Semiconductor chip belt oven

Abstract

The utility model relates to the technical field of chip processing, in particular to a semiconductor chip belt oven, which is characterized in that a plurality of transfer cavities and a plurality of drying cavities arranged in a layered manner are arranged in a box body; a track assembly used for conveying a semiconductor chip belt and a heating element used for drying the semiconductor chip belt are installed in the drying cavity. An air exhaust part is arranged on the box body, and the air exhaust part communicates with the drying cavities through air exhaust pipes; and the transfer cavities are arranged at the side ends of the drying cavities, transfer pieces are arranged in the transfer cavities, and the transfer pieces are used for transferring the semiconductor chip belts on the track assemblies in the corresponding drying cavities to the track assemblies in the adjacent drying cavities. The chip drying device solves the problem that an existing chip drying device is too large in occupied space.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to a semiconductor chip belt baking furnace. Background Art

[0002] Semiconductor chips are semiconductor devices that can achieve certain functions by etching and wiring on semiconductor sheets. They are not just silicon chips. Common ones also include semiconductor materials such as gallium arsenide and germanium. In order to meet the needs of mass production, the electrical properties of semiconductors must be predictable and stable. Therefore, strict requirements must be placed on the purity of dopants and the quality of the semiconductor lattice structure.

[0003] During the processing of semiconductor chips, the semiconductor chips need to be glued, and after glued, the semiconductor chip strip needs to be baked to solidify the glue.

[0004] Referring to the invention patent with publication number CN105157388A, a chip conveying and drying device is disclosed, which conveys chips through a transmission belt so that the chips enter a drying box for baking processing. Although this design can effectively dry the chips, based on the time required for drying, the length of the drying box usually needs to reach more than ten meters or even dozens of meters, resulting in the chip conveying and drying device occupying too large an area.

[0005] Therefore, it is necessary to provide a technical solution to solve the above problems. Utility Model Content

[0006] The utility model aims to solve the problem that the existing chip drying device usually needs to have a drying box of more than ten meters or even dozens of meters in order to ensure that the glue on the chip is fully cured and the baking work is carried out efficiently, resulting in the chip conveying and drying device occupying too much space.

[0007] To achieve the above object, the utility model provides a semiconductor chip strip baking oven, comprising a box body, wherein a plurality of transfer chambers and a plurality of drying chambers arranged in layers are arranged inside the box body, wherein:

[0008] A track assembly for conveying semiconductor chip strips and a heating element for drying semiconductor chip strips are installed in the drying chamber; an exhaust component is provided on the box body, and the exhaust component is connected to each of the drying chambers through an exhaust pipe;

[0009] The transfer chamber is arranged at the side end of the drying chamber, and each transfer chamber is provided with a transfer member, and each transfer member is used to transfer the semiconductor chip belt on the track assembly in the corresponding drying chamber to the track assembly in the adjacent drying chamber.

[0010] More specifically, a plurality of heating elements are provided in the drying chamber, and the plurality of heating elements are arranged in order and are all fixedly connected to the box body.

[0011] More specifically, an inert gas inlet pipe is installed on the box body, and the inert gas inlet pipe is connected with each of the drying chambers.

[0012] More specifically, the inert gas inlet pipe includes a main pipe and a plurality of branch pipes corresponding to each of the drying chambers, one end of the branch pipe is connected to the main pipe, and the other end is connected to the corresponding drying chamber, and a control valve is provided on the branch pipe.

[0013] More specifically, an air collecting chamber is provided on the box body, the exhaust pipe is installed at the side end of the box body and is connected to the air collecting chamber and each of the drying chambers, and the exhaust end of the exhaust component is connected to the air collecting chamber.

[0014] More specifically, the track assembly includes two guide rails, which are parallel to each other and fixedly connected to the box body. Support ridges are arranged on opposite surfaces of the two guide rails, and stoppers are arranged at positions of the guide rails corresponding to the support ridges.

[0015] More specifically, a plurality of convex ribs are arranged on the top of the supporting convex strip.

[0016] More specifically, the track assembly further comprises a plurality of base frames, and the plurality of base frames are fixedly connected to the box body, two movable plates with adjustable positions are mounted on the base frames, and the two guide rails are fixedly connected to the corresponding movable plates.

