Equipment for machining dresser

Abstract

The utility model relates to equipment for processing a trimmer, which comprises a processing platform and a processing mechanism, and is characterized in that a leveling device is arranged on the processing platform, the leveling device comprises a reference piece for defining a reference plane M and a leveling platform for carrying a base body, and the base body comprises a processing plane N for fixing a material piece to be processed; the equipment further comprises a protective cover which can at least cover the local machining plane N and position the to-be-machined material piece. And when the processing plane N is adjusted to be parallel to the reference plane M, the processing mechanism can process the to-be-processed material piece into a finishing piece, so that a polishing plane P formed by the tip ends of the finishing pieces is parallel to the reference plane M. The utility model has the advantages that the to-be-processed material piece is processed into the finishing piece through the processing mechanism; for example, a to-be-machined material piece is directly cut into a trimmer piece through a machining mechanism such as laser, and the trimmer can be machined relatively quickly; the material piece to be machined is detachably connected to the base body through the adhesive, so that the base body can be reused.

Description

Technical Field

[0001] The utility model relates to the field of chemical mechanical polishing, in particular to a device for processing a trimmer. Background Art

[0002] Chemical mechanical polishing, also known as CMP (Chemical Mechanical Planarization), also known as chemical mechanical flattening, is an important process in the field of diamond processing. This process can achieve high-quality surface processing in a short time by polishing materials with CMP polishing pads. In order to ensure the quality of surface processing, the CMP polishing pad needs to be regularly trimmed and maintained using a dresser. Currently commonly used dressers can refer to, for example, the dresser provided in the Chinese invention patent "A CMP polishing pad dresser with diamond columnar crystal clusters and its preparation method" with application number CN202310911611.0 (publication number CN116619246B).

[0003] Existing dressers usually include a substrate and multiple dressing pieces for dressing CMP polishing pads. The equipment commonly used for processing dressers currently processes the dressing pieces by directly depositing a diamond layer on the substrate. However, the dressers processed by this equipment have certain defects during processing and use, as follows: 1. The equipment needs to deposit a diamond layer on the substrate of the dresser to process the dressing piece, and the deposition time is relatively long, usually at least several hours; 2. The dressing piece is deposited directly on the substrate, and the substrate and the dressing piece can almost be regarded as an integrated structure, making it difficult for the dresser to reuse the substrate after multiple uses or partial damage of the dressing piece, which easily leads to waste of the substrate. Therefore, further improvements to the existing technology are needed. Utility Model Content

[0004] The first technical problem to be solved by the utility model is to provide a device capable of processing a trimmer relatively quickly in view of the above-mentioned existing technical status;

[0005] The second technical problem to be solved by the present invention is to provide a device capable of processing a trimmer whose base is convenient for repeated use in view of the above-mentioned existing technical status.

[0006] The technical solution adopted by the utility model to solve the above technical problems is: the equipment for processing the trimmer includes:

[0007] A processing platform for mounting a base of a dresser;

[0008] A processing mechanism is arranged above the processing platform and forms a working space between the processing mechanism and the processing platform;

[0009] It is characterized by also including:

[0010] A leveling device is arranged on the processing platform, comprising a leveling platform and a reference part, wherein the reference part defines a reference plane M, the leveling platform is used to carry the base, the base comprises a processing plane N for fixing at least two to-be-processed materials along the circumferential direction, and the leveling platform can adjust the processing plane N to be parallel to the reference plane M;

[0011] A protective cover, which can at least partially cover the processing plane N, and the protective cover is provided with a positioning portion for positioning each of the workpieces to be processed;

[0012] When the processing plane N is adjusted to be parallel to the reference plane M, the processing mechanism can process each of the workpieces to be processed fixed on the processing plane N into a trimmed piece, so that the grinding plane P formed by the tips of each of the trimming pieces is parallel to the processing plane N. The protective cover can also prevent the processing mechanism from damaging the substrate during the processing.

[0013] In order to solve the second technical problem, preferably, the positioning portion is a through hole opened on the protective cover, and each of the to-be-processed materials can pass through the corresponding positioning portion respectively, and be detachably fixedly connected to the processing plane N through an adhesive. With such a design, the to-be-processed materials can be positioned only when they are located within the range of the corresponding positioning portion, and the to-be-processed materials can be detachably fixedly connected to the processing plane N through an adhesive, so that even if part of the trimming parts is damaged, the damaged trimming parts can be removed and replaced with normal trimming parts, so that the substrate can be reused, and commonly used adhesives can be selected, such as epoxy resin adhesives.

