Cooling device of reflow soldering furnace

Abstract

The utility model discloses a cooling device of a reflow soldering furnace, which comprises a cooling box, a mounting plate is connected inside the cooling box, the upper surface of the mounting plate is connected with a placing mechanism, the bottom of the cooling box is provided with a cleaning fluid storage box, the cleaning fluid storage box is connected with a cleaning mechanism, and the cleaning mechanism is connected with a cooling mechanism. A mounting frame is connected to one side of the cooling box, a cooling mechanism is connected to the mounting frame, and a gas treatment mechanism is connected to the top of the cooling box. According to the cooling device of the reflow soldering furnace, the driving motor is started to drive the driving wheel to rotate, then the driving wheel is driven to rotate, then the cooling fan is driven to rotate, heat dissipation is conducted on a PCB, the cooled PCB can be cleaned through the cleaning water pump by pumping cleaning liquid in the cleaning liquid storage box, the PCB does not need to be taken out independently to be cleaned, and the cooling efficiency is improved. And the welding efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of reflow soldering furnaces, in particular to a cooling device of a reflow soldering furnace. Background Art

[0002] The reflow oven is a type of soldering equipment in the SMT industry. It can provide an automatic and stable heating environment, so that the solder paste in the furnace is heated and melted, so that the pre-mounted electrical components on the PCB board and the PCB board can be reliably combined together through the solder alloy. After the soldering is completed, the PCB board needs to be cooled and taken out.

[0003] A Chinese patent application with application number CN201720202714.X discloses a reflow soldering furnace cooling circulation device, including a soldering furnace body, wherein the outlet end of the soldering furnace body is provided with a first heat exchange device for absorbing heat, and the inlet end is provided with a second heat exchange device for releasing heat. The utility model discloses a reflow soldering furnace cooling circulation device, which absorbs heat through the first heat exchange device and releases heat through the second heat exchange device, and heats the inlet end of the reflow soldering furnace while cooling the outlet end of the reflow soldering furnace, thereby improving energy utilization, reducing production costs, and achieving the purpose of energy saving and environmental protection.

[0004] However, the existing cooling device still has some defects. It can only cool the PCB board but cannot clean the PCB board, and the production efficiency is poor. Utility Model Content

[0005] In view of the above-mentioned deficiencies in the prior art, the utility model provides a cooling device for a reflow soldering furnace, which aims to solve the problems of being able to cool only a PCB board but unable to clean the PCB board and having poor production efficiency.

[0006] In order to achieve the above-mentioned utility model object, the technical solution adopted by the utility model is: a cooling device for a reflow soldering furnace, comprising a cooling box, a mounting plate is connected to the interior of the cooling box, a placing mechanism is connected to the upper surface of the mounting plate, a cleaning liquid storage box is provided at the bottom of the cooling box, a cleaning mechanism is connected to the cleaning liquid storage box, a mounting frame is connected to one side of the cooling box, a cooling mechanism is connected to the mounting frame, and a gas processing mechanism is connected to the top of the cooling box;

[0007] The cleaning mechanism includes a cleaning water pump installed on one side of the cleaning liquid storage tank, an inlet pipe is connected between one end of the cleaning water pump and the cleaning liquid storage tank, the other end of the cleaning water pump is connected to a water outlet pipe, one end of the outlet pipe extends into the interior of the cooling box and is connected to a cleaning nozzle, a filter is connected to the interior of the cleaning liquid storage tank, a guide plate is connected to the interior of the cleaning liquid storage tank, and a water leakage port is opened on the mounting plate.

[0008] Furthermore, the cooling mechanism includes a driving motor installed on a mounting frame, the output end of the driving motor is connected to a driving wheel, one side of the cooling box is connected to a rotating shaft, one end of the rotating shaft is connected to a cooling fan, the other end of the rotating shaft extends into the mounting frame and is connected to a driven wheel, and the driving wheel and the driven wheel are meshed.

[0009] Furthermore, the placement mechanism includes a fixing seat 1 installed on the upper surface of the mounting plate, the upper surface of the mounting plate is connected to a connecting block at one end away from the fixing seat 1, a threaded rod is threadedly connected to the connecting block, one end of the threaded rod is connected to a fixing seat 2, and the other end of the threaded rod is connected to a handle.

[0010] Furthermore, the gas processing mechanism includes a processing box installed on the upper surface of the cooling box, a blower is connected to one side of the processing box, an air intake pipe is connected to the other side of the processing box, an air intake hood is connected to the bottom end of the air intake pipe, and a processing net is installed inside the processing box.

[0011] Furthermore, a drain pipe is connected to the cleaning liquid storage box, and a drainage pipe is connected below the drain pipe.

