Semiconductor refrigeration device applied to open space

Abstract

The utility model provides a semiconductor refrigeration device applied to an open space, which comprises a shell, and further comprises a semiconductor refrigeration unit arranged in an inner cavity of the shell; the circulating water cooling unit is arranged on the outer side of the semiconductor refrigeration unit and used for absorbing heat of the high-temperature side of the semiconductor refrigeration unit, and the circulating water cooling unit forms a cold air channel in the inner cavity of the shell; the cold air conveying unit is arranged at the output end of the cold air duct, the number of the semiconductor refrigeration units is multiple, and the multiple semiconductor refrigeration units are distributed in an S shape along an inner cavity of the cold air duct. The semiconductor refrigeration piece is used as a refrigeration element, rapid high-integration semiconductor refrigeration can be achieved, and the semiconductor refrigeration device has the advantages of being high in integration, low in cost, easy to maintain and high in energy utilization rate.

Description

Technical Field

[0001] The utility model relates to the technical field of refrigeration, in particular to a semiconductor refrigeration device applied to an open space. Background Art

[0002] Semiconductor refrigeration chips are made of N-type and P-type semiconductor materials. The Peltier effect of semiconductor refrigeration chips is used to generate a temperature difference between the hot and cold ends to achieve refrigeration. Semiconductor refrigeration chips have the characteristics of fast response and strong adaptability. To achieve local refrigeration in open spaces, multiple factors usually need to be considered, including refrigeration efficiency, energy consumption, refrigeration area, and ease of operation. There are currently two main solutions: 1. Choose a mobile air conditioner or refrigeration unit, which has high flexibility and a large refrigeration area, but its investment cost is high, and the dispersed air duct will cause energy waste; 2. Use wearable or patch refrigeration equipment, but its refrigeration area is small, and it will cause additional weight to personnel, and there are safety hazards due to its direct connection to the human body. Therefore, it is necessary to design a highly integrated semiconductor refrigeration device that can be adapted to open production sites and can quickly cool down. Utility Model Content

[0003] The utility model provides a highly integrated semiconductor refrigeration device which takes regional refrigeration of open spaces as a main application scenario and uses semiconductor refrigeration sheets as refrigeration elements and can perform rapid refrigeration.

[0004] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0005] A semiconductor refrigeration device for use in an open space, comprising a housing, and further comprising:

[0006] A semiconductor refrigeration unit, wherein the semiconductor refrigeration unit is arranged in the inner cavity of the shell;

[0007] A circulating water cooling unit, which is arranged outside the semiconductor refrigeration unit and is used to absorb heat from the high-temperature side of the semiconductor refrigeration unit, and the circulating water cooling unit forms a cold air duct in the inner cavity of the shell; and

[0008] A cold air delivery unit is arranged at the output end of the cold air duct.

[0009] Preferably, there are multiple semiconductor refrigeration units, and the multiple semiconductor refrigeration units are distributed in an S shape along the inner cavity of the cold air duct.

[0010] Preferably, the semiconductor refrigeration unit includes a semiconductor refrigeration plate, pins arranged on the semiconductor refrigeration plate for connecting to the positive and negative poles of the power supply, and a cooling block arranged on the low-temperature side of the semiconductor refrigeration plate, and the cooling block is provided with through grooves for forming dense teeth on the cooling block body.

[0011] Preferably, both the low-temperature end and the high-temperature end of the semiconductor refrigeration plate are provided with a thermally conductive silicone grease layer.

[0012] Preferably, the circulating water cooling unit includes a heat sink block arranged relatively to the outside of the semiconductor refrigeration plate, a support block arranged at the opposite end of the semiconductor refrigeration plate and engaged with the heat sink block, a partition plate arranged on the opposite long side of the heat sink block to form the cold air duct with the heat sink block, and a water inlet pipe and a water outlet pipe for connecting to the internal guide groove of the heat sink block.

[0013] Preferably, water pipe joints are provided at the connection places between the water inlet pipe, the water outlet pipe and the heat sink block.

[0014] Preferably, the long sides of the heat dissipation block are provided with mounting slots for engaging with the support block and the partition piece.

[0015] Preferably, the cold air delivery unit includes a turbo fan disposed at the output end of the cold air duct.

[0016] Preferably, the cold air delivery unit further includes a dustproof net arranged on a side wall of one side of the shell and corresponding to the position of the cold air duct, and a protective net arranged on the side wall of the other side of the shell and located at the output end of the turbofan.

[0017] Preferably, the semiconductor refrigeration device applied to an open space further comprises a DC power supply unit for supplying power to the semiconductor refrigeration unit and the cold air delivery unit, and a protective shell is provided on the outside of the DC power supply unit.

