Wafer cleaning device

Abstract

The utility model provides a wafer cleaning device. The wafer cleaning device comprises a cleaning mechanism, a rotating mechanism and a velometer, the rotating mechanism is used for mounting a wafer and can drive the wafer to rotate, and the edge of the wafer is provided with a notch; the cleaning mechanisms are arranged on the two sides of the rotating mechanism and used for cleaning the front face and the back face of the wafer; and the velometer is arranged close to the rotating mechanism, corresponds to the edge of the wafer, and is used for detecting the position of the notch so as to obtain the rotating speed of the wafer. According to the wafer cleaning device provided by the utility model, the velometer is arranged near the rotating mechanism and is used for detecting the rotating speed of the wafer, so that the accuracy of detecting the rotating speed of the wafer when the wafer is cleaned is improved, and the accuracy of judging the wafer cleaning effect by a worker is ensured, so that the worker can timely adjust the optimal rotating speed when the wafer is cleaned, and the working efficiency is improved. And the cleaning effect of the wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing equipment, in particular to a wafer cleaning device. Background Art

[0002] Chemical mechanical polishing equipment also needs to clean the wafer after grinding. Usually, the drive wheel will drive the wafer to rotate during cleaning, and the brush will scrub the front and back of the wafer. Since the rotation speed of the wafer during cleaning has a great influence on the cleaning effect, a tachometer wheel is added to the cleaning unit in the prior art to confirm the actual rotation speed of the wafer. The speed measurement principle of the existing scheme is that when the wafer is placed in the cleaning unit, the wafer will be inserted into the tachometer wheel. Due to the friction between the wafer edge and the tachometer wheel, when the wafer rotates under the action of the drive wheel, the tachometer wheel will be driven to rotate. The rotation speed sensor of the tachometer wheel can indirectly reflect the rotation speed of the wafer, and the cleaning effect of the wafer can be judged by observing the rotation speed of the wafer.

[0003] Since a large amount of cleaning fluid is used when cleaning the wafer, some cleaning fluids will significantly reduce the surface friction between the wafer edge and the tachometer wheel, causing slipping. In addition, if the tachometer wheel is not installed at an adequate height, the tachometer wheel will have poor contact with the wafer. In these situations, the tachometer wheel will not be able to truly reflect the actual rotation speed of the wafer, making it impossible for staff to accurately judge the cleaning effect of the wafer. Utility Model Content

[0004] The utility model aims to provide a wafer cleaning device, which can accurately detect the actual rotation speed of the wafer to ensure the accuracy of the staff in judging the wafer cleaning effect.

[0005] To achieve the above-mentioned purpose, in a first aspect, the utility model provides a wafer cleaning device, including a cleaning mechanism, a rotating mechanism and a speed measuring device;

[0006] The rotating mechanism is used to install the wafer and can drive the wafer to rotate, and the edge of the wafer has a notch;

[0007] The cleaning mechanism is arranged on both sides of the rotating mechanism and is used to clean the wafer;

[0008] The speed meter is arranged close to the rotating mechanism and corresponds to the edge of the wafer, and is used to detect the position of the notch to obtain the rotation speed of the wafer.

[0009] In some embodiments, the speed meter includes a light transmitter and a light receiver;

[0010] The light emitter and the light receiver are respectively located on two sides of the wafer and arranged opposite to each other, and the light emitter and the light receiver respectively correspond to the edge of the wafer;

[0011] When the rotating mechanism drives the wafer to rotate so that the notch of the wafer is located on the light path of the light transmitter, the light intensity detected by the light receiver becomes stronger.

[0012] In some embodiments, the speed meter further includes a first mounting member and a second mounting member;

[0013] The first mounting member and the second mounting member are respectively located on two sides of the wafer and arranged opposite to each other, the first mounting member is provided with a first mounting hole, and the second mounting member is provided with a second mounting hole;

[0014] The optical transmitter is arranged in the first mounting hole, and the optical receiver is arranged in the second mounting hole.

[0015] In some embodiments, the first mounting member is provided with a first purge channel, the first purge channel is annularly arranged in the circumference of the first mounting hole, and is used to purge gas toward the second mounting member;

[0016] The second mounting member is provided with a second purge channel, and the second purge channel is annularly arranged in the circumference of the second mounting hole, and is used for purging gas toward the first mounting member.

[0017] In some embodiments, a first through hole is formed on the outer wall of the first mounting member, the first through hole is connected to the first purge channel, and the first through hole is used to connect to the gas supply pipeline;

[0018] A second through hole is formed on the outer side wall of the second mounting member. The second through hole leads to the second purge channel. The second through hole is used for connecting to an air supply pipeline.

