Rotary cutting device for cutting large-size quartz ingot

Abstract

The utility model provides a rotary cutting device used for cutting a large-size quartz ingot, which comprises a rotary table used for fixing and supporting the large-size quartz ingot to be processed and capable of driving the large-size quartz ingot to rotate synchronously; the diamond wire cutting assembly is used for cutting the large-size quartz ingot; the diamond wire cutting assembly can move to adjust the depth of cutting the large-size quartz ingot; the feeding assembly is used for driving the diamond wire cutting assembly to move; and the driving device is used for driving the rotating table to rotate. And when the relative position of the diamond wire cutting assembly and the axis of the rotating table is kept unchanged and the rotating table rotates, the diamond wire cutting assembly annularly cuts the large-size quartz ingot around the axis of the rotating table.

Description

Technical Field

[0001] The utility model relates to a cutting machine, in particular to a rotary cutting device used for cutting large-size quartz ingots. Background Art

[0002] With the continuous development of the semiconductor industry, the demand for fused quartz ingots, as a very important quartz raw material, is also increasing. In the production process of fused quartz ingots, the quartz ingots are usually kept at nearly 2000℃ for about a week, and the grown quartz ingots are cylindrical in shape. During this period, materials such as molybdenum crucibles and insulation bricks will diffuse metal elements into the quartz ingots, causing the outer periphery of the quartz ingot to be affected by the diffusion of metal elements within a range of 2cm to 5cm, and this effect is difficult to observe in advance with the naked eye.

[0003] The grown quartz ingot is usually larger in size with a diameter of more than 1500 mm and a height of more than 500 mm. However, existing conventional cutting equipment can only cut the quartz ingot longitudinally or transversely, and cannot cut off the edge of the quartz ingot where the metal elements diffuse.

[0004] The edge of the quartz ingot where metal elements diffuse will cause abnormalities in the processed semiconductor quartz devices. In severe cases, it may even affect the normal operation of the semiconductor equipment, thereby affecting the quality of the semiconductor wafer. Utility Model Content

[0005] Purpose of the utility model: The technical problem to be solved by the utility model is to address the deficiencies in the prior art and to provide a rotary cutting device for cutting large-sized quartz ingots, which can rotary cut large-sized quartz ingots to remove the peripheral portion diffused by metal elements, thereby improving the quality of semiconductor wafers and reducing the risk of abnormalities in semiconductor quartz devices.

[0006] In order to solve the above technical problems, the utility model discloses a rotary cutting device for cutting large-size quartz ingots, which comprises:

[0007] A rotating table, used for fixing and supporting the large-sized quartz ingot to be processed and capable of driving the large-sized quartz ingot to rotate synchronously;

[0008] A diamond wire cutting assembly, used for cutting the large-sized quartz ingot; the diamond wire cutting assembly can be moved to adjust the depth of cutting the large-sized quartz ingot;

[0009] A feeding assembly, used for driving the diamond wire cutting assembly to move;

[0010] and a driving device, used for driving the rotating table to rotate.

[0011] Specifically, when the relative positions of the diamond wire cutting assembly and the axis of the rotating table remain unchanged and the rotating table rotates, the diamond wire cutting assembly cuts the large-sized quartz ingot around the axis of the rotating table.

[0012] Specifically, the rotating table includes a top surface and a peripheral side wall. The top surface is provided with two grooves. The ends of the two grooves on the same side penetrate the peripheral side wall to form an opening for a forklift claw for placing a large-sized quartz ingot to enter and exit.

[0013] Specifically, the diamond wire cutting assembly comprises a diamond beaded rope arranged in a ring shape. The diamond beaded rope comprises a cutting section for grinding and cutting the large-sized quartz ingot, and the cutting section and the axis of the rotating table are both arranged in the longitudinal direction.

[0014] Specifically, the feed assembly includes a lead screw for driving the diamond wire cutting assembly to move when the lead screw rotates, and a feed motor for driving the lead screw to rotate.

