Gigabit SFP SX receiving and transmitting integrated optical module
By designing a combined heat dissipation method of water-cooled pipe and heat sink in the Gigabit SFP SX transceiver integrated optical module, and combining an anti-interference mechanism, the problem of overheating and electromagnetic signal interference of the module under long-term high load is solved, and the stability of the module is improved Sex and reliability.
Patent Information
- Application Number
- CN202421277147.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-05
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-06-05
AI Technical Summary
The Gigabit SFP SX transceiver integrated optical module may overheat during long-term high load operation, and improper housing design may lead to electromagnetic signal interference, affecting the stability and performance of the module.
A Gigabit SFP SX transmission and reception integrated optical module including a main housing, a heat dissipation mechanism and an anti-interference mechanism is designed. This module adopts a combined heat dissipation method of water-cooled pipe and heat sink, assists heat dissipation through a micro fan, and an anti-interference mechanism is set up inside and bottom of the main shell, including a jamming slot, a jamming block, a micro spring and a shielding plate to avoid electromagnetics radiation.
It effectively reduces the temperature of the motherboard, avoids overheating problems, and reduces electromagnetic signal interference through an anti-interference mechanism, improving the reliability and stability of the system. This design makes the installation and disassembly of the shielding plate more convenient, saves maintenance time, and improves the overall heat dissipation efficiency by optimizing the heat dissipation structure.
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Figure CN222464621U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of integrated optical module equipment, in particular to a gigabit SFP SX transceiver integrated optical module. Background Art
[0002] SFP (Small Form Pluggable) can be simply understood as an upgraded version of GBIC (Gigabit Interface Converter). It is an interface device that converts gigabit electrical signals into optical signals and can be hot-swapped. GBIC is an interchangeable product that complies with international standards. Gigabit switches designed with GBIC interfaces have a large market share due to their flexible interchangeability.
[0003] However, when using the Gigabit SFP SX transceiver integrated optical module, the mainboard of the Gigabit SFP SX transceiver integrated optical module may continue to generate heat, affecting the heat dissipation performance of the module, causing the module to overheat when working at a high load for a long time, and improper shell design may cause electromagnetic signal interference, affecting the stability and performance of the module. Therefore, those skilled in the art provide a Gigabit SFP SX transceiver integrated optical module to solve the problems raised in the above background technology. Utility Model Content
[0004] The purpose of the utility model is to provide a Gigabit SFP SX transceiver integrated optical module to solve the problems raised in the above background technology.
[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0006] The Gigabit SFP SX transceiver integrated optical module comprises a main shell, a heat dissipation mechanism and an anti-interference mechanism. A pull-out block is arranged at one end of the main shell, a main board is arranged inside the main shell, a limit shell is arranged on the upper end of the main board, a top plate is movably connected to the upper end of the limit shell, the top plate is movably connected to the main shell, a locking block is arranged at the bottom end of the main shell, a heat dissipation groove is arranged inside the main shell, a heat dissipation mechanism is arranged between the top plate and the main board and inside the heat dissipation groove, and an anti-interference mechanism is arranged inside the main shell and at the bottom end of the main shell.
[0007] As a further solution of the utility model: a plurality of micro fans are arranged between the top plate and the main board, a plurality of micro heat sinks are arranged in the heat dissipation groove, the outer side walls of the micro heat sinks are sleeved and connected with water cooling pipes, a water inlet is arranged at one end of the water cooling pipe, a water outlet is arranged at the other end of the water cooling pipe, and the water outlet and the water inlet are both connected with sealing covers.
[0008] As a further solution of the utility model: a plurality of snap-in grooves are arranged on the outer side wall at the bottom end of the main shell body, micro springs are arranged on the left and right side walls inside the snap-in grooves, the other ends of the micro springs are fixedly connected with extrusion blocks, and snap-in blocks are movably connected between the extrusion blocks.
[0009] As a further solution of the utility model: a limiting groove is provided at the bottom end of the clamping groove, an extension block is fixedly connected to the bottom end of the clamping block, a pair of protrusions are fixedly connected to the bottom end of the extension block, the protrusions and the extension blocks are movably clamped with the limiting groove, and the upper end of the clamping block is fixedly connected to the shielding plate.
