Semiconductor laser hair removal instrument

By using water-cooled radiator, semiconductor refrigeration sheet and multi-layer thermal column design in semiconductor laser hair removal instruments, the problem of excessive temperature inside the instrument is solved, and efficient heat dissipation and stable equipment operation are achieved.

CN222467077UActive Publication Date: 2025-02-14GUANGDONG GUANGER MEDICAL CO LTD
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Patent Information

Application Number
CN202420772323.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-15
Publication Date
2025-02-14
Estimated Expiration
2034-04-15

AI Technical Summary

Technical Problem

During use, semiconductor laser hair removal instruments are prone to problems such as excessive temperature and excessive water temperature, which leads to alarms of the instrument and affects customer experience.

Method used

A semiconductor laser hair removal instrument was designed, using a heat dissipation system combining a water-cooled radiator and a semiconductor refrigeration sheet to achieve effective heat exchange and heat dissipation through circulating water pipes and heat dissipation fans, and to increase cooling water through multi-layer thermal columns and partitions. Cooling area.

Benefits of technology

It effectively avoids the internal temperature of the instrument, improves the heat dissipation efficiency of the equipment, and ensures the stable operation of the instrument and the customer's user experience.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of laser hair removal instruments, and discloses a semiconductor laser hair removal instrument which comprises a bottom shell and a laser pulse power supply, a front panel is arranged on one side of the top of the bottom shell, a heat dissipation side rear net plate is arranged on one side of the front panel, a stainless steel water tank is arranged on the inner wall of the top of the bottom shell, and a water pump is arranged on one side of the inner wall of the heat dissipation side rear net plate. According to the utility model, the cooled cooling water is fed into the radiator by the water pump through the circulating water inlet pipe, external air exchanges heat with the cooling water through the radiator, then is cooled, and then is blown to the laser pulse power supply; the laser pulse power supply is subjected to air cooling heat dissipation, and the large-area mesh design of the heat dissipation side rear mesh plate is matched, so that heat dissipation can be effectively carried out on equipment in the laser hair removal instrument, and the situation that the temperature in the instrument is prone to being too high is avoided.
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Description

Technical Field

[0001] The utility model relates to the technical field of laser hair removal devices, in particular to a semiconductor laser hair removal device. Background Art

[0002] Semiconductor laser hair removal device is a device specially used for hair removal. It is more specific in treatment and has relatively good results. The principle of laser hair removal is to use the selective absorption of light to act on melanin, heating the hair follicles to a certain temperature, and the hair follicles will lose their activity, thus achieving the effect of hair removal. The melanin content in the growing hair follicles reaches its peak, so each irradiation can only achieve the expected effect on the hair in the growing period.

[0003] The working principle of semiconductor laser hair removal device is based on selective thermodynamics, and the microprocessor controls the laser power supply to provide adjustable constant current to the laser module, so that the high-power laser diode inside the laser module converts electrical energy into light energy.

[0004] Therefore, the temperature inside the instrument is prone to be too high, the water temperature is too high, affecting refrigeration, etc. It will also cause the instrument to alarm, affecting the customer experience. Summary of the invention

[0005] The purpose of the utility model is to provide a semiconductor laser hair removal device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor laser hair removal device, comprising: a bottom shell and a laser pulse power supply, a front panel is provided on one side of the top of the bottom shell, a heat dissipation side rear mesh plate is provided on one side of the front panel, a stainless steel water tank is provided on the inner wall of the top of the bottom shell, a water pump is provided on one side of the inner wall of the heat dissipation side rear mesh plate, a top plate is provided on the top of the heat dissipation side rear mesh plate, a radiator is provided on one side of the bottom of the top plate, a cover plate is provided on the top of the stainless steel water tank, a top partition is provided on one side of the inner wall of the stainless steel water tank, a bottom partition is provided on the inner wall of the stainless steel water tank below the top partition, a circulating water inlet pipe is provided on one end of the water inlet of the water pump, a circulating water outlet pipe is provided on one side of the cover plate, the water outlet of the circulating water outlet pipe is located above the top partition, and the water inlet of the circulating water inlet pipe is located below the bottom partition.

[0007] Furthermore, the radiator is a water-cooled radiator, which includes a circulating water pipe and a heat sink. The water inlet of the radiator is connected to the water outlet of a water pump, and the water outlet of the radiator is connected to one end of a circulating water outlet pipe. A semiconductor refrigeration plate is provided on the bottom outer wall of the stainless steel water tank.

