Calibration jig for position calibration of alignment fixture and wafer bearing device

Abstract

The utility model discloses a calibration jig for position calibration of an alignment fixture and a wafer bearing device. The calibration jig is suitable for an alignment clamp of a wafer bearing device, the wafer bearing device comprises a bearing table and the alignment clamp, the bearing table is located in a central area, and a supporting column positioning column is arranged in the center of the supporting seat bearing table. According to the calibration jig, the circle center of the disc of the calibration jig is positioned at the center of the bearing table through the inner groove matched with the positioning column at the center of the bearing table on the wafer bearing device, so that the calibration speed and accuracy of the position of the alignment jig are improved, and the relative positions of the wafer and the wafer bearing device are concentric circles; therefore, the frequency of eliminating errors by human intervention in the wafer processing process is reduced, the wafer processing efficiency is improved, and the labor cost of wafer processing is saved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a calibration fixture and a wafer carrying device for calibrating the position of an alignment fixture. Background Art

[0002] With the continuous development of semiconductor technology, the diameter of wafers is getting larger and larger. As the integration of integrated circuits continues to increase, the processing accuracy requirements of wafers are getting higher and higher. This requires the precise positioning of the position and center of the wafer when processing the wafer. At the same time, there are many steps in the wafer processing process, and the wafer needs to be frequently transferred and placed, which also puts high requirements on the speed of wafer positioning and alignment. In the process of semiconductor device processing, an alignment fixture is needed to position the wafer on the machine. After determining the position of the wafer, the alignment fixture fixes the wafer for processing. This requires the alignment fixture to be calibrated in advance, and the position of the wafer is determined by the calibrated alignment fixture position.

[0003] The existing alignment fixture uses a baffle for accurate positioning. The baffle is the same size as the wafer, but the use of the baffle to calibrate the alignment fixture is cumbersome and cannot guarantee accurate positioning, which will cause errors in the calibration of the alignment fixture. When the alignment fixture is used to clamp the wafer, the wafer position deviates from the predetermined processing position, and the wafer fails to find the edge or has an edge-finding error, which increases the frequency of human intervention to eliminate errors during wafer processing, reduces wafer processing efficiency, and increases the labor cost of wafer processing. Utility Model Content

[0004] In order to solve the problems in the prior art, the present application provides a calibration fixture for calibrating the position of an alignment fixture, which is suitable for an alignment fixture of a wafer carrying device, wherein the wafer carrying device includes a carrying platform and the alignment fixture, the carrying platform is located in a central area, and a positioning column is arranged at the center of the carrying platform, and the calibration fixture includes: a disk, the diameter of the disk is the same as the diameter of a wafer predetermined to be clamped by the alignment fixture; a base, which is arranged on one side of the central area of ​​the disk and connected to the disk, wherein an inner groove is provided on a side of the base facing away from the disk, the center of the disk is located on the central axis of the inner groove, and the inner groove is constructed to match the positioning column so that the positioning column can be embedded in the inner groove.

[0005] Exemplarily, at least one through hole is provided on the disc, and the through hole is located on the outer side of the base.

[0006] Exemplarily, there are a plurality of through holes, and the plurality of through holes are spaced apart on the same radius of the disk.

[0007] Exemplarily, the base is cylindrical, and the shape of the inner groove is cylindrical.

[0008] According to another aspect of the present application, a wafer carrying device is also provided, the device comprising: a carrying platform, a mounting seat is provided in the central area of ​​the carrying platform, a positioning column is arranged at the center of the mounting seat; an alignment fixture is movably connected to the carrying platform; and a calibration jig as described above, the calibration jig is detachably arranged on the mounting seat, and the positioning column is suitable for being embedded in the inner groove of the calibration jig.

[0009] Exemplarily, the alignment fixture includes a plurality of clamping parts, which are arranged at intervals on four edges of the supporting platform, and the clamping parts are suitable for clamping the disc of the calibration fixture.