[0012] The beneficial effects of the utility model are:

[0013] The utility model discloses a cooling device for a reflow soldering furnace. A soldered PCB board storage tray is placed on a fixing seat one, a threaded rod is driven to rotate by a handle, and then a fixing seat two is driven to move, so as to fix the PCB board storage tray. A driving motor is started to drive a driving wheel to rotate, and then a cooling fan is driven to rotate, so as to dissipate heat for the PCB board. While dissipating heat, a blower is started to drive an air suction hood to extract harmful gases emitted by the PCB board, and at the same time, heat on the PCB board is quickly discharged, so as to facilitate heat dissipation and cooling. The cooled PCB board can be cleaned by a cleaning water pump by extracting cleaning liquid in a cleaning liquid storage box, and there is no need to take it out separately for cleaning. The method is convenient and quick, and the welding efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a cross-sectional view of a cooling device of a reflow soldering furnace of the utility model;

[0015] Figure 2 A cooling device for a reflow soldering furnace according to the utility model Figure 1 Enlarged view of point A in the middle.

[0016] Reference table of reference numerals:

[0017] 1. Cooling box; 2. Mounting plate; 3. Placing mechanism; 301. Fixing seat 1; 302. Connecting block; 303. Threaded rod; 304. Fixing seat 2; 305. Handle; 4. Cleaning liquid storage box; 401. Drain pipe; 402. Drain pipe; 5. Cleaning mechanism; 501. Cleaning water pump; 502. Water inlet pipe; 503. Water outlet pipe; 504. Cleaning nozzle; 505. Filter net; 506. Guide plate; 507. Leakage port; 6. Mounting frame; 7. Cooling mechanism; 701. Driving motor; 702. Driving wheel; 703. Rotating shaft; 704. Cooling fan; 705. Driven wheel; 8. Gas treatment mechanism; 801. Treatment box; 802. Blower; 803. Inlet pipe; 804. Suction hood; 805. Treatment net. DETAILED DESCRIPTION

[0018] The specific implementation of the utility model is further described below in conjunction with the accompanying drawings, wherein the same parts are represented by the same reference numerals.

[0019] It should be noted that the words "front", "rear", "left", "right", "up" and "down" used in the following description refer to directions in the drawings, and the words "inside" and "outside" refer to directions toward or away from the geometric center of a specific component, respectively.

[0020] In order to make the contents of the present invention more clearly understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0021] like Figure 1 to Figure 2 As shown, a cooling device for a reflow oven comprises a cooling box 1, a mounting plate 2 is connected to the interior of the cooling box 1, a placing mechanism 3 is connected to the upper surface of the mounting plate 2, a cleaning liquid storage box 4 is provided at the bottom of the cooling box 1, a cleaning mechanism 5 is connected to the cleaning liquid storage box 4, a mounting frame 6 is connected to one side of the cooling box 1, a cooling mechanism 7 is connected to the mounting frame 6, and a gas processing mechanism 8 is connected to the top of the cooling box 1;

[0022] The cleaning mechanism 5 includes a cleaning water pump 501 installed on one side of the cleaning liquid storage tank 4, an inlet pipe 502 is connected between one end of the cleaning water pump 501 and the cleaning liquid storage tank 4, the other end of the cleaning water pump 501 is connected to a water outlet pipe 503, one end of the water outlet pipe 503 extends into the interior of the cooling box 1 and is connected to a cleaning nozzle 504, a filter screen 505 is connected to the interior of the cleaning liquid storage tank 4, a guide plate 506 is connected to the interior of the cleaning liquid storage tank 4, and a water leakage port 507 is opened on the mounting plate 2.

[0023] Specifically, the cooled PCB board can be cleaned by the cleaning water pump 501 by extracting the cleaning liquid in the cleaning liquid storage box 4, without having to take it out separately for cleaning, which is convenient and fast and improves welding efficiency.

[0024] The cooling mechanism 7 includes a driving motor 701 installed on the mounting frame 6, the output end of the driving motor 701 is connected to a driving wheel 702, one side of the cooling box 1 is connected to a rotating shaft 703, one end of the rotating shaft 703 is connected to a cooling fan 704, the other end of the rotating shaft 703 extends into the mounting frame 6 and is connected to a driven wheel 705, and the driving wheel 702 and the driven wheel 705 are meshed with each other.

[0025] Specifically, by starting the driving motor 701, the driving wheel 702 is driven to rotate, which in turn drives the driving wheel 702 to rotate, and then drives the cooling fan 704 to rotate to dissipate heat from the PCB board.

[0026] The placement mechanism 3 includes a fixing seat 301 installed on the upper surface of the mounting plate 2, and the end of the upper surface of the mounting plate 2 away from the fixing seat 301 is connected to a connecting block 302, a threaded rod 303 is threadedly connected to the connecting block 302, one end of the threaded rod 303 is connected to a fixing seat 2 304, and the other end of the threaded rod 303 is connected to a handle 305.