[0008] Furthermore, cooling fans are provided on both sides of the bottom of the radiator, a device slot is provided on one side of the top of the cover plate, the laser pulse power supply is installed inside the device slot, and the cooling fan is located above the laser pulse power supply.

[0009] Furthermore, a third heat-conducting column is provided at the bottom of the equipment tank, and the bottom end of the third heat-conducting column extends to above the bottom inner wall of the stainless steel water tank.

[0010] Furthermore, the cross-section of the top partition is L-shaped, and a first heat-conducting column is provided at the bottom of the top partition, and the bottom of the first heat-conducting column extends to above the bottom partition. The cross-section of the bottom partition is L-shaped, and the length of the bottom partition is greater than the length of the top partition. A second heat-conducting column is provided at the bottom of the bottom partition, and the bottom of the second heat-conducting column extends to above the bottom inner wall of the stainless steel water tank.

[0011] Furthermore, a gun head bracket is provided on one side of the outer wall of the bottom shell, a winding rod is provided on the other side of the bottom shell, and a joint is provided on one side of the front panel.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] The utility model realizes that when the semiconductor laser hair removal device is used, the heat generated by the internal equipment is cooled by the semiconductor refrigeration sheet to cool the cooling water in the stainless steel water tank, and the cooled cooling water is pumped into the radiator through the circulating water inlet pipe. At the same time, the heat dissipation fan is started to extract the outside air, and the outside air is cooled after the heat exchange with the cooling water through the radiator, and then blows to the laser pulse power supply to cool the laser pulse power supply. With the large-area mesh design of the heat dissipation side rear mesh plate, the internal equipment of the laser hair removal device can be effectively cooled to avoid the situation that the temperature inside the device is easily too high.

[0014] In addition, the cooling water after heat exchange re-enters the stainless steel water tank through the circulating water outlet pipe. After the cooling water re-enters the stainless steel water tank, it is first retained on the top partition, and a large area of ​​heat is dissipated through the top partition and the first heat-conducting column to avoid the problem of concentrated cooling water entering the stainless steel water tank and causing local water temperature to be too high. Then the cooling water flows through one side of the top partition to the bottom partition to cooperate with the second heat-conducting column for retention and heat dissipation. After the cooling water is cooled again, it flows to the bottom of the stainless steel water tank through one side of the bottom partition, and the cooling water is cooled again through the semiconductor refrigeration plate and the heat dissipation of the stainless steel water tank itself. The stepped water outlet through the top partition and the bottom partition increases the cooling area of ​​the cooling water, which makes the cooling water cool down quickly while ensuring the uniformity of the cooling water temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a three-dimensional diagram of the semiconductor laser hair removal device of the utility model;

[0016] Figure 2 A three-dimensional diagram of the semiconductor laser hair removal device of the utility model from another perspective;

[0017] Figure 3 This is a main cross-sectional view of the semiconductor laser hair removal device of the utility model;

[0018] Figure 4 The utility model is a schematic diagram of the cross-sectional structure of the stainless steel water tank of the semiconductor laser hair removal device.

[0019] In the figure: 1. bottom shell; 2. gun head bracket; 3. winding rod; 4. front panel; 5. connector; 6. heat dissipation side rear mesh plate; 7. top plate; 8. radiator; 9. water pump; 10. cooling fan; 11. laser pulse power supply; 12. stainless steel water tank; 13. cover plate; 14. equipment slot; 15. circulating water outlet pipe; 16. circulating water inlet pipe; 17. semiconductor refrigeration plate; 18. top partition; 19. first thermal conductive column; 20. bottom partition; 21. second thermal conductive column; 22. third thermal conductive column. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0021] See also Figure 1-Figure 4 The utility model provides a technical solution: a semiconductor laser hair removal device, comprising: a bottom shell 1 and a laser pulse power supply 11, a front panel 4 is provided on one side of the top of the bottom shell 1, a heat dissipation side rear mesh plate 6 is provided on one side of the front panel 4, a stainless steel water tank 12 is provided on the top inner wall of the bottom shell 1, a water pump 9 is provided on one side of the inner wall of the heat dissipation side rear mesh plate 6, a top plate 7 is provided on the top of the heat dissipation side rear mesh plate 6, a radiator 8 is provided on one side of the bottom of the top plate 7, a cover plate 13 is provided on the top of the stainless steel water tank 12, a top partition plate 18 is provided on one side of the inner wall of the stainless steel water tank 12, a bottom partition plate 20 is provided on the inner wall of the stainless steel water tank 12 below the top partition plate 18, a circulating water inlet pipe 16 is provided on one end of the water inlet of the water pump 9, a circulating water outlet pipe 15 is provided on one side of the cover plate 13, the water outlet of the circulating water outlet pipe 15 is located above the top partition plate 18, and the water inlet of the circulating water inlet pipe 16 is located below the bottom partition plate 20. The cooling water in the stainless steel water tank 12 is cooled by the semiconductor refrigeration sheet 17, and the cooled cooling water is sent to the radiator 8 by the water pump 9 through the circulating water inlet pipe 16. At the same time, the cooling fan 10 is started to draw in external air. The external air is cooled after heat exchange with the cooling water through the radiator 8, and then blown to the laser pulse power supply 11 to perform air cooling on the laser pulse power supply 11. Combined with the large-area mesh design of the rear screen plate 6 on the heat dissipation side, the internal equipment of the laser hair removal device can be effectively cooled to avoid the situation where the temperature inside the instrument is easily too high.

