inner guide grooves can then prevent the adhesive from excessively diffusing inward. It can be seen that this form can achieve a good bonding effect and can effectively avoid the problem of glue overflow.

[0028] Preferably, the guide groove runs through the guide plate to which it belongs.

[0029] Therefore, the position of the guide groove can be identified from the other surface of the guide plate relative to the joint surface, thereby achieving a good alignment effect.

[0030] Preferably, the guide groove is recessed from the joint surface where the guide groove is located.

[0031] Therefore, the guide groove has only an opening located at the joint surface, which can prevent the adhesive from flowing to the other surface of the guide plate opposite to the joint surface.

[0032] Preferably, at least one of the first joint surface and the second joint surface is further provided with at least one glue-dispensing groove in the non-probe area, and the glue-dispensing groove is located in the glue-dispensing area.

[0033] Therefore, the glue can be first dotted in the glue dot groove, and then spread or diffused to other parts of the glue dispensing area due to the pressing of the guide plate. This makes it easy to control the thickness of the glue layer, thereby avoiding horizontal deviation of the guide plate, and having a clear and easily identifiable glue dot position allows the glue dispensing operation to be more accurate. In addition, part of the glue will gather in the glue dot groove, so that the joint surface of the guide plate can be effectively bonded and fixed without the need for a large area of ​​glue.

[0034] Preferably, the guide plates of the bonded multi-layer guide plate unit include an inner guide plate and two outer guide plates, the inner guide plate includes two bonding surfaces facing opposite directions, the outer guide plates are respectively bonded to the bonding surfaces of the inner guide plates, and the outer guide plates are respectively provided with guide grooves, which penetrate the outer guide plates.

[0035] Therefore, the adhesive can be first applied to the joint surface of the inner guide plate, and then the joint surface of the outer guide plate can be bonded to the joint surface of the inner guide plate respectively. In this way, the position of the guide groove can be identified by the other surface of the outer guide plate relative to the joint surface (i.e., the outer surface of the guide plate unit), thereby achieving a good alignment effect.

[0036] Preferably, the guide plates of the adhesive multi-layer guide plate unit include at least two limiting guide plates and at least one aligning guide plate, the limiting guide plates and the aligning guide plates are alternately stacked, and the width of the perforations of the aligning guide plates is greater than the width of the perforations of the limiting guide plates.

[0037] Therefore, the width of the perforation of the limiting guide plate can match the width of the probe to control the movement of the probe, and the larger width of the perforation of the alignment guide plate is conducive to alignment to avoid the probe movement being affected by the burrs of the perforation due to inaccurate perforation alignment.

[0038] The utility model also provides a probe head, comprising an upper guide plate unit, a lower guide plate unit, and a plurality of probes, each probe passing through the upper guide plate unit and the lower guide plate unit, wherein at least one of the upper guide plate unit and the lower guide plate unit is the aforementioned adhesive multi-layer guide plate unit.

[0039] Therefore, the upper guide plate unit and / or the lower guide plate unit of the probe head can adopt the adhesive multi-layer guide plate unit provided by the above-mentioned utility model to achieve good structural strength and flatness in the case of a large area.

[0040] The utility model further provides a probe seat, comprising an upper guide plate unit, a lower guide plate unit, a support structure, and an accommodation space. The upper guide plate unit comprises an upper surface, a lower surface, and a plurality of upper through holes penetrating the upper surface and the lower surface of the upper guide plate unit. The lower guide plate unit comprises an upper surface, a lower surface, and a plurality of lower through holes penetrating the upper surface and the lower surface of the lower guide plate unit. The support structure comprises a plurality of support columns, and the plurality of support columns are arranged between the upper guide plate unit and the lower guide plate unit. The accommodation space is formed around the plurality of support columns and is located between the upper guide plate unit and the lower guide plate unit, and the accommodation space is used for a plurality of probes to pass through the upper through holes, the accommodation space, and the lower through holes, respectively. The plurality of support columns comprise a plurality of upper support columns and a plurality of lower support columns, the upper support columns protrude from the lower surface of the upper guide plate unit along a vertical axis, the lower support columns protrude from the upper surface of the lower guide plate unit along a vertical axis, and the upper support columns are in contact with the lower support columns, respectively. At least one of the upper guide plate unit and the lower guide plate unit is an adhesive multi-layer guide plate unit with a guide groove as described above, and the position of the guide groove of the adhesive multi-layer guide plate unit and at least a part of the glue cloth area defined by it corresponds to at least one of the upper support column and the lower support column of the support structure along the vertical axis.

[0041] Therefore, the probe seat provided by the utility model can be provided with a middle guide plate and a accommodating space for accommodating the probe is formed in the middle guide plate, or the middle guide plate may not be provided, but the upper and lower guide plate units are directly connected and jointly form a accommodating space for accommodating the probe, and the upper and lower support columns can be arranged in the place where the probe is not provided in the accommodating space, and the upper and lower support columns are respectively protruded from the upper and lower guide plate units and contact each other. Such upper and lower support columns not only strengthen the structural strength of the upper and lower guide plate units respectively, but also when the upper and lower guide plate units are connected to each other, the upper and lower support columns jointly reinforce the weak structural strength of the center of the probe seat due to the accommodating space, so that the probe seat will have good structural strength even in the case of a large area and will not be easily deformed by force, so as to reduce the deformation of the lower guide plate unit caused by the reaction force generated by the object to be tested during the test. In addition, the upper guide plate unit and / or the lower guide plate unit are the aforementioned adhesive multi-layer guide plate units, which can achieve good structural strength and flatness in the case of a large area, and the adhesive multi-layer guide plate unit is provided with the aforementioned guide groove, which can further ensure that the glue will not overflow to the probe area and affect the probe. Furthermore, the position of at least a part of the guide groove and the glue distribution area defined by it corresponds to the upper support column and / or the lower support column along the vertical axis, that is, the guide groove and at least a part of the glue distribution area defined by it are located directly above or below the upper support column and / or the lower support column, so that the upper support column and / or the lower support column can directly produce a structural reinforcement effect on the location of the guide groove and the glue distribution area, making the guide plate unit less susceptible to deformation due to force.

[0042] The utility model also provides a probe head, which comprises the probe seat with the supporting structure as mentioned above, and a plurality of probes, each of which passes through an upper guide plate unit and a lower guide plate unit.

[0043] Therefore, the probe head adopts the aforementioned probe seat, which not only has a supporting structure, but also adopts an adhesive multi-layer guide plate unit with a guide groove. The supporting structure directly produces a structural reinforcement effect on the guide groove and the glue distribution area. Therefore, it can achieve good structural strength and flatness in a large area and effectively avoid the problem of glue overflow.

