Substrate based on high-pressure plastic packaging equipment
By designing a multi-layer structure substrate, including wear-resistant protective layer, thermal conductive layer, performance base layer, conductive layer and heat dissipation pore, the shortcomings of traditional substrates in physical wear, chemical corrosion and heat dissipation performance are solved, and a longer service life is achieved and more stable high temperature performance.
Patent Information
- Application Number
- CN202421255039.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-04
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2034-06-04
AI Technical Summary
The substrates of traditional high-pressure plastic sealing equipment have weak resistance when facing physical wear and chemical corrosion, have short service life, and have limited heat dissipation performance, resulting in the equipment's performance degradation or failure in high temperature environments.
A multi-layer structure substrate is designed, including a first wear-resistant protective layer, a thermal conductive layer, a performance base layer, a conductive layer and a second wear-resistant protective layer, through the design of polygonal limit grooves and protrusions, and the first and The dislocation of the second heat dissipation pore enhances the heat dissipation performance and structural strength of the substrate.
When facing physical wear and chemical corrosion during high-pressure plastic sealing equipment, the substrate has extremely high resistance, extends its service life, and ensures the stable performance of the substrate in high-temperature environment through efficient heat dissipation design.
Smart Images
Figure CN222473566U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of substrates for high-voltage plastic packaging equipment, in particular to a substrate based on high-voltage plastic packaging equipment. Background Art
[0002] The substrate of high-voltage plastic packaging equipment is the core component to ensure the efficiency and stability of the electronic packaging process. It is made of high-temperature resistant and high-strength materials and can withstand the extreme temperature and pressure during high-pressure injection molding to ensure the safety and reliability of the packaging process. The substrate not only has good thermal stability and mechanical strength, but also has excellent electrical properties, such as high insulation and low resistivity, which helps to improve the electrical performance of the packaged products. In addition, the material selection and preparation process of the substrate are also carefully selected and strictly controlled to ensure its stable performance and durability. In short, the substrate of high-voltage plastic packaging equipment is an indispensable and important component in the field of electronic packaging.
[0003] However, the traditional substrate design often shows weak resistance to the physical wear and chemical corrosion caused by the operation of high-pressure plastic sealing equipment, resulting in a short service life of the substrate and affecting the stability and reliability of the equipment operation. At the same time, in terms of heat dissipation performance, the design of the traditional substrate also has certain limitations, and it is unable to effectively dissipate the heat generated inside the equipment quickly, resulting in performance degradation of the equipment in a high-temperature working environment, or even failure. Therefore, a substrate based on high-pressure plastic sealing equipment is proposed. Utility Model Content
[0004] The utility model solves the technical problems in the above-mentioned background technology and provides a substrate based on high-pressure plastic packaging equipment.
[0005] In order to solve the above technical problems, the technical solution provided by the utility model is:
[0006] A substrate based on high-pressure plastic packaging equipment comprises a first wear-resistant protective layer, a heat-conducting layer, a performance base layer, a conductive layer and a second wear-resistant protective layer, wherein the performance base layer is arranged in the innermost layer, the heat-conducting layer is arranged in the upper layer of the performance base layer, the first wear-resistant protective layer is arranged in the upper layer of the heat-conducting layer, the conductive layer is arranged in the lower layer, the second wear-resistant protective layer is arranged in the lower layer of the conductive layer, a polygonal limiting groove is arranged on the performance base layer, a polygonal limiting protrusion is fixedly connected to the heat-conducting layer, a second heat dissipation pore is arranged between the heat-conducting layer and the performance base layer, a first heat dissipation pore is arranged between the performance base layer and the conductive layer, and the first heat dissipation pore and the second heat dissipation pore are staggered, which can maximize the increase in heat dissipation area, improve heat dissipation efficiency, and ensure that the heat dissipation performance of the substrate is always maintained in the best state.
[0007] Preferably, the first wear-resistant protective layer is made of polytetrafluoroethylene, which can effectively resist external physical wear and chemical corrosion and ensure the long-term stable operation of the substrate.