[0010] As a further solution of the utility model: a reinforcement layer is arranged at one end inside the main shell, a heat-conducting layer is arranged at the other end of the reinforcement layer, and an insulating layer is arranged at the other end of the heat-conducting layer.
[0011] As a further solution of the utility model: the heat-conducting layer is made of aluminum, the insulating layer is made of silicone, and the reinforcement layer is made of copper.
[0012] Compared with the prior art, the utility model has the following beneficial effects: the utility model is provided with an anti-interference mechanism, which can reduce interference to sensitive signals by avoiding electromagnetic radiation, especially in some occasions where signal stability is required to be high. Such a design can improve the reliability and stability of the system. The design of the clamping block, the clamping groove and the micro spring makes the installation and removal of the shielding plate more convenient and faster, saving the time cost of maintaining and replacing the shielding plate. The limit design of the extension block and the protrusion can ensure that the shielding plate is stable and reliable after installation, and is not prone to displacement or failure. Since a heat dissipation mechanism is provided, the motherboard is cooled by a water cooling pipe and a heat sink, which can effectively help the motherboard to remove the generated heat and keep the motherboard running within the normal operating temperature range, thereby improving the stability and reliability of the equipment. The cooperation of the water cooling pipe and the heat sink can improve the heat dissipation efficiency and ensure that the overall heat dissipation effect of the motherboard is better. The auxiliary heat dissipation effect of the micro fan also further enhances the heat dissipation effect and ensures that the motherboard will not overheat. The utility model relates to a gigabit SFP SX transceiver integrated optical module. The utility model is simple and reasonable in structure design and convenient and quick to use. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 This is a schematic diagram of the structure of the Gigabit SFP SX transceiver optical module.
[0014] Figure 2 The figure is a schematic diagram of the exploded structure of the Gigabit SFP SX transceiver optical module.
[0015] Figure 3 This is a schematic diagram of the structure of the other end of the Gigabit SFP SX transceiver optical module.
[0016] Figure 4 This is a schematic diagram of the exploded structure of the other end of the Gigabit SFP SX transceiver optical module.
[0017] Figure 5 This is a schematic diagram of a partial side cross-sectional structure of the main housing of a Gigabit SFP SX transceiver integrated optical module.
[0018] Figure 6 The figure is a schematic diagram of the internal structure of the side wall of the main housing of the Gigabit SFP SX transceiver integrated optical module.
[0019] In the figure: 1-main shell, 2-pull-out block, 3-top plate, 4-limiting shell, 5-main board, 6-heat dissipation groove, 7-locking block, 8-micro fan, 9-micro heat sink, 10-water cooling pipe, 11-water inlet, 12-water outlet, 13-shielding plate, 14-clamping groove, 15-clamping block, 16-extension block, 17-bump, 18-micro spring, 19-extrusion block, 20-limiting groove, 21-reinforcement layer, 22-heat conducting layer, 23-insulating layer. DETAILED DESCRIPTION
[0020] See also Figures 1 to 6In the embodiment of the utility model, the Gigabit SFP SX transceiver integrated optical module includes a main shell 1, a pull-out block 2, a top plate 3, a limit shell 4, a main board 5, a heat dissipation groove 6, a locking block 7, a micro fan 8, a micro heat sink 9, a water cooling pipe 10, a water inlet 11, a water outlet 12, a shielding plate 13, a clamping groove 14, a clamping block 15, an extension block 16, a protrusion 17, a micro spring 18, an extrusion block 19, a limit groove 20, a reinforcement layer 21, a heat conducting layer 22, and an insulating layer 23; a pull-out block 2 is provided at one end of the main shell 1, and a main board 5 is provided inside the main shell 1. A limit shell 4 is arranged on the upper end of the main board 5, a top plate 3 is movably connected to the upper end of the limit shell 4, the top plate 3 is movably connected to the main shell 1, a locking block 7 is arranged at the bottom of the main shell 1, a heat dissipation groove 6 is arranged inside the main shell 1, a heat dissipation mechanism is arranged between the top plate 3 and the main board 5 and inside the heat dissipation groove 6, an anti-interference mechanism is arranged inside the main shell 1 and at the bottom of the main shell 1, a plurality of micro fans 8 are arranged between the top plate 3 and the main board 5, a plurality of micro heat sinks 9 are arranged in the heat dissipation groove 6, and the outer walls of the micro heat sinks 9 