Floating type liquid cooling device and chip module

Abstract

The utility model provides a floating type liquid cooling device and a chip module, the floating type liquid cooling device is applied to the chip module comprising a first chip module and a second chip module, and the floating type liquid cooling device comprises a metal cover arranged above the first chip module and the second chip module; the liquid cooling plate is arranged above the metal cover corresponding to the first chip module and the second chip module; the metal block is arranged on the liquid cooling plate and corresponds to the second chip module; and the heat pipe is respectively connected to the liquid cooling plate and the metal block so as to transfer the heat of the second chip module to the liquid cooling plate. The liquid cooling plate and the metal block are connected with the chip module through the metal cover and the heat pipe, so that the height difference of the heat dissipation device is reduced, the problem of poor contact caused by the height difference is improved, and meanwhile, the contact temperature can be effectively reduced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic devices, and more particularly to a chip module, and more particularly to a floating liquid cooling device applied to a chip module. Background Art

[0002] With the development of technology, the number of chips and power consumption in electronic devices are increasing. Due to limited layout space on printed circuit boards, multiple chips are concentrated together. These chips often need to be cooled by common heat sinks. There are multiple contact surfaces between the common heat sinks and the chips that need to be cooled. If the contact is not good, some chips will overheat and affect the normal operation of the system.

[0003] Therefore, the heat dissipation solution needs to focus on solving the problem of good contact between multiple chips and heat dissipation components. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide a floating liquid cooling device and a chip module, which are used to solve the technical problem of poor contact with the heat dissipation device during multi-chip integration in the prior art.

[0005] To achieve the above-mentioned purpose and other related purposes, in a first aspect, the present application provides a floating liquid cooling device, which is applied to a chip module including a first chip module and a second chip module, and the floating liquid cooling device includes:

[0006] A metal cover is installed above the first chip module and the second chip module; a liquid cooling plate is installed above the metal cover corresponding to the first chip module; a metal block is installed on the liquid cooling plate and corresponds to the second chip module; and a heat pipe is respectively connected to the liquid cooling plate and the metal block to transfer the heat of the second chip module to the liquid cooling plate.

[0007] In an implementation manner of the first aspect, a boss is provided on the liquid cooling plate; and the boss is in contact with the first chip.

[0008] In an implementation of the first aspect, the metal cover is provided with: a first avoidance hole corresponding to the second chip module, and the metal block is installed above the first avoidance hole; and a second avoidance hole corresponding to the boss to avoid interference with the liquid cooling plate.

[0009] In an implementation of the first aspect, the heat pipe includes: a first tube portion, which is attached to the surface of the metal block; a second tube portion, which is attached to the surface of the liquid cooling plate; and a bent connecting portion, which is connected between the first tube portion and the second tube portion and suspended between the surface of the metal block and the surface of the liquid cooling plate.

[0010] In an implementation manner of the first aspect, the floating liquid cooling device further includes a fixing member, and the fixing member is fixed on the metal cover.

[0011] In an implementation manner of the first aspect, a groove corresponding to the fixing piece is provided on the surface of the metal cover; and the metal cover is buckled with the fixing piece.

[0012] In an implementation manner of the first aspect, the liquid cooling plate includes a mounting hole, and the liquid cooling plate is connected to the chip module through the mounting hole.

[0013] In a second aspect, the present application provides a chip module, comprising: a chip substrate; a first chip module and at least one second chip module mounted on the chip substrate; and a floating liquid cooling device as described in any one of the first aspects of the present application.

[0014] In an implementation manner of the second aspect, at least one of the chip modules is disposed around the first chip module.

[0015] In an implementation manner of the second aspect, the first chip module includes a switching chip, and each of the second chip modules includes a plurality of light engine chips arranged horizontally.

