Radiator, power module, motor controller, power assembly and vehicle

Abstract

A radiator, a power module, a motor controller, a power assembly and a vehicle, the radiator comprises a bottom plate and radiating fins, the radiating fins are indirectly connected with the bottom plate through a first solder layer, and the bottom plate, the first solder layer and the radiating fins jointly enclose a first channel. The cooling fins and the bottom plate are connected through the first solder layer, so that the connecting strength between the cooling fins and the bottom plate is improved, the first channel is jointly defined by the bottom plate, the first solder layer and the cooling fins, heat exchange media circulate through the first channel, the heat exchange area can be increased when the heat exchange media flow through, and the heat exchange efficiency is improved. The heat exchange medium can realize heat exchange through the bottom plate, the first solder layer and the radiating fins, so that the heat exchange efficiency of the radiator is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat exchange, and in particular to a radiator, a power module, a motor controller, a power assembly and a vehicle. Background Art

[0002] In existing heat sinks used to dissipate heat from power devices, the heat dissipation fins in the heat sink are generally directly in contact with the bottom plate or the top and bottom. Due to processing accuracy, some fins may not be in contact with the top plate or the bottom plate, thereby affecting the heat conduction efficiency and resulting in poor heat exchange effect of the heat sink. Utility Model Content

[0003] The utility model aims to provide a radiator, a power module, a motor controller, a power assembly and a vehicle, which solve the problems of poor stability of radiating fins and poor heat exchange effect in the radiator.

[0004] In order to achieve the purpose of the utility model, the utility model provides the following technical solutions:

[0005] In a first aspect, the utility model provides a heat sink, comprising a base plate and heat dissipation fins, wherein the heat dissipation fins are indirectly connected to the base plate via a first solder layer, and the base plate, the first solder layer and the heat dissipation fins jointly enclose a first channel.

[0006] In one embodiment, the heat dissipation fin includes a first section, wherein at least a portion of the first solder layer is disposed between the first section and the base plate and covers the first section.

[0007] In one embodiment, the first solder layer includes a middle section and a side section connected in the first direction, the middle section is located between the first section and the base plate; in the second direction, the size L1 of the side section is greater than or equal to the size L2 of the middle section; the first direction and the second direction intersect.

[0008] In one embodiment, the first section is a planar section, and the first section is parallel to the bottom plate.

[0009] In one embodiment, the base plate, the first solder layer and the heat dissipating fins together enclose a plurality of first channels, and the heat dissipating fins include a plurality of first sections sequentially arranged along a first direction, and the plurality of first sections are not completely the same in size in the first direction.

[0010] In one embodiment, the first section is an arc-shaped section, and the first section protrudes toward the bottom plate.

[0011] In one embodiment, a surface of the first solder layer facing the first channel is a curved surface.

[0012] In one embodiment, the radiator further includes a top plate and a second solder layer, the bottom plate and the top plate are connected along a second direction, the second solder layer is connected to the top plate, the heat sink fins are connected to the second solder layer, and the heat sink fins are connected to the top plate through the second solder layer, the top plate, the first solder layer and the heat sink fins jointly enclose a second channel; the first direction and the second direction intersect.

[0013] In one embodiment, in the second direction, the heat dissipating fin includes a second section away from the first section; the second section extends along the first direction, and at least a portion of the second solder layer is disposed between the second section and the top plate and covers the second section.

[0014] In one embodiment, the heat dissipation fin also includes a third section and a fourth section, and the third section, the first section, the fourth section and the second section are connected in sequence to form a bending portion, and the number of the bending portions is multiple, and the multiple bending portions are connected in sequence along the first direction; on two adjacent bending portions, the fourth section, the second section, the third section, the bottom plate and the first solder layer jointly enclose the first channel; on the same bending portion, the third section, the first section, the fourth section, the top plate and the second solder layer jointly enclose the second channel.

[0015] In one embodiment, the curved portion further includes a fifth segment and a sixth segment, wherein two ends of the fifth segment are respectively connected to the fourth segment and the third segment of another adjacent curved portion, the fifth segment and the second segment are spaced apart by a distance, and the fifth segment divides the first channel into a first sub-channel and a second sub-channel; two ends of the sixth segment are respectively connected to the third segment and the fourth segment, the sixth segment and the first segment are spaced apart by a distance, and the sixth segment divides the second channel into a third sub-channel and a fourth sub-channel.

[0016] In one embodiment, in the second direction, the first section and the second section are connected, and the first section and the second section jointly enclose a third channel.

[0017] In one embodiment, in the second direction, the first section is connected to the second section via a connecting portion, and the first section, the second section and the connecting portion respectively enclose a third channel.

[0018] In one embodiment, the heat dissipation fins include at least two rows of annular heat dissipation units, each row of annular heat dissipation units are connected in sequence, and two adjacent rows of heat dissipation units are connected to each other to form a fourth channel.

[0019] In one embodiment, a microchannel is provided on the surface of the heat dissipation fin, and the microchannel is connected to the first channel.