are sleeved with connecting A water cooling pipe 10 is connected, one end of the water cooling pipe 10 is provided with a water inlet 11, and the other end of the water cooling pipe 10 is provided with a water outlet 12. The water outlet 12 and the water inlet 11 are both externally connected with a sealing cover. A plurality of clamping grooves 14 are provided on the outer side wall of the bottom end of the main shell 1. Micro springs 18 are provided on the left and right side walls of the inside of the clamping groove 14. The other ends of the micro springs 18 are fixedly connected with extrusion blocks 19. The extrusion blocks 19 are movably clamped with clamping blocks 15. The bottom ends of the clamping grooves 14 are provided with limiting grooves 2 0, the bottom ends of the clamping blocks 15 are fixedly connected with the extension blocks 16, the bottom ends of the extension blocks 16 are fixedly connected with a pair of protrusions 17, the protrusions 17 and the extension blocks 16 are movably clamped with the limiting grooves 20, the upper ends of the clamping blocks 15 are fixedly connected with the shielding plate 13, a reinforcement layer 21 is arranged at one end inside the main shell 1, a heat-conducting layer 22 is arranged at the other end of the reinforcement layer 21, and an insulating layer 23 is arranged at the other end of the heat-conducting layer 22, the heat-conducting layer 22 is made of aluminum, the insulating layer 23 is made of silicone, and the reinforcement layer 21 is made of copper.
[0021] The working principle of the utility model is as follows: the multiple clamping blocks 15 at the bottom end of the shielding plate 13 are all clamped into the clamping groove 14, and the micro springs 18 arranged at the left and right ends of the clamping groove 14 can shrink backward after the extrusion block 19 is subjected to force, so that the clamping block 15 is smoothly placed in the limiting groove 20, and the extension block 16 and the protrusion 17 are limited. When the extension block 16 and the protrusion 17 enter, the micro spring 18 loses the impact of force, and resets, driving the extrusion plate 19 to squeeze the clamping rod 15, thereby completing the installation of the shielding plate 13, and avoiding electromagnetic radiation and sensitive signals when in use. Interference; when the main shell 1 is not in use, cold water is injected into the water inlet 11 of the water-cooling pipe 10, and then the water inlet is sealed through the sealing cover, and the micro-fan is started, and then the various components are installed, and after being tested and confirmed, they are inserted into the specified chassis. When the mainboard 5 is running, heat is generated, and the water-cooling pipe cools it. At the same time, the heat sink 9 cools the water-cooling pipe 10 to ensure the cooling efficiency of the water-cooling pipe. In addition, the micro-fan 8 at the upper end of the mainboard 5 also continuously blows cold air to the mainboard 5 to ensure that the temperature of the mainboard 5 is normal. The heat-conducting layer 22 is made of aluminum, and the insulating layer 23 is made of silicone. The solid layer 21 is made of copper, and has good thermal conductivity through the inherent properties of various materials. When the temperature inside the main shell 1 is too high, the heat can be discharged. The utility model is provided with an anti-interference mechanism, which can reduce the interference to sensitive signals by avoiding electromagnetic radiation, especially in some occasions with high requirements for signal stability. Such a design can improve the reliability and stability of the system. The design of the clamping block 15, the clamping slot 14 and the micro spring 18 makes the installation and removal of the shielding plate 13 more convenient and faster, saving the time cost of maintaining and replacing the shielding plate 13. By extending the block 16 The limiting design of the block 17 can ensure that the shielding plate 13 is stable and reliable after installation, and is not prone to displacement or failure. Because a heat dissipation mechanism is provided, the mainboard is cooled by the water-cooling pipe 10 and the heat sink 9, which can effectively help the mainboard to remove the generated heat and keep the mainboard running within the normal operating temperature range, thereby improving the stability and reliability of the equipment. The cooperation of the water-cooling pipe 10 and the heat sink 9 can improve the heat dissipation efficiency and ensure a better overall heat dissipation effect of the mainboard. The auxiliary heat dissipation effect of the micro fan 8 also further enhances the heat dissipation effect and ensures that the mainboard will not overheat. The utility model relates to a Gigabit SFP SX transceiver integrated optical module. The utility model is simple and reasonable in structure design and is convenient and quick to use.
