Carrier for improving welding spot failure of embedded patch

Abstract

The utility model relates to the technical field of a chip inversion process, in particular to a carrier for improving embedded patch welding spot failure, which comprises a base for adsorbing one side of an encapsulation layer, one side of the base for adsorbing the encapsulation layer is provided with an accommodating groove, the accommodating groove is filled with a phase change piece prepared from a phase change material, and the phase change piece is provided with a plurality of phase change holes. And the base is provided with a suction channel for adsorption. Compared with the prior art, the utility model has the following effects: through an independent carrier, the carrier is fixed on the surface, close to DIE, of the encapsulation layer through the suction channel in the curing process, and the phase change piece can enable the temperature of the fitting side to be relatively low in the curing process, so that the temperature of the flip-chip welding point part is lower than the melting point of the flip-chip welding point part under the condition that the second rewiring layer is not influenced, and the bonding strength of the flip-chip welding point part is improved. The effective state of the welding spot is kept, and the condition of welding spot failure is improved under the condition that the original PI glue is used.

Description

Technical Field

[0001] The present application relates to the technical field of chip flip-chip technology, and in particular to a carrier for improving the failure of embedded chip solder joints. Background Art

[0002] Flip chip technology, also known as FC packaging technology, is an advanced integrated circuit packaging technology. In the prior art, it is necessary to prepare a single or multi-layer redistribution layer on a glass substrate, then flip the die on the redistribution layer, and protect the connection between the die and the redistribution layer through an encapsulation process. Then remove the glass substrate and prepare the C4 layer or the redistribution layer and the C4 layer.

[0003] After the packaging process is completed, there is a probability that the flip-chip solder joints will partially or completely fail during actual testing, that is, the solder joints will be detached, and the yield rate will be low. Utility Model Content

[0004] In order to improve the situation of flip-chip solder joint failure, the present application provides a carrier for improving embedded chip solder joint failure.

[0005] The present application provides a carrier for improving the failure of embedded patch solder joints, which adopts the following technical solution: a carrier for improving the failure of embedded patch solder joints, comprising a base for adsorbing one side of an encapsulation layer, the base having a receiving groove on one side of the encapsulation layer for adsorbing the encapsulation layer, the receiving groove is filled with a phase change member made of phase change material, and the base has a suction channel for adsorption.

[0006] By adopting the above technical solution, a separate carrier is used to fix it to the side of the encapsulation layer close to the DIE through a suction channel during the curing process. During the curing process, the phase change component can make the temperature of the bonding side relatively low, so that without affecting the second redistribution layer, the temperature of the flip-chip solder joint part is lower than its melting point, thereby maintaining the effective state of the solder joint and improving the failure of the solder joint when the original PI glue is used.

[0007] Preferably, a blocking surface is provided between the end of the suction channel and the accommodating groove.

[0008] Preferably, the accommodating grooves are arranged continuously, and the accommodating grooves are arranged on the base in a spiral shape.

[0009] Preferably, the accommodating grooves are a plurality of separate single grooves, and the plurality of accommodating grooves are distributed on the base in the form of concentric circles with equal intervals.

[0010] By adopting the above technical solution and setting the single groove, in case the suction channel sucks out the phase change component, the impact on other containing grooves can be reduced.

[0011] Preferably, the portion on the base and located between the accommodating grooves is a suction area, the suction channel is arranged in the suction area, and the side wall of the accommodating groove is a blocking surface.

[0012] Preferably, there is a gap between the phase change member and the opening of the accommodating groove, and a top pressing block is provided at the bottom of the accommodating groove, and the top pressing block is used to move along the depth direction of the accommodating groove.

[0013] Preferably, a plurality of the pressing blocks are connected to a movable seat, the movable seat is slidably connected in the base, and a driving member for driving the movable seat to move is provided in the base.

[0014] Preferably, the base has a sliding groove for the movable seat to move, and the driving member includes a driving rod threadedly connected to the base and extending into the sliding groove, and the end of the driving rod is rotatably connected to the movable seat.

[0015] Preferably, the outer wall of the base has a limiting groove, and the movable seat has a limiting block located in the limiting groove.

[0016] Preferably, the phase change material is paraffin.

