Integrated circuit hanger liquid guide groove device

Abstract

The utility model relates to the technical field of integrated circuit electroplating hangers, in particular to a liquid guide groove device of an integrated circuit hanger, which comprises a hanger body, a hanger surface liquid guide groove is movably mounted at the center of the hanger body, and two inclined downward hanger surface liquid guide grooves are engraved on the hanger body. The hanging tool surface liquid guide grooves are symmetrically formed in the hanging tool body, and the middle of each hanging tool surface liquid guide groove is provided with a cover plate middle liquid guide groove which inclines downwards. According to the utility model, the liquid guide groove is additionally arranged on the hanger body and the fixed wafer cover plate, so that the maximum collection and utilization of liquid is realized, the waste of electroplating liquid is reduced, the descending track of the liquid is fixed due to the design of the liquid guide groove, the pollution of a machine table caused by dripping of the liquid medicine is effectively prevented, and the cost is reduced by optimizing the design of the liquid guide groove. Compared with the prior art, the electroplating liquid recycling device has the advantages that the recycling time of electroplating liquid medicine is shortened, the overall production efficiency is improved, and the electroplating liquid recycling device is suitable for various tank body type electroplating equipment in various wafer electroplating procedures and has good universality and adaptability.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit electroplating hangers, in particular to a liquid guide trough device for an integrated circuit hanger. Background Art

[0002] In the integrated circuit electroplating process, the design of the hanger liquid guide trough device is crucial, which is not only related to the recycling of the electroplating solution, but also involves production efficiency and cost control. The main purpose of the design of the electroplating machine hanger liquid guide trough is to be used for: after the electroplating process, the hanger will be transported by the crane to the next cleaning and drying area. During this operation, the electroplating liquid will drop due to the influence of gravity, and the liquid guide trough will facilitate better collection of the electroplating liquid to reduce loss.

[0003] Due to the influence of process time and cost, the hanger will be lifted up after the electroplating process is completed, stay for a period of time and then be transported to the next tank. During this process, the dripping electroplating liquid will be collected and recycled. However, due to the short distance between adjacent tanks and time control, the collection of the liquid is not so thorough. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a liquid guide groove device for an integrated circuit hanger.

[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an integrated circuit hanger liquid guide groove device, including a hanger body, a hanger surface liquid guide groove movably installed at the center of the hanger body, two hanger surface liquid guide grooves inclined downward are engraved on the hanger body, and the hanger surface liquid guide grooves are symmetrically arranged on the hanger body, and a cover plate middle liquid guide groove inclined downward is engraved in the middle of the hanger surface liquid guide groove, and two cover plate left and right liquid guide grooves inclined downward are also engraved on the hanger surface liquid guide groove, and the cover plate left and right liquid guide grooves are symmetrically arranged on both sides of the cover plate middle liquid guide groove with the cover plate middle liquid guide groove axis.

[0006] As a further description of the above technical solution:

[0007] The angle of the liquid guiding groove on the surface of the hanger is 150°.

[0008] As a further description of the above technical solution:

[0009] The depth of the liquid guide groove on the surface of the hanger is 2 mm.

[0010] As a further description of the above technical solution:

[0011] The angle between the liquid guiding groove in the middle of the cover plate and the liquid guiding grooves on the left and right sides of the cover plate is 120°.

[0012] As a further description of the above technical solution:

[0013] The depth of the liquid guide groove in the middle of the cover plate and the liquid guide grooves on the left and right sides of the cover plate is 1 mm.

[0014] As a further description of the above technical solution:

[0015] The upper part of the liquid guiding groove in the middle part of the cover plate is connected with the hanger body.

[0016] The utility model has the following beneficial effects:

[0017] In the utility model, by adding liquid guide grooves on the hanger body and the fixed wafer cover plate, the maximum liquid collection and utilization is achieved, and the waste of electroplating liquid is reduced. The design of the liquid guide groove makes the liquid descending trajectory fixed, and effectively prevents the machine contamination caused by the dripping of the liquid. By optimizing the design of the liquid guide groove, the recovery time of the electroplating liquid is shortened, and the overall production efficiency is improved. The utility model is suitable for various trough-type electroplating equipment for various electroplating wafer processes, and has good versatility and adaptability. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a structural schematic diagram of the integrated circuit hanger liquid guide trough device proposed by the utility model;

[0019] Figure 2 for Figure 1 Cross-sectional view at AA on the middle wafer fixing cover;

[0020] Figure 3 for Figure 1 Cross-sectional view of the middle hanger body at BB.

[0021] Legend:

[0022] 1. Hanger body; 11. Liquid guide groove on the hanger surface; 2. Wafer fixing cover; 21. Liquid guide groove in the middle of the cover; 22. Liquid guide grooves on the left and right of the cover. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Reference Figure 1-3The utility model provides an embodiment: an integrated circuit hanger liquid guide groove device, comprising a hanger body 1, a hanger surface liquid guide groove 11 is movably installed at the center of the hanger body 1, two hanger surface liquid guide grooves 11 inclined downward are engraved on the hanger body 1, and the hanger surface liquid guide grooves 11 are symmetrically arranged on the hanger body 1, and a cover plate middle liquid guide groove 21 inclined downward is engraved in the middle of the hanger surface liquid guide groove 11, and two cover plate left and right liquid guide grooves 22 inclined downward are also engraved on the hanger surface liquid guide groove 11, and the cover plate left and right liquid guide grooves 22 are symmetrically arranged on both sides of the cover plate middle liquid guide groove 21 with the cover plate middle liquid guide groove 21 axis, and the upper part of the cover plate middle liquid guide groove 21 is connected to the hanger body 1.