[0014] In order to detect whether the processing plane N is parallel to the reference plane M, preferably, the leveling device also includes a detection mechanism for detecting whether the processing plane N is parallel to the reference plane M, and the detection mechanism is located above the protective cover and connected to the reference part. Considering that the processing mechanism usually takes the reference plane M as the reference, it can be regarded that the processing surface of the processing mechanism is parallel to the reference plane M. Therefore, when processing each workpiece to be processed into a trimming part, the processing plane N is adjusted to be parallel to the reference plane M, so that the grinding plane P formed by the tips of each trimming part after processing can be kept as parallel as possible to the processing plane N, that is, the height difference between the tips of each trimming part after processing and the processing plane N is within the allowable range. Therefore, it is necessary to first set the detection mechanism to detect whether the processing plane N is parallel to the reference plane M; the detection mechanism can detect whether the processing plane N is parallel to the base plane M through sensors such as laser ranging.

[0015] Further, in order to realize the function of the detection mechanism, preferably, the detection mechanism includes a distance measuring unit that can move along the reference plane M or a plane parallel to the reference plane M, and the distance measuring unit can respectively detect the distances between at least three detection points on the processing plane N and the reference plane M, so as to determine whether the processing plane N is parallel to the reference plane M. Since three non-collinear points determine a plane, the distance measuring unit is set to detect the distances between at least three non-collinear detection points on the processing plane N and the reference plane M, so as to determine whether the processing plane N is parallel to the reference plane M.

[0016] In order to determine the detection point on the processing plane N and avoid the protective cover from interfering with the distance measuring unit, preferably, the distance measuring unit can emit laser to detect the distance between the detection point of the processing plane N and the reference plane M, and the protective cover is provided with at least three openings for the laser to pass through, and the points of the processing plane N exposed to the openings form the detection points. Such a design can not only avoid the protective cover from blocking the laser emitted by the distance measuring unit to interfere with the distance measuring unit, but also can more conveniently determine the position of the detection point, ensuring that the distribution of the detection points is relatively reasonable.

[0017] In order to enable the ranging part to move along the reference plane M or a plane parallel to the reference plane M, preferably, the detection mechanism also includes a first movable part arranged on the reference plane M, the first movable part can move along the Y direction, and correspondingly, a second movable part that can move along the X direction is staggered below the first movable part, the second movable part can move with the first movable part, and the ranging part is fixedly connected to the second movable part.

[0018] In order to adjust the processing plane N to be parallel to the reference plane M by adjusting the platform, preferably, the leveling device further includes an adjustment mechanism disposed below the leveling platform, and the adjustment mechanism can adjust the distance between the local leveling platform and the reference plane M, so as to adjust the processing plane N to be parallel to the reference plane M. Since the substrate is disposed on the leveling platform, adjusting the distance between the local leveling platform and the reference plane M is actually equivalent to adjusting the distance between the processing plane N of the local substrate and the reference plane M, so as to adjust the processing plane N to be parallel to the reference plane M.

[0019] In order to adjust the distance of the local leveling platform compared to the reference plane M, preferably, the adjustment mechanism includes a base arranged below the leveling platform, the base is fixedly connected to the leveling platform through a connecting piece, and the part where the leveling platform is connected to the connecting piece forms a fixed part with a constant height, and the adjustment mechanism also includes at least two adjustment members capable of outputting vertical power to the leveling platform to adjust the distance of the local leveling platform compared to the reference plane M. The adjustment member can be a commonly used driving source such as an electric push rod, a cylinder, etc.