[0016] As described above, the floating liquid cooling device and chip module described in this application have the following beneficial effects:

[0017] The present application connects the liquid cooling plate and the metal block with the chip module through a metal cover and a heat pipe, thereby reducing the height difference of the heat dissipation device, improving the problem of poor contact caused by the height difference, and effectively reducing the contact temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 Shown is a schematic structural diagram of a floating liquid cooling device described in one embodiment of the present application.

[0019] Figure 2 Shown is an exploded view of a floating liquid cooling device according to an embodiment of the present application.

[0020] Figure 3 Shown is a top view of a floating liquid cooling device according to an embodiment of the present application.

[0021] Figure 4 Shown is a bottom view of a floating liquid cooling device according to an embodiment of the present application.

[0022] Figure 5 Shown is a schematic structural diagram of a metal cover in a floating liquid cooling device according to an embodiment of the present application.

[0023] Component number description

[0024] 100 Floating Liquid Cooling Unit

[0025] 1 Fixing parts

[0026] 2 Liquid cooling plate

[0027] 3 Metal cover

[0028] 4. First chip module

[0029] 5 Second chip module

[0030] 6 Chip Substrate

[0031] 7 Metal Blocks

[0032] 8 Mounting holes

[0033] 9 Heat pipe

[0034] 10 Boss

[0035] 11 The first avoidance hole

[0036] 12 Second avoidance hole

[0037] 13 Groove

[0038] 200 Chip Module DETAILED DESCRIPTION

[0039] The following describes the implementation methods of the present application through specific specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0040] It should be noted that the illustrations provided in the following embodiments are only used to illustrate the basic concept of the present application in a schematic manner, and therefore the illustrations only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0041] In addition, in this application, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0042] The following embodiments of the present application provide a floating liquid cooling device and a chip module, which are used to solve the technical problem of poor contact with the heat dissipation device during multi-chip integration in the prior art.

[0043] The following will be combined with the attached Figure 1 To Attachment Figure 5 The principles and implementation methods of a floating liquid cooling device and a chip module in the embodiment of the present application are described in detail so that those skilled in the art can understand the floating liquid cooling device and the chip module in the embodiment without creative work.

[0044] like Figure 1 As shown, this embodiment provides a floating liquid cooling device 100, which is applied to a chip module 200 including a first chip module 4 and a second chip module 5. The floating liquid cooling device 100 includes: a metal cover 3, a liquid cooling plate 2, a metal block 7 and a heat pipe 9. The metal cover 3 is installed above the first chip module 4 and the second chip module 5; the liquid cooling plate 2 is installed above the metal cover 3 corresponding to the first chip module 4; the metal block 7 is installed on the liquid cooling plate 2 and corresponds to the second chip module 5; the heat pipe 9 is connected to the liquid cooling plate 2 and the metal block 7 respectively to transfer the heat of the second chip module 5 to the liquid cooling plate 2.

[0045] In this embodiment, the first chip module 4 is a high-power chip, such as a CPU, GPU, ASIC chip, etc. The second chip module 5 is configured around the first chip module 4. For example, the second chip module 5 is an optical engine (OE) chip. A plurality of the second chip modules 5 are evenly arranged around the first chip module 4.

[0046] Among them, in this embodiment, preferably, the first chip module 4 includes an ASIC chip, and each of the second chip modules 5 includes multiple optical engine chips, and the ASIC chip and each optical engine chip form an NPO (Near-packaged optics) chip or a CPO (co-compact Optical) chip.

[0047] The floating liquid cooling device 100 in this embodiment is described in detail below.

[0048] In this embodiment, the metal cover 3 is installed above the first chip module 4 and the second chip module 5 , and a first avoidance hole 11 and a second avoidance hole 12 are provided on the metal cover 3 to prevent the metal cover 3 from covering the first chip module 4 and the second chip module 5 .

[0049] In this embodiment, the liquid cooling plate 2 and the first chip module 4 are correspondingly mounted above the metal cover 3, and a boss 10 is provided on the liquid cooling plate 2 to contact with the first chip module 4 to absorb the heat emitted by the first chip module 4. The first avoidance hole 11 provided on the metal cover 3 avoids contact with the boss 10 to avoid interference between the metal cover 3 and the liquid cooling plate 2.

