Composite heat-conducting gasket

Abstract

The utility model discloses a composite heat-conducting gasket which comprises a carbon fiber orientation heat-conducting gasket, one side of the carbon fiber orientation heat-conducting gasket is compounded with a first heat-conducting silica gel layer through a calendaring and baking process, and the other side of the carbon fiber orientation heat-conducting gasket is compounded with a second heat-conducting silica gel layer through the calendaring and baking process. According to the composite heat-conducting gasket, the carbon fiber orientation heat-conducting gasket and the heat-conducting silica gel layer are compounded together, so that the interface thermal resistance of the whole product is small, meanwhile, due to the fact that the heat-conducting silica gel layer with low hardness is used, the heat conductivity coefficient of the whole product can be improved, and the composite heat-conducting gasket can be suitable for being used in high-heat-dissipation products such as a CPU and a PCB.

Description

Technical Field

[0001] The utility model relates to the field of heat-conducting pads for the electronics industry, in particular to a composite heat-conducting pad. Background Art

[0002] In heat-conducting and heat-dissipating components such as CPUs and PCB boards, thermal conductive materials are needed to enhance their thermal conductivity. Currently, carbon fiber-oriented thermal conductive gaskets are the most commonly used thermal conductive materials. Although the thermal conductivity of carbon fiber-oriented thermal conductive gaskets is very high, the Z-direction thermal conductivity can reach up to 50W / mk, but the surface has no wettability. During installation testing, the interface thermal resistance is very high, and the thermal conductivity deteriorates a lot. Even if the assembly pressure is increased, the surface is tightly bonded to reduce the interface thermal resistance, but the carbon fiber of the gasket will be bent, the carbon fiber orientation will deteriorate, and the thermal conductivity will also deteriorate a lot. Utility Model Content

[0003] The technical problem solved by the utility model is to provide a composite heat-conducting gasket with small interface thermal resistance, high overall thermal conductivity and certain compressibility.

[0004] The technical solution adopted by the utility model to solve its technical problem is: a composite thermal conductive gasket, including a carbon fiber thermal conductive gasket, one side of the carbon fiber thermal conductive gasket is compounded with a first thermal conductive silicone layer through a calendering and baking process, and the other side of the carbon fiber thermal conductive gasket is compounded with a second thermal conductive silicone layer through a calendering and baking process.

[0005] Furthermore, the first thermally conductive silicone layer is a low-hardness thermally conductive silicone layer, and the Shore 00 hardness of the low-hardness thermally conductive silicone layer is 20-40.

[0006] Furthermore, the second thermally conductive silicone layer is a low-hardness thermally conductive silicone layer, and the Shore 00 hardness of the low-hardness thermally conductive silicone layer is 20-40.

[0007] Furthermore, the thickness of the first thermally conductive silicone layer is 0.2-1.0 mm.

[0008] Furthermore, the thickness of the second thermally conductive silicone layer is 0.2-1.0 mm.

[0009] Furthermore, the thickness of the carbon fiber taken from the heat conducting pad is 0.5-10 mm.

[0010] Furthermore, the total thickness of the carbon fiber-based heat-conducting pad, the first heat-conducting silicone layer, and the second heat-conducting silicone layer is 0.9 to 12 mm.

[0011] The beneficial effect of the utility model is that the composite thermal conductive gasket of the utility model is compounded together by taking carbon fiber and taking the thermal conductive gasket and the thermal conductive silicone layer, so that the interface thermal resistance of the overall product is small, and at the same time, due to the use of the low-hardness thermal conductive silicone layer, the overall thermal conductivity and compression shock absorption performance of the product can be improved, so that it can be adapted for use in high heat dissipation products such as CPUs and PCB boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of the structure of a composite thermally conductive gasket according to an embodiment of the present application.

[0013] Marked in the figure are: carbon fiber-based thermal conductive gasket 1, first thermal conductive silicone layer 2, and second thermal conductive silicone layer 3. DETAILED DESCRIPTION

[0014] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0015] like Figure 1 As shown, an embodiment of the present application discloses a composite thermal conductive gasket, including a carbon fiber thermal conductive gasket 1, one side of the carbon fiber thermal conductive gasket 1 is compounded with a first thermal conductive silicone layer 2 through a calendering and baking process, and the other side of the carbon fiber thermal conductive gasket 1 is compounded with a second thermal conductive silicone layer 3 through a calendering and baking process.

[0016] Specifically, the first thermally conductive silicone layer 2 is a low-hardness thermally conductive silicone layer, and the Shore 00 hardness of the low-hardness thermally conductive silicone layer is 20-40.

[0017] Specifically, the second thermally conductive silicone layer 3 is a low-hardness thermally conductive silicone layer, and the Shore 00 hardness of the low-hardness thermally conductive silicone layer is 20-40.