[0020] In one embodiment, the heat dissipation fins are further bent and extended along a third direction, and the third direction intersects with the first direction.

[0021] In a second aspect, the utility model further provides a power module, comprising a power device and the heat sink described in the first aspect.

[0022] In one implementation, the power device is disposed between the two heat sinks.

[0023] In a third aspect, the utility model further provides a motor controller, comprising the heat sink described in the first aspect; or, comprising the power module described in the second aspect.

[0024] In a fourth aspect, the utility model further provides a power assembly, comprising the radiator described in the first aspect; or, comprising the power module described in the second aspect; or, comprising the motor controller described in the third aspect.

[0025] In a fifth aspect, the utility model further provides a vehicle, comprising the radiator described in the first aspect; or, comprising the power module described in the second aspect; or, comprising the motor controller described in the third aspect; or, comprising the powertrain described in the fourth aspect.

[0026] The radiator provided by the utility model includes a base plate and heat dissipation fins, and the heat dissipation fins and the base plate are connected by a first solder layer, thereby increasing the connection strength between the heat dissipation fins and the base plate, and the base plate, the first solder layer and the heat dissipation fins are used to enclose a first channel together, and the first channel is used for the circulation of heat exchange medium, which can increase the heat exchange area when the heat exchange medium flows through, and the heat exchange medium can achieve heat exchange through the base plate, the first solder layer and the heat dissipation fins, thereby improving the heat exchange efficiency of the radiator. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1A is a cross-sectional view of a heat sink according to an embodiment;

[0029] Figure 1B is a cross-sectional view of a heat sink according to another embodiment;

[0030] Figure 2 yes Figure 1A Enlarged view of the AA section;

[0031] Figure 3 is a cross-sectional view of a heat dissipation fin of an embodiment;

[0032] Figure 4 is a cross-sectional view of a heat dissipation fin of another embodiment;

[0033] Figure 5A A cross-sectional view of a heat dissipation fin according to an embodiment including a first section and a second section connected;

[0034] Figure 5B A cross-sectional view of a heat dissipation fin according to an embodiment includes a first section, a second section and a connecting portion;

[0035] Figure 6 is a cross-sectional view of a heat dissipation fin of yet another embodiment;

[0036] Figure 7 is a cross-sectional view of a heat dissipation fin of another embodiment;

[0037] Figure 8 yes Figure 3 Enlarged view of the middle BB part;

[0038] Fig. 9 is an appearance diagram of a heat dissipation fin of an embodiment;

[0039] Fig.10 is an appearance diagram of a heat dissipation fin of another embodiment;

[0040] Fig.11 is an appearance diagram of a heat dissipation fin of another embodiment;

[0041] Fig.12 FIG. 1 is a cross-sectional view of a heat dissipation fin portion of an embodiment with different heights.

[0042] Description of reference numerals:

[0043] 100-heat sink, 10-heat sink fin, 11-first channel, 11A-first sub-channel, 11B-second sub-channel, 12-second channel, 12A-third sub-channel, 12B-fourth sub-channel, 13-bending portion, 14-third channel, 15-fourth channel, 16-heat dissipation unit, 17-microchannel, 18-connecting portion, 111-first section, 112-second section, 113-third section, 114-fourth section, 115-fifth section, 116-sixth section, 20-bottom plate, 30-top plate, 41-first solder layer, 411-middle section, 412-side section, 42-second solder layer, X-first direction, Y-second direction, Z-third direction. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0045] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there can be a central component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there can be a central component at the same time.

[0046] Unless otherwise defined, all technical and scientific terms used in this utility model have the same meaning as those commonly understood by technicians in the technical field of this utility model. The terms used in the specification of this utility model are only for the purpose of describing specific embodiments and are not intended to limit this utility model. The term "and / or" used in this utility model includes any and all combinations of one or more related listed items.

[0047] In conjunction with the accompanying drawings, some embodiments of the present invention are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0048] In a first aspect, the utility model provides a heat sink 100, please refer to Figure 1A , including a base plate 20 and heat dissipation fins 10 , wherein the heat dissipation fins 10 are indirectly connected to the base plate 20 through a first solder layer 41 , and the base plate 20 , the first solder layer 41 and the heat dissipation fins 10 jointly enclose a first channel 11 .

[0049] Specifically, the base plate 20 can be a flat metal plate, including but not limited to one or more of aluminum, copper, iron, and steel. The heat sink 10 is an integrally formed structure. The specific molding process can be but not limited to stamping, casting, 3D printing, etc. The material of the heat sink 10 can be metal, including but not limited to one or more of aluminum, copper, iron, and steel. For example, the heat sink 10 can be a three-dimensional structural part formed by stamping a sheet metal. Optionally, the material of the heat sink 10 can be made of copper, aluminum, copper-aluminum composite materials, copper alloys, and aluminum alloys, and the above materials can save costs without reducing the heat dissipation performance. The heat sink 10 is arranged on the base plate 20, and a first solder layer 41 is arranged between the heat sink 10 and the base plate 20. The first solder layer 41 is a material including metal alloy materials such as welding wire, welding rod, and solder left between the heat sink 10 and the base plate 20 after the welding process.