[0044] The utility model also provides a probe card for performing functional testing on an object to be tested, the probe card comprising an interface board, a space transformer, and a probe head as described above. The interface board is configured to be connected to a test machine, a space transformer is associated with the interface board and is suitable for providing space transformation in spacing between contact pads formed on two opposite surfaces thereof, and the probe head is associated with the space transformer.

[0045] Therefore, the probe card of the utility model can be a large-area probe card to improve detection efficiency and reduce detection costs, and the probe head of the probe card adopts the adhesive multi-layer guide plate unit provided by the utility model, which can achieve good structural strength and flatness in a large area, thereby producing accurate detection results.

[0046] The utility model further provides a detection system for detecting at least one object to be tested, wherein the object to be tested includes a plurality of conductive contacts. The detection system includes a support platform for supporting the object to be tested, a probe card, and a tester. The probe card includes a probe head as described above, which is used to electrically connect the probe card to the object to be tested by contacting the conductive contacts of the object to be tested with the probes of the probe head. The tester is electrically connected to the probe card, and is used to generate a test signal for the probe card to transmit the test signal to the object to be tested, and to receive a result signal through the probe card and analyze the result signal.

[0047] Therefore, the probe card in the detection system can be a large-area probe card to improve detection efficiency and reduce detection costs, and the probe head of the probe card adopts the adhesive multi-layer guide plate unit provided by the aforementioned utility model, which can achieve good structural strength and flatness in a large area, thereby enabling the detection system to produce accurate detection results.

[0048] The detailed structure, features, assembly or use of the bonded multilayer guide plate unit, probe head, probe seat, probe card and detection system provided by the present invention will be described in the detailed description of the implementation method in the following. However, those skilled in the art should understand that these detailed descriptions and the specific embodiments listed for implementing the present invention are only used to illustrate the present invention and are not used to limit the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 It is a schematic diagram of a detection system provided by a first preferred embodiment of the utility model.

[0050] Figure 2 The invention is a cross-sectional schematic diagram of a bonded multi-layer guide plate unit and a plurality of probes of a probe card of a detection system.

[0051] Figure 3 Schematic diagram of a guide plate of a bonded multi-layer guide plate unit.

[0052] Figure 4a It is a schematic diagram of another form of guide plate.

[0053] Figure 4b yes Figure 4a A partial enlarged view of .

[0054] Figure 5 yes Figure 4bA cross-sectional view along section line 5-5 showing the adhesive and multiple probes.

[0055] Figure 6 Is has Figure 5 The cross-sectional schematic diagram of the bonded multi-layer guide plate unit and multiple probes of the guide plate is shown.

[0056] Figure 7 It is a cross-sectional schematic diagram of a bonded multi-layer guide plate unit and a plurality of probes provided by a second preferred embodiment of the utility model.

[0057] Figure 8 and Fig. 9 Schematic diagrams of two other forms of guide plates.

[0058] Fig.10a , Fig.10b and Fig.11 It is a schematic diagram of the configuration of three types of guide grooves and dispensing grooves.

[0059] Fig.12 It is a cross-sectional schematic diagram of a bonded multi-layer guide plate unit and a plurality of probes provided by a third preferred embodiment of the utility model.

[0060] Fig.13 and Fig.14 It is a cross-sectional schematic diagram of another two forms of bonded multi-layer guide plate units and multiple probes.

[0061] Fig.15 It is a partial cross-sectional stereoscopic view of a probe seat provided by a fourth preferred embodiment of the utility model.

[0062] Fig.16 yes Fig.15 A partial cross-sectional view of the probe base is shown.

[0063] Fig.17 is a schematic diagram of a commonly used detection system. DETAILED DESCRIPTION

[0064] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution of the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings of the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the described embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the utility model.

[0065] The applicant first explains that in the embodiments and drawings to be introduced below, the same reference numbers represent the same or similar elements or their structural features. It should be noted that the elements and structures in the drawings are for illustration purposes only and are not drawn according to the actual proportions and quantities, and if it is possible in practice, the features of different embodiments can be applied interchangeably. Secondly, when it is mentioned that an element is disposed on another element, it means that the element is directly disposed on the other element, or the element is indirectly disposed on the other element, that is, one or more other elements are disposed between the two elements. When it is mentioned that an element is "directly" disposed on another element, it means that no other elements are disposed between the two elements.

[0066] Please read first Figure 1 The detection system 61 provided in the first preferred embodiment of the utility model is used to detect at least one device under test (DUT). Figure 1 Schematically shown are four objects to be tested 63 formed on a substrate 62, each object to be tested 63 including a plurality of conductive contacts 632. The detection system 61 includes a carrier 64 for carrying the object to be tested 63, a probe card 20, and a tester 65. The probe card 20 can be used to electrically connect and / or mechanically contact a device under test, and to test the electrical performance of the device under test. The probe card 20 can be configured to test a device under test (i.e., the object to be tested 63) that can be formed on a substrate 62. The device under test can be a wafer-level circuit, examples of which include semiconductor devices, electronic devices, and / or optoelectronic devices. The device under test can be formed on a substrate 62. Examples of substrate 62 include wafers, semiconductor wafers, silicon wafers, gallium arsenide wafers, and / or type III-V semiconductor wafers. In some examples, the device under test may be, for example, a tested semiconductor device and / or an unpackaged semiconductor device. The carrier 64 may be used to carry the substrate 62 and the device under test for detection by the probe card 20. The device under test may include one or more contact pads (e.g., Figure 1 A conductive contact 632 is shown such that the probe tip is configured to contact the one or more contact pads during testing of the device under test.

[0067] The probe card 20 includes an interface board 21 (also called a main circuit board), a space transformer 22, and a probe head 23. The interface board 21 is configured to interface to a tester 65, the space transformer 22 is associated with the interface board 21, and the probe head 23 is associated with the space transformer 22. The term "associated" mentioned above refers to a component being connected to another component (either directly or indirectly), not necessarily in a rigid manner. The space transformer 22 is suitable for providing a space transformation in spacing between contact pads (not shown) formed on its two opposite surfaces 221 and 222, that is, the spacing of the contact pads on the surface 221 for connecting with the interface board 21 is different from the spacing of the contact pads on the surface 222 for connecting with the probe head 23. The probe head 23 includes a probe seat 24 and a plurality of probes 25 penetrating the probe seat 24. The probe 25 contacts the conductive contact 632 of the object under test 63, so that the probe card 20 is electrically connected to the object under test 63, and the test machine 65 is electrically connected to the probe card 20, so as to generate a test signal for the probe card 20 to transmit the test signal to the object under test 63, and receive a result signal through the probe card 20 and analyze the result signal. In other words, the probe card 20 is used to electrically connect the object under test 63 to the test machine 65, so as to perform a functional test on the object under test 63.

