Graphite boat sticking point
By designing the buffer parts of high-strength ceramic materials in the graphite boat snap point, the wear and service life problems of the graphite boat snap point when inserting silicon wafers of different thicknesses are solved, and more efficient and safe silicon wafer processing and extension are achieved. The service life of the snap point.
Patent Information
- Application Number
- CN202420276228.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-04
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-02-04
AI Technical Summary
In the PECVD process, graphite boat jamming points are prone to scratches and damage when inserting silicon wafers of different thicknesses, resulting in scratches and grooves inside the jamming points grooves, which reduces service life, increases fragmentation rate, and affects production capacity.
Design a graphite boat clamp point, including clamp point cap, buffering part, clamping part and base. The buffering part is made of high-strength, high-temperature and wear-resistant ceramic materials to form arc surface or multi-cushioning surface structures to reduce Impact force and wear when the silicon wafer slides down.
Through the design of the buffer part, the efficiency and safety of silicon wafer processing are significantly improved, the wear of the jam point is reduced, the service life is extended, the risk of silicon wafer breakage is reduced, and the stability of automated insertion is improved.
Smart Images
Figure CN222462851U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the field of graphite boats, in particular to a graphite boat clamping point. Background Art
[0002] The principle of PECVD (Plasma Enhanced Chemical Vapor Deposition) is to ionize the gas containing the atoms that make up the thin film with the help of microwaves or radio frequencies to form plasma locally. Since plasma has strong chemical properties, it is easy to react, so the desired thin film is deposited on the substrate.
[0003] During the coating process of PECVD, a graphite boat made of graphite is used to hold silicon wafers. In order to stably fix the silicon wafers in the graphite boat, graphite boat clamping points for fixing the silicon wafers are provided on the wall of the graphite boat.
[0004] With the improvement of raw silicon wafer cutting technology and solar cell manufacturing equipment technology, silicon wafers of different thickness specifications have appeared in the raw silicon wafer market, resulting in frequent switching of silicon wafers of different specifications for production on the production line. The automation of the PECVD process will cause scratches and damage to the graphite boat when inserting and removing wafers from the graphite boat, resulting in scratches and grooves inside the graphite boat card point grooves. If silicon wafers of different thickness specifications are switched, it will make automated insertion difficult, the service life of the graphite boat card point will be reduced, the fragmentation rate will increase, and production capacity will be affected. Utility Model Content
[0005] In view of the above problems, the utility model discloses a graphite boat clamping point, comprising a clamping point cap, a buffer part, a clamping part and a base which are sequentially connected into an integrated structure;
[0006] The clamping point cap is connected to the buffer part to form an obtuse angle, and the buffer part is connected to the clamping part to form an obtuse angle;
[0007] The clamping point cap and the buffering part on one side, and the base on the other side and the clamping part in the middle form a groove.
[0008] Furthermore, the buffering portion is a buffering surface, and the buffering surface is respectively connected to the surfaces of the clamping point cap and the clamping portion.
[0009] Furthermore, the included angle between the buffer surface and the surface of the card point cap is not less than 150°.
[0010] Furthermore, the buffer surface is made of a material that is high-strength, high-temperature resistant and has good wear resistance.
[0011] Furthermore, the buffer surface is made of ceramic material.
[0012] Furthermore, the buffering portion is a curved surface.
[0013] Furthermore, the connection points of the arc surface and the clamping point cap and the connection points of the clamping portion are connected with auxiliary lines, and the angle between the auxiliary line and the buffer portion is not less than 150°.
[0014] Furthermore, the buffering portion includes a first buffering surface and a second buffering surface, and an angle between the first buffering surface and the second buffering surface is not less than 175°.
[0015] Furthermore, the first buffer surface is connected to the clamping point cap, and the second buffer surface is connected to the first buffer surface and the clamping portion;
[0016] An auxiliary line is formed to connect the connection point between the first buffer surface and the clamping point cap, and the connection point between the second buffer surface and the clamping portion. The angle between the auxiliary line and the buffer surface is not less than 150°.
[0017] Furthermore, the first buffer surface is made of elastic material, and the second buffer surface is made of rigid material.
[0018] The beneficial effect of the utility model is that the buffer part is provided between the clamping point cap and the clamping seat, which can significantly improve the efficiency and safety of silicon wafer processing. The buffer part reduces the impact when the silicon wafer directly contacts the clamping point cap and the clamping seat, thereby reducing the wear of these parts, extending the service life of the graphite boat clamping point, and reducing the risk of silicon wafer damage during processing.
[0019] Furthermore, the presence of the buffer portion enables the silicon wafer to slide more smoothly into the card connector when the automated device is plugging and unplugging it, thereby reducing the possibility of the silicon wafer getting stuck at the connection between the card point cap and the card connector.