[0050] Optionally, the heat sink 10 may be a three-dimensional structural part, and after the heat sink 10 is disposed on the base plate 20, it protrudes from the plane where the base plate 20 is located, that is, at least a portion of the heat sink 10 is indirectly connected to the base plate 20 through the first solder layer 41, and at least a portion of the heat sink 10 is spaced apart from the base plate 20, thereby forming a first channel 11. It should be explained that the heat sink 10 and the base plate 20 are indirectly connected, which means that they are not in direct contact, but are connected to the base plate 20 through the first solder layer 41. Therefore, the base plate 20, the first solder layer 41 and the heat sink 10 jointly enclose the first channel 11. After the base plate 20 and the heat sink 10 are welded through the first solder layer 41, the contact mode between the heat sink 10 and the first solder layer 41 is surface contact, and the contact mode between the first solder layer 41 and the base plate 20 is surface contact.

[0051] The first channel 11 is used to allow heat exchange medium to pass through, and the cooling medium can be liquid or gas. The heat exchange medium flowing through the first channel 11 can fully exchange heat with the heat dissipation fins 10, the bottom plate 20 and the first solder layer 41, so that the heat exchange effect is achieved by using the heat sink 100.

[0052] The radiator 100 provided by the utility model includes a base plate 20 and heat dissipation fins 10, and the heat dissipation fins 10 and the base plate 20 are connected by a first solder layer 41, thereby increasing the connection strength between the heat dissipation fins 10 and the base plate 20, and the base plate 20, the first solder layer 41 and the heat dissipation fins 10 are used to enclose a first channel 11 together, and the first channel 11 is used for the circulation of heat exchange medium, which can increase the heat exchange area when the heat exchange medium flows through, and the heat exchange medium can achieve heat exchange through the base plate 20, the first solder layer 41 and the heat dissipation fins 10, thereby improving the heat exchange efficiency of the radiator 100.

[0053] In one implementation, please refer to Figure 2 The heat sink 10 includes a first section 111, and at least a portion of the first solder layer 41 is disposed between the first section 111 and the base plate 20 and covers the first section 111; in the first direction X, a size H1 of the first solder layer 41 is greater than or equal to a size H2 of the first section 111.

[0054] Specifically, the heat sink 100 may include a width direction, a height direction, and a length direction. The width direction is the first direction X in the figure, the height direction is the second direction Y in the figure, and the length direction is the third direction Z in the figure. It should be explained that the width direction, the height direction, and the length direction of the heat sink 100 may be the width, thickness, and length of the sheet metal before the heat sink 10 is stamped.

[0055] Optional, such as Figure 2As shown, the first section 111 on the heat dissipation fin 10 is connected to the bottom plate 20 through the first solder layer 41; and the first section 111 is the section where the heat dissipation fin 10 is connected to the first solder layer 41, that is, the first section 111 is covered by the first solder layer 41. In the first direction X, the first section 111 has a width dimension H2, and the first solder layer 41 has a width dimension H1. H1 is greater than or equal to H2, that is, in the first direction X, the projection width of the first section 111 on the bottom plate 20 is less than or equal to the projection width of the first solder layer 41 on the bottom plate 20, and the first solder layer 41 protrudes from the inner wall surface of the first channel 11.

[0056] In one implementation, please refer to Figure 2 The first solder layer 41 includes a middle section 411 and a side section 412 connected in the first direction X, the middle section 411 is located between the first section 111 and the bottom plate 20; in the second direction Y, the size L1 of the side section 412 is greater than or equal to the size L2 of the middle section 411; the first direction X and the second direction Y intersect.

[0057] Specifically, in the first direction X, the first solder layer 41 includes a middle section 411 and two side sections 412 connected to both sides of the middle section 411 , and both the middle section 411 and the side sections 412 are connected to the first section 111 .

[0058] Optionally, when the width dimension H1 of the first solder layer 41 is greater than the width dimension H2 of the first section 111 (when H1>H2 in the figure), and the first section 111 is at least partially an arc surface, the thickness of the two sides of the first solder layer 41 will be greater than the thickness in the middle, that is, in the second direction Y, the thickness dimension L1 of the upper side section 412 is greater than the thickness dimension L2 of the middle section 411.

[0059] Optionally, when the width dimension H1 of the first solder layer 41 is equal to the width dimension H2 of the first section 111 (when H1=H2 in the figure), and the first section 111 is at least partially an arc surface, the thickness of both sides of the first solder layer 41 will be greater than or equal to the thickness in the middle, that is, in the second direction Y, the thickness dimension L1 of the upper side section 412 is greater than or equal to the thickness dimension L2 of the middle section 411.

[0060] In one implementation, please refer to Figure 1A and Figure 2 , the first section 111 is a plane section, and the first section 111 is parallel to the bottom plate 20. Specifically, after the first section 111 of the heat dissipation fin 10 is connected to the bottom plate 20, it can be a plane section, that is, the side of the first section 111 facing the bottom plate 20 is a plane. And, optionally, in the first direction X, the two ends of the first section 111 are arc surfaces, and the middle is a plane, so the plane in the middle of the first section 111 corresponds to the middle section 411 (thinner thickness) mentioned above, and the two sides of the first section 111 correspond to the side sections 412 (thicker thickness) mentioned above.