[0068] Figure 1 The probe base 24 shown includes an upper guide plate unit 30, a lower guide plate unit 40, and a middle guide plate 241 disposed between the upper guide plate unit 30 and the lower guide plate unit 40. However, the probe base 24 may also be without the middle guide plate 241, and the upper guide plate unit 30 and the lower guide plate unit 40 may be directly connected to each other (such as Fig.15 and Fig.16 ). Figure 1 In the embodiment, the upper guide plate unit 30 is composed of two overlapping guide plates 31, 32, and the lower guide plate unit 40 is composed of two overlapping guide plates 41, 42. However, the present invention does not limit the upper and lower guide plate units 30, 40 to include a plurality of guide plates.

[0069] At least one of the upper and lower guide plate units 30 and 40 of the probe base 24 provided by the present invention is a bonded multi-layer guide plate unit 70. Figure 2 The adhesive multi-layer guide plate unit provided by the present invention comprises a plurality of guide plates, such as Figure 2 The illustrated bonding multi-layer guide plate unit 70 includes two guide plates 71 and 72. Figure 1 In the case where the lower guide plate unit 40 shown is an adhesive multi-layer guide plate unit 70 , the guide plates 41 , 42 of the lower guide plate unit 40 are guide plates 71 , 72 of the adhesive multi-layer guide plate unit 70 , respectively.

[0070] like Figure 2As shown, the guide plate 71 includes a plurality of through holes 711, and the guide plate 72 includes a plurality of through holes 721. The probes 25 pass through the through holes 711 of the guide plate 71 and the through holes 721 of the guide plate 72, respectively. The configuration of the probes 25 corresponds to the configuration of the conductive contacts 632 of the object to be tested 63. According to the required probe configuration, the bonded multi-layer guide plate unit 70 can define at least one probe area 74 and at least one non-probe area 75. The through holes 711 and 721 of the guide plates 71 and 72 are located in the probe area 74 so that the probes 25 can pass through the probe area 74. The non-probe area 75 is where the probes 25 are not required to be set, so the non-probe area 75 does not have the through holes 711 and 721.

[0071] In the adhesive multi-layer guide plate unit provided by the present invention, each guide plate includes at least one bonding surface, and the bonding surface of the guide plate refers to the surface bonded to another guide plate by adhesive. Figure 2 In the figure, the guide plate 72 includes a first bonding surface 722, the guide plate 71 includes a second bonding surface 712, and an adhesive layer 73 bonds the first bonding surface 722 and the second bonding surface 712 to each other. Moreover, the adhesive layer 73 is completely located in the non-probe area 75, and the blocks of the first and second bonding surfaces 722 and 712 located in the non-probe area 75 can be fully or partially covered by the adhesive layer 73.

[0072] Furthermore, Figure 3 show Figure 2 The first engaging surface 722 of the guide plate 72 is shown to simplify the drawing and facilitate description. Figure 3 A circle of tiny dots is arranged around each non-probe area 75 to represent the perforation 721. Figure 2 and Figure 3 As shown, the second joint surface 712 is a plane, and the first joint surface 722 has a concave-convex structure. More specifically, the first joint surface 722 includes a rectangular groove 723 and a plurality of rectangular protrusions 724 located in the groove 723. The positions of the protrusions 724 are respectively non-probe areas 75. Therefore, when the guide plates 71 and 72 are bonded to each other, the protrusions 724 of the first joint surface 722 are bonded to the second joint surface 712 by the adhesive layer 73. In some embodiments, only part of the protrusions 724 may be bonded to the second joint surface 712 by the adhesive layer 73.

[0073] Depend on Figure 3It can be seen that the adhesive multi-layer guide plate unit 70 of this embodiment includes a plurality of non-probe areas 75 arranged in a matrix, and the probes 25 are arranged around these non-probe areas 75, that is, the areas between adjacent non-probe areas 75 and the peripheries of all non-probe areas 75 are where the probes are inserted, and these areas where the probes are inserted are connected to each other in a grid shape without being separated. Therefore, this configuration can be defined as including a plurality of non-probe areas 75 and a probe area 74, and the probe area 74 is distributed in a grid shape around all non-probe areas 75 and between the non-probe areas 75. The through holes 711 and 721 of the guide plates 71 and 72 are distributed in the probe area 74, so that the probes 25 can be inserted in the through holes 711 and 721. In other words, the areas between adjacent non-probe areas 75 and the peripheries of all non-probe areas 75 are collectively regarded as a grid-shaped probe area 74, and the non-probe areas 75 are regarded as the meshes of the grid. The non-probe areas 75 of this configuration can allow the adhesive to be distributed more evenly to achieve a good bonding effect.

[0074] Therefore, the bonded multi-layer guide plate unit 70 in the present invention is a multi-layer guide plate unit composed of multiple guide plates 71 and 72 bonded to each other with an adhesive layer 73. Therefore, in the process of manufacturing the bonded multi-layer guide plate unit 70, the guide plates 71 and 72 can be drilled respectively to form the through holes 711 and 721 of the probe area 74, and then the adhesive is applied to the non-probe area 75 to form the adhesive layer 73, and then the guide plates 71 and 72 are bonded into a guide plate unit. In this way, the problem of difficulty in drilling caused by the increase in thickness of a single guide plate for good structural strength can be avoided, and the size limitation of the locking combination method can be avoided. Moreover, by stacking multiple layers of guide plates to achieve a considerable thickness, the bonded multi-layer guide plate unit 70 has good structural strength in a large area. Moreover, the adhesive multilayer guide plate unit 70 can be distinguished into a probe area 74 and a non-probe area 75. No probe 25 is provided in the non-probe area 75, and the adhesive layer 73 is completely located in the non-probe area 75, that is, the adhesive layer 73 is completely located in the whole or part of the block where the first and second bonding surfaces 722 and 712 are located in the non-probe area 75, so that overflow of glue can be avoided to affect the probe 25. In this way, even if the adhesive multilayer guide plate unit 70 is enlarged in area for penetrating a large number of probes 25 corresponding to a plurality of objects to be tested 63, it can ensure good structural strength of the guide plate unit on the one hand, and avoid the problem of difficult drilling processing and the size limitation of the locking combination method on the other hand, and can avoid overflow of glue to affect the probe 25. Therefore, the utility model can improve the production efficiency and product quality of large-area probe cards, especially the guide plates in the probe heads thereof.