[0022] The radiator 8 is a water-cooled radiator, which includes a circulating water pipe and a heat sink. The water inlet of the radiator 8 is connected to the water outlet of the water pump 9, and the water outlet of the radiator 8 is connected to one end of the circulating water outlet pipe 15. The outer wall of the bottom of the stainless steel water tank 12 is provided with a semiconductor refrigeration sheet 17. The cooling water in the stainless steel water tank 12 is cooled by the semiconductor refrigeration sheet 17, and the cooled cooling water is sent to the radiator 8 by the water pump 9 through the circulating water inlet pipe 16.

[0023] Cooling fans 10 are provided on both sides of the bottom of the radiator 8, a device slot 14 is provided on one side of the top of the cover plate 13, the laser pulse power supply 11 is installed inside the device slot 14, the cooling fan 10 is located above the laser pulse power supply 11, and a third heat-conducting column 22 is provided at the bottom of the device slot 14. The bottom end of the third heat-conducting column 22 extends to above the bottom inner wall of the stainless steel water tank 12. The third heat-conducting column 22 contacts the cooling water to perform heat exchange on the equipment at the top of the device slot 14, thereby improving the heat dissipation efficiency.

[0024] The cross-section of the top partition 18 is L-shaped, and a first heat-conducting column 19 is provided at the bottom of the top partition 18. The bottom of the first heat-conducting column 19 extends to above the bottom partition 20. The cross-section of the bottom partition 20 is L-shaped. The length of the bottom partition 20 is greater than the length of the top partition 18. A second heat-conducting column 21 is provided at the bottom of the bottom partition 20, and the bottom of the second heat-conducting column 21 extends to above the bottom inner wall of the stainless steel water tank 12. The cooling water re-enters the stainless steel water tank 12 through the circulating water outlet pipe 15. After the cooling water re-enters the stainless steel water tank 12, it is first retained on the top partition 18, and the top partition 18 and the first heat-conducting column 19 are used to dissipate heat over a large area to avoid the problem of concentrated cooling water entering the stainless steel water tank and causing the problem of excessive local water temperature. Then the cooling water flows through one side of the top partition 18 to the bottom partition 20 to cooperate with the second heat-conducting column 21 for retention and heat dissipation. After the cooling water is cooled again, it flows to the bottom of the stainless steel water tank 12 through one side of the bottom partition 20, and the cooling water is cooled again through the semiconductor refrigeration plate 17 and the heat dissipation of the stainless steel water tank 17 itself. The stepped water outlet through the top partition 18 and the bottom partition 20 increases the cooling area of ​​the cooling water, so that the cooling water is cooled quickly while ensuring the uniformity of the cooling water temperature.

[0025] A gun head bracket 2 is provided on one side of the outer wall of the bottom shell 1 for placing the gun head of the laser hair removal device. A winding rod 3 is provided on the other side of the bottom shell 1 for winding and storing the laser hair removal device hose. A connector 5 is provided on one side of the front panel 4 for connecting the laser hair removal device and the gun head plug.

[0026] When the semiconductor laser hair removal device is in use, the heat generated by its internal equipment is cooled by the semiconductor refrigeration sheet 17 to cool the cooling water in the stainless steel water tank 12. The cooled cooling water is sent to the radiator 8 by the water pump 9 through the circulating water inlet pipe 16. At the same time, the heat dissipation fan 10 is started to extract the outside air. The outside air is cooled after heat exchange with the cooling water through the radiator 8 and then blown to the laser pulse power supply 11 to perform air cooling and heat dissipation on the laser pulse power supply 11. With the large-area mesh design of the rear screen plate 6 on the heat dissipation side, the internal equipment of the laser hair removal device can be effectively cooled to avoid the situation where the temperature inside the device is easily too high.