[0020] Other features and advantages of the utility model will be described in the following description, and partly become apparent from the description, or understood by implementing the utility model. The purpose and other advantages of the utility model can be realized and obtained by the structures indicated in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0022] Figure 1A graphite boat stuck point structure diagram according to the prior art is shown;
[0023] Figure 2 A graphite boat card point structure diagram according to an embodiment of the utility model is shown;
[0024] Figure 3 A graphite boat card point structure diagram according to an embodiment of the utility model is shown;
[0025] Figure 4 A partial structural diagram of a graphite boat clamping point according to an embodiment of the utility model is shown;
[0026] Figure 5 A graphite boat card point structure diagram according to an embodiment of the utility model is shown;
[0027] Figure 6 A partial structural diagram of a graphite boat clamping point according to an embodiment of the utility model is shown.
[0028] In the attached figure:
[0029] 11 - old-style clamping cap, 12 - old-style clamping part, 13 - old-style base;
[0030] 21 - card point cap, 22 - buffer part, 23 - card connection part, 24 - base. DETAILED DESCRIPTION
[0031] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0032] like Figure 1 The commonly used graphite boat clamping point shown is a U-shaped clamping point, which is formed into a U-shaped structure by the old clamping point cap 11, the old clamping part 12 and the old base 13. When in use, the automated equipment inserts and removes the wafer in the graphite boat to prevent edge collapse and fragmentation. Generally, when the robot runs to the silicon wafer 3-5mm away from the clamping point, it chooses to break the vacuum to allow the silicon wafer to automatically slide along the inclined surface of the old clamping point cap 11 to the inside of the clamping point. However, long-term insertion and removal of wafers causes wear and tear between the connection between the old clamping point cap 11 and the old clamping part 12, and grooves appear. When switching wafer sources of different thicknesses, the silicon wafer is easily stuck in the worn groove, resulting in failure to remove the wafer normally, which reduces the service life of the graphite boat clamping point, increases the fragmentation rate, and affects the production capacity.
[0033] The present embodiment discloses a graphite boat clamping point, which comprises a clamping point cap 21, a buffer part 22, a clamping part 23 and a base 24 which are connected in sequence as an integrated structure; the clamping point cap 21 and the buffer part 22 are connected to form an obtuse angle, and the buffer part 22 and the clamping part 23 are connected to form an obtuse angle; the clamping point cap 21 and the buffer part 22 on one side, and the base 24 on the other side and the clamping part 23 in the middle form a groove.
[0034] In an exemplary embodiment, the specific structure reference Figure 2 The buffer part 22 is a buffer surface, which is arranged between the clamping cap 21 and the clamping part 23. The buffer surface can effectively reduce the impact force and wear degree of the connection part between the clamping cap 21 and the clamping part 23 during the sliding process of the silicon wafer after breaking the vacuum. In this embodiment, the overall angle of the inclined surface is 30°.
[0035] During use, when the silicon wafer is carried by the robot and approaches the stuck point (the distance is about 3-5mm), the operator or the automated system chooses to break the vacuum, at which time the adsorption force on the silicon wafer is reduced or released, and the silicon wafer falls into the stuck point.
[0036] In this embodiment, the silicon wafer will naturally slide down along the buffer surface. Compared with the prior art in which the silicon wafer directly contacts the connection between the card point cap 21 and the clamping part 23, in this embodiment, when the silicon wafer slides down along the inclined surface of the card point cap 21, it first contacts the buffer part 22, absorbing the impact force generated by the silicon wafer during the sliding process, and reducing the force directly impacting the card point cap 21 and the clamping part 23. Secondly, due to the design of the buffer surface, the friction of the silicon wafer is reduced when passing through this area, which reduces the possibility of forming wear grooves during long-term use. Finally, the silicon wafer slides smoothly into the inside of the clamping part 23.
[0037] In some specific embodiments, the buffer surface is a material with high strength, high temperature resistance and good wear resistance. For example, high-performance ceramic materials or specially treated synthetic resins can be used. These materials can not only withstand the impact force generated when the silicon chip slides, but also show excellent wear resistance during long-term use. The above specific structure is only an example and does not limit this embodiment.
[0038] In another specific exemplary embodiment, the buffer portion 22 is a curved surface. Figure 3 It is understood that in this exemplary embodiment, the arc surface structure can reduce the silicon wafer from getting stuck in the worn groove during the wafer removal process, and can prevent the silicon wafer from getting stuck in the worn groove.