[0020] Compared with the prior art, the advantages of the utility model are:

[0021] 1. The workpiece to be processed fixed on the processing plane N is processed into a trimming piece by a processing mechanism. For example, a processing mechanism such as a laser is used to directly cut the workpiece to be processed into a trimming piece, so that the trimmer can be processed relatively quickly;

[0022] 2. The workpiece to be processed is detachably fixed to the processing plane N by adhesive, so that even if the trimming parts of the processed trimmer are damaged during use, the trimmer can be easily repaired by replacing the trimming parts, so that the base can be reused. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of the equipment used for processing the trimmer in the embodiment of the utility model;

[0024] Figure 2 This is a schematic diagram of the structure of the base and the protective cover in the embodiment of the utility model;

[0025] Figure 3 It is a schematic diagram of the exploded structure of the base, the protective cover and the material to be processed in the embodiment of the utility model;

[0026] Figure 4 It is a structural schematic diagram of the device from another angle in the embodiment of the utility model;

[0027] Figure 5 It is a structural schematic diagram of the reference member and the detection mechanism in the embodiment of the utility model;

[0028] Figure 6 It is a schematic diagram of the structure of the leveling platform, the adjustment mechanism, the base, the protective cover and the workpiece to be processed in the embodiment of the utility model;

[0029] Figure 7 It is a schematic diagram of the exploded structure of the leveling platform and the adjusting mechanism in the embodiment of the utility model;

[0030] Figure 8 This is a schematic diagram of the state of the device in the initial state in the embodiment of the utility model;

[0031] Fig. 9 It is a schematic diagram of the state of the device in the embodiment of the utility model in the leveling state;

[0032] Fig.10 This is a schematic diagram of the structure of the trimmer and the protective cover in the embodiment of the utility model;

[0033] Fig.11 It is a schematic diagram of the structure of the trimmer in the embodiment of the utility model. DETAILED DESCRIPTION

[0034] The present invention is further described in detail below in conjunction with specific embodiments.

[0035] like Figures 1 to 7As shown, it is a preferred embodiment of the utility model. The equipment for processing the trimmer in this embodiment includes a processing platform 21 for carrying the base 11 of the trimmer 1, and a processing mechanism 22 is provided above the processing platform 21, and a working space 23 is formed between the processing mechanism 22 and the processing platform 21. A leveling device 3 is also provided on the processing platform 21, and the leveling device 3 includes a leveling platform 31 for carrying the base 11 and a reference part 32 defining a reference plane M. The base 11 includes a processing plane N for fixing at least two to-be-processed materials 12 in the circumferential direction, and the leveling platform 31 can adjust the processing plane N to be parallel to the reference plane M. In this embodiment, six to-be-processed materials 12 are arranged on the base 11. A protective cover 4 capable of covering at least a part of the processing plane N is also provided on the processing plane N, and a positioning portion 41 for positioning each to-be-processed material 12 is provided on the protective cover 4. When the processing plane N is adjusted to be parallel to the reference plane M, the processing mechanism 22 can process each to-be-processed material 12 fixed on the processing plane N into a trimming piece 13, so that the grinding plane P formed by the tips of each trimming piece 13 is parallel to the processing plane N. The protective cover 4 can also prevent the processing mechanism 22 from damaging the substrate 11 during the processing. The processing mechanism 22 in this embodiment is a commonly used laser cutting mechanism, so it will not be described and marked too much. This design is based on the consideration that the processing mechanism 22 is usually based on the reference plane M, and the processing surface of the processing mechanism 22 can be regarded as parallel to the reference plane M. Therefore, when processing each workpiece 12 to be processed into a trimming piece 13, the processing plane N is adjusted to be parallel to the reference plane M, so that the grinding plane P formed by the tips of the processed trimming pieces 13 can be kept as parallel as possible to the processing plane N, that is, the height difference between the tips 131 of the processed trimming pieces 13 and the processing plane N is within an allowable range. In this embodiment, the height difference range is 0 to 20 μm. When the height difference between the tips 131 of the trimming pieces 13 and the processing plane N is within this range, it is considered that the grinding plane P is parallel to the processing plane N. Only in this way can the processed trimmer have relatively good trimming ability.

[0036] Furthermore, in order to enable the base 11 to be reused, the positioning portion 41 in this embodiment is a through hole opened on the protective cover 4, and each workpiece 12 to be processed can pass through the corresponding positioning portion 41 respectively, and be detachably fixedly connected to the processing plane N by an adhesive. With such a design, the workpiece 12 to be processed can be positioned only if it is located within the range of the corresponding positioning portion 41, and the workpiece 12 to be processed can be detachably fixedly connected to the processing plane N by an adhesive, so that even if part of the trimming piece 13 is damaged, the damaged trimming piece 13 can be removed and replaced with a normal trimming piece 13, so that the base 11 can be reused. In addition, the device in this embodiment bonds the workpiece 12 to the processing plane N by an epoxy resin adhesive.