[0075] In addition, if Figure 2As shown, the second bonding surface 712 is a plane, and the first bonding surface 722 includes a bump 724 located in the non-probe area 75. Therefore, the first bonding surface 722 is convex in the non-probe area 75 relative to the probe area 74. Therefore, the adhesive can be applied to the bump 724 first, and then the bump 724 is connected to the second bonding surface 712. This method can make the position of setting the adhesive clearer and further avoid the problem of glue overflow.

[0076] See also Figure 7 The adhesive multi-layer guide plate unit 70 provided in the second preferred embodiment of the utility model is Figure 2 Similar to that shown, but Figure 7 In addition to the first joint surface 722 having a concavo-convex structure, the second joint surface 712 also has a concavo-convex structure. In detail, the first joint surface 722 includes a plurality of protrusions 724 respectively located in the non-probe area 75, so the first joint surface 722 is convex in the non-probe area 75 relative to the probe area 74. On the contrary, the second joint surface 712 includes a plurality of grooves 714 respectively located in the non-probe area 75, so the second joint surface 712 is concave in the non-probe area 75 relative to the probe area 74. In other words, the first joint surface 722 is concave in the probe area 74 relative to the non-probe area 75, and the second joint surface 712 is convex in the probe area 74 relative to the non-probe area 75. When the guide plates 71 and 72 are bonded to each other, the protrusions 724 of the first joint surface 722 are bonded to the grooves 714 of the second joint surface 712 by the adhesive layer 73.

[0077] Thus, the adhesive can be first applied to the protrusion 724, and then the protrusion 724 is connected to the groove 714, and then the guide plates 71 and 72 are bonded to each other. This method can make the position of setting the adhesive more clear, and further avoid the problem of adhesive overflow. Moreover, when the first and second bonding surfaces 722 and 712 are bonded, the adhesive is located in the groove 714, which makes it less likely to overflow to the probe area 74. Even through the height difference between the first and second bonding surfaces 722 and 712 in the probe area 74 and the non-probe area 75, even if adhesive overflow occurs, the impact of adhesive overflow on the probe 25 in the probe area 74 can be greatly reduced. In addition, the first and second bonding surfaces 722 and 712 have a corresponding concave and convex interlocking structure, which makes assembly alignment easier.

[0078] The bonding surface of the guide plate of the adhesive multi-layer guide plate unit provided by the present invention is not limited to having the aforementioned concave-convex structure. Regardless of whether it has the aforementioned concave-convex structure, the problem of glue overflow can be further avoided by providing at least one guide groove and / or at least one glue point groove, as described in detail below.

[0079] Figures 4a to 6 The guide plate 72 shown in FIG. Figure 2 and Figure 3The main difference between the guide plate 72 shown in FIG. 7 is that the shape of the protrusion 724 of the first joint surface 722 is different. Figures 4a to 6 The first joint surface 722 of the guide plate 72 shown in the figure is further provided with a guide groove 725A and a glue point groove 726 (the shape is not limited to a circle) in each non-probe area 75 (i.e. where the bump 724 is located). Figure 4a and Figure 4b A circle of tiny dots is arranged around each non-probe area 75 to represent the through hole 721. The guide groove and the glue dispensing groove described in the utility model can be arranged together on the first joint surface 722 or the second joint surface 712, or respectively on different joint surfaces, or can be arranged on both the first and second joint surfaces 722 and 712. Figures 4a to 6 Taking the guide groove 725A and the glue dispensing groove 726 being disposed together on the first joint surface 722 as an example, the diagram is simplified and the description is convenient.

[0080] like Figure 4b As shown, the guide groove 725A is closed in a circle, also called a closed guide groove, and the enclosed range is defined as a glue distribution area 727. Therefore, the guide groove 725A is located between the glue distribution area 727 and the probe area 74, and the glue dispensing groove 726 is located in the glue distribution area 727.

[0081] Therefore, if Figure 5 As shown, the adhesive 76 can be firstly dotted into the adhesive dot groove 726 and then applied to other parts of the adhesive application area 727, or the adhesive 76 can be applied without being applied but when the guide plate 71 is pressed onto the guide plate 72 (such as Figure 6 The adhesive 76 is spread to other parts of the adhesive application area 727 by applying the adhesive 76 in the adhesive application groove 726. By applying the adhesive 76 in the adhesive application groove 726, the thickness of the adhesive layer 73 formed in the end can be easily controlled, thereby avoiding the horizontal deviation of the guide plate. Moreover, the adhesive application groove 726 provides a clear and easily identifiable adhesive application position, which allows the adhesive application operation to be performed more accurately. In addition, a part of the adhesive 76 will be gathered in the adhesive application groove 726, so that the joint surface of the guide plate can be effectively bonded and fixed without applying adhesive on a large area.

[0082] Furthermore, even if the adhesive 76 exceeds the adhesive application area 727 during coating or when the guide plates 71 and 72 are pressed together, the adhesive 76 will flow into the guide groove 725A, thereby preventing the adhesive 76 from further spreading, thereby further ensuring that the adhesive will not overflow into the probe area 74 and affect the probe 25. In particular, the guide groove 725A is a closed guide groove, which can play a good adhesive blocking effect, thereby preventing the adhesive from overflowing.

[0083] Alternatively, only the glue dispensing groove 726 may be provided in the non-probe area 75 without the guide groove 725A, so as to avoid glue overflow. Alternatively, only the guide groove 725A may be provided in the non-probe area 75 without the glue dispensing groove 726, so as to provide a clear glue dispensing area 727, so that the position for setting the glue is clearer, further avoiding the problem of glue overflow, and the guide groove 725A can play a good glue blocking effect, so it can be more ensured that the glue will not overflow to the probe area 74 and affect the probe 25.

[0084] From the above content, it can be known that the adhesive multi-layer guide plate unit provided by the utility model is suitable for application in a large-area probe card, so as to set a large number of probes that can detect multiple objects to be tested at the same time, so that the probe card has both good structural strength and detection efficiency. In particular, in order to cooperate with the current test method of multiple objects to be tested, the adhesive multi-layer guide plate unit of the utility model can be used as follows Figure 3 and Figure 4a The peripheral probe configuration shown, or Figure 8 Centralized probe configuration as shown, or Fig. 9 The probe configuration for jumping the DUT is shown and described in detail below.