[0022] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.
Claims
1. A Gigabit SFP SX transceiver integrated optical module, comprising a main housing (1), a heat dissipation mechanism and an anti-interference mechanism, characterized in that: A drawer block (2) is provided at one end of the main shell (1), a main board (5) is provided inside the main shell (1), a limit shell (4) is provided at the upper end of the main board (5), a top plate (3) is movably connected to the upper end of the limit shell (4), the top plate (3) is movably connected to the main shell (1), a locking block (7) is provided at the bottom end of the main shell (1), a heat dissipation groove (6) is provided inside the main shell (1), a heat dissipation mechanism is provided between the top plate (3) and the main board (5) and inside the heat dissipation groove (6), and an anti-interference mechanism is provided inside the main shell (1) and at the bottom end of the main shell (1).
2. The Gigabit SFP SX transceiver integrated optical module according to claim 1, characterized in that: The heat dissipation mechanism comprises a micro fan (8), a micro heat sink (9), a water cooling pipe (10), a water inlet (11), and a water outlet (12); a plurality of micro fans (8) are arranged between the top plate (3) and the main plate (5).
3. The Gigabit SFP SX transceiver integrated optical module according to claim 2, characterized in that: A plurality of micro heat sinks (9) are arranged in the heat dissipation groove (6), and the outer walls of the micro heat sinks (9) are sleeved and connected with water cooling pipes (10), one end of the water cooling pipe (10) is provided with a water inlet (11), and the other end of the water cooling pipe (10) is provided with a water outlet (12), and the water outlet (12) and the water inlet (11) are both externally connected with sealing covers.
4. The Gigabit SFP SX transceiver integrated optical module according to claim 1, characterized in that: The anti-interference mechanism comprises a shielding plate (13), a snap-fit groove (14), a snap-fit block (15), an extension block (16), a protrusion (17), a micro spring (18), an extrusion block (19), a limit groove (20), a reinforcement layer (21), a heat-conducting layer (22), and an insulating layer (23), and a plurality of snap-fit grooves (14) are provided on an outer side wall of the bottom end of the main housing (1).
5. The Gigabit SFP SX transceiver integrated optical module according to claim 4, characterized in that: Micro springs (18) are provided on both left and right side walls of the clamping groove (14); the other ends of the micro springs (18) are fixedly connected to extrusion blocks (19); and clamping blocks (15) are movably clamped between the extrusion blocks (19) and the extrusion blocks (19).
6. The Gigabit SFP SX transceiver integrated optical module according to claim 5, characterized in that: The bottom ends of the clamping grooves (14) are all provided with limiting grooves (20), the bottom ends of the clamping blocks (15) are all fixedly connected to extension blocks (16), the bottom ends of the extension blocks (16) are all fixedly connected to a pair of protrusions (17), the protrusions (17) and the extension blocks (16) are all movably clamped to the limiting grooves (20), and the upper ends of the clamping blocks (15) are all fixedly connected to the shielding plate (13).
7. The Gigabit SFP SX transceiver integrated optical module according to claim 1, characterized in that: A reinforcement layer (21) is provided at one end inside the main shell (1), a heat conduction layer (22) is provided at the other end of the reinforcement layer (21), and an insulation layer (23) is provided at the other end of the heat conduction layer (22).
8. The Gigabit SFP SX transceiver integrated optical module according to claim 7, characterized in that: The heat conducting layer (22) is made of aluminum, the insulating layer (23) is made of silicone, and the reinforcement layer (21) is made of copper.