[0017] In summary, the present application includes at least one of the following beneficial technical effects:

[0018] 1. During the curing process, the phase change component is fixed to the side of the encapsulation layer close to the DIE through the suction channel. During the curing process, the temperature of the bonding side can be relatively low, so that the temperature of the flip-chip solder joint part is lower than its melting point without affecting the second redistribution layer, so as to keep the solder joint effective and improve the failure of the solder joint when the original PI glue is used;

[0019] 2. Before the phase change component in the accommodating groove is adsorbed, it has not reached the same height as the base plane. After the suction channel adsorbs and fixes the encapsulation layer, the phase change component is pushed up to contact the encapsulation layer through the pressing block, reducing the possibility of the phase change component being disturbed by the suction channel. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a process flow chart for preparing the redistribution layer in layers;

[0021] Figure 2 This is a schematic diagram of the positional relationship between the embodiment 1 of the present application and the encapsulation layer;

[0022] Figure 3 is a schematic diagram of the structure of Example 1 of the present application;

[0023] Figure 4 is a schematic diagram of a base that is a spiral receiving groove;

[0024] Figure 5It is a cross-sectional view of Example 2 of the present application.

[0025] Explanation of the reference numerals: 100, base; 110, accommodating groove; 111, suction channel; 112, adsorption area; 113, blocking surface; 120, top pressure block; 121, movable seat; 122, sliding groove; 123, driving rod; 124, limiting groove; 125, limiting block. DETAILED DESCRIPTION

[0026] The present application is further described in detail below in conjunction with the accompanying drawings.

[0027] Reference Figure 1 In the prior art, the flip-chip packaging process requires a redistribution layer to be prepared on a glass substrate, and then the die is flipped on the redistribution layer, and the connection between the die and the redistribution layer is protected by an encapsulation process. The glass substrate is then debonded and removed, and a C4 layer is prepared on the side of the redistribution layer away from the die. The C4 layer is used to connect to an external packaging substrate.

[0028] However, when there are many redistribution layers, such as a 5P5M redistribution layer, the redistribution layer needs to be prepared in steps. That is, the first redistribution layer (3P3M) needs to be prepared on a glass substrate, and then the die is flipped on the first redistribution layer, and the connection between the die and the first redistribution layer is protected by an encapsulation process. The glass substrate is then debonded and removed, and the second redistribution layer (2P2M) and C4 layer are sequentially prepared on the side of the first redistribution layer away from the die.

[0029] Since the flip-chip connection between the bare chip and the first redistribution layer is achieved by relying on FC solder joints, which are generally made of SnAg materials. When preparing the second redistribution layer, a curing process is required. The temperature involved in the curing process (250°C) is greater than the melting point of the FC solder joint (235°C), which will cause the FC solder joint to fail. This application mainly solves the problem that the flip-chip solder joint may fail during the curing process when the redistribution layer is prepared in layers.

[0030] Embodiment 1: A carrier for improving the failure of embedded patch solder joints, referring to FIG. 2, Figure 3 , including a base 100 for adsorbing one side of the encapsulation layer, the base 100 has a receiving groove 110 on one side for adsorbing the encapsulation layer, and the receiving groove 110 is filled with a phase change member made of a phase change material. In this embodiment, the phase change material is paraffin, and the paraffin will be filled in the receiving groove 110. The encapsulation layer refers to the bottom filling glue liquid and the plastic sealing part.

[0031] The receiving groove 110 may be a continuous one, such as a spiral shape (eg Figure 4As shown), they are evenly distributed on the bottom wall of the base 100, or they may be a plurality of separate single grooves. In this embodiment, a plurality of accommodating grooves 110 are distributed on the base 100 in the form of concentric circles with equal spacing as an example.

[0032] The base 100 has a suction channel 111 for adsorption, and the end of the suction channel 111 is attached to the encapsulation layer. In this embodiment, a vacuum suction head (not shown in the figure) is installed in the suction channel 111. In other embodiments, the suction channel 111 can also be set as an air channel for suction. The part on the base 100 and located between the receiving grooves 110 is the adsorption area 112, and the suction channel 111 is set in the adsorption area 112, so that the suction channel 111 is not connected to the receiving groove 110. There is a blocking surface 113 between the end of the suction channel 111 and the receiving groove 110. In this embodiment, the side wall of the receiving groove 110 is the blocking surface 113.

[0033] The implementation principle of Example 1 of the present application is as follows: the phase change component is filled in the receiving groove 110, and then the side with the suction channel 111 is facing the encapsulation layer. After the negative pressure is generated in the suction channel 111, the whole will be attached to the encapsulation layer. In the subsequent curing process, the part close to the flip-chip solder joint is contacted by the phase change component, so that the solder joint part can maintain a temperature not higher than the melting point. During the adsorption process of the suction channel 111, since the suction channel 111 is not connected to the receiving groove 110 through the blocking surface 113, the phase change component will not be interfered.