[0019] In some embodiments, the air outlet of the first purge channel is inclined toward the outside of the first mounting member and forms an angle a with the axis of the first mounting hole, 80°≥a≥0°;

[0020] The air outlet of the second purge channel is inclined toward the outside of the second mounting member and forms an angle b with the axis of the second mounting hole, 80°≥b≥0°.

[0021] In some embodiments, the cleaning mechanism includes a first cleaning member and a second cleaning member disposed opposite to each other;

[0022] The first cleaning piece and the second cleaning piece are located on both sides of the wafer, and a gap is formed between the first cleaning piece and the second cleaning piece to form a cleaning area. The wafer is located in the cleaning area so that the first cleaning piece and the second cleaning piece clean the wafer.

[0023] In some embodiments, the first cleaning member comprises a first rotating roller, and an outer side wall of the first rotating roller is provided with a first brushing portion for brushing the front side of the wafer;

[0024] The second cleaning member comprises a second rotating roller, and an outer side wall of the second rotating roller is provided with a second brushing portion for brushing the back side of the wafer.

[0025] In some embodiments, the cleaning mechanism further includes a first liquid spraying member and a second liquid spraying member disposed opposite to each other, wherein the first liquid spraying member and the second liquid spraying member are used to spray the cleaning liquid on the front side and the back side of the wafer.

[0026] In some embodiments, the rotating mechanism includes a first rolling wheel and a second rolling wheel that are arranged opposite to each other, and a driven roller located below the first rolling wheel and the second rolling wheel;

[0027] The first rolling wheel and the second rolling wheel can respectively contact the outer contour of the wafer to drive the wafer to rotate, and the driven roller is used to support the wafer and can rotate with the wafer.

[0028] The beneficial effect of the wafer cleaning device provided by the utility model is that a tachometer is arranged near the rotating mechanism to detect the rotation speed of the wafer, so as to improve the accuracy of the rotation speed detection of the wafer during cleaning, thereby ensuring the accuracy of the staff's judgment on the wafer cleaning effect, so that the staff can timely adjust the optimal rotation speed during wafer cleaning and improve the wafer cleaning effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A front view of a wafer cleaning device according to an embodiment of the present invention;

[0030] Figure 2 A side view of a wafer cleaning device according to an embodiment of the present invention;

[0031] Figure 3 A cross-sectional view of the first mounting member and the second mounting member of the embodiment provided by the utility model along their axial direction;

[0032] Figure 4 The speed meter of the embodiment provided by the utility model detects a periodic diagram of light intensity and time.

[0033] Reference numerals:

[0034] Light transmitter 11, light receiver 12, first mounting member 13, first mounting hole 131, first purge channel 132, first through hole 133, second mounting member 14, second mounting hole 141, second purge channel 142, second through hole 143, wafer 2, notch 21, first cleaning member 31, first rotating roller 311, first brushing portion 312, second cleaning member 32, second rotating roller 321, second brushing portion 322, first liquid spraying member 33, second liquid spraying member 34, first rolling wheel 41, second rolling wheel 42, driven roller 43. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Unless otherwise defined, the technical terms or scientific terms used herein should be the usual meanings understood by people with general skills in the field to which the utility model belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Unless otherwise specified, the "connection" described in this article can be a direct connection or an indirect connection, that is, a connection through an intermediate.

[0036] The embodiment of the utility model provides a wafer cleaning device, referring to Figure 1 As shown, it includes a cleaning mechanism, a rotating mechanism and a tachometer. The rotating mechanism is used to mount the wafer 2 and can drive the wafer 2 to rotate. The cleaning mechanism is arranged on both sides of the rotating mechanism, and is used to clean the front and back sides of the wafer 2. The tachometer is arranged close to the rotating mechanism, and the tachometer corresponds to the edge of the wafer 2, and is used to detect the rotation speed of the wafer 2.

[0037] In this embodiment, the tachometer can be used to detect the actual rotational speed of the wafer 2, thereby improving the accuracy of the rotational speed detection of the wafer 2, thereby ensuring the accuracy of the staff's judgment on the cleaning effect of the wafer 2, so that the staff can timely adjust the optimal rotational speed of the wafer 2 during cleaning, thereby improving the cleaning effect of the wafer 2.