[0018] During the specific production of this product, the production steps are as follows: a surface treatment agent is used to treat both sides of the carbon fiber-mounted heat-conducting gasket 1, and then a thermally conductive silicone base material is respectively calendered on both sides of the carbon fiber-mounted heat-conducting gasket 1 through a calendering process, and the two sides are then respectively baked at 120°C for vulcanization and finalization to finally form the entire product.

[0019] The composite thermally conductive gasket of the utility model is compounded with a carbon fiber-oriented thermally conductive gasket 1 and a thermally conductive silicone layer, so that the interface thermal resistance of the overall product is small. At the same time, due to the use of a low-hardness thermally conductive silicone layer, the overall thermal conductivity of the product can be improved, so that it can be adapted for use in high-heat dissipation products such as CPUs and PCB boards. At the same time, due to the good compression performance of the low-hardness thermally conductive silicone layer, it has good compressibility, surface wettability and adhesion under low assembly pressure, and can also prevent the carbon fiber-oriented thermally conductive gasket from being bent.

[0020] Specifically, the thickness of the first thermally conductive silicone layer 2 is 0.2-1.0 mm, and specifically may be 0.2 mm, 0.5 mm, 0.7 mm, 1.0 mm, etc.

[0021] The thickness of the second thermally conductive silicone layer 3 is 0.2-1.0 mm, and specifically can be 0.2 mm, 0.5 mm, 0.7 mm, 1.0 mm, etc.

[0022] When specifically selecting the thickness of the first thermally conductive silicone layer 2 and the second thermally conductive silicone layer 3, if the thickness of the first thermally conductive silicone layer 2 and the second thermally conductive silicone layer 3 is selected to be too thick, the thermal conductivity of the first thermally conductive silicone layer 2 and the second thermally conductive silicone layer 3 will be greatly reduced. If the thickness of the first thermally conductive silicone layer 2 and the second thermally conductive silicone layer 3 is selected to be too thin, the compression shock absorption of the first thermally conductive silicone layer 2 and the second thermally conductive silicone layer 3 will be poor. Therefore, when the thickness is selected to be between 0.2 and 1.0 mm, it is possible to ensure both the thermal conductivity and the compression shock absorption performance.

[0023] In this embodiment, the thickness of the carbon fiber taken from the heat conducting pad 1 is 0.5-10 mm, and the specific thickness can be 0.5 mm, 1 mm, 5 mm, 10 mm, etc.

[0024] In this embodiment, the total thickness of the carbon fiber-based thermal conductive pad 1, the first thermal conductive silicone layer 2 and the second thermal conductive silicone layer 3 is 0.9-12 mm, and the specific thickness can be 0.9 mm, 2 mm, 8 mm, 12 mm, etc.

[0025] The thickness of the carbon fiber thermal conductive pad 1 is selected based on actual product requirements so that it can meet the thickness requirements of thermal conductive structures in products such as CPUs and PCB boards.

[0026] Specifically, according to the needs, a first release layer can be provided on the side of the first thermally conductive silicone layer 2 away from the carbon fiber thermal conductive gasket 1 , and a second release layer can be provided on the side of the second thermally conductive silicone layer 3 away from the carbon fiber thermal conductive gasket 1 .

[0027] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A composite thermally conductive pad, characterized in that: It comprises a carbon fiber-derived heat-conducting gasket (1), one side of the carbon fiber-derived heat-conducting gasket (1) being compounded with a first heat-conducting silicone layer (2) through a calendering and baking process, and the other side of the carbon fiber-derived heat-conducting gasket (1) being compounded with a second heat-conducting silicone layer (3) through a calendering and baking process.

2. A composite thermally conductive pad as claimed in claim 1, characterized in that: The first thermally conductive silicone layer (2) is a low-hardness thermally conductive silicone layer, and the Shore 00 hardness of the low-hardness thermally conductive silicone layer is 20-40.

3. The composite thermally conductive pad according to claim 1, characterized in that: The second thermally conductive silicone layer (3) is a low-hardness thermally conductive silicone layer, and the Shore 00 hardness of the low-hardness thermally conductive silicone layer is 20-40.

4. The composite thermally conductive pad according to claim 1, characterized in that: The thickness of the first thermally conductive silicone layer (2) is 0.2-1.0 mm.

5. The composite thermally conductive pad according to claim 1, characterized in that: The thickness of the second thermally conductive silicone layer (3) is 0.2-1.0 mm.

6. The composite thermally conductive pad according to claim 1, characterized in that: The carbon fiber-based heat-conducting pad (1) has a thickness of 0.5 to 10 mm.

7. The composite thermally conductive pad according to claim 1, characterized in that: The total thickness of the carbon fiber-oriented heat-conducting pad (1), the first heat-conducting silicone layer (2) and the second heat-conducting silicone layer (3) is 0.9 to 12 mm.

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