[0061] Optionally, before the heat sink 10 is welded and mounted on the base plate 20 , the first section 111 may be a curved surface (arc section), and under the pressure of external force, the first section 111 is subjected to a reaction force from the base plate 20 to form a plane section parallel to the base plate 20 .

[0062] In one implementation, please refer to Fig.12 The base plate 20, the first solder layer 41 and the heat sink fins 10 together enclose a plurality of first channels 11. The heat sink fins 10 include a plurality of first sections 111 sequentially arranged along the first direction X. The sizes of the plurality of first sections 111 in the first direction X are not completely the same.

[0063] For example, taking the semicircular curved top ordinary cross-section heat sink fin 10 as an example, during the production process, the height of each curved surface vertex does not need to be guaranteed to be in the same plane, but only the upper and lower curved surface vertices need to be guaranteed to be higher than the overall height of the receiving cavity by a certain distance, so as to ensure that the upper and lower ends of the heat sink fin 10 are in close contact with the surface of the bottom plate 20 and the top plate 30 after being compressed, and can be reasonably designed according to actual production. The heat sink fin 10 includes a plurality of arc-shaped lower protrusions, which are formed by the pressure of the bottom plate 20 when forming the planar first section 111. The dimensions of the plurality of first sections 111 in the first direction X are not exactly the same, so that the manufacturing precision of the arc-shaped lower protrusions is allowed to be lower, thereby reducing costs.

[0064] In one implementation, please refer to Figure 1B , the first section 111 is an arc section, and the first section 111 protrudes toward the bottom plate 20. Specifically, after the first section 111 of the heat dissipation fin 10 is connected to the bottom plate 20, it can be an arc section, that is, the first section 111 has an arc surface facing the bottom plate 20. And, optionally, in the first direction X, the two ends of the first section 111 are arc surfaces, and the middle is a plane, so the plane in the middle of the first section 111 corresponds to the middle section 411 mentioned above, and the two sides of the first section 111 correspond to the side sections 412 mentioned above. And, optionally, the first section 111 is a continuous arc, so the middle of the first section 111 corresponds to the middle section 411 (thinner thickness) mentioned above, and the two sides of the first section 111 correspond to the side sections 412 (thicker thickness) mentioned above.

[0065] Optionally, before the heat dissipation fin 10 is welded and mounted on the base plate 20 , the first section 111 may be a curved surface (arc-shaped section), and under or without external force, the first section 111 maintains the original arc-shaped section.

[0066] In one implementation, please refer to Figure 2 The first solder layer 41 has a curved surface facing the first channel 11 .

[0067] Specifically, the first channel 11 is enclosed by the first solder layer 41, the bottom plate 20 and the heat sink fins 10, and the side of the first solder layer 41 enclosing the first channel 11 is an arc surface, which can reduce the turbulence effect of the heat exchange medium when it flows through, increase the flow rate of the heat exchange medium, and thus improve the heat mixing efficiency.

[0068] In one implementation, please refer to Figure 1A The radiator 100 also includes a top plate 30 and a second solder layer 42. The bottom plate 20 and the top plate 30 are connected along a second direction Y. The second solder layer 42 is connected to the top plate 30. The heat sink 10 is connected to the second solder layer 42. The heat sink 10 is connected to the top plate 30 through the second solder layer 42. The top plate 30, the first solder layer 41 and the heat sink fin 10 jointly enclose the second channel 12. The first direction X and the second direction Y intersect.

[0069] Specifically, the heat sink 100 includes a top plate 30, the top plate 30 and the bottom plate 20 are arranged opposite to each other and connected, the top plate 30 and the bottom plate 20 are connected and enclose a receiving cavity, and the heat dissipation fins 10 are received in the receiving cavity and connected to the inner wall of the receiving cavity. Figure 1A As shown, the top plate 30 and the bottom plate 20 can both be made of metal. In addition, the top plate 30 can be a "convex" structure, as shown in the cross-sectional view of the heat sink 100 along the second direction Y in the figure.

[0070] Optional, such as Figure 1A As shown, the top plate 30 may include a first connecting section, a protruding section, and a second connecting section in sequence. The first connecting section and the second connecting section are used to connect with the bottom plate 20, and the protruding section protrudes from the plane where the first connecting section and the second connecting section are located. Therefore, after the top plate 30 and the bottom plate 20 are connected, they jointly enclose the receiving cavity, and the heat dissipation fin 10 is received in the receiving cavity and connected to the inner wall of the receiving cavity.

[0071] Optionally, in the second direction Y, the upper and lower ends of the heat sink 10 are connected to the bottom plate 20 and the top plate 30 respectively through the first solder layer 41 and the second solder layer 42. In the first direction X, the left and right ends of the heat sink 10 can also be connected to the top plate 30 through the second solder layer 42.