[0008] Preferably, the thermal conductive layer is made of an aluminum substrate, and the first wear-resistant protective layer and the thermal conductive layer are bonded by an adhesive. When heat is generated inside the device, the heat can be quickly transferred to the thermal conductive layer through the performance base layer, effectively reducing the working temperature of the substrate and ensuring the stability and service life of the substrate.
[0009] Preferably, the performance base layer is made of a polyimide composite material, and the thermal conductive layer and the performance base layer are bonded by hot pressing. This material not only has good mechanical properties, but also can assist in heat dissipation to a certain extent.
[0010] Preferably, the conductive layer is made of a copper foil composite material, and the performance base layer and the conductive layer are bonded by hot pressing. This material has good electrical conductivity and can ensure smooth transmission of current inside the device.
[0011] Preferably, the second wear-resistant protective layer is made of polytetrafluoroethylene, the conductive layer and the second wear-resistant protective layer are bonded by an adhesive, and the second wear-resistant protective layer protects the lower layer of the conductive layer, thereby avoiding external interference or damage during operation of the equipment.
[0012] Preferably, the polygonal limiting protrusions are provided in several groups, the polygonal limiting protrusions are arranged at the lower end of the heat conducting layer, the polygonal limiting grooves are provided in several groups, the polygonal limiting protrusions and the polygonal limiting grooves have the same shape and size, the polygonal limiting grooves match the polygonal limiting protrusions on the heat conducting layer, which not only enhances the structural strength of the substrate, but also improves the heat conduction efficiency by increasing the contact area, the first heat dissipation holes are provided in several groups, the second heat dissipation holes are provided in several groups, and the first heat dissipation holes and the second heat dissipation holes are staggered.
[0013] With the above structure, the utility model has the following advantages:
[0014] 1. In the utility model, by using polytetrafluoroethylene as the material of the first wear-resistant protective layer and the second wear-resistant protective layer, the substrate has extremely high resistance to physical wear and chemical corrosion generated when the high-voltage plastic sealing equipment is working, which not only greatly extends the service life of the substrate, but also ensures the stability and reliability of the long-term operation of the equipment. The protection of the conductive layer by the second wear-resistant protective layer effectively avoids the conductive layer from being disturbed or damaged by the outside world during the operation of the equipment, thereby ensuring the smooth transmission of the current inside the equipment.
[0015] 2. In the utility model, the thermal conductive layer is made of an aluminum substrate material, which is tightly bonded to the performance base layer by hot pressing to form an efficient heat conduction path. When heat is generated inside the substrate, the heat can be quickly transferred to the thermal conductive layer through the performance base layer. The polygonal limiting groove design on the performance base layer matches the polygonal limiting protrusion on the thermal conductive layer, which not only enhances the structural strength of the substrate, but also improves the heat conduction efficiency by increasing the contact area. Furthermore, the first heat dissipation hole and the second heat dissipation hole are staggered. This arrangement increases the heat dissipation area, significantly improves the heat dissipation efficiency, and ensures that the substrate can still maintain stable performance in a high-temperature working environment.
[0016] The above summary is for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the utility model will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0018] Figure 1 This is a three-dimensional structural explosion diagram of a substrate based on a high-pressure plastic packaging device proposed by the utility model;
[0019] Figure 2 This is a partial structural cross-sectional view of a substrate based on a high-pressure plastic packaging device proposed by the utility model;
[0020] Figure 3 The utility model is a partial three-dimensional structural schematic diagram of a substrate based on a high-pressure plastic packaging device.
[0021] As shown in the figure: 1. First wear-resistant protective layer; 2. Heat-conducting layer; 3. Performance base layer; 4. Conductive layer; 5. Second wear-resistant protective layer; 6. Polygonal limiting protrusions; 7. Polygonal limiting grooves; 8. First heat dissipation holes; 9. Second heat dissipation holes. DETAILED DESCRIPTION
[0022] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.