[0027] In addition, the cooling water after heat exchange re-enters the stainless steel water tank 12 through the circulating water outlet pipe 15. After the cooling water re-enters the stainless steel water tank 12, it is first retained on the top partition 18, and the top partition 18 and the first heat-conducting column 19 are used to dissipate heat over a large area to avoid the problem of concentrated cooling water entering the stainless steel water tank and causing the local water temperature to be too high. Then the cooling water flows through one side of the top partition 18 to the bottom partition 20 to cooperate with the second heat-conducting column 21 for retention and heat dissipation. After the cooling water is cooled again, it flows to the bottom of the stainless steel water tank 12 through one side of the bottom partition 20, and the cooling water is cooled again through the semiconductor refrigeration plate 17 and the heat dissipation of the stainless steel water tank 17 itself. The stepped water outlet through the top partition 18 and the bottom partition 20 increases the cooling area of ​​the cooling water, so that the cooling water is cooled quickly while ensuring the uniformity of the cooling water temperature.

[0028] Based on the embodiments of the present utility model, all other embodiments obtained by ordinary technicians in the field without making any creative work shall fall within the scope of protection of the present utility model.

Claims

1. Semiconductor laser hair removal device, including: A bottom shell (1) and a laser pulse power supply (11), characterized in that: a front panel (4) is provided on one side of the top of the bottom shell (1), a heat dissipation side rear screen (6) is provided on one side of the front panel (4), a stainless steel water tank (12) is provided on the inner wall of the top of the bottom shell (1), a water pump (9) is provided on one side of the inner wall of the heat dissipation side rear screen (6), a top plate (7) is provided on the top of the heat dissipation side rear screen (6), a radiator (8) is provided on one side of the bottom of the top plate (7), and a cover plate is provided on the top of the stainless steel water tank (12). (13), a top baffle (18) is provided on one side of the inner wall of the stainless steel water tank (12), a bottom baffle (20) is provided on the inner wall of the stainless steel water tank (12) below the top baffle (18), a circulating water inlet pipe (16) is provided at one end of the water inlet of the water pump (9), a circulating water outlet pipe (15) is provided on one side of the cover plate (13), the water outlet of the circulating water outlet pipe (15) is located above the top baffle (18), and the water inlet of the circulating water inlet pipe (16) is located below the bottom baffle (20).

2. The semiconductor laser hair removal device according to claim 1, characterized in that: The radiator (8) is a water-cooled radiator, comprising a circulating water pipe and a heat sink, the water inlet of the radiator (8) being connected to the water outlet of a water pump (9), the water outlet of the radiator (8) being connected to one end of a circulating water outlet pipe (15), and a semiconductor cooling plate (17) being provided on the outer wall of the bottom of the stainless steel water tank (12).

3. The semiconductor laser hair removal device according to claim 2, characterized in that: Cooling fans (10) are provided on both sides of the bottom of the heat sink (8), a device slot (14) is provided on one side of the top of the cover plate (13), the laser pulse power supply (11) is installed inside the device slot (14), and the cooling fan (10) is located above the laser pulse power supply (11).

4. The semiconductor laser hair removal device according to claim 3, characterized in that: A third heat-conducting column (22) is provided at the bottom of the equipment tank (14), and the bottom end of the third heat-conducting column (22) extends above the bottom inner wall of the stainless steel water tank (12).

5. The semiconductor laser hair removal device according to claim 2, characterized in that: The cross section of the top partition (18) is L-shaped, a first heat-conducting column (19) is provided at the bottom of the top partition (18), the bottom of the first heat-conducting column (19) extends to above the bottom partition (20), the cross section of the bottom partition (20) is L-shaped, the length of the bottom partition (20) is greater than the length of the top partition (18), a second heat-conducting column (21) is provided at the bottom of the bottom partition (20), the bottom of the second heat-conducting column (21) extends to above the bottom inner wall of the stainless steel water tank (12).

6. The semiconductor laser hair removal device according to claim 1, characterized in that: A gun head bracket (2) is provided on one side of the outer wall of the bottom shell (1), a winding rod (3) is provided on the other side of the bottom shell (1), and a joint (5) is provided on one side of the front panel (4).