[0038] refer to Figures 1 to 3As shown, in some embodiments, the speed meter includes a light emitter 11, a light receiver 12, a first mounting member 13, and a second mounting member 14. The first mounting member 13 and the second mounting member 14 are respectively located on both sides of the wafer 2 and arranged opposite to each other. The first mounting member 13 is provided with a first mounting hole 131, and the second mounting member 14 is provided with a second mounting hole 141. The light emitter 11 is provided in the first mounting hole 131, and the light receiver 12 is provided in the second mounting hole 141, so that the light emitter 11 and the light receiver 12 are respectively located on both sides of the wafer 2 correspondingly, and the light emitter 11 and the light receiver 12 correspond to the edges of the wafer 2 respectively.

[0039] It should be noted that, since the edge of the wafer 2 has a notch 21, when the rotating mechanism drives the wafer 2 to rotate so that the notch 21 of the wafer 2 is located on the optical path of the light transmitter 11, the light intensity detected by the light receiver 12 becomes stronger, and when the rotating mechanism drives the wafer 2 to rotate so that the notch 21 of the wafer 2 is not on the optical path of the light transmitter 11, the light intensity detected by the light receiver 12 becomes weaker. Therefore, the light intensity received by the light receiver 12 changes periodically, as shown in FIG. Figure 4 By recording the time difference between two consecutive light intensity peaks, the actual rotation speed of the wafer 2 can be accurately calculated.

[0040] In some embodiments, the speed meter may also be an image sensor. By using the image sensor to detect the number of rotations of the notch 21 of the wafer 2 per unit time, the actual rotation speed of the wafer 2 can be obtained.

[0041] refer to Figure 3 As shown, in some embodiments, the first mounting member 13 is provided with a first purge channel 132, which is annularly arranged in the circumference of the first mounting hole 131 and is used to purge gas toward the second mounting member 14. The second mounting member 14 is provided with a second purge channel 142, which is annularly arranged in the circumference of the second mounting hole 141 and is used to purge gas toward the first mounting member 13.

[0042] In this embodiment, both the first purge channel 132 and the second purge channel 142 can release purge gas to prevent water mist condensation on the surfaces of the light emitter 11 and the light receiver 12 to improve the detection accuracy of the light emitter 11 and the light receiver 12 .

[0043] Furthermore, a first through hole 133 is formed on the outer wall of the first mounting member 13, the first through hole 133 is connected to the first purge channel 132, and the first through hole 133 is used to connect the gas supply pipeline. A second through hole 143 is formed on the outer wall of the second mounting member 14, the second through hole 143 is connected to the second purge channel 142, and the second through hole 143 is used to connect the gas supply pipeline. The gas supply pipeline can be connected to the gas supply system of the factory.

[0044] In some embodiments, the air outlet of the first purge channel 132 is inclined toward the outside of the first mounting member 13 and forms an angle a with the axis of the first mounting hole 131, 80°≥a≥0°. The air outlet of the second purge channel 142 is inclined toward the outside of the second mounting member 14 and forms an angle b with the axis of the second mounting hole 141, 80°≥b≥0°.

[0045] In this embodiment, by setting the angle a between the air outlet of the first purge channel 132 and the axis of the first mounting hole 131, and setting the angle b between the air outlet of the second purge channel 142 and the axis of the second mounting hole 141, the range of gas protection is increased, and the condensation of water mist of the cleaning liquid on the optical transmitter 11 and the optical receiver 12 is avoided, so as to improve the detection accuracy of the optical transmitter 11 and the optical receiver 12.

[0046] In some embodiments, the cleaning mechanism includes a first cleaning member 31 and a second cleaning member 32 that are arranged opposite to each other. The first cleaning member 31 and the second cleaning member 32 are located on both sides of the wafer 2, and a gap is formed between the first cleaning member 31 and the second cleaning member 32 to form a cleaning area. After the wafer 2 is mounted on the rotating mechanism, it is located in the cleaning area so that the first cleaning member 31 and the second cleaning member 32 clean the wafer 2.

[0047] Further, the first cleaning member 31 includes a first rotating roller 311, and the outer wall of the first rotating roller 311 is provided with a first brushing portion 312, and the first rotating roller 311 can drive the first brushing portion 312 to rotate for brushing the front side of the wafer 2. The second cleaning member 32 includes a second rotating roller 321, and the outer wall of the second rotating roller 321 is provided with a second brushing portion 322, and the second rotating roller 321 can drive the second brushing portion 322 to rotate for brushing the back side of the wafer 2.

[0048] In addition, the cleaning mechanism also includes a first liquid spray component 33 and a second liquid spray component 34 which are relatively arranged on both sides of the wafer 2. The first liquid spray component 33 and the second liquid spray component 34 are both provided with liquid spray holes. The liquid spray holes on the first liquid spray component 33 and the second liquid spray component 34 are used to spray the cleaning liquid on the front and back sides of the wafer 2.