[0010] Exemplarily, each of the clamping portions includes an openable and closable clamp, a connecting portion and a supporting portion, the connecting portion being movably connected to the supporting platform, the clamp being connected to an end of the connecting portion away from the center of the supporting platform via the supporting portion, the opening of the clamp facing the center of the supporting platform, and the connecting portion being configured to move inward or outward along the radial direction of the supporting platform.

[0011] Exemplarily, the connecting portion is connected to the supporting platform via a fixing portion, a fastening screw is provided on the fixing portion, and the position of the through hole on the disk can correspond one-to-one to the position of the fastening screw thereunder.

[0012] Exemplarily, the bearing device further includes a driving device, which is transmission-connected to the mounting seat and is used to drive the bearing platform to rotate axially.

[0013] Exemplarily, the carrying device further comprises a cap, which is detachably disposed on the carrying platform, and the cap has a supporting surface that matches a predetermined size of a wafer to be clamped, and the supporting surface is suitable for placing the wafer.

[0014] The calibration jig for calibrating the position of the alignment fixture according to the embodiment of the present application positions the center of the circular disc of the calibration jig at the center of the carrier platform through an inner groove that matches the positioning column at the center of the carrier platform on the wafer carrier, thereby improving the calibration speed and accuracy of the position of the alignment fixture and making the relative positions of the wafer and the wafer carrier concentric circles, thereby reducing the frequency of human intervention to eliminate errors during wafer processing, improving wafer processing efficiency, and saving the labor cost of wafer processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0016] Figure 1 A schematic diagram showing an edge-finding error of a conventional alignment fixture is shown;

[0017] Figure 2 A schematic diagram of the structure of a calibration fixture according to an embodiment of the present application is shown;

[0018] Figure 3 A schematic structural diagram of a wafer carrier according to an embodiment of the present application is shown;

[0019] Figure 4 A schematic structural diagram of an alignment fixture according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0020] Next, the present invention will be more fully described in conjunction with the accompanying drawings, in which embodiments of the present invention are shown. However, the present invention can be implemented in different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, providing these embodiments will make the disclosure thorough and complete and fully convey the scope of the present invention to those skilled in the art. In the accompanying drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. The same reference numerals throughout represent the same elements.

[0021] It should be understood that when an element or layer is referred to as being "on," "adjacent," "connected to," or "coupled to" another element or layer, it may be directly on, adjacent, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or portion from another element, component, region, layer, or portion. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer, or portion discussed below may be represented as a second element, component, region, layer, or portion.

[0022] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," and the like may be used herein for ease of description to describe the relationship of one element or feature shown in the figures to other elements or features. It should be understood that the spatially relative terms are intended to include different orientations of the device in use and operation in addition to the orientations shown in the figures. For example, if the device in the drawings is flipped, then elements or features described as "under" or "beneath" or "below" the other elements would be oriented "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0023] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present invention. When used herein, the singular forms "a", "an", and "said / the" are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0024] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art in the field of the present invention. It will also be understood that terms such as those defined in commonly used dictionaries should be understood to have a meaning consistent with their meaning in the context of the relevant art and / or this specification, and should not be interpreted in an ideal or overly formal sense unless expressly defined as such herein.

[0025] In order to fully understand the present invention, detailed steps and structures will be presented in the following description to illustrate the technical solution proposed by the present invention. The preferred embodiments of the present invention are described in detail below, but in addition to these detailed descriptions, the present invention may also have other implementations.