[0023] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0024] The utility model is further described in detail below in conjunction with the full text:
[0025] Combined with Figures 1 to 3 A substrate based on high-pressure plastic packaging equipment, comprising a first wear-resistant protective layer 1, a heat-conducting layer 2, a performance base layer 3, a conductive layer 4, and a second wear-resistant protective layer 5, characterized in that: the performance base layer 3 is arranged in the innermost layer, the heat-conducting layer 2 is arranged on the upper layer of the performance base layer 3, the first wear-resistant protective layer 1 is arranged on the upper layer of the heat-conducting layer 2, the conductive layer 4 is arranged on the lower layer, and the second wear-resistant protective layer 5 is arranged on the lower layer of the conductive layer 4, a polygonal limiting groove 7 is arranged on the performance base layer 3, a polygonal limiting protrusion 6 is fixedly connected to the heat-conducting layer 2, and a second heat dissipation pore is arranged between the heat-conducting layer 2 and the performance base layer 3 9. A first heat dissipation pore 8 is provided between the performance base layer 3 and the conductive layer 4. By using polytetrafluoroethylene as the material of the first wear-resistant protective layer 1 and the second wear-resistant protective layer 5, the substrate has extremely high resistance to physical wear and chemical corrosion generated when the high-voltage plastic sealing equipment is working, which not only greatly extends the service life of the substrate, but also ensures the stability and reliability of the long-term operation of the equipment. The protection of the second wear-resistant protective layer 5 on the conductive layer 4 effectively prevents the conductive layer 4 from being disturbed or damaged by the outside world during the operation of the equipment, thereby ensuring the smooth transmission of the current inside the equipment;
[0026] Among them, the material of the first wear-resistant protective layer 1 is polytetrafluoroethylene, the material of the heat-conducting layer 2 is an aluminum substrate, the first wear-resistant protective layer 1 and the heat-conducting layer 2 are bonded by an adhesive, the material of the performance base layer 3 is a polyimide composite material, the heat-conducting layer 2 and the performance base layer 3 are bonded by hot pressing, the first wear-resistant protective layer 1 can effectively resist external physical wear and chemical corrosion, and ensure the long-term stable operation of the substrate, the heat-conducting layer 2 when heat is generated inside the device, the heat can be quickly transferred to the heat-conducting layer through the performance base layer, effectively reducing the working temperature of the substrate, ensuring the stability and service life of the substrate, the performance base layer 3 has good mechanical properties, and can also assist in heat dissipation to a certain extent;
[0027] The conductive layer 4 is made of copper foil composite material, the performance base layer 3 and the conductive layer 4 are bonded by hot pressing, the second wear-resistant protective layer 5 is made of polytetrafluoroethylene, the conductive layer 4 and the second wear-resistant protective layer 5 are bonded by an adhesive, the polygonal limiting protrusions 6 are provided in several groups, the polygonal limiting protrusions 6 are arranged at the lower end of the thermal conductive layer 2, the polygonal limiting grooves 7 are provided in several groups, the polygonal limiting protrusions 6 and the polygonal limiting grooves 7 have the same shape and size, the first heat dissipation pores 8 are provided in several groups, the second heat dissipation pores 9 are provided in several groups, the first heat dissipation pores 8 and the second heat dissipation pores 9 are staggered, and the thermal conductive layer 2 is made of an aluminum substrate. , tightly bonded with the performance base layer 3 by hot pressing, forming an efficient heat conduction path. When heat is generated inside the substrate, the heat can be quickly transferred to the thermal conductive layer 2 through the performance base layer 3. The polygonal limiting groove 7 design on the performance base layer 3 matches the polygonal limiting protrusion 6 on the thermal conductive layer 2, which not only enhances the structural strength of the substrate, but also improves the heat conduction efficiency by increasing the contact area. Further, the first heat dissipation hole 8 and the second heat dissipation hole 9 are staggered. This arrangement increases the heat dissipation area, significantly improves the heat dissipation efficiency, and ensures that the substrate can still maintain stable performance under high temperature working environment.
[0028] Working principle of the utility model: when in use, when the high-pressure plastic sealing equipment is working, the substrate is subjected to various pressures and temperature changes from the equipment. First, the outermost first wear-resistant protective layer 1 and the second wear-resistant protective layer 5, due to the use of polytetrafluoroethylene, a highly wear-resistant material, can effectively resist external physical wear and chemical corrosion, and ensure the long-term stable operation of the substrate. In terms of thermal conductivity, the thermal conductive layer 2 is made of aluminum substrate material, and is tightly bonded to the performance base layer 3 by hot pressing, forming an efficient heat conduction path. When heat is generated inside the equipment, the heat can be quickly transferred to the thermal conductive layer 2 through the performance base layer 3, effectively reducing the temperature of the substrate when working, and ensuring the stability and service life of the substrate. The performance base layer 3 adopts a polyimide composite material, which not only has good mechanical properties, but also can assist heat dissipation to a certain extent. The polygonal limiting groove 7 on the performance base layer 3 is arranged to match the polygonal limiting protrusion 6 on the thermal conductive layer 2, which not only enhances the structural strength of the substrate, but also improves the heat conduction efficiency by increasing the contact area.