[0034] Embodiment 2: The difference from Embodiment 1 is that, referring to Figure 5 There is a gap between the phase change element and the opening of the receiving groove 110, that is, when the phase change element is filled, it will not fill the receiving groove 110. During adsorption, the end of the suction channel 111 will be higher than the height of the phase change element, further reducing the possibility of interference with the phase change element.

[0035] In this embodiment, after the suction channel 111 is attached, the phase change member is lifted up to contact the surface of the encapsulation layer. A top pressing block 120 is provided at the bottom of the accommodating groove 110, and the top pressing block 120 is used to move along the depth direction of the accommodating groove 110. A plurality of top pressing blocks 120 are connected to a movable seat 121, and a sliding groove 122 for the movable seat 121 to move is provided in the base 100, and the movable seat 121 is slidably connected in the sliding groove 122.

[0036] A driving member for driving the movable seat 121 to move is provided in the base 100. The driving member includes a driving rod 123 that is threadedly connected to the base 100 and extends into the sliding groove 122, and the end of the driving rod 123 is rotatably connected to the movable seat 121. Twisting the driving rod 123 can make the movable seat 121 slide inside, so that the top pressing block 120 is pushed up, so that the phase change member contacts the surface of the encapsulation layer.

[0037] In order to more accurately contact the surface of the encapsulation layer, the outer wall of the base 100 is provided with a limit groove 124, and the movable seat 121 has a limit block 125 located in the limit groove 124. At the end point of the movement of the movable seat 121, the travel can be controlled by the limit block 125.

[0038] The implementation principle of Example 2 of the present application is as follows: first, when filling, fill the phase change component to the lower side of the opening of the accommodating groove 110, for example, a distance of X, and then first make the suction channel 111 attached and fixed to the side of the encapsulation layer close to the flip-chip solder joint. Then, by rotating the driving rod 123, the movable seat 121 moves, and the limit block 125 will limit the movement distance in the limit groove 124, and this distance is also X, so that the phase change component is pushed up and contacts the surface of the encapsulation layer, which can reduce the interference of the suction channel 111 with the phase change component in the early stage, so that the temperature of the flip-chip solder joint part is lower than its melting point without affecting the second rewiring layer, so as to keep the solder joint in an effective state, and improve the solder joint failure situation when the original PI glue is used.

[0039] The embodiments of this specific implementation method are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore, all equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A carrier for improving embedded patch solder joint failure, characterized by: The invention comprises a base (100) for adsorbing one side of the encapsulation layer, the base (100) having a receiving groove (110) on the side for adsorbing the encapsulation layer, the receiving groove (110) being filled with a phase change member made of a phase change material, and the base (100) having a suction channel for adsorption.

2. A carrier for improving embedded patch solder joint failure according to claim 1, characterized in that: A blocking surface (113) is provided between the end of the suction channel and the accommodating groove (110).

3. A carrier for improving embedded patch solder joint failure according to claim 2, characterized in that: The accommodating grooves (110) are arranged in a continuous manner, and the accommodating grooves (110) are arranged on the base (100) in a spiral shape.

4. A carrier for improving embedded patch solder joint failure according to claim 2, characterized in that: The containing grooves (110) are a plurality of separate single grooves, and the plurality of containing grooves (110) are distributed on the base (100) in the form of concentric circles with equal spacing.

5. A carrier for improving embedded patch solder joint failure according to claim 2, characterized in that: The portion on the base (100) located between the containing grooves (110) is a suction area (112), the suction channel is arranged in the suction area (112), and the side wall of the containing groove (110) is a blocking surface (113).

6. A carrier for improving embedded patch solder joint failure according to claim 4, characterized in that: There is a gap between the phase change member and the opening of the accommodating groove (110), and a top pressing block (120) is provided at the bottom of the accommodating groove (110), and the top pressing block (120) is used to move along the depth direction of the accommodating groove (110).

7. A carrier for improving embedded patch solder joint failure according to claim 6, characterized in that: The plurality of pressing blocks (120) are connected to a movable seat (121), the movable seat (121) is slidably connected inside the base (100), and a driving member for driving the movable seat (121) to move is provided inside the base (100).

8. The carrier for improving embedded patch solder joint failure according to claim 7, characterized in that: The base (100) has a sliding groove (122) for the movable seat (121) to move, and the driving member comprises a driving rod (123) threadedly connected to the base (100) and extending into the sliding groove (122), and the end of the driving rod (123) is rotatably connected to the movable seat (121).

9. A carrier for improving embedded patch solder joint failure according to claim 8, characterized in that: The outer wall of the base (100) has a limiting groove (124), and the movable seat (121) has a limiting block (125) located in the limiting groove (124).

10. The carrier for improving embedded patch solder joint failure according to claim 1, characterized in that: The phase change material is paraffin.

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