[0017] More specifically, the transfer member includes a rotating shaft, two fixed plates and two supporting baffle plates. The rotating shaft is rotatably connected to the box body. The two fixed plates are fixedly connected to the rotating shaft. The two supporting baffle plates are arranged between the two fixed plates and are installed on the fixed plates. The diameter of the supporting baffle plates is smaller than the diameter of the fixed plates.

[0018] More specifically, a plurality of connecting shafts are arranged between the two fixed plates, and two ends of the connecting shafts are respectively fixedly connected to the two fixed plates; the supporting baffle plate is installed on the connecting shafts in an adjustable position.

[0019] The technical effects of the utility model are:

[0020] The present application sets up multiple drying chambers inside the box body, and correspondingly adds multiple transfer parts, so that the movement trajectory of the semiconductor chip belt inside the box body is a combination of horizontal forward and backward movement and vertical upward movement. This design cleverly utilizes the vertical space, greatly reducing the footprint of the oven, and on this basis, even if the semiconductor chip belt is baked at high speed, the chip has sufficient baking time, so that the semiconductor chip belt can be dried efficiently; in addition, the present application uses an exhaust component to extract the exhaust gas generated by heating in each drying chamber for unified treatment, so as to avoid the exhaust gas from diffusing outward and polluting the environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the structure of a semiconductor chip belt baking oven involved in the utility model;

[0022] Figure 2 It is a cross-sectional schematic diagram of a semiconductor chip strip baking oven involved in the utility model;

[0023] Figure 3 for Figure 2 The enlarged schematic diagram of point A in the middle;

[0024] Figure 4 Another cross-sectional schematic diagram of a semiconductor chip belt baking oven involved in the utility model;

[0025] Figure 5 It is a structural schematic diagram of a track assembly in a semiconductor chip belt baking oven involved in the utility model;

[0026] Figure 6 for Figure 5 The enlarged schematic diagram of point B in the middle;

[0027] Figure 7 The utility model is a schematic structural diagram of a transfer component in a semiconductor chip belt baking furnace.

[0028] Markings in the figure:

[0029] 1. Box body; 2. Track assembly; 3. Heating element; 4. Air extraction component; 5. Air extraction pipe; 6. Transfer component;

[0030] 11. Drying chamber; 12. Transfer chamber; 13. Gas collecting chamber;

[0031] 21. Guide rail; 22. Support convex strip; 23. Stopper; 24. Protruding rib; 25. Base frame; 26. Moving plate;

[0032] 61. Rotating shaft; 62. Fixed plate; 63. Support baffle plate; 64. Connecting shaft. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0034] It should be noted that when an element is referred to as being "fixed on" or "disposed on" another element, it may be directly on the other element or there may be a central element at the same time; when an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0036] In the description of the embodiments of the present invention, it should be understood that the directions or positional relationships indicated by “up”, “down”, “front”, “back”, “left”, “right”, “top”, “bottom”, “inside” and “outside”, etc., are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0037] In order to more clearly illustrate the technical solution of the utility model, a preferred embodiment is provided below. Figure 1 to Figure 7 A semiconductor chip strip baking oven comprises a box body 1, wherein a plurality of transfer chambers 12 and a plurality of drying chambers 11 arranged in layers are arranged inside the box body 1, wherein:

[0038] A track assembly 2 for conveying semiconductor chip strips and a heating element 3 for drying semiconductor chip strips are installed in the drying chamber 11; an exhaust component 4 is provided on the box body 1, and the exhaust component 4 is connected to each drying chamber 11 through an exhaust pipe 5;

[0039] The transfer chamber 12 is arranged at the side end of the drying chamber 11 . A transfer member 6 is arranged in each transfer chamber 12 . Each transfer member 6 is used to transfer the semiconductor chip tape on the track assembly 2 in the corresponding drying chamber 11 to the track assembly 2 in the adjacent drying chamber 11 .