[0037] In terms of adjusting the machining plane N to be parallel to the reference plane M, firstly, in order to detect whether the machining plane N is parallel to the reference plane M, the leveling device 3 in this embodiment also includes a detection mechanism 5 for detecting whether the machining plane N is parallel to the reference plane M. The detection mechanism 5 is located above the protective cover 4 and connected to the reference member 32. Specifically, the detection mechanism 5 in this embodiment includes a distance measuring unit 51 that can move along the reference plane M or a plane parallel to the reference plane M. The distance measuring unit 51 can respectively detect the distances between at least three detection points 111 on the machining plane N and the reference plane M, thereby determining whether the machining plane N is parallel to the reference plane M. Since three non-collinear points determine a plane, the distance measuring unit 51 is set to detect the distances between at least three non-collinear detection points 111 on the machining plane N and the reference plane M, so as to determine whether the machining plane N is parallel to the reference plane M. The distance measuring unit 51 in this embodiment can emit a laser 511 to detect the distance between the detection point of the processing plane N and the reference plane M. The protective cover 4 is provided with at least three openings 42 for the laser 511 to pass through, and the points of the processing plane N exposed to the openings 42 form detection points 111. Such a design can not only prevent the protective cover 4 from blocking the laser 511 emitted by the distance measuring unit 51 to interfere with the distance measuring unit 51, but also can more conveniently determine the position of the detection point 111, ensuring that the distribution of the detection point 111 is relatively reasonable. Figure 2 In this embodiment, three openings 42 are arranged on the protective cover 4 around the center of the protective cover 4. On the one hand, it ensures that the detection points 111 corresponding to the three openings 42 are not on a straight line. On the other hand, it is also convenient for the processing mechanism 21 to be positioned at the center of the protective cover 4 for processing. Figure 4In order for the distance measuring part 51 to be able to move along the reference plane M or a plane parallel to the reference plane M, the detection mechanism 5 also includes a first movable part 52 arranged on the reference plane M, the first movable part 52 can move along the Y direction, and a second movable part 53 that can move along the X direction is staggeredly arranged below the first movable part 52, the second movable part 53 can move with the first movable part 52, and the distance measuring part 51 is fixedly connected to the second movable part 53.

[0038] In terms of adjusting the processing plane N to be parallel to the reference plane M by adjusting the platform 31, the leveling device 3 in this embodiment also includes an adjustment mechanism 6 disposed below the leveling platform 31, and the adjustment mechanism 6 can adjust the distance between the local leveling platform 31 and the reference plane M, so as to adjust the processing plane N to be parallel to the reference plane M. Since the substrate 11 is disposed on the leveling platform 31, adjusting the distance between the local leveling platform 31 and the reference plane M is actually equivalent to adjusting the distance between the processing plane N of the local substrate 11 and the reference plane M, thereby adjusting the processing plane N to be parallel to the reference plane M. Specifically, see Figure 7 The adjustment mechanism 6 in this embodiment includes a base 61 arranged below the leveling platform 31. The base 61 is fixedly connected to the leveling platform 31 through a connecting member 62. The portion where the leveling platform 31 and the connecting member 62 are connected forms a fixed portion 311 with a constant height. The adjustment mechanism 6 also includes two adjustment members 63 that can output vertical power to the leveling platform 31 to adjust the distance of the local leveling platform 31 compared to the reference plane M.

[0039] The use process of the equipment for processing the trimmer provided in this embodiment is as follows:

[0040] See also Figure 8 At this time, the equipment is in the initial state, the substrate 11 bonded with the workpiece 12 to be processed is placed on the leveling platform 31, and the protective cover 4 covers the processing plane N of the substrate 11. Obviously, under the action of the gravity of the substrate 11, the leveling platform 31 is tilted relative to the base 61, and the processing plane N is not parallel to the reference plane M at this time; see Fig. 9 After the distance measuring unit 51 detects the distances between the three detection points 111 and the reference plane M and determines whether the processing plane N is parallel to the reference plane M, the adjustment mechanism 6 acts on the leveling platform 31 to adjust the processing plane N to be parallel to the reference plane M. Then the processing mechanism 22 starts to work to process each of the to-be-processed materials 12 into the trimmed parts 13. During the processing, the protective cover 4 can also prevent the processing mechanism 22 from causing damage to the substrate 11; see Fig.10 The base 11 and the processed trimming pieces 13 together form the trimmer 1, and the grinding plane P formed by the tips 131 of the trimming pieces 13 is parallel to the processing plane N; finally, see Fig.11, remove the protective cover 4 from the working plane N of the base 11 , and the equipment completes the processing of the trimmer 1 .