[0026] like Figure 1As shown, the wafer 101 is placed on the wafer carrier 100 and clamped by an alignment fixture. Before the wafer is placed on the wafer carrier 100, it is usually necessary to calibrate the position of the alignment fixture. When an error occurs in the calibration of the alignment fixture, the position of the wafer deviates from the predetermined processing position when the alignment fixture is used to clamp the wafer, and the center 103 of the wafer 101 deviates from the center 102 of the wafer carrier 100, which easily causes the wafer to fail to find the edge or find an error. In one example, an edge finder is provided in the wafer carrier 100. The edge finder includes a light emitting device and a photoelectric sensor. The light emitting device emits light at the edge of the wafer 101 and in a direction perpendicular to the wafer 101. For simplicity, the light irradiation area 104 is shown as a rectangle. The wafer is located between the photoelectric sensor and the light emitting device. The edge finder performs edge finding when the wafer carrier rotates the wafer. When there is no error in the calibration of the alignment fixture and the wafer is in the predetermined processing position when the alignment fixture is used to clamp the wafer, the wafer keeps rotating around its center during rotation, and its rotation trajectory is basically circular. The light received by the photoelectric sensor during the rotation of the wafer remains basically unchanged, the light emitted by the light emitting device to the photoelectric sensor is partially blocked by the wafer, and the output electrical signal (such as a voltage signal) is usually within a predetermined range and remains basically unchanged; however, when there is an error in the calibration of the alignment fixture and the wafer deviates from the predetermined processing position when the alignment fixture is used to clamp the wafer, for example, its rotation center deviates from the center of the wafer, so that its rotation trajectory appears to be elliptical, and the part of the light emitted by the light emitting device to the photoelectric sensor that is blocked by the wafer changes, causing the light received by the photoelectric sensor during the rotation of the wafer to change, and the output electrical signal is not within the predetermined range, thereby causing edge finding errors or edge finding failures.

[0027] Combine the following Figure 2 A calibration jig for calibrating the position of an alignment fixture according to an embodiment of the present application is described. In order to at least partially solve the aforementioned technical problems, as Figure 2 As shown, the present application provides a calibration fixture 200 for calibrating the position of an alignment fixture, which is suitable for an alignment fixture of a wafer carrying device. The wafer carrying device includes a carrying platform and an alignment fixture, the carrying platform is located in the central area, and a positioning column is arranged at the center of the carrying platform. The calibration fixture 200 includes: a disk 201, the diameter of the disk 201 is the same as the diameter of the wafer to be clamped by the alignment fixture; a base 202, which is arranged on one side of the central area of ​​the disk 201 and connected to the disk 201, wherein an inner groove 203 is arranged on a side of the base 202 facing away from the disk 201, the center of the disk 201 is located on the central axis of the inner groove 203, and the inner groove 203 is constructed to match the positioning column so that the positioning column can be embedded in the inner groove.

[0028] The calibration jig for calibrating the position of the alignment fixture according to the embodiment of the present application positions the center of the circular disc of the calibration jig at the center of the carrier platform through an inner groove that matches the positioning column at the center of the carrier platform on the wafer carrier, thereby improving the calibration speed and accuracy of the position of the alignment fixture and making the relative positions of the wafer and the wafer carrier concentric circles, thereby reducing the frequency of human intervention to eliminate errors during wafer processing, improving wafer processing efficiency, and saving the labor cost of wafer processing.

[0029] In one example, the diameter of the disk 201 can be determined according to the diameter of the wafer to be clamped by the alignment fixture. The diameter of the disk 201 can be substantially the same as the diameter of the wafer to be clamped. For example, when the diameter of the wafer to be clamped by the alignment fixture is 150mm, 200mm, 300mm or 450mm, the diameter of the disk 201 is correspondingly equal to 150mm, 200mm, 300mm or 450mm. It should be noted that the same diameter can also be slightly deviated within the error tolerance range. In one example, the bottom surface area and shape of the inner groove 203 are equal to the bottom surface area and shape of the positioning column. In one example, the diameter of the wafer to be clamped by the alignment fixture is 200mm, the diameter of the disk 201 is the same as the diameter of the wafer to be clamped by the alignment fixture, the diameter of the disk 201 is 200mm, and the inner groove 203 corresponds to the positioning column to accurately locate the center of the disk. In one example, the base 202 is cylindrical. In one example, the base 202 may also include a cuboid, a polygonal column, or a trapezoid. Exemplarily, the inner groove 203 is cylindrical. In one example, the inner groove 203 and the positioning column are both cylindrical, and the bottom diameters of the inner groove 203 and the positioning column are equal, which may be 4 mm, 5 mm, 6 mm, 7 mm, or any size that enables the base 202 to stably support the disk 201 and enables the inner groove 203 to accurately correspond to the position of the positioning column.

[0030] Exemplarily, at least one through hole is provided on the disk, and the through hole is located on the outer side of the base.