[0015] Specifically, the rotary cutting device includes a guide assembly, which is used to guide the movement of the diamond wire cutting assembly. The guide assembly includes a feed track and a cutting assembly bracket slidably connected to the feed track, and the diamond wire cutting assembly is installed on the cutting assembly bracket. The cutting assembly bracket is threadedly connected to the lead screw to form a lead screw pair, so as to drive the diamond wire cutting assembly to move when the lead screw rotates.

[0016] Specifically, the driving device is a motor.

[0017] Specifically, the rotary cutting device comprises a positioning plate, and the positioning plate is used to position the large-size quartz ingot.

[0018] Specifically, the rotary cutting device comprises a base and a frame, the rotary table is rotatably mounted on the base, the frame is fixedly connected to the upper part of the base, and the frame is used to fixedly support the feeding assembly.

[0019] Preferably, the diamond bead rope comprises a rope body, and the rope body has a diameter ranging from 3 mm to 8 mm.

[0020] Specifically, the large-size quartz ingot is a quartz ingot with a diameter ranging from 1200 mm to 1900 mm.

[0021] Beneficial effects:

[0022] (1) The utility model provides a rotary cutting device for cutting large-sized quartz ingots. When the relative positions of the diamond wire cutting component and the axis of the rotating table remain unchanged and the rotating table rotates, the diamond wire cutting component cuts the large-sized quartz ingot around the axis of the rotating table, thereby cutting off the peripheral portion of the large-sized quartz ingot diffused by metal elements, thereby improving the quality of semiconductor wafers and reducing the risk of abnormalities in semiconductor quartz devices.

[0023] (2) The utility model provides a feeding assembly to drive the diamond wire cutting assembly to move, so that circular cutting of different depths can be achieved according to actual needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods, and the above and / or other advantages of the present invention will become more clear.

[0025] Figure 1 The utility model is a three-dimensional structural schematic diagram of a rotary cutting device for cutting large-size quartz ingots.

[0026] The description of the accompanying drawings is:

[0027] 1. Rotating table; 2. Diamond wire cutting assembly; 3. Feed assembly; 4. Positioning plate; 5. Guide assembly; 11. Top surface; 12. Peripheral side wall; 13. Groove; 21. Diamond beaded rope; 211. Cutting section; 22. Wheel; 23. Guide wheel; 24. Hydraulic rope tightening cylinder; 31. Lead screw; 32. Feed motor; 51. Feed track; 52. Cutting assembly bracket; 71. Base; 72. Frame; 131. Opening. DETAILED DESCRIPTION

[0028] The utility model provides a rotary cutting device for cutting large-sized quartz ingots, which can rotary cut the large-sized quartz ingots to remove the peripheral portion diffused by metal elements, thereby improving the quality of semiconductor wafers and reducing the risk of abnormalities in semiconductor quartz devices.

[0029] See also Figure 1 The utility model provides a rotary cutting device for cutting large-sized quartz ingots, comprising a rotary table 1 having an axis, a diamond wire cutting assembly 2, a feed assembly 3 and a drive device. The rotary table 1 is used to fix and support the large-sized quartz ingot to be processed and can drive the large-sized quartz ingot to rotate synchronously around the axis. The diamond wire cutting assembly 2 is used to cut the large-sized quartz ingot. The diamond wire cutting assembly 2 can move to adjust the depth of its cutting of the large-sized quartz ingot. The feed assembly 3 is used to drive the diamond wire cutting assembly 2 to move. The drive device is used to drive the rotary table 1 to rotate.

[0030] When the relative positions of the diamond wire cutting assembly 2 and the axis of the rotating table 1 remain unchanged and the rotating table 1 rotates, the diamond wire cutting assembly 2 cuts the large-sized quartz ingot around the axis of the rotating table 1 .

[0031] The large-sized quartz ingot to be processed is cylindrical in shape as a whole. When placing the large-sized quartz ingot, the large-sized quartz ingot should be coaxial with the rotating table 1 as much as possible. The large-sized quartz ingot is fixed on the rotating table 1 by its own gravity.