[0049] In some embodiments, the rotating mechanism includes a first rolling wheel 41 and a second rolling wheel 42 that are arranged opposite to each other, and a driven roller 43 located below the first rolling wheel 41 and the second rolling wheel 42. The first rolling wheel 41 and the second rolling wheel 42 can respectively contact the outer contour of the wafer 2 to drive the wafer 2 to rotate, and the driven roller 43 is used to support the wafer 2 and can rotate with the wafer 2.

[0050] The above is only a specific implementation of the embodiment of the present application, but the protection scope of the embodiment of the present application is not limited thereto, and any changes or replacements within the technical scope disclosed in the embodiment of the present application should be included in the protection scope of the embodiment of the present application. Therefore, the protection scope of the embodiment of the present application should be based on the protection scope of the claims.

Claims

1. A wafer cleaning device, characterized in that: It includes a cleaning mechanism, a rotating mechanism and a speed measuring device; The rotating mechanism is used to install the wafer and can drive the wafer to rotate, and the edge of the wafer has a notch; The cleaning mechanism is arranged on both sides of the rotating mechanism and is used to clean the wafer; The speed meter is arranged close to the rotating mechanism and corresponds to the edge of the wafer, and is used to detect the position of the notch to obtain the rotation speed of the wafer.

2. The wafer cleaning device according to claim 1, characterized in that: The speed measuring device comprises a light transmitter and a light receiver; The light emitter and the light receiver are respectively located on two sides of the wafer and arranged opposite to each other, and the light emitter and the light receiver respectively correspond to the edge of the wafer; When the rotating mechanism drives the wafer to rotate so that the notch of the wafer is located on the light path of the light transmitter, the light intensity detected by the light receiver becomes stronger.

3. The wafer cleaning device according to claim 2, characterized in that: The speed meter also includes a first mounting member and a second mounting member; The first mounting member and the second mounting member are respectively located on two sides of the wafer and arranged opposite to each other, the first mounting member is provided with a first mounting hole, and the second mounting member is provided with a second mounting hole; The optical transmitter is arranged in the first mounting hole, and the optical receiver is arranged in the second mounting hole.

4. The wafer cleaning device according to claim 3, characterized in that: The first mounting member is provided with a first purge channel, which is annularly arranged in the circumference of the first mounting hole and is used to purge gas toward the second mounting member; The second mounting member is provided with a second purge channel, and the second purge channel is annularly arranged in the circumference of the second mounting hole, and is used for purging gas toward the first mounting member.

5. The wafer cleaning device according to claim 4, characterized in that: A first through hole is formed on the outer wall of the first mounting member, the first through hole is connected to the first purge channel, and the first through hole is used to connect to the air supply pipeline; A second through hole is formed on the outer side wall of the second mounting member. The second through hole leads to the second purge channel. The second through hole is used for connecting to an air supply pipeline.

6. The wafer cleaning device according to claim 4, characterized in that: The air outlet of the first purge channel is inclined toward the outside of the first mounting member and forms an angle a with the axis of the first mounting hole, 80°≥a≥0°; The air outlet of the second purge channel is inclined toward the outside of the second mounting member and forms an angle b with the axis of the second mounting hole, 80°≥b≥0°.

7. The wafer cleaning device according to claim 1, characterized in that: The cleaning mechanism comprises a first cleaning member and a second cleaning member which are arranged opposite to each other; The first cleaning piece and the second cleaning piece are located on both sides of the wafer, and a gap is formed between the first cleaning piece and the second cleaning piece to form a cleaning area. The wafer is located in the cleaning area so that the first cleaning piece and the second cleaning piece clean the wafer.

8. The wafer cleaning device according to claim 7, characterized in that: The first cleaning member comprises a first rotating roller, and an outer side wall of the first rotating roller is provided with a first brushing portion for brushing the front side of the wafer; The second cleaning member comprises a second rotating roller, and an outer side wall of the second rotating roller is provided with a second brushing portion for brushing the back side of the wafer.

9. The wafer cleaning device according to claim 7, characterized in that: The cleaning mechanism further comprises a first liquid spraying member and a second liquid spraying member arranged opposite to each other, wherein the first liquid spraying member and the second liquid spraying member are used to spray cleaning liquid on the front side and the back side of the wafer.

10. The wafer cleaning device according to claim 1, characterized in that: The rotating mechanism comprises a first rolling wheel and a second rolling wheel which are arranged opposite to each other, and a driven rolling wheel located below the first rolling wheel and the second rolling wheel; The first rolling wheel and the second rolling wheel can respectively contact the outer contour of the wafer to drive the wafer to rotate, and the driven roller is used to support the wafer and can rotate with the wafer.

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