[0085] Figure 8 Similarly, the first joint surface 722 of the guide plate 72 is used to schematically represent the probe area 74 and the non-probe area 75 of the bonded multi-layer guide plate unit. This bonded multi-layer guide plate unit includes a plurality of probe areas 74 arranged in a matrix, and a non-probe area 75 located outside all the probe areas 74. The through holes 711 and 721 of the guide plates 71 and 72 are distributed in the probe area 74, so that the probes 25 can pass through the through holes 711 and 721. In order to simplify the diagram and facilitate the description, Figure 8 Only tiny dots are used to represent the perforations 721. This type of adhesive multi-layer guide plate unit centrally arranges the probe area 74 in the central area of ​​the guide plate unit, and the peripheral area of ​​the guide plate unit becomes the non-probe area 75. This not only clearly separates the probe area 74 from the non-probe area 75, so that the adhesive disposed in the non-probe area 75 is not likely to affect the probe, but also the non-probe area 75 has a large area for the adhesive to be distributed over a large area, thereby achieving a good bonding effect.

[0086] Figure 8 The first joint surface 722 of the guide plate 72 shown may also (but not limited to) be provided with a guide groove and a glue-dispensing groove in the non-probe area 75 to avoid glue overflow. Figure 8 Another type of guide groove different from the aforementioned closed guide groove is taken as an example for description. Figure 8The first joint surface 722 shown is provided with a plurality of guide grooves, including a plurality of inner guide grooves 725B and a plurality of outer guide grooves 725C. The inner guide grooves 725B are intermittently formed into a circle and surround the entire probe area 74, and the outer guide grooves 725C are also intermittently formed into a circle and surround all the inner guide grooves 725B. Such intermittently formed guide grooves are also referred to as intermittent guide grooves in the present invention. There is a gap 728 between every two adjacent inner guide grooves 725B, and the positions of the outer guide grooves 725C correspond to the gaps 728 respectively. Figure 8 The glue area 727 defined by the middle guide groove surrounds all the outer guide grooves 725C, and the inner and outer guide grooves 725B and 725C are located between the glue area 727 and the probe area 74. Before the two guide plates are bonded to each other, the glue is set in the glue area 727. When the two guide plates are pressed together, the glue layer is formed in the glue area 727 and the two guide plates are firmly bonded. The glue area 727 can also be provided with a glue dispensing groove (not shown) to make the glue dispensing position more accurate and improve the bonding effect.

[0087] Fig. 9 Similarly, the first joint surface 722 of the guide plate 72 is used to schematically represent the probe area 74 and the non-probe area 75 of the bonded multi-layer guide plate unit. This bonded multi-layer guide plate unit includes a plurality of probe areas 74 and a plurality of non-probe areas 75 that are staggered. The probe areas 74 and the non-probe areas 75 are arranged in a matrix. The staggered distribution means that the probe areas 74 are adjacent to the non-probe areas 75 but not adjacent to the probe areas 74, and the non-probe areas 75 are adjacent to the probe areas 74 but not adjacent to the non-probe areas 75. The through holes 711 and 721 of the guide plates 71 and 72 are distributed in the probe area 74, so that the probes 25 can be inserted into the through holes 711 and 721. In order to simplify the diagram and facilitate the description, Fig. 9 Only tiny dots are used to represent the perforations 721. The distribution of the perforations in each probe area 74 is not limited to the following: Fig. 9 The dense distribution shown in the figure can be arranged in any desired manner. This kind of adhesive multilayer guide plate unit is suitable for the detection method of simultaneously detecting non-adjacent DUTs (commonly known as DUT jumping), that is, when performing detection, the positions of the probe area 74 and the non-probe area 75 each correspond to a DUT, but only the probe area 74 is provided with a probe, so the DUT corresponding to the position of the non-probe area 75 is not detected. When the probe card is tested next time, it only needs to move a short distance to move the probe area 74 to the position of the non-probe area 75 during the previous detection, so that the DUT that was not detected last time can be detected. Since there is a non-probe area 75 with a considerable area between each two probe areas 74 for setting adhesive, a good bonding effect can be achieved.

[0088] Fig. 9The first bonding surface 722 shown may also (but not limited to) be provided with guide grooves and glue-dispensing grooves in each non-probe area 75 to avoid glue overflow. Fig. 9 The guide grooves 725A shown are closed guide grooves, but the present invention is not limited thereto. Each guide groove 725A encloses a glue area 727, and the guide groove 725A is located between the glue area 727 and the probe area 74. Each glue area 727 is provided with a glue point groove 726. Glue can be first applied to each glue point groove 726, and when the two guide plates are pressed together, an adhesive layer will be formed in the glue area 727 and firmly bond the two guide plates.

[0089] The configuration of the guide groove in the present invention can be changed according to needs, as long as the guide groove can be closed or discontinuously surrounded by at least one circle to define the glue distribution area. The glue distribution area can be the range surrounded by the guide groove or outside the guide groove, as long as the guide groove is located between the glue distribution area and the probe area. Fig.10a , Fig.10b and Fig.11 Three other configuration forms of the guide groove are exemplified, in which the glue distribution area 727 is located within the range surrounded by the guide groove and is provided with a glue point groove 726, but the glue distribution area 727 can also be outside the guide groove, and the glue distribution area 727 is not limited to being provided with a glue point groove 726.

[0090] Fig.10a The shown guide grooves include a plurality of discontinuous guide grooves 725D, which are discontinuously arranged in a circle. Therefore, the gaps 728 between the discontinuous guide grooves 725D can still be used for the glue to flow through, so that the distribution range of the glue can be slightly expanded to produce a good bonding effect. At the same time, the discontinuous guide grooves 725D can still effectively block the glue to prevent the glue from overflowing. In other words, the setting of such discontinuous guide grooves 725D can be used to control the amount of glue, so as to reduce the accuracy required for controlling the amount of glue and improve the ease of manufacturing.

[0091] Fig.10b The diversion channel shown is Figure 8 The same as shown, including a plurality of inner guide grooves 725B and a plurality of outer guide grooves 725C, the inner and outer guide grooves 725B and 725C are both discontinuous guide grooves, the inner guide grooves 725B are discontinuously surrounded in a circle, and the outer guide grooves 725C are also discontinuously surrounded in a circle and surround all the inner guide grooves 725B. There is a gap 728 between every two adjacent inner guide grooves 725B, and the positions of the outer guide grooves 725C correspond to the gaps 728 respectively.