[0029] Next, the conductive layer 4, as an important component of the substrate, adopts a copper foil composite material and is tightly bonded to the performance base layer 3 by hot pressing. This material has good conductivity and can ensure smooth transmission of current inside the device. At the same time, since the conductive layer 4 is arranged in the lower layer and is protected by the second wear-resistant protective layer 5, it can avoid external interference or damage during the operation of the device. Finally, the first heat dissipation pores 8 and the second heat dissipation pores 9 are staggered, which can maximize the heat dissipation area, improve the heat dissipation efficiency, and ensure that the heat dissipation performance of the substrate is always maintained in the best state.
[0030] The above describes the utility model and its implementation methods, which is not restrictive. What is shown in the full text is only one of the implementation methods of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it, without departing from the purpose of the invention of the utility model, they can design a structure and embodiment similar to the technical solution without creativity, which should belong to the protection scope of the utility model.
Claims
1. A substrate based on a high-pressure plastic packaging device, comprising a first wear-resistant protective layer (1), a heat-conducting layer (2), a performance base layer (3), a conductive layer (4) and a second wear-resistant protective layer (5), characterized in that: The performance base layer (3) is arranged as the innermost layer, the heat conductive layer (2) is arranged on the upper layer of the performance base layer (3), the first wear-resistant protective layer (1) is arranged on the upper layer of the heat conductive layer (2), the conductive layer (4) is arranged on the lower layer, the second wear-resistant protective layer (5) is arranged on the lower layer of the conductive layer (4), a polygonal limiting groove (7) is provided on the performance base layer (3), a polygonal limiting protrusion (6) is fixedly connected to the heat conductive layer (2), a second heat dissipation pore (9) is provided between the heat conductive layer (2) and the performance base layer (3), and a first heat dissipation pore (8) is provided between the performance base layer (3) and the conductive layer (4).
2. A substrate based on high pressure plastic packaging equipment according to claim 1, characterized in that: The material of the first wear-resistant protective layer (1) is polytetrafluoroethylene.
3. A substrate based on high pressure plastic packaging equipment according to claim 2, characterized in that: The material of the heat-conducting layer (2) is an aluminum substrate, and the first wear-resistant protective layer (1) and the heat-conducting layer (2) are bonded together by an adhesive.
4. A substrate based on high pressure plastic packaging equipment according to claim 3, characterized in that: The material of the performance base layer (3) is a polyimide composite material, and the heat-conducting layer (2) and the performance base layer (3) are bonded by hot pressing.
5. The substrate based on high pressure plastic packaging equipment according to claim 4, characterized in that: The conductive layer (4) is made of a copper foil composite material, and the performance base layer (3) and the conductive layer (4) are bonded by hot pressing.
6. A substrate based on high pressure plastic packaging equipment according to claim 5, characterized in that: The material of the second wear-resistant protective layer (5) is polytetrafluoroethylene, and the conductive layer (4) and the second wear-resistant protective layer (5) are bonded by an adhesive.
7. A substrate based on high pressure plastic packaging equipment according to claim 6, characterized in that: The polygonal limiting protrusions (6) are provided in a plurality of groups, the polygonal limiting protrusions (6) are arranged at the lower end of the heat conducting layer (2), the polygonal limiting grooves (7) are provided in a plurality of groups, the polygonal limiting protrusions (6) and the polygonal limiting grooves (7) are of the same shape and size, the first heat dissipation holes (8) are provided in a plurality of groups, the second heat dissipation holes (9) are provided in a plurality of groups, and the first heat dissipation holes (8) and the second heat dissipation holes (9) are arranged in a staggered manner.