[0031] Exemplarily, there are multiple through holes, and the multiple through holes are spaced apart on the same radius of the disk.

[0032] like Figure 2 As shown, a through hole 204 and a through hole 205 are provided along the radius of the disk 201 . The through holes 204 and 205 are both provided on the disk 201 corresponding to the outer side of the base 202 , and the through holes 204 and the through holes 205 are located on the same radius of the disk 201 .

[0033] According to another aspect of the present application, a wafer carrying device is also provided, such as Figure 3As shown, the carrier device 300 includes: a carrier platform 301 and an alignment fixture 304, the central area of ​​the carrier platform 301 has a mounting seat 302, and a positioning column 303 is arranged at the center of the mounting seat 302; the alignment fixture 304 is movably connected to the carrier platform 301; as the calibration fixture 200 described above, the calibration fixture 200 is detachably arranged on the mounting seat 302, and the positioning column 303 is suitable for being embedded in the inner groove 203 of the calibration fixture 200. In one example, when the calibration fixture 200 is arranged on the mounting seat 302 and the positioning column is embedded in the inner groove, the inner groove 203 and the positioning column 303 form an interference fit. In another example, relative rotational motion can be generated between the calibration fixture 200 and the alignment fixture 304, for example, the calibration fixture can be rotated around its own central axis, or the alignment fixture 304 can be rotated around the central axis of the carrier platform, wherein the central axis of the carrier platform and the central axis of the calibration fixture are coaxial.

[0034] For example, the alignment fixture 304 includes a plurality of clamping parts, which are arranged at intervals on the edges of the carrier platform, and the clamping parts are used to clamp the disc of the calibration jig. When the calibration jig is used to calibrate the position of the alignment fixture 304, the clamping part can be used to clamp the disc, and when the alignment fixture 304 is used in the wafer processing process, it is used to clamp the wafer.

[0035] In one example, the alignment fixture 304 includes a plurality of clamping portions 305, such as Figure 3 As shown, the clamping parts 305 are arranged at intervals around the edges of the carrier platform 301. When the alignment fixture 200 is set on the mounting seat 302, the clamping parts 305 are used to clamp the disc 201 of the alignment fixture 200, and when the wafer carrier 300 carries the wafer to be processed, the clamping parts 305 are used to clamp the wafer to be processed. In one example, a plurality of clamping parts 305 are arranged at equal intervals along the circumference of the carrier platform. When the alignment fixture 304 includes two clamping parts 305, the positions of the two clamping parts 305 correspond to the two ends of the same diameter of the disc. When the alignment fixture 304 includes three clamping parts 305, the three clamping parts 305 are arranged at equal intervals around the edges of the carrier platform 301. In some other embodiments, the plurality of clamping parts can also be arranged at unequal intervals along the circumference of the carrier platform.

[0036] Exemplarily, each clamping portion includes an openable and closable clamp, a connecting portion and a supporting portion, the connecting portion is movably connected to the carrier platform, the clamp is connected to an end of the connecting portion away from the center of the carrier platform through the supporting portion, the opening of the clamp faces the center of the carrier platform, and the connecting portion is configured to move inward or outward along the radial direction of the carrier platform, thereby adjusting the position of the clamping portion. Figure 4As shown, the clamping portion 305 includes an openable clamp 305a, a connecting portion 305b and a supporting portion 305c, wherein the clamp 305a is connected to an end of the connecting portion 305b away from the center of the carrier 301 through the vertical supporting portion 305c. In one example, the opening of the clamp 305a in the clamping portion 305 faces the center of the carrier 301, so that the clamping portion can clamp the wafer or alignment jig on the carrier.

[0037] In some embodiments, the wafer carrier further includes a controller (not shown). When the alignment jig 200 or the wafer to be processed is set on the carrier 301, the controller can control the opening and closing of the clamps 305a of the plurality of clamping parts 305, so that the clamps in the closed state clamp the disk 201 of the alignment jig 200 or the wafer to be processed to fix the alignment jig 200 or the wafer to be processed, and when the clamps are opened, they can be used to place or remove the alignment jig 200 or the wafer on the carrier. In one example, the connecting portion is configured to move inward or outward along the radial direction of the carrier 301, so that each clamping portion 205 can move inward or outward along the radial direction of the carrier 301.