[0040] Compared with the prior art, the semiconductor chip belt baking oven involved in the utility model is different in that a plurality of drying chambers 11 are arranged inside the box body 1, and a plurality of transfer parts 6 are added accordingly, so that the movement trajectory of the semiconductor chip belt inside the box body 1 is a combination of horizontal forward and backward movement and vertical upward movement. This design cleverly utilizes the vertical space, greatly reducing the floor space of the baking oven, and on this basis, even if the semiconductor chip belt is baked by high-speed movement, the chip has sufficient baking time, so that the semiconductor chip belt can be dried efficiently; in addition, the present application utilizes the exhaust component 4 to extract the exhaust gas generated by heating in each drying chamber 11 for unified treatment, so as to avoid the exhaust gas from diffusing outward and polluting the environment.

[0041] In this embodiment, a plurality of heating elements 3 are provided in the drying chamber 11, and the plurality of heating elements 3 are arranged in an orderly manner and are fixedly connected to the housing 1. In practical applications, different temperature zones can be generated in the drying chamber 11 by regulating the temperature of each heating element 3, so as to meet different baking requirements. For example, the temperature of the side of the drying chamber 11 close to the input port is lower, so that the semiconductor chip belt input into the housing 1 is first preheated in the low temperature zone and then slowly moved to the high temperature zone for baking, so as to avoid the semiconductor chip belt from being damaged due to the large temperature difference between the inside and the outside when entering the housing 1.

[0042] In this embodiment, an inert gas inlet pipe is installed on the box body 1, and the inert gas inlet pipe is connected to each drying chamber 11; the inert gas is preferably nitrogen. In actual application, the inert gas can be introduced into the drying chamber 11 through the inert gas inlet pipe to discharge the oxygen in the drying chamber 11, thereby preventing the semiconductor chip strip from producing an oxidation reaction at high temperature.

[0043] In this embodiment, the inert gas inlet pipe includes a main pipe and a plurality of branch pipes corresponding to each drying chamber 11. One end of the branch pipe is connected to the main pipe, and the other end is connected to the corresponding drying chamber 11. A control valve is provided on the branch pipe. With the above design, the inert gas can be controlled to enter any drying chamber 11 according to demand, which is more controllable and avoids waste of resources.

[0044] Preferably, the heating element 3 is provided with air holes, and the branch pipe is connected to a plurality of air delivery pipes, and the output end of each air delivery pipe is connected to the corresponding air hole. With the above design, the inert gas input into the drying chamber 11 can be precisely sprayed onto the semiconductor chip strip, thereby ensuring that the periphery of the semiconductor chip strip is filled with inert gas, reducing the risk of oxidation of the semiconductor chip.

[0045] In this embodiment, a gas collecting chamber 13 is provided on the box body 1, and the exhaust pipe 5 is installed at the side end of the box body 1 and is connected to the gas collecting chamber 13 and each drying chamber 11, and the exhaust end of the exhaust component 4 is connected to the gas collecting chamber 13. The above design makes the overall structure of the box body 1 more compact.

[0046] In this embodiment, the track assembly 2 includes two guide rails 21, which are parallel to each other and fixedly connected to the box body 1. Support convex strips 22 are arranged on the opposite surfaces of the two guide rails 21, and the guide rails 21 are provided with stoppers 23 at positions corresponding to the support convex strips 22. In actual application, both sides of the semiconductor chip belt are placed on the support convex strips 22, and the stoppers 23 play a limiting role. The above design reduces the contact area between the semiconductor chip belt and the track assembly 2, that is, increases the contact area between the semiconductor chip belt and the air, so that the semiconductor chip belt can be fully dried.

[0047] In this embodiment, a plurality of ribs 24 are provided on the top of the supporting convex strip 22. The above design further reduces the contact area between the semiconductor chip strip and the track assembly 2, thereby improving the smoothness of the movement of the semiconductor chip strip.

[0048] In this embodiment, the track assembly 2 further includes a plurality of base frames 25, each of which is fixedly connected to the box body 1, and two movable plates 26 with adjustable positions are mounted on the base frames 25, and the two guide rails 21 are fixedly connected to the corresponding movable plates 26. With the above design, the spacing between the two guide rails 21 is adjustable, thereby meeting the conveying requirements of different semiconductor chip strips.