[0039] Continue to refer Figure 4It is understood that the arc surface structure can provide a smooth and continuous guiding surface for guiding the silicon wafer to slide along the card cap 21 to the clamping part 23 after breaking the vacuum. Compared with the straight or angular structure in the prior art or the aforementioned embodiment, the silicon wafer is easily stuck in the groove formed by wear during the sliding process, especially when the card point is worn due to long-term use. In contrast, the continuous curve shape of the arc surface provides a smoother and natural path, so that the silicon wafer will hardly contact and collide with any sharp or uneven edges during the sliding process, avoiding the card part 23 from being worn due to long-term impact. The direct impact of the silicon wafer on the key connection point is reduced, thereby reducing long-term wear and extending the service life of the graphite boat card point.
[0040] In addition, the arc-shaped buffer surface can prevent the silicon wafer from getting stuck in the worn groove and being unable to be removed normally. It can also provide more convenient and convenient operation during the automatic wafer removal process, and is suitable for the production line switching of silicon wafers of different thicknesses and signals. This structural design greatly improves the service life of the graphite boat card point, reduces the fragmentation rate of silicon wafers, and also reduces the alarm rate of equipment, thereby providing higher efficiency and reliability in the entire silicon wafer processing process.
[0041] In another exemplary embodiment, the buffer portion 22 includes a first buffer surface and a second buffer surface. Figure 5-6 It is understood that in this embodiment, the first buffer surface and the second buffer surface of the card point cap 21 are connected with the card connection portion 23, so that the silicon wafer can smoothly enter the groove.
[0042] When in use, when the silicon wafer slides off the clamping cap 21, the first buffer surface first contacts the silicon wafer to provide preliminary deceleration and direction guidance. The buffer surface at this stage can be designed to be a high temperature resistant material with a certain elasticity to absorb the initial impact force when the silicon wafer slides off, and reduce the direct contact between the silicon wafer and the clamping cap 21 and the clamping portion 23.
[0043] Then, the silicon chip continues to slide and contacts the second buffer surface, which is a rigid surface to ensure that the silicon chip can be stably stuck in the stuck point.
[0044] The advantage of this double buffer surface structure is that it provides more levels of protection and guidance for the handling of silicon wafers. The wear caused by the direct impact of the silicon wafer on the card point cap 21 and the clamping part 23 is reduced, which not only prolongs the service life of the graphite boat card point, but also reduces the possibility of silicon wafer damage. Secondly, this staged buffer design makes the movement of the silicon wafer more stable and controllable during the entire sliding process, which is crucial to ensure the integrity and accurate placement of the silicon wafer.
[0045] In the above embodiments, the buffering portion 22 is regarded as an inclined surface, which is not limited to a straight slope or a stepped angle of the inner cut surface, but can be any structure in the above embodiments. The angle of the inclined surface does not exceed 30°. The specific inclination angle can be referred to Figure 4 , 6 The auxiliary angle lines shown can be used for understanding.
[0046] In summary, the structure of the aforementioned embodiment is also applicable to production line switching of silicon wafers of various different thicknesses.
[0047] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. A graphite boat card point, characterized in that: It includes a clamping point cap, a buffer part, a clamping part and a base which are sequentially connected into an integrated structure; The clamping point cap is connected to the buffer part to form an obtuse angle, and the buffer part is connected to the clamping part to form an obtuse angle; The clamping point cap and the buffering part on one side, and the base on the other side and the clamping part in the middle form a groove.
2. The graphite boat clamping point according to claim 1, characterized in that: The buffering part is a buffering surface, and the buffering surface is connected to the surfaces of the clamping point cap and the clamping part respectively.
3. The graphite boat clamping point according to claim 2, characterized in that: The included angle between the buffer surface and the surface of the card point cap is not less than 150°.
4. The graphite boat clamping point according to claim 2, characterized in that: The buffer surface is made of a material that is high-strength, high-temperature resistant and has good wear resistance.
5. The graphite boat clamping point according to claim 4, characterized in that: The buffer surface is made of ceramic material.
6. The graphite boat clamping point according to claim 1, characterized in that: The buffering part is a cambered surface.
7. The graphite boat clamping point according to claim 6, characterized in that: An auxiliary line is connected between the connection point between the arc surface and the clamping point cap and the connection point of the clamping part, and the angle between the auxiliary line and the buffer part is not less than 150°.
8. The graphite boat clamping point according to claim 1, characterized in that: The buffering part includes a first buffering surface and a second buffering surface, and the angle between the first buffering surface and the second buffering surface is not less than 175°.
9. The graphite boat clamping point according to claim 8, characterized in that: The first buffer surface is connected to the clamping point cap, and the second buffer surface is connected to the first buffer surface and the clamping portion; An auxiliary line is formed to connect the connection point between the first buffer surface and the clamping point cap, and the connection point between the second buffer surface and the clamping portion. The angle between the auxiliary line and the buffer surface is not less than 150°.
10. The graphite boat clamping point according to claim 8, characterized in that: The first buffer surface is made of elastic material, and the second buffer surface is made of rigid material.