[0038] Exemplarily, the connecting portion is connected to the bearing platform through a fixing portion, and a fastening screw is provided on the fixing portion. The position of the through hole on the disk can correspond to the position of the fastening screw below it one by one, so that the user can operate the fastening screw through the through hole, so that the fastening screw can be loosened when the position of the alignment fixture needs to be adjusted, so that the position of the alignment fixture can be adjusted radially, and the screw is locked when the alignment fixture is adjusted to a suitable position to fix the position of the alignment fixture. Optionally, the fastening screw is located on the outside of the connecting portion. In an example, the connecting portion 305b on the clamping portion 305 is connected to the bearing platform through a fixing portion, and the fixing portion is provided with two fastening screws 33333. When the clamping portion 305 moves to the alignment position along the radial direction of the bearing platform 301, a screwdriver can be used to pass through the through hole 204 and the through hole 205 on the disk 201 to lock the two fastening screws, so that the connecting portion is fixed on the bearing platform through the fixing portion and cannot move. In an example, one or more fastening screws can be provided on the connecting portion, and the number of fastening screws is less than or equal to the number of through holes on the disk.

[0039] Exemplarily, the bearing device further comprises a driving device, which is connected to the mounting seat for driving the bearing platform to rotate around the axial direction. In one example, the mounting seat is connected to the driving device. In one example, Figure 3 As shown, the mounting seat 302 is connected to the driving device through a plurality of screw fasteners 306, and the screw fasteners 306 protrude from the surface of the mounting seat 302, and the base 202 of the calibration fixture 200 can be on a portion of the surface of the mounting seat defined by the plurality of screw fasteners 306. It is worth mentioning that, for ease of understanding, Figure 3In the figure, only the partial structure of the supporting platform is shown.

[0040] Exemplarily, the base 202 of the calibration jig 200 is cylindrical, and the bottom diameter of the base 202 is smaller than the diameter of the circle where the plurality of screw fasteners 306 are located, so that when the calibration jig 200 is set on the mounting seat 302, the base 202 can be stably set on the mounting seat 302 without covering the portion of the screw fasteners 306 protruding from the surface of the mounting seat 302. In one example, the bottom diameter of the base 202 can also be greater than or equal to the diameter of the circle where the plurality of screw fasteners 306 are located, and the base 202 is provided with a plurality of screw inner grooves, so that when the calibration jig 200 is set on the mounting seat 302, the portion of the screw fasteners 306 protruding from the surface of the mounting seat 302 corresponds to the position of the screw inner groove on the base 202, so that the base 202 can be stably set on the mounting seat 302. In one example, the bottom surface of the base 202 can also be rectangular, triangular, etc., and the multiple screw fasteners 306 do not need to be located on the same circle. The bottom surface of the base 202 is provided with multiple screw inner grooves, so that when the calibration fixture 200 is set on the mounting seat 302, the portion of the screw fastener 306 protruding from the surface of the mounting seat 302 corresponds to the position of the screw inner groove on the base 202, so that the base 202 can be stably set on the mounting seat 302. In one example, the driving device includes a rotating motor, and when the rotating motor is powered on and starts to rotate, the driving device drives the carrier 301 to rotate around the axial direction of the carrier. In one example, the speed of the carrier 301 rotating around the axial direction can be adjusted by adjusting the speed of the rotating motor.

[0041] Exemplarily, the carrying device further includes a cap, which is detachably arranged on the carrying platform 301, and the cap has a supporting surface that matches the size of the wafer to be clamped, and the supporting surface is suitable for placing the wafer. In one example, the cap includes a supporting surface and a cap base, the supporting surface is circular, and the diameter can be equal to the diameter of the wafer to be clamped, or can be larger than the diameter of the wafer to be clamped, and there is a preset interval between the supporting surface of the cap and the carrying platform.