[0050] Among them, the liquid cooling plate 2 is provided with a liquid flow channel inside, and is filled with coolant. The liquid cooling plate 2 is connected to an external heat dissipation device, and the coolant in the liquid cooling plate 2 is transported to the heat dissipation device through a power device such as a hydraulic pump. After the heat dissipation device cools the liquid cooling plate 2, it is controlled by the power device to flow back to the liquid cooling plate 2110, taking away the heat generated by the first chip module 4, thereby cooling the first chip module 4.

[0051] Preferably, according to actual needs, the liquid flow channel inside the liquid cooling plate 2 is not restricted in arrangement.

[0052] Furthermore, a thermal interface material is filled between the boss 10 of the liquid cooling plate 2 and the first chip module 4, wherein the thermal interface material includes but is not limited to ultra-thin silicone grease and / or a phase-changing film, so as to improve the contact problem between the liquid cooling plate 2 and the first chip module 4 to a certain extent and reduce the contact temperature between the liquid cooling plate 2 and the first chip module 4.

[0053] In the actual heat dissipation process, the heat of the first chip module 4 is directly conducted to the boss 10 of the liquid cooling plate 2 through the thermal interface material.

[0054] In this embodiment, the metal block 7 is installed on the liquid cooling plate 2 and corresponds to the second chip module 5 . The metal block 7 contacts each second chip in the second chip module 5 in a one-to-one correspondence through the second avoidance holes 12 provided on the metal cover 3 .

[0055] Specifically, a thermal conductive interface material is filled between the metal block 7 and the second chip module 5, wherein the thermal conductive interface material includes but is not limited to ultra-thin silicone grease and / or phase-changing film, so as to improve the contact problem between the metal block 7 and the second chip module 5 to a certain extent and reduce the contact temperature between the metal block 7 and the second chip module 5.

[0056] Specifically, in one embodiment, if Figure 2 As shown, the second chip module 5 is arranged in a U-shape around the first chip module 4, and the metal block 7 is arranged in a U-shape around the liquid cooling plate 2 corresponding to the second chip module 5, so as to contact with each second chip in the second chip module 5 one by one, avoiding the poor contact problem caused by the height tolerance between the second chip modules 5 and the flatness tolerance of the metal parts themselves.

[0057] In this embodiment, the heat pipe 9 is connected to the liquid cooling plate 2 and the metal block 7 respectively to transfer the heat of the second chip module 5 to the liquid cooling plate 2. When the metal block 7 contacts each second chip in the second chip module 5 one by one, there are also multiple heat pipes 9 connected to the block.

[0058] Any of the heat pipes 9 includes: a first pipe portion attached to the surface of the metal block 7, a second pipe portion attached to the surface of the liquid cooling plate 2, and a curved connection portion connected between the first pipe portion and the second pipe portion. The curved connection portion is suspended between the surface of the metal block 7 and the surface of the liquid cooling plate 2, so that the floating liquid cooling device 100 has a floating effect.

[0059] During the actual heat dissipation process, the heat of the second chip module 5 is transferred to the metal block 7 through the thermal interface material, and then transferred to the liquid cooling plate 2 through the heat pipe 9 connected between the metal block 7 and the liquid cooling plate 2 .

[0060] In this embodiment, the floating liquid cooling device 100 further includes a fixing member 7 , which is fixed to the metal cover 3 ; the buckle is a hollow structure, corresponding to the metal block 7 respectively, and a groove 13 is provided on the metal cover 3 .

[0061] Specifically, each buckling point of the fixing member 7 corresponds to the groove 13 provided on the metal cover 3 , so that the metal cover 3 and the fixing member 7 are buckled.