[0072] Optionally, the second solder layer 42 may be disposed on the top plate 30 in the same manner as the first solder layer 41 , and specific details may refer to the first solder layer 41 in the above embodiment, which will not be described in detail herein.

[0073] It can be understood that the first channel 11 and the second channel 12 are used to allow heat exchange medium to pass through, and the cooling medium can be liquid or gas. The heat exchange medium flowing through the first channel 11 and the second channel 12 can fully exchange heat with the heat dissipation fins 10, the bottom plate 20, the top plate 30 and the solder, so as to achieve a heat exchange effect using the radiator 100.

[0074] In one implementation, please refer to Figure 2 In the second direction Y, the heat sink 10 includes a second section 112 away from the first section 111 ; the second section 112 extends along the first direction X, and at least part of the second solder layer 42 is disposed between the second section 112 and the top plate 30 and covers the second section 112 .

[0075] Specifically, the second section 112 on the heat sink 10 is connected to the top plate 30 through the second solder layer 42. Since the top plate 30 and the bottom plate 20 are arranged opposite to each other, the second section 112 is located on the side of the heat sink 10 away from the first section 111. The second section 112 is arranged in the same manner as the first section 111, so the structure of the first section 111 can be referred to, and no further description is given here.

[0076] In one implementation, please refer to Figure 3 The heat dissipation fin 10 also includes a third section 113 and a fourth section 114. The third section 113, the first section 111, the fourth section 114 and the second section 112 are connected in sequence to form a curved portion 13. There are multiple curved portions 13, and the multiple curved portions 13 are connected in sequence along the first direction X; on two adjacent curved portions 13, the fourth section 114, the second section 112, the third section 113, the bottom plate 20 and the first solder layer 41 jointly enclose the first channel 11; on the same curved portion 13, the third section 113, the first section 111, the fourth section 114, the bottom plate 20 and the second solder layer 42 jointly enclose the second channel 12.

[0077] Specifically, the heat dissipation fin 10 includes a bent portion 13 ( Figure 3 The bent portion 13 is bent and extended along the first direction X, and the bent portion 13 is connected to the bottom plate 20 and the top plate 30 through the first solder layer 41 and the second solder layer 42 respectively, and encloses the first channel 11 and the second channel 12.

[0078] Optionally, the number of the bent portions 13 may be multiple, and the multiple bent portions 13 are sequentially connected along the second direction Y, that is, the heat dissipation fin 10 is a structure obtained by arranging multiple bent portions 13 in a periodic manner. It can be understood that the bent portion 13 may be a periodic unit in the heat dissipation fin 10, and the multiple bent portions 13 are connected end to end along the first direction X to form the heat dissipation fin 10. Of course, the multiple bent portions 13 are an integrated structure. Two adjacent bent portions 13 enclose the first channel 11.

[0079] The curved portion 13 includes a third segment 113, a first segment 111, a fourth segment 114 and a second segment 112 connected in sequence; wherein the third segment 113 is connected to the second segment 112 of the previous curved portion 13. It can be understood that, as Figure 3As shown, the bent portion 13 bends and extends along the first direction X. In the length direction of the heat dissipation fin 10, the shape of the heat dissipation fin 10 is wave-shaped and extends; the cross section of the heat dissipation fin 10 along the second direction Y has a shape of crests and troughs, wherein the position of the crests can be the second section 112, and the position of the troughs can be the first section 111.

[0080] like Figure 3 FIG. 1 is a cross-sectional schematic diagram of a heat dissipation fin 10 of an embodiment, that is, the cross section of the heat dissipation fin 10 along the first direction X is also wavy, and the dotted line portion in the figure is an extension schematic line of the curved portion 13. In the figure, the first channel 11 and the second channel 12 are arranged on the left and right.

[0081] Optionally, when there are multiple (greater than) bends 13, there are also multiple first channels 11 and second channels 12, and the first channels 11 and second channels 12 are arranged sequentially along the first direction X, and the first channels 11 and second channels 12 are arranged periodically at intervals.

[0082] In one implementation, please refer to Figure 4 The curved portion 13 also includes a fifth segment 115 and a sixth segment 116, wherein two ends of the fifth segment 115 are respectively connected to the fourth segment 114 and the third segment 113 of another adjacent curved portion 13, the fifth segment 115 and the second segment 112 are spaced apart, and the fifth segment 115 divides the first channel 11 into a first sub-channel 11A and a second sub-channel 11B; two ends of the sixth segment 116 are respectively connected to the third segment 113 and the fourth segment 114, the sixth segment 116 and the first segment 111 are spaced apart, and the sixth segment 116 divides the second channel 12 into a third sub-channel 12A and a fourth sub-channel 12B.

[0083] Specifically, when two curved portions 13 are connected, the fourth segment 114 and the third segment 113 (another curved portion 13) are arranged relatively spaced apart in the first direction X, the first segment 111 and the fifth segment 115 are located between the fourth segment 114 and the third segment 113, the fifth segment 115 is connected to the fourth segment 114 and the third segment 113 at two opposite ends in the first direction X, and the first segment 111 and the fifth segment 115 are spaced apart in the second direction Y. Figure 4 As shown, the fifth section 115 is actually located in the first channel 11 , so the fifth section 115 divides the first channel 11 into a first sub-channel 11A and a second sub-channel 11B.