[0092] Therefore, in Figure 8 and Fig.10b In the embodiment shown, the inner and outer guide grooves 725B and 725C complement each other. When the adhesive is applied to the area surrounded by the inner guide groove 725B, for example Fig.10bThe glue spreading area 727 shown is located within the range surrounded by the inner guide grooves 725B. The gaps 728 between the inner guide grooves 725B can still allow the glue to flow through, which can slightly expand the glue distribution range and produce a good bonding effect. At the same time, the outer guide grooves 725C can effectively prevent the glue from excessively spreading outward because their positions correspond to the gaps 728 of the inner guide grooves 725B. Similarly, when the glue is applied outside the range surrounded by the outer guide grooves 725C, for example Figure 8 The glue spreading area 727 shown is located outside the range surrounded by the outer guide grooves 725C, and the gap 729 between the outer guide grooves 725C can still allow the glue to flow inward, and then the inner guide grooves 725B prevent the glue from excessively spreading inward. It can be seen that the inner and outer guide grooves 725B and 725C form a complementary shape, which can achieve a good bonding effect and effectively avoid the problem of glue overflow. In other words, the inner and outer guide grooves 725B and 725C can be used to form a complementary shape to control the amount of glue, so as to reduce the accuracy required for controlling the amount of glue and improve the ease of manufacturing.

[0093] Fig.11 The shown guide groove includes an inner guide groove 725E and an outer guide groove 725F. The inner guide groove 725E and the outer guide groove 725F are both closed guide grooves. The inner guide groove 725E is closed to form a circle, and the outer guide groove 725F is also closed to form a circle and surrounds the inner guide groove 725E. Therefore, the closed guide groove has a good effect in preventing glue overflow, and the two-circle guide groove can play a better adhesive blocking effect than a single-circle guide groove. Alternatively, at least one of the inner and outer guide grooves 725E and 725F can also be changed to an intermittent guide groove, which can be configured according to needs.

[0094] The utility model is to bond a plurality of guide plates to each other through an adhesive layer to form a bonded multi-layer guide plate unit, wherein the number of guide plates included can also be three or more, for example, Fig.12 The adhesive multi-layer guide plate unit 70 provided in the third preferred embodiment of the present invention includes a guide plate 71 and two guide plates 72. The guide plate 71 is arranged between the two guide plates 72, so the guide plate 71 is also called the inner guide plate, and the guide plate 72 is also called the outer guide plate.

[0095] The guide plates 71 and 72 in this embodiment are similar to the guide plates 71 and 72 described in the second preferred embodiment (such as Figure 6 ), but the first joint surface 722 of the guide plate 72 of this embodiment does not have a dispensing groove, and the guide plate 71 includes two second joint surfaces 712 facing opposite directions because it needs to be bonded with the two guide plates 72. The first joint surface 722 of the guide plate 72 is bonded with the second joint surface 712 of the guide plate 71, respectively, so there are two adhesive layers 73. The structural features and functions of this embodiment are similar to those of the second preferred embodiment except for those described in the next paragraph, and will not be repeated here.

[0096] In addition to the aforementioned differences, Figure 6 The guide groove 725A shown is recessed from the first joint surface 722 where it is located, so the guide groove 725A has only one opening 77 located on the first joint surface 722, and has no opening on the other surface 78 opposite to the first joint surface 722, thereby preventing the adhesive from flowing to the surface 78. Fig.12 The guide groove 725A shown in the figure penetrates the guide plate 72, so the guide groove 725A has two openings 77 respectively located on the first joint surface 722 and the surface 78. Therefore, the adhesive can be first applied to the second joint surface 712 of the guide plate 71, and then the first joint surface 722 of the guide plate 72 is respectively bonded to the second joint surface 712 of the guide plate 71. In this way, the position of the guide groove 725A can be identified by the surface 78 of the guide plate 72 (that is, the outer surface of the guide plate unit), thereby achieving a good alignment effect.

[0097] It is worth mentioning that when the guide groove is not located on the outer surface of the guide plate unit or is blocked by other components of the probe card, although the guide groove cannot be seen from the appearance of the probe card, the image taken under X-ray can identify the guide groove in the guide plate unit.

[0098] In the aforementioned embodiments, the widths of the through holes 711, 721 of the guide plates 71, 72 are only slightly larger than the width of the probe 25 to control the movement of the probe 25. However, in the case where the guide plate unit includes more than three guide plates, at least one of the guide plates may have a wider through hole, so that the through holes of different guide plates can be more easily aligned with each other.

[0099] For example, Fig.13 and Fig.14 The guide plate units shown all include four guide plates, including two limit guide plates 81 and two alignment guide plates 82. The limit guide plates 81 and the alignment guide plates 82 are alternately stacked, that is, the limit guide plates 81 overlap with the alignment guide plates 82 but not with the limit guide plates 81, and the alignment guide plates 82 overlap with the limit guide plates 81 but not with the alignment guide plates 82. The width W1 of the perforation 811 of the limit guide plate 81 matches the width W2 of the probe 25 and is used to control the movement of the probe 25. The width W3 of the perforation 821 of the alignment guide plate 82 is larger than the width W1 of the perforation 811 of the limit guide plate 81. This facilitates the mutual alignment of the perforations 811 and 821 of different guide plates to avoid the movement of the probe 25 being affected by the burrs of the perforations due to inaccurate perforation alignment. Fig.13 In the embodiment, the first through hole 821 is directly connected to the second through hole 811. The width W3 of the through hole 821 is larger, which is more conducive to alignment. Fig.14The width W3 of the middle through hole 821 is relatively small, and one through hole 821 is directly connected to only one through hole 811 . This allows the structural strength of the alignment guide plate 82 to be higher and still facilitates the alignment of the through holes 811 , 821 . Fig.13 and Fig.14 The limiting guide plate 81 and the alignment guide plate 82 and their through holes 811 and 821 and the probe 25 are only schematically shown to illustrate the aforementioned technical features. The other structural features of the limiting guide plate 81 and the alignment guide plate 82 are similar to those of the guide plates 71 and 72, and are not repeated here and are not shown in the figure. Fig.13 and Fig.14 middle.

[0100] See also Fig.15 and Fig.16 A fourth preferred embodiment of the utility model provides a probe seat 24, wherein the upper and lower guide plate units 30, 40 are not only the aforementioned adhesive multi-layer guide plate units 70, but also a support structure 50 is provided between the upper and lower guide plate units 30, 40, which can enhance the structural strength of the probe seat 24 and make the upper and lower guide plate units 30, 40 less likely to be deformed by force.