[0025] A downwardly inclined middle liquid guide groove 21 of the cover plate is engraved in the middle of the liquid guide groove 11 on the surface of the hanger, and two downwardly inclined left and right liquid guide grooves 22 of the cover plate are also engraved on the liquid guide groove 11 on the surface of the hanger. The left and right liquid guide grooves 22 of the cover plate are symmetrically arranged on both sides of the middle liquid guide groove 21 of the cover plate. This liquid guide groove design further improves the efficiency of liquid collection.

[0026] The upper part of the liquid guide groove 21 in the middle of the cover is connected to the hanger body 1, ensuring the stability and reliability of the overall structure. The angle of the liquid guide groove 11 on the hanger surface is 150° and the depth is 2mm. This design facilitates the rapid flow and collection of liquid and prevents liquid from being retained in the liquid guide groove.

[0027] The angle of the liquid guide groove 21 in the middle of the cover plate and the liquid guide grooves 22 on the left and right sides of the cover plate is 120° and the depth is 1 mm. Such a design helps to guide the liquid to flow smoothly to the collection area.

[0028] The device is suitable for various electroplating wafers. Through the design of the liquid guide groove, it not only improves the recovery efficiency of the electroplating solution, but also helps to reduce production costs and environmental pollution. It has important practical value and market prospects.

[0029] Working principle:

[0030] In the rear-end fully automatic electroplating area, the hanger body 1 is first taken from the automatic disassembly and assembly mechanism by the driving clamp, and after loading the wafer, it is sent to the electroplating process tank for electroplating operation. After the electroplating is completed, the hanger body 1 is transported to the next cleaning tank for cleaning. During this process, the hanger body 1 stays directly above the tank body for a period of time to allow the residual liquid on the hanger to slide freely into the tank body, and then go to the cleaning tank for cleaning operation.

[0031] After cleaning, the rack body 1 is transported to the drying tank for drying. In the front-end fully automatic loading and unloading area, the wafer is loaded into the rack body 1 using an automatic disassembly and assembly mechanism, and then transferred to the back-end fully automatic electroplating area by a crane for process operation.

[0032] After reaching the top of the tank body, the hanger body 1 will be placed vertically into the corresponding tank body. After the electroplating is completed, the hanger body 1 will rise from the process tank, and the chemical solution will drip down along the hanger under the influence of gravity. By adding liquid guide grooves on the hanger body 1 and the fixed wafer cover plate, the flow of the chemical solution can be effectively guided to reduce dripping and contamination.

[0033] By replacing the above device, the following benefits can be achieved compared with the existing technology:

[0034] Maximized liquid collection: Due to the increase of liquid guide grooves, the liquid collection and utilization is maximized, reducing the waste of electroplating liquid;

[0035] Prevent pollution: The design of the liquid guide groove makes the liquid's descending trajectory fixed, effectively preventing the machine from being polluted by the dripping of liquid medicine;

[0036] Strong adaptability: suitable for various tank-type electroplating equipment, with good versatility and adaptability;

[0037] Improve production efficiency: By optimizing the design of the liquid guide groove, the recovery time of the electroplating solution is shortened and the overall production efficiency is improved.

[0038] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated circuit hanger liquid guide trough device, comprising a hanger body (1), characterized in that: A hanger surface liquid guide groove (11) is movably mounted at the center of the hanger body (1), two hanger surface liquid guide grooves (11) inclined downward are engraved on the hanger body (1), the hanger surface liquid guide grooves (11) are symmetrically arranged on the hanger body (1), a cover plate middle liquid guide groove (21) inclined downward is engraved in the middle of the hanger surface liquid guide groove (11), two cover plate left and right liquid guide grooves (22) inclined downward are also engraved on the hanger surface liquid guide groove (11), the cover plate left and right liquid guide grooves (22) are symmetrically arranged on both sides of the cover plate middle liquid guide groove (21) with respect to the cover plate middle liquid guide groove (21) axis.

2. The integrated circuit hanger liquid guide trough device according to claim 1, characterized in that: The angle of the liquid-conducting groove (11) on the surface of the hanger is 150°.

3. The integrated circuit hanger liquid guide groove device according to claim 2, characterized in that: The depth of the liquid-conducting groove (11) on the surface of the hanger is 2 mm.

4. The integrated circuit hanger liquid guide groove device according to claim 3, characterized in that: The angle between the liquid guiding groove (21) in the middle of the cover plate and the liquid guiding grooves (22) on the left and right sides of the cover plate is 120°.

5. The integrated circuit hanger liquid guide groove device according to claim 4, characterized in that: The depth of the liquid guide groove (21) in the middle of the cover plate and the liquid guide grooves (22) on the left and right sides of the cover plate is 1 mm.

6. The integrated circuit hanger liquid guide groove device according to claim 5, characterized in that: The upper portion of the liquid guide groove (21) in the middle of the cover plate is connected to the hanger body (1).

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