[0084] In the same curved portion 13, the third section 113 and the fourth section 114 are arranged relatively spaced in the first direction X, the second section 112 and the sixth section 116 are located between the third section 113 and the fourth section 114, the sixth section 116 is connected to the third section 113 and the fourth section 114 at two opposite ends in the first direction X, and the second section 112 and the sixth section 116 are spaced in the second direction Y. Figure 4 As shown, the sixth segment 116 is actually located in the second channel 12, so the sixth segment 116 divides the second channel 12 into a third sub-channel 12A and a fourth sub-channel 12B.

[0085] Optionally, the fifth segment 115 and the sixth segment 116 may be arc segments. Of course, in other embodiments, the fifth segment 115 and the sixth segment 116 may be plane segments.

[0086] In one implementation, please refer to Figure 5A In the second direction Y, the first section 111 and the second section 112 are connected, and the first section 111 and the second section 112 jointly enclose the third channel 14 .

[0087] Specifically, the first section 111 and the second section 112 are butted against each other in the second direction Y; that is, in the second direction Y, the second section 112 is located above the first section 111, and thus are relatively connected along the second direction Y. The first section 111 and the second section 112 jointly enclose the third channel 14 (such as Figure 5A (shown by the dashed line).

[0088] It can be understood that the heat sink 10 is a structure obtained by periodically arranging a plurality of first sections 111 and second sections 112. That is, it can be understood that the first section 111 and the second section 112 are connected to form a periodic unit, and the plurality of periodic units are connected end to end along the first direction X to form the heat sink 10. Of course, the plurality of periodic units are an integrated structure.

[0089] In one implementation, please refer to FIG. 5B to FIG. 7 In the second direction Y, the first section 111 is connected to the second section 112 via the connecting portion 18 , and the first section 111 , the second section 112 and the connecting portion 18 respectively enclose the third channel 14 .

[0090] Specifically, the first section 111, the connecting portion 18, and the second section 112 are connected in the second direction Y; that is, in the second direction Y, the two opposite ends of the connecting portion 18 are respectively connected to the first section 111 and the second section 112, so as to be relatively connected along the second direction Y. The first section 111 and the connecting portion 18 enclose a third channel 14, and the second section 112 and the connecting portion 18 also enclose another third channel 14 (such as Figure 5B (shown by the dashed line).

[0091] It can be understood that the heat dissipation fin 10 is a structure obtained by periodically arranging a plurality of first sections 111, connecting portions 18, and second sections 112. That is, it can be understood that the first section 111, connecting portion 18, and second section 112 are connected to form a periodic unit, and a plurality of periodic units are connected end to end along the first direction X to form the heat dissipation fin 10. Of course, the plurality of periodic units are an integrated structure.

[0092] Optionally, the first section 111 and the second section 112 may be mirror-symmetrical about the connecting portion 18. FIG. 5B to FIG. 7 As shown, in the cross section of the heat dissipation fin 10 along the second direction Y, the first section 111, the connecting portion 18 and the second section 112 may form a periodic unit whose outline shape is a rhombus, a hexagon, a circle or an ellipse.

[0093] In one implementation, please refer to FIG. 5B to FIG. 7 The heat dissipation fin 10 includes at least two rows of annular heat dissipation units 16 , each row of annular heat dissipation units 16 are connected in sequence, and two adjacent rows of heat dissipation units 16 are interconnected to form a fourth channel 15 .

[0094] Specifically, the number of heat dissipation units 16 is multiple, and the multiple heat dissipation units 16 are arranged in multiple rows and columns, wherein at least two rows constitute multiple rows, and each row of annular heat dissipation units 16 connected in sequence constitutes multiple columns. Each heat dissipation unit 16 includes a first section 111 and a second section 112. It can be understood that the heat dissipation unit 16 in this embodiment is the periodic unit in the above embodiment. FIG. 5B to FIG. 7 As shown, the plurality of heat dissipation units 16 are arranged in multiple rows and columns (two rows and seven columns or two rows and nine columns) along the first direction X and the second direction Y. Four adjacent heat dissipation units 16 enclose the fourth channel 15 (the dotted box portion in the figure).

[0095] In order to improve the heat dissipation efficiency, the heat dissipation fins 10 can be processed into single-layer, double-layer, multi-layer and honeycomb structures according to actual needs such as the height of the water channel cavity (the receiving cavity mentioned above) and the heat dissipation requirements, so the cross-sectional shape includes but is not limited to circular, elliptical, quadrilateral and hexagonal shapes and other shapes suitable for processing and heat dissipation.