Claims

1. A device for processing a trimmer, comprising: A processing platform (21) for mounting a base (11) of a trimmer (1); A processing mechanism (22) is arranged above the processing platform (21) and forms a working space (23) between the processing mechanism and the processing platform (21); It is characterized in that Also included are: A leveling device (3) is arranged on the processing platform (21), comprising a leveling platform (31) and a reference member (32), wherein the reference member (32) defines a reference plane (M), the leveling platform (31) is used to carry the base (11), the base (11) comprises a processing plane (N) for fixing at least two to-be-processed workpieces (12) along a circumferential direction, and the leveling platform (31) is capable of adjusting the processing plane (N) to be parallel to the reference plane (M); A protective cover (4) capable of at least partially covering the processing plane (N), and a positioning portion (41) for positioning each of the to-be-processed materials (12) is provided on the protective cover (4); When the processing plane (N) is adjusted to be parallel to the reference plane (M), the processing mechanism (22) can process each of the workpieces (12) to be processed fixed on the processing plane (N) into a trimming piece (13), so that the grinding plane (P) formed by the tips (131) of each of the trimming pieces (13) is parallel to the processing plane (N), and the protective cover (4) can also prevent the processing mechanism (22) from damaging the substrate (11) during the processing.

2. The device according to claim 1, characterized in that: The positioning portion (41) is a through hole opened on the protective cover (4), and each of the workpieces (12) to be processed can pass through the corresponding positioning portion (41) respectively and be detachably fixedly connected to the processing plane (N) by an adhesive.

3. The device according to claim 2, characterized in that: The leveling device (3) also includes a detection mechanism (5) for detecting whether the processing plane (N) is parallel to the reference plane (M); the detection mechanism (5) is located above the protective cover (4) and connected to the reference member (32).

4. The device according to claim 3, characterized in that: The detection mechanism (5) comprises a distance measuring unit (51) capable of moving along the reference plane (M) or a plane parallel to the reference plane (M), and the distance measuring unit (51) can respectively detect the distance between the detection points (111) on at least three of the processing planes (N) and the reference plane (M), so as to determine whether the processing plane (N) is parallel to the reference plane (M).

5. The device according to claim 4, characterized in that: The distance measuring unit (51) is capable of emitting a laser (511) to detect the distance between a detection point (111) of the processing plane (N) and the reference plane (M); the protective cover (4) is provided with at least three openings (42) through which the laser (511) can pass; the point of the processing plane (N) exposed to the opening (42) forms the detection point (111).

6. The device according to claim 5, characterized in that: The detection mechanism (5) further comprises a first movable part (52) arranged on the reference plane (M), the first movable part (52) being movable along the Y direction, and correspondingly, a second movable part (53) being movable along the X direction is staggeredly arranged below the first movable part (52), the second movable part (53) being movable along the first movable part (52), and the distance measuring part (51) being fixedly connected to the second movable part (53).

7. The device according to any one of claims 1 to 6, characterized in that: The leveling device (3) also includes an adjustment mechanism (6) arranged below the leveling platform (31), and the adjustment mechanism (6) is capable of adjusting the distance between the local leveling platform (31) and the reference plane (M) so as to adjust the processing plane (N) to be parallel to the reference plane (M).

8. The device according to claim 7, characterized in that: The adjustment mechanism (6) comprises a base (61) arranged below the leveling platform (31); the base (61) is fixedly connected to the leveling platform (31) via a connecting piece (62); a portion where the leveling platform (31) and the connecting piece (62) are connected forms a fixed portion (311) with a constant height; the adjustment mechanism (6) further comprises at least two adjustment pieces (63) capable of outputting vertical power to the leveling platform (31) so as to adjust the distance of a part of the leveling platform (31) relative to the reference plane (M).

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