[0049] In this embodiment, the transfer member 6 includes a rotating shaft 61, two fixed disks 62 and two supporting baffles 63. The rotating shaft 61 is rotatably connected to the box body 1. The two fixed disks 62 are fixedly connected to the rotating shaft 61. The two supporting baffles 63 are arranged between the two fixed disks 62 and are installed on the fixed disks 62. The diameter of the supporting baffles 63 is smaller than the diameter of the fixed disks 62. In actual application, after the semiconductor chip belt output by one track assembly 2 bypasses the transfer member 6, it is input to another adjacent track assembly 2, wherein both sides of the semiconductor chip belt are placed on two corresponding supporting baffles 63, and the two fixed disks 62 limit the semiconductor chip belt so that the semiconductor chip belt is stably placed on the transfer member 6.

[0050] In this embodiment, a plurality of connecting shafts 64 are arranged between the two fixed plates, and the two ends of the connecting shafts 64 are respectively fixedly connected to the two fixed plates 62; the support baffles 63 are adjustable in position and mounted on the connecting shafts 64. With the above design, the spacing between the two support baffles 63 is adjustable, thereby meeting the conveying requirements of semiconductor chip tapes of different specifications.

[0051] The above description is only a preferred embodiment of the present invention, and its structure is not limited to the shapes listed above. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor chip strip baking oven, comprising a box, characterized in that: The interior of the box is provided with a plurality of transfer chambers and a plurality of drying chambers arranged in layers, wherein: A track assembly for conveying semiconductor chip strips and a heating element for drying semiconductor chip strips are installed in the drying chamber; an exhaust component is provided on the box body, and the exhaust component is connected to each of the drying chambers through an exhaust pipe; The transfer chamber is arranged at the side end of the drying chamber, and each transfer chamber is provided with a transfer member, and each transfer member is used to transfer the semiconductor chip belt on the track assembly in the corresponding drying chamber to the track assembly in the adjacent drying chamber.

2. A semiconductor chip strip baking oven according to claim 1, characterized in that: There are multiple heating elements in the drying chamber, and the multiple heating elements are arranged in order and are fixedly connected to the box body.

3. A semiconductor chip strip baking oven according to claim 1, characterized in that: An inert gas inlet pipe is installed on the box body, and the inert gas inlet pipe is communicated with each of the drying chambers.

4. A semiconductor chip strip baking oven according to claim 3, characterized in that: The inert gas inlet pipe includes a main pipe and a plurality of branch pipes corresponding to each of the drying chambers. One end of the branch pipe is connected to the main pipe, and the other end is connected to the corresponding drying chamber. A control valve is arranged on the branch pipe.

5. The semiconductor chip strip baking oven according to claim 1, characterized in that: The box body is provided with an air collecting chamber, the air extraction pipe is installed at the side end of the box body and is connected with the air collecting chamber and each of the drying chambers, and the air extraction end of the air extraction component is connected with the air collecting chamber.

6. The semiconductor chip strip baking oven according to claim 1, characterized in that: The track assembly includes two guide rails, which are parallel to each other and fixedly connected to the box body. Support convex strips are arranged on the opposite surfaces of the two guide rails, and stoppers are arranged at positions of the guide rails corresponding to the support convex strips.

7. A semiconductor chip strip baking oven according to claim 6, characterized in that: A plurality of convex ribs are arranged on the top of the supporting convex strip.

8. A semiconductor chip strip baking oven according to claim 7, characterized in that: The track assembly also includes a plurality of base frames, which are all fixedly connected to the box body, two movable plates with adjustable positions are installed on the base frames, and the two guide rails are fixedly connected to the corresponding movable plates.

9. The semiconductor chip strip baking oven according to claim 1, characterized in that: The transfer member includes a rotating shaft, two fixed disks and two supporting baffles. The rotating shaft is rotatably connected to the box body. The two fixed disks are fixedly connected to the rotating shaft. The two supporting baffles are arranged between the two fixed disks and are installed on the fixed disks. The diameter of the supporting baffle is smaller than the diameter of the fixed disk.

10. A semiconductor chip strip baking oven according to claim 9, characterized in that: A plurality of connecting shafts are arranged between the two fixed plates, and the two ends of the connecting shafts are respectively fixedly connected to the two fixed plates; the supporting baffle plate is installed on the connecting shafts in an adjustable position.

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