[0096] In one implementation, please refer to Figure 8 The surface of the heat sink 10 is provided with a microchannel 17, and the microchannel 17 is connected to the first channel 11. Specifically, a concave or convex microstructure can be formed on the surface of the heat sink 10 to form the microchannel 17. The surface of the heat sink 10 is the surface through which the heat exchange medium flows. The purpose of adding the microchannel 17 is to increase the surface area of ​​the heat sink 10, thereby improving the heat dissipation efficiency.

[0097] In one implementation, please refer to Fig. 9The heat dissipation fin 10 is also bent and extended along a third direction Z, and the third direction Z intersects with the first direction X.

[0098] Specifically, the third direction Z is the length direction of the heat sink 100 , and the first channel 11 , the second channel 12 , the third channel 14 and the fourth channel 15 may be bent and extended along the third direction Z.

[0099] Optional, such as Fig. 9 As shown, the heat dissipation fin 10 is bent and extended along the third direction Z. In the length direction of the heat dissipation fin 10, the shape of the heat dissipation fin 10 is wave-shaped; Fig.10 As shown, the heat dissipation fin 10 is in the shape of a zigzag extension. It is understandable that the overall shape of the heat dissipation fin 10 can be straight, corrugated, zigzag, etc. The corrugated and zigzag fins can be designed with curves and zigzags of appropriate shapes according to actual needs.

[0100] Of course, in other embodiments, such as Fig.11 As shown, the heat dissipation fins 10 extend along a third direction Z straight line.

[0101] In one embodiment, in the second direction Y, the height of the heat dissipating fin 10 is greater than or equal to the depth of the receiving cavity.

[0102] Specifically, Figure 1B As shown, the heat sink 100 in the figure can also be a schematic diagram of various parts without external force. It can be seen that there is a gap between the bottom plate 20 and the cover plate under the support of the heat sink fins 10. As the heat sink 100 is processed and formed, the schematic diagram of the deformation of various parts of the heat sink 100 after clamping shows that the external force squeezes the connection between the bottom plate 20 and the cover plate to cause the heat sink fins 10 to deform.

[0103] For example, taking the semicircular curved top ordinary cross-section heat sink 10 as an example, since the upper and lower ends of the heat sink 10 are curved surfaces, and the top of the curved surface is a certain distance higher than the height of the heat sink 100 cavity, the upper and lower ends of the heat sink 10 are in line contact with the bottom plate 20 and the cover plate without external force. When the clamp is gradually clamped, the upper and lower ends of the heat sink 10 are flattened under the clamping force, and the contact between the three is also changed to surface contact, and the contact surface between the heat sink 10 and the bottom plate 20 and the cover plate must be in the same plane. At this time, welding can ensure the welding quality between the three, and the heat dissipation efficiency of the heat sink 100 is also improved.

[0104] When the bottom plate 20 and the cover plate are welded, due to the clamping force, the contact between the upper and lower end surfaces of the heat sink 10 and the bottom plate 20 and the cover plate changes from line contact to surface contact, and each contact surface must be in the same plane and tightly connected, so the heat dissipation effect can be improved. The heat sink 10 adopts double-sided welding (the first solder layer 41 and the second solder layer 42) to ensure that the risk of desoldering caused by the welding surfaces not being in the same plane is reduced, thereby improving the welding quality and heat dissipation efficiency of the heat sink 100.

[0105] In one embodiment, the utility model further provides a power module, including a power device and the heat sink 100 provided in the above embodiment. The power device is connected to the heat sink 100 .

[0106] In one implementation, the power device is disposed between two heat sinks 100 .

[0107] In one embodiment, the utility model further provides a motor controller, including the heat sink 100 provided in the above embodiment; or, the motor controller includes the power module provided in the above embodiment.

[0108] In one embodiment, the utility model further provides a power assembly, including the heat sink 100 provided in the above embodiment; or, the motor controller includes the power module provided in the above embodiment; or, includes the motor controller provided in the above embodiment.

[0109] In one embodiment, the utility model further provides a vehicle, including the radiator 100 provided in the above embodiment; or, the vehicle includes the power module provided in the above embodiment; or, includes the motor controller provided in the above embodiment; or, includes the powertrain provided in the above embodiment.

[0110] In the description of the embodiments of the present invention, it should be noted that the orientation or positional relationship of terms such as "center", "up", "down", "left", "right", "vertical", "horizontal", "inside" and "outside" are based on the orientation or positional relationship of the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0111] The above disclosure is only a preferred embodiment of the present invention, and certainly cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made according to the claims of the present invention still fall within the scope covered by the present invention.

Claims

1. A radiator, characterized in that: include: Bottom plate (20); A top plate (30), the bottom plate (20) and the top plate (30) are connected; A heat dissipation fin (10), wherein the heat dissipation fin (10) is indirectly connected to the base plate (20) via a first solder layer (41), the heat dissipation fin (10) is connected to the top plate (30), and the base plate (20), the first solder layer (41) and the heat dissipation fin (10) jointly enclose a first channel (11).

2. The heat sink according to claim 1, characterized in that: The heat dissipation fin (10) comprises a first section (111), and at least a portion of the first solder layer (41) is arranged between the first section (111) and the bottom plate (20), and covers the first section (111).