[0101] The upper and lower guide plate units 30 and 40 respectively include two guide plates 71 and 72 bonded to each other, similar to Figure 6 The guide plates 71 and 72 shown in the figure are different from the guide plates 71 and 72 shown in the figure. However, in this embodiment, the guide plate 71 of the upper guide plate unit 30 has an upper groove 37, and the guide plate 71 of the lower guide plate unit 40 has a lower groove 47. The upper and lower guide plate units 30 and 40 are connected to each other so that the upper groove 37 and the lower groove 47 together form a receiving space 242. The upper and lower guide plate units 30 and 40 can jointly define a probe area 74 and a non-probe area 75, and the non-probe area 75 is provided with a guide groove 725A and a glue dispensing groove 726. The guide plates 71 and 72 are bonded by an adhesive layer provided in the non-probe area 75. The adhesive layer is actually very thin and is therefore not shown. Fig.15 and Fig.16 middle.

[0102] The upper guide plate unit 30 includes an upper surface 33, a lower surface 34, and a plurality of upper through holes penetrating the upper surface 33 and the lower surface 34. Each of the upper through holes includes a Figure 6 The lower guide plate unit 40 includes an upper surface 43, a lower surface 44, and a plurality of lower through holes penetrating the upper surface 43 and the lower surface 44. Each lower through hole includes a Figure 6 The through holes 711 and 721 shown in the figure. The through holes 711 and 721 of the guide plates 71 and 72 are actually very small in diameter and are numerous. In order to simplify the figure and facilitate the description, Fig.15 and Fig.16 The perforations 711 , 721 are not shown.

[0103] The support structure 50 includes a plurality of support columns, wherein the plurality of support columns include a plurality of upper support columns 51 and a plurality of lower support columns 52. The plurality of support columns are arranged between the upper guide plate unit 30 and the lower guide plate unit 40. The lower surface 34 of the upper guide plate unit 30 and the upper surface 43 of the lower guide plate unit 40 described in the utility model refer to the surfaces where the support columns are located. The upper support column 51 extends integrally from the lower surface 34 of the upper guide plate unit 30, that is, the upper support column 51 is integrally connected with the guide plate 71 of the upper guide plate unit 30. The lower support column 52 extends integrally from the upper surface 43 of the lower guide plate unit 40, that is, the lower support column 52 is integrally connected with the guide plate 71 of the lower guide plate unit 40. Thus, the support column is integrally connected with the guide plate, so that the probe seat structure is simple, easy to manufacture and assemble, and has good structural strength. However, the support column is not limited to being integrally connected with the guide plate.

[0104] The upper and lower guide plate units 30 and 40 in the present invention are not limited to including the upper and lower grooves 37 and 47, that is, the support column does not have to be located in the groove, and the support column can be allowed to protrude from the connecting surfaces 36 and 46 of the upper and lower guide plate units 30 and 40. In this case, a hollow middle guide plate or other supportable structure can be set between the upper and lower guide plate units 30 and 40 to form a receiving space 242 for accommodating the support structure 50 and the probe 25. In other words, the receiving space 242 only needs to be formed around the plurality of support columns and between the upper and lower guide plate units 30 and 40. In addition to accommodating the support structure 50, the receiving space 242 is also used for the probe 25 to pass through. More specifically, the plurality of probes 25 of the probe card 20 pass through the upper through hole of the upper guide plate unit 30, the receiving space 242, and the lower through hole of the lower guide plate unit 40, respectively, and the support column can be arranged at the place where the probe 25 is not provided in the receiving space 242.

[0105] The upper support column 51 protrudes from the lower surface 34 of the upper guide plate unit 30 along the vertical axis (Z axis), and the lower support column 52 protrudes from the upper surface 43 of the lower guide plate unit 40 along the vertical axis (Z axis), and the upper support column 51 is in contact with the lower support column 52. The upper and lower support columns 51, 52 described in the utility model contact each other, including various contact modes, such as mutual abutment, mutual locking, mutual locking, etc., as long as the upper and lower support columns 51, 52 are not integrally formed with each other, but are connected together when the probe seat 24 is assembled.

[0106] Therefore, the upper and lower support columns 51, 52 are respectively protruded from the upper and lower guide plate units 30, 40 and contact each other. Such upper and lower support columns 51, 52 not only strengthen the structural strength of the upper and lower guide plate units 30, 40 respectively, but also when the upper and lower guide plate units 30, 40 are connected to each other, the upper and lower support columns 51, 52 jointly reinforce the weaker structural strength of the center of the probe seat 24 due to the provision of the accommodating space 242, so that the probe seat 24 has good structural strength even in the case of a large area and is not easily deformed by force, so as to reduce the deformation of the lower guide plate unit 40 caused by the reaction force generated by the object to be tested during the test.

[0107] In addition, the upper and lower guide plate units 30 and 40 are the adhesive multi-layer guide plate units 70 as described above, which can achieve good structural strength and flatness in a large area, and the upper and lower guide plate units 30 and 40 are provided with the guide groove 725A as described above, which can further ensure that the glue will not overflow into the probe area 74 and affect the probe 25.

[0108] Furthermore, the positions of the guide groove 725A and the adhesive area 727 defined by it in the upper and lower guide plate units 30 and 40 correspond to the upper and lower support columns 51 and 52 along the vertical axis, that is, the guide groove 725A and the adhesive area 727 defined by it are located directly above or below the upper and lower support columns 51 and 52, so that the upper and lower support columns 51 and 52 can directly produce a structural reinforcement effect on the location of the guide groove 725A and the adhesive area 727, making the guide plate unit less susceptible to deformation due to force. The guide groove 725A and the adhesive area 727 defined by it are not limited to completely corresponding to the upper and lower support columns 51 and 52 along the vertical axis. As long as at least a portion corresponds to the upper support column 51 and / or the lower support column 52 along the vertical axis, the structural reinforcement effect can be achieved through the upper support column 51 and / or the lower support column 52.

[0109] Finally, it must be stated again that the constituent elements disclosed in the aforementioned embodiments of the present invention are for illustrative purposes only and are not intended to limit the scope of patent protection of this case. Replacements or changes to other equivalent elements should also be covered by the scope of patent protection of this case.

Claims

1. A bonded multi-layer guide plate unit, used as a probe head of a detection system for performing functional testing on a device under test integrated on a semiconductor wafer, the bonded multi-layer guide plate unit comprising at least one probe area and at least one non-probe area, the probe area being used to penetrate a plurality of probes, characterized in that The adhesive multi-layer guide plate unit comprises: A plurality of guide plates, each of the guide plates comprising at least one joint surface and a plurality of through holes located in the at least one probe area, for allowing each of the probes to slidably pass through the through holes of each of the guide plates; At least one adhesive layer is used to bond the joint surfaces of the guide plates to each other, and the at least one adhesive layer is completely located in the at least one non-probe area.