[0027] Specifically, the welded PCB board storage tray is placed on the fixing seat 1 301 , and the threaded rod 303 is driven to rotate by the provided handle 305 , thereby driving the fixing seat 2 304 to move, so as to fix the PCB board storage tray.

[0028] The gas processing mechanism 8 includes a processing box 801 installed on the upper surface of the cooling box 1, a blower 802 is connected to one side of the processing box 801, an air intake pipe 803 is connected to the other side of the processing box 801, an air intake hood 804 is connected to the bottom end of the air intake pipe 803, and a processing net 805 is installed inside the processing box 801.

[0029] Specifically, starting the blower 802 can drive the suction hood 804 to extract harmful gases emitted by the PCB board, and at the same time quickly discharge the heat on the PCB board, making it convenient for heat dissipation and cooling.

[0030] A drain pipe 401 is connected to the cleaning liquid storage tank 4 , and a drain pipe 402 is connected below the drain pipe 401 .

[0031] The working principle of the utility model is as follows: in actual use, the soldered PCB board storage tray is placed on the fixing seat 1 301, and the threaded rod 303 is driven to rotate by the provided handle 305, thereby driving the fixing seat 2 304 to move, and the PCB board storage tray is fixed; the driving motor 701 is started to drive the driving wheel 702 to rotate, thereby driving the driving wheel 702 to rotate, thereby driving the cooling fan 704 to rotate, and the PCB board is cooled; while the heat is being cooled, the blower 802 is started, and the harmful gas emitted by the PCB board can be extracted by driving the suction hood 804, and the heat on the PCB board can be quickly discharged, so as to facilitate heat dissipation and cooling; the cooled PCB board can be cleaned by the cleaning water pump 501 by extracting the cleaning liquid inside the cleaning liquid storage box 4, without having to be taken out separately for cleaning, which is convenient and quick, and improves the welding efficiency.

[0032] The above description is only a preferred embodiment of the present utility model patent and is not intended to limit the present utility model patent. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model patent shall be included in the protection scope of the present utility model patent.

Claims

1. A cooling device for a reflow oven, comprising a cooling box (1), characterized in that: The interior of the cooling box (1) is connected to a mounting plate (2), the upper surface of the mounting plate (2) is connected to a placement mechanism (3), a cleaning liquid storage box (4) is provided at the bottom of the cooling box (1), the cleaning liquid storage box (4) is connected to a cleaning mechanism (5), a mounting frame (6) is connected to one side of the cooling box (1), a cooling mechanism (7) is connected to the mounting frame (6), and a gas processing mechanism (8) is connected to the top of the cooling box (1); The cleaning mechanism (5) comprises a cleaning water pump (501) installed on one side of a cleaning liquid storage tank (4); a water inlet pipe (502) is connected between one end of the cleaning water pump (501) and the cleaning liquid storage tank (4); the other end of the cleaning water pump (501) is connected to a water outlet pipe (503); one end of the water outlet pipe (503) extends into the interior of the cooling box (1) and is connected to a cleaning nozzle (504); the interior of the cleaning liquid storage tank (4) is connected to a filter screen (505); the interior of the cleaning liquid storage tank (4) is connected to a guide plate (506); and a water leakage port (507) is provided on the mounting plate (2).

2. The cooling device for a reflow oven according to claim 1, characterized in that: The cooling mechanism (7) comprises a driving motor (701) mounted on a mounting frame (6), the output end of the driving motor (701) being connected to a driving wheel (702), one side of the cooling box (1) being connected to a rotating shaft (703), one end of the rotating shaft (703) being connected to a cooling fan (704), the other end of the rotating shaft (703) extending into the mounting frame (6) being connected to a driven wheel (705), and the driving wheel (702) and the driven wheel (705) being meshed with each other.

3. The cooling device for a reflow oven according to claim 1, characterized in that: The placement mechanism (3) comprises a fixing seat 1 (301) mounted on the upper surface of the mounting plate (2); an end of the upper surface of the mounting plate (2) away from the fixing seat 1 (301) is connected to a connecting block (302); a threaded rod (303) is threadedly connected to the connecting block (302); one end of the threaded rod (303) is connected to a fixing seat 2 (304); and the other end of the threaded rod (303) is connected to a handle (305).

4. The cooling device for a reflow oven according to claim 1, characterized in that: The gas processing mechanism (8) comprises a processing box (801) installed on the upper surface of the cooling box (1), one side of the processing box (801) is connected to a blower (802), the other side of the processing box (801) is connected to an air intake pipe (803), the bottom end of the air intake pipe (803) is connected to an air suction hood (804), and a processing net (805) is installed inside the processing box (801).

5. The cooling device for a reflow oven according to claim 1, characterized in that: The cleaning liquid storage box (4) is connected to a drain pipe (401), and a drainage pipe (402) is connected below the drain pipe (401).

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