3. The heat sink according to claim 2, characterized in that: The first solder layer (41) comprises a middle section (411) and a side section (412) connected in a first direction (X), wherein the middle section (411) is located between the first section (111) and the bottom plate (20); in a second direction (Y), a size L1 of the side section (412) is greater than or equal to a size L2 of the middle section (411); and the first direction (X) and the second direction (Y) intersect.

4. The radiator according to claim 2 or 3, characterized in that: The first section (111) is a plane section, and the first section (111) is parallel to the bottom plate (20).

5. The heat sink according to claim 4, characterized in that: The base plate (20), the first solder layer (41) and the heat dissipation fins (10) together enclose a plurality of first channels (11); the heat dissipation fins (10) include a plurality of first sections arranged in sequence along a first direction; the plurality of first sections have different sizes in the first direction.

6. The radiator according to claim 2 or 3, characterized in that: The first section (111) is an arc-shaped section, and the first section (111) protrudes toward the bottom plate (20).

7. The radiator according to any one of claims 1 to 3, characterized in that: The first solder layer (41) has a curved surface facing the first channel (11).

8. The heat sink according to claim 3, characterized in that: The heat sink also includes a second solder layer (42); the bottom plate (20) and the top plate (30) are connected along a second direction (Y); the second solder layer (42) is connected to the top plate (30); the heat dissipation fins (10) are connected to the second solder layer (42); and the heat dissipation fins (10) are indirectly connected to the top plate (30) via the second solder layer (42); the top plate (30), the second solder layer (42) and the heat dissipation fins (10) jointly enclose a second channel (12); and the first direction (X) and the second direction (Y) intersect.

9. The heat sink according to claim 8, characterized in that: In the second direction (Y), the heat dissipation fin (10) includes a second section (112) facing away from the first section (111); the second section (112) extends along the first direction (X), and at least a portion of the second solder layer (42) is arranged between the second section (112) and the top plate (30) and covers the second section (112).

10. The heat sink according to claim 9, characterized in that The heat dissipation fin (10) further comprises a third section (113) and a fourth section (114); the third section (113), the first section (111), the fourth section (114) and the second section (112) are connected in sequence to form a bent portion (13); there are a plurality of bent portions (13), and the plurality of bent portions (13) are connected in sequence along the first direction (X); On two adjacent bent portions (13), the fourth section (114), the second section (112), the third section (113), the bottom plate (20) and the first solder layer (41) jointly enclose the first channel (11); On the same bent portion (13), the third section (113), the first section (111), the fourth section (114), the top plate (30) and the second solder layer (42) jointly enclose the second channel (12).

11. The heat sink according to claim 10, characterized in that The curved portion (13) further comprises a fifth section (115) and a sixth section (116); two ends of the fifth section (115) are respectively connected to the fourth section (114) and the third section (113) of another adjacent curved portion (13); the fifth section (115) and the second section (112) are spaced apart by a distance, and the fifth section (115) divides the first channel (11) into a first sub-channel (11A) and a second sub-channel (11B); two ends of the sixth section (116) are respectively connected to the third section (113) and the fourth section (114); the sixth section (116) and the first section (111) are spaced apart by a distance, and the sixth section (116) divides the second channel (12) into a third sub-channel (12A) and a fourth sub-channel (12B).

12. The heat sink according to claim 9, characterized in that In the second direction (Y), the first section (111) and the second section (112) are connected, and the first section (111) and the second section (112) jointly enclose a third channel (14).

13. The heat sink according to claim 9, characterized in that In the second direction (Y), the first section (111) is connected to the second section (112) via a connecting portion (18), and the first section (111), the second section (112) and the connecting portion (18) respectively enclose a third channel (14).

14. The heat sink according to claim 1, characterized in that The heat dissipation fins (10) comprise at least two rows of annular heat dissipation units (16), each row of annular heat dissipation units (16) are connected in sequence, and two adjacent rows of heat dissipation units (16) are connected to each other to form a fourth channel (15).

15. The heat sink according to claim 1, characterized in that A microchannel (17) is provided on the surface of the heat dissipation fin (10), and the microchannel is connected to the first channel (11).

16. The heat sink according to claim 3, characterized in that The heat dissipation fin (10) is also bent and extended along a third direction (Z), and the third direction (Z) intersects with the first direction (X).

17. A power module, characterized in that: The invention comprises a power device and a heat sink as claimed in any one of claims 1 to 16.

18. The power module according to claim 17, characterized in that: The power device is arranged between the two heat sinks.

19. A motor controller, characterized in that: Comprising the heat sink as described in any one of claims 1-16; or, comprising the power module as described in claim 17 or 18.

20. A powertrain, characterized in that: It comprises a heat sink as described in any one of claims 1 to 16; or, it comprises a power module as described in claim 17 or 18; or, it comprises a motor controller as described in claim 19.

21. A vehicle, characterized in that: It comprises a heat sink as described in any one of claims 1 to 16; or, comprises a power module as described in claim 17 or 18; or, comprises a motor controller as described in claim 19; or, comprises a powertrain as described in claim 20.

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