2. The adhesive multi-layer guide plate unit according to claim 1, characterized in that: It comprises a plurality of probe areas arranged in a matrix, and a non-probe area located outside each of the probe areas; or it comprises a plurality of probe areas and a plurality of non-probe areas distributed in an alternating manner, and each of the probe areas and each of the non-probe areas are arranged in a matrix; or it comprises a plurality of non-probe areas arranged in a matrix, and a probe area, and the probe areas are distributed in a grid-like manner outside each of the non-probe areas and between each of the non-probe areas.

3. The adhesive multi-layer guide plate unit according to claim 1 or 2, characterized in that: The joint surface of each guide plate includes a first joint surface and a second joint surface that are bonded to each other, the first joint surface contains at least one protrusion located in the at least one non-probe area; the second joint surface is a plane, the protrusion of the first joint surface is bonded to the second joint surface by the adhesive layer, or the second joint surface contains at least one groove located in the at least one non-probe area, the protrusion of the first joint surface is bonded to the groove of the second joint surface by the adhesive layer.

4. The adhesive multi-layer guide plate unit according to claim 1 or 2, characterized in that: The joint surface of each guide plate includes a first joint surface and a second joint surface that are bonded to each other, and at least one of the first joint surface and the second joint surface is provided with at least one guide groove in the non-probe area, and the at least one guide groove defines a fabric glue area, and the at least one guide groove is located between the fabric glue area and the probe area, and the adhesive layer is located in the fabric glue area.

5. The adhesive multi-layer guide plate unit according to claim 4, characterized in that: The at least one guide groove includes a closed guide groove which is enclosed in a circle.

6. The adhesive multi-layer guide plate unit according to claim 4, characterized in that: The at least one guide groove includes a plurality of discontinuous guide grooves, and each of the discontinuous guide grooves discontinuously forms a circle.

7. The adhesive multi-layer guide plate unit according to claim 4, characterized in that: The at least one guiding groove includes at least one inner guiding groove forming a circle, and at least one outer guiding groove surrounding the at least one inner guiding groove.

8. The adhesive multi-layer guide plate unit according to claim 4, characterized in that: The at least one guide groove includes a plurality of inner guide grooves intermittently forming a circle, and a plurality of outer guide grooves intermittently surrounding each of the inner guide grooves. There is a gap between every two adjacent inner guide grooves, and the position of each of the outer guide grooves corresponds to each of the gaps.

9. The adhesive multi-layer guide plate unit according to claim 4, characterized in that: The guide groove passes through the guide plate to which it belongs.

10. The adhesive multi-layer guide plate unit according to claim 4, characterized in that: The guide groove is recessed from the joint surface where the guide groove is located.

11. The adhesive multi-layer guide plate unit according to claim 4, characterized in that: At least one of the first joint surface and the second joint surface is further provided with at least one glue-dotting groove in the non-probe area, and the at least one glue-dotting groove is located in the glue-dispensing area.

12. The adhesive multi-layer guide plate unit according to claim 4, characterized in that: The multiple guide plates include an inner guide plate and two outer guide plates, the inner guide plate includes two joint surfaces facing opposite directions, the two outer guide plates are respectively bonded to the joint surfaces of the inner guide plate, and the two outer guide plates are respectively provided with guide grooves, which penetrate the outer guide plates.

13. The adhesive multi-layer guide plate unit according to claim 1 or 2, characterized in that: The plurality of guide plates include at least two limit guide plates and at least one alignment guide plate. The at least two limit guide plates and the at least one alignment guide plate are alternately stacked. The width of the through hole of the alignment guide plate is greater than the width of the through hole of the limit guide plate.

14. The adhesive multi-layer guide plate unit according to claim 1 or 2, characterized in that: The joint surface of each guide plate includes a first joint surface and a second joint surface which are bonded to each other, and at least one of the first joint surface and the second joint surface is provided with at least one glue-dotting groove in the non-probe area.

15. A probe head, comprising: an upper guide plate unit; Lower the guide plate unit; A plurality of probes, each of the probes passes through the upper guide plate unit and the lower guide plate unit; Features: At least one of the upper guide plate unit and the lower guide plate unit is an adhesive multi-layer guide plate unit according to any one of claims 1 to 14.

16. A probe seat, characterized in that Contains: An upper guide plate unit having an upper surface, a lower surface, and a plurality of upper through holes penetrating the upper surface and the lower surface of the upper guide plate unit; A lower guide plate unit having an upper surface, a lower surface, and a plurality of lower through holes penetrating the upper surface and the lower surface of the lower guide plate unit; a supporting structure having a plurality of supporting columns, each of which is disposed between the upper guide plate unit and the lower guide plate unit; An accommodating space is formed around each of the support columns and is located between the upper guide plate unit and the lower guide plate unit, and the accommodating space is used for allowing a plurality of probes to pass through each of the upper through holes, through the accommodating space, and through each of the lower through holes respectively; Each of the support columns includes a plurality of upper support columns and a plurality of lower support columns, each of the upper support columns protrudes out of the lower surface of the upper guide plate unit along a vertical axis, and each of the lower support columns protrudes out of the upper surface of the lower guide plate unit along the vertical axis, and each of the upper support columns is in contact with each of the lower support columns respectively, and at least one of the upper guide plate unit and the lower guide plate unit is the adhesive multi-layer guide plate unit as described in claim 4, and the position of the guide groove of the adhesive multi-layer guide plate unit and at least a part of the glue area defined by it corresponds to at least one of the upper support column and the lower support column of the support structure along the vertical axis.

17. A probe head, characterized in that Contains: The probe holder as claimed in claim 16; A plurality of probes are provided, each of the probes passing through the upper guide plate unit and the lower guide plate unit.

18. A probe card for performing functional testing on an object to be tested, characterized in that The probe card comprises: an interface board configured to connect to a test machine; a space transformer associated with the interface board and adapted to provide a space transformation in spacing between contact pads formed on two opposing surfaces thereof; The probe head of claim 15 or 17, associated with the space transformer.

19. A detection system for detecting at least one object to be detected, wherein the object to be detected comprises a plurality of conductive contacts; characterized in that The detection system comprises: A carrying platform, used for carrying the at least one object to be tested; A probe card comprising the probe head as claimed in claim 15 or 17, for electrically connecting the probe card to the at least one object to be tested by contacting the conductive contacts of the at least one object to be tested with the probes of the probe head; A testing machine is electrically connected to the probe card, and is used for generating a testing signal for the probe card to transmit the testing signal to the at least one object to be tested, and receiving a result signal through the probe card and analyzing the result signal.

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