[0042] In one example, when the cap is set on the carrier, the cap base is connected to the carrier through a fastener, and when the driving device drives the carrier to rotate around the axis, the cap rotates with the carrier. Alternatively, in other embodiments, the cap can also be connected to the carrier by one or more connection methods such as snap-fit, bonding or welding. In one example, when the wafer to be processed is set on the carrier device 300, the wafer to be processed is placed on the cap, and the clamping part, clamping part and clamping part of the carrier clamp the wafer to be processed, and when the driving device drives the carrier to rotate around the axis, the wafer to be processed rotates with the carrier.

[0043] The calibration jig for calibrating the position of the alignment fixture according to the embodiment of the present application positions the center of the circular disc of the calibration jig at the center of the carrier platform through an inner groove that matches the positioning column at the center of the carrier platform on the wafer carrier, thereby improving the calibration speed and accuracy of the position of the alignment fixture and making the relative positions of the wafer and the wafer carrier concentric circles, thereby reducing the frequency of human intervention to eliminate errors during wafer processing, improving wafer processing efficiency, and saving the labor cost of wafer processing.

[0044] It should be noted that the above embodiments illustrate rather than limit the present application, and that those skilled in the art may design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets shall not be construed as a limitation on the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "one" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present application may be implemented with the aid of hardware comprising a number of different elements and with the aid of a suitably programmed computer. In a unit claim listing a number of vehicle-mounted systems, several of these vehicle-mounted systems may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words may be interpreted as names.

[0045] The above is only a specific implementation method or description of a specific implementation method of the present application, and the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. The protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A calibration fixture for calibrating the position of an alignment fixture, characterized in that: An alignment fixture suitable for a wafer carrier, the wafer carrier comprising a carrier platform and the alignment fixture, the carrier platform is located in a central area, a positioning column is provided at the center of the carrier platform, and the calibration fixture comprises: a disk, the diameter of the disk being the same as the diameter of the wafer to be clamped by the alignment fixture; A base is arranged on one side of the central area of ​​the disc and connected to the disc, wherein an inner groove is provided on a side of the base facing away from the disc, the center of the disc is located on the central axis of the inner groove, and the inner groove is constructed to match the positioning column so that the positioning column can be embedded in the inner groove.

2. The calibration jig according to claim 1, characterized in that: The disc is provided with at least one through hole, and the through hole is located on the outer side of the base.

3. The calibration jig according to claim 2, characterized in that: There are multiple through holes, and the multiple through holes are arranged at intervals on the same radius of the disk.

4. The calibration fixture according to claim 1, characterized in that: The base is cylindrical, and the inner groove is cylindrical.

5. A wafer carrying device, characterized in that: The device comprises: A carrying platform, wherein a central area of ​​the carrying platform has a mounting seat, and a positioning column is arranged at the center of the mounting seat; an alignment fixture movably connected to the carrier platform; According to any one of claims 1 to 4, the calibration jig is detachably mounted on the mounting seat, and the positioning column is adapted to be embedded in an inner groove of the calibration jig.

6. The device according to claim 5, characterized in that The alignment fixture comprises a plurality of clamping parts, which are arranged at intervals on the edges of the supporting platform, and the clamping parts are suitable for clamping the disc of the calibration fixture.

7. The device according to claim 6, characterized in that Each of the clamping parts includes an openable and closable clip, a connecting part and a supporting part, the connecting part is movably connected to the supporting platform, the clip is connected to an end of the connecting part away from the center of the supporting platform through the supporting part, the opening of the clip faces the center of the supporting platform, and the connecting part is configured to move inward or outward along the radial direction of the supporting platform.

8. The device according to claim 7, characterized in that The connecting part is connected to the supporting platform through a fixing part, and a fastening screw is arranged on the fixing part. The position of the through hole on the disk can correspond to the position of the fastening screw below the disk one by one.

9. The device according to claim 5, characterized in that It also includes a driving device, which is transmission-connected to the mounting seat and is used to drive the bearing platform to rotate around the axial direction.

10. The device according to claim 5, characterized in that The carrying device further comprises a cap, which is detachably arranged on the carrying platform. The cap has a supporting surface that matches the size of the wafer to be clamped, and the supporting surface is suitable for placing the wafer.

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