[0032] For details, see Figure 1 The rotating table 1 includes a top surface 11 and a peripheral side wall 12. The top surface 11 is provided with two grooves 13. The ends of the two grooves 13 on the same side penetrate the peripheral side wall 12 to form an opening 131 for a forklift claw for placing a large-sized quartz ingot to enter and exit.

[0033] Specifically, the rotating platform 1 can realize 360-degree rotation.

[0034] For details, see Figure 1 The rotary cutting device includes a positioning plate 4 for positioning a large-sized quartz ingot, and the positioning plate 4 is mounted on a rotary table 1.

[0035] Specifically, the driving device is a motor.

[0036] For details, see Figure 1 The diamond wire cutting assembly 2 includes a diamond bead rope 21 arranged in a ring shape and a tensioning device for tensioning the diamond bead rope 21. The tensioning device includes a wheel disc 22, a guide wheel 23 and a hydraulic rope tensioning cylinder 24. The diamond bead rope 21 is wound around the wheel disc 22. The diamond bead rope 21 moves longitudinally under the drive of the wheel disc 22, and is fixed and tightened under the action of the guide wheel 23 and the hydraulic rope tensioning cylinder 24, so that it has abrasive force to achieve cutting of the product. The wheel disc 22 can be driven by a motor. The tensioning device for driving the diamond bead rope 21 to rotate and tensioning the diamond bead rope 21 can adopt a tensioning device in the field of wire cutting, which is not the main invention point of the present application, so it will not be repeated.

[0037] More specifically, the diameter of the diamond bead rope 21 is in the range of 3 mm to 8 mm.

[0038] For details, see Figure 1 The diamond bead rope 21 includes a cutting section 211 for grinding and cutting large-sized quartz ingots, and the cutting section 211 is arranged parallel to the axis of the rotating table 1. More specifically, the cutting section 211 and the axis of the rotating table 1 are both arranged in the longitudinal direction.

[0039] For details, see Figure 1The rotary cutting device includes a guide assembly 5, which is used to guide the movement of the diamond wire cutting assembly 2. The guide assembly 5 includes a feed track 51 and a cutting assembly bracket 52 slidably connected to the feed track 51, and the diamond wire cutting assembly 2 is mounted on the cutting assembly bracket 52.

[0040] Preferably, the feeding assembly 3 drives the diamond wire cutting assembly 2 to move radially along the rotating table 1 .

[0041] Specifically, see Figure 1 The feed assembly 3 includes a lead screw 31 and a feed motor 32. The lead screw 31 is threadedly connected with the cutting assembly bracket 52 to form a lead screw pair, which is used to drive the diamond wire cutting assembly 2 to move synchronously with the cutting assembly bracket 52 when the lead screw 31 rotates. The feed motor 32 is used to drive the lead screw 31 to rotate.

[0042] For details, see Figure 1 The rotary cutting device includes a base 71 and a frame 72, and the rotary table 1 is rotatably mounted on the base 71. The frame 72 is fixedly connected to the upper part of the base 71, and the frame 72 is used to fixedly support the feed assembly 3. More specifically, the lead screw 31 is rotatably supported on the frame 72. The feed motor 32 is fixedly mounted on the frame 72.

[0043] The process of ring cutting a large-sized quartz ingot using the rotary cutting device provided by the utility model is as follows:

[0044] A quartz ingot with a diameter of 1800 mm and a height of 500-700 mm is forked onto the rotating table 1 by a forklift, and the forklift claws enter and exit through the groove 13 on the rotating table 1. The quartz ingot is positioned against the positioning plate 4. The equipment is started, and the feed motor 32 is controlled to push the diamond wire cutting assembly 2 to move along the feed track 51 so that the diamond bead rope 21 is close to the large-sized quartz ingot. The rotating table 1 is kept stationary, and each motor is started so that various guide wheels 23 and the hydraulic rope tightening motor drive the diamond bead rope 21 to operate. The diamond bead rope 21 first moves along the direction of the feed track 51 to cut 2 cm deep, and then the position of the cutting assembly is kept unchanged, and the motor drives the rotating table 1 to rotate around its axis to drive the large-sized quartz ingot to rotate. The rotating table 1 rotates at a speed of usually 5 mm / min to 10 mm / min. After 5 to 16 hours, along the circumferential direction of the rotating table 1, the diamond wire cutting assembly 2 can complete annular cutting within the range of 0-360° for the original large-sized quartz ingot product.