[0062] In this embodiment, four mounting holes 8 are disposed around the liquid cooling plate 2 , so that the liquid cooling plate 2 and the chip module 200 are connected via screws and the mounting holes 8 .

[0063] In one embodiment, the present application further provides a chip module 200, the chip module 200 comprising: a chip substrate 6, a first chip module 4 and at least one second chip module 5 mounted on the chip substrate 6, and the above-mentioned floating liquid cooling device 100. The above-mentioned floating liquid cooling device 100 has been described in detail, which will not be repeated here.

[0064] In this embodiment, at least one second chip module 5 is arranged around the first chip module 4 , that is, the first chip module 4 is placed in the middle, and a plurality of second chip modules 5 are arranged around the first chip module 4 .

[0065] In this embodiment, the first chip module 4 includes an ASIC chip; each of the second chip modules 5 includes a plurality of light engine chips arranged horizontally. Figure 2 As shown. A second chip module 5 is disposed around the ASIC chip, and each second chip module 5 includes four light engine chips arranged side by side. The ASIC chip and each light engine chip form an NPO (Near-packaged optics) chip or a CPO (co-compact Optical) chip.

[0066] In summary, the present application connects the liquid cooling plate and the metal block with the chip module through the metal cover and the heat pipe, reduces the height difference of the heat dissipation device, improves the problem of poor contact caused by the height difference, and can effectively reduce the contact temperature. Therefore, the present application effectively overcomes various shortcomings in the prior art and has a high industrial utilization value.

[0067] The above embodiments are merely illustrative of the principles and effects of the present application and are not intended to limit the present application. Anyone familiar with the technology may modify or change the above embodiments without violating the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by a person of ordinary skill in the art without departing from the spirit and technical ideas disclosed in the present application shall still be covered by the claims of the present application.

Claims

1. A floating liquid cooling device, characterized in that: Applied to a chip module including a first chip module and a second chip module, the floating liquid cooling device includes: A metal cover, installed above the first chip module and the second chip module; A liquid cooling plate, mounted above the metal cover corresponding to the first chip module; a metal block, mounted on the liquid cooling plate and corresponding to the second chip module; The heat pipe is respectively connected to the liquid cooling plate and the metal block to transfer the heat of the second chip module to the liquid cooling plate.

2. The floating liquid cooling device according to claim 1, characterized in that: The liquid cooling plate is provided with a boss; the boss is in contact with the first chip.

3. The floating liquid cooling device according to claim 2, characterized in that: The metal cover is provided with: A first avoidance hole, corresponding to the second chip module, and the metal block is installed above the first avoidance hole; The second avoidance hole corresponds to the boss to avoid interference with the liquid cooling plate.

4. The floating liquid cooling device according to claim 1, characterized in that: The heat pipe comprises: A first tube portion, attached to the surface of the metal block; The second tube portion is attached to the surface of the liquid cooling plate; The bent connecting portion is connected between the first tube portion and the second tube portion and is suspended between the surface of the metal block and the surface of the liquid cooling plate.

5. The floating liquid cooling device according to claim 1, characterized in that: The floating liquid cooling device also includes a fixing member, and the fixing member is fixed on the metal cover.

6. The floating liquid cooling device according to claim 5, characterized in that: The surface of the metal cover is provided with a groove corresponding to the fixing piece; the metal cover is buckled with the fixing piece.

7. The floating liquid cooling device according to claim 1, characterized in that: The liquid cooling plate comprises a mounting hole, and the liquid cooling plate is connected to the chip module through the mounting hole.

8. A chip module, characterized in that: The chip module comprises: Chip substrate; a first chip module and at least one second chip module mounted on the chip substrate; A floating liquid cooling device as claimed in any one of claims 1 to 7.

9. The chip module according to claim 8, characterized in that: At least one of the chip modules is disposed around the first chip module.

10. The chip module according to claim 8, characterized in that: The first chip module includes a switching chip, and each of the second chip modules includes a plurality of light engine chips arranged horizontally.

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