[0045] The utility model provides a concept and method of a rotary cutting device for cutting large-size quartz ingots. There are many methods and ways to implement the technical solution. The above is only a preferred implementation of the utility model. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the utility model. These improvements and modifications should also be regarded as the protection scope of the utility model. All components not specified in this embodiment can be implemented by existing technologies.

Claims

1. A rotary cutting device for cutting large-size quartz ingots, characterized in that: include: A rotating table (1) is used to fix and support a large-sized quartz ingot to be processed and can drive the large-sized quartz ingot to rotate synchronously; A diamond wire cutting assembly (2) for cutting the large-sized quartz ingot; the diamond wire cutting assembly (2) is movable to adjust the depth of cutting the large-sized quartz ingot; A feeding assembly (3), used for driving the diamond wire cutting assembly (2) to move; and a driving device, used for driving the rotating table (1) to rotate.

2. A rotary cutting device for cutting large-size quartz ingots according to claim 1, characterized in that: When the relative position of the diamond wire cutting component (2) and the axis of the rotating table (1) remains unchanged and the rotating table (1) rotates, the diamond wire cutting component (2) cuts the large-sized quartz ingot around the axis of the rotating table (1).

3. A rotary cutting device for cutting large-size quartz ingots according to claim 1 or 2, characterized in that: The rotating table (1) comprises a top surface (11) and an outer peripheral side wall (12). The top surface (11) is provided with two grooves (13). The ends of the two grooves (13) on the same side penetrate the outer peripheral side wall (12) to form an opening (131) for a forklift claw for placing a large-sized quartz ingot to enter and exit.

4. A rotary cutting device for cutting large-size quartz ingots according to claim 3, characterized in that: The diamond wire cutting assembly (2) comprises a diamond beaded rope (21) arranged in a ring shape; the diamond beaded rope (21) comprises a cutting section (211) for grinding and cutting the large-sized quartz ingot, and the cutting section (211) and the axis of the rotating table (1) are both arranged in the longitudinal direction.

5. A rotary cutting device for cutting large-size quartz ingots according to claim 4, characterized in that: The feeding assembly (3) comprises: A lead screw (31) is used to drive the diamond wire cutting assembly (2) to move when the lead screw (31) rotates; and a feeding motor (32) for driving the lead screw (31) to rotate.

6. A rotary cutting device for cutting large-size quartz ingots according to claim 5, characterized in that: The rotary cutting device comprises a guide assembly (5), wherein the guide assembly (5) is used to guide the movement of the diamond wire cutting assembly (2); the guide assembly (5) comprises a feed track (51) and a cutting assembly bracket (52) slidably connected to the feed track (51), and the diamond wire cutting assembly (2) is mounted on the cutting assembly bracket (52); the cutting assembly bracket (52) is threadedly connected to the lead screw (31) to form a lead screw pair, so as to achieve the movement of the diamond wire cutting assembly (2) when the lead screw (31) rotates.

7. A rotary cutting device for cutting large-size quartz ingots according to claim 6, characterized in that: The driving device is a motor.

8. A rotary cutting device for cutting large-size quartz ingots according to claim 7, characterized in that: The rotary cutting device comprises a positioning plate (4), and the positioning plate (4) is used to position the large-size quartz ingot.

9. A rotary cutting device for cutting large-size quartz ingots according to claim 8, characterized in that: The rotary cutting device comprises: A base (71), the rotating platform (1) being rotatably mounted on the base (71); and a frame (72), wherein the frame (72) is fixedly connected to the upper part of the base (71); the frame (72) is used for fixedly supporting the feeding assembly (3).

10. A rotary cutting device for cutting large-size quartz ingots according to claim 9, characterized in that: The diamond beaded rope (21) comprises a rope body, the diameter of which ranges from 3 mm to 8 mm; the large-size quartz ingot is a quartz ingot with a diameter ranging from 1200 mm to 1900 mm.

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