[0018] It can be seen from the above technical solutions that the utility model has the following beneficial effects:

[0019] 1. Highly integrated: The volume of the whole device is much smaller than that of mobile air-conditioning equipment, and its maximum length does not exceed 0.3m. The quick-plug circulating water cooling unit and DC power supply unit can be flexibly moved;

[0020] 2. Low cost and easy maintenance: The whole device reduces the restrictions on material selection as much as possible, and the selected components are easy to obtain, replace and update;

[0021] 3. High efficiency of energy utilization: The unique combination of cooling block and cold air duct greatly improves the efficiency of cold air utilization, and the directional output of cold air by the turbo fan improves the control effect of cooling the local area. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0023] Figure 2 for Figure 1 A schematic diagram of the structure from another side perspective;

[0024] Figure 3 It is a schematic diagram of the structure of the heat sink and its components;

[0025] Figure 4 is a cutaway view of a heat sink;

[0026] Figure 5 It is a structural schematic diagram of the connection between the DC power supply unit and the protective shell.

[0027] In the figure: 10, outer shell; 210, semiconductor cooling sheet; 220, pin; 230, cooling block; 231, through groove; 310, heat sink; 311, guide groove; 312, mounting slot; 320, support block; 330, partition plate; 340, water inlet pipe; 350, water outlet pipe; 360, water pipe joint; 410, turbo fan; 420, dust net; 430, protective net; 50, DC power supply unit; 60, protective shell. DETAILED DESCRIPTION

[0028] A preferred embodiment of the present invention is described in detail below in conjunction with the accompanying drawings.

[0029] To achieve the above purpose, the embodiment of the present invention adopts the following technical solution: Figure 1 , Figure 2 A semiconductor refrigeration device for open space includes a shell 10, a semiconductor refrigeration unit, a circulating water cooling unit and a cold air delivery unit, wherein the semiconductor refrigeration unit is arranged in the inner cavity of the shell 10. It should be noted that the semiconductor refrigeration unit will form a low-temperature side and a high-temperature side when working, and the cold air in the inner cavity of the shell is generated by the low-temperature side of the semiconductor refrigeration unit, and the circulating water cooling unit is arranged on the outside of the semiconductor refrigeration unit to absorb the heat on the high-temperature side of the semiconductor refrigeration unit. At the same time, the circulating water cooling unit forms a cold air duct in the inner cavity of the shell 10, and the cold air delivery unit is arranged at the output end of the cold air duct. The cold air formed on the low-temperature side of the semiconductor refrigeration unit can flow and be transported along the aforementioned cold air duct. In this way, when in use, the refrigeration function of the semiconductor refrigeration is utilized to achieve local low temperature on the low-temperature side, the circulating water cooling unit takes away the heat on the high-temperature side of the semiconductor refrigeration unit, and the cold air delivery unit efficiently diffuses and outputs the low temperature, thereby finally achieving local rapid refrigeration of the open space.

[0030] As a preferred technical solution of this embodiment, there are multiple semiconductor refrigeration units, and the multiple semiconductor refrigeration units are distributed in an S shape along the inner cavity of the cold air duct. Specifically, the multiple semiconductor refrigeration units are staggered on opposite sides along the two inner parts of the circulating water cooling unit to form an S shape. In this way, a uniform low-temperature air mass can be quickly formed in the cold air duct; in addition, the staggered arrangement of the semiconductor refrigeration units can also improve the transmission efficiency of the cold air delivery unit to the cold air.

[0031] Reference Figure 3 Furthermore, the semiconductor refrigeration unit includes a semiconductor refrigeration sheet 210, a pin 220 and a cooling block 230. The pin 220 is arranged on the semiconductor refrigeration sheet for connecting to the positive and negative poles of the power supply. It should be noted that the semiconductor refrigeration sheet has strict polarity requirements. Reverse connection of the positive and negative poles will cause damage. The cooling block 230 is arranged on the low-temperature side of the semiconductor refrigeration sheet. At the same time, a through groove 231 for forming dense teeth on the cooling block body is opened on the cooling block. When in use, the semiconductor refrigeration sheet forms a low temperature on the low-temperature side, which is transmitted to the cold air duct through the cooling block.

[0032] Reference Figure 3 As a preferred technical solution of this embodiment, the circulating water cooling unit includes a heat sink 310, a support block 320, a partition plate 330, a water inlet pipe 340 and a water outlet pipe 350. The heat sink 310 is distributed on the outside of the semiconductor refrigeration plate 210 in a relatively arranged form, and the heat sink is arranged on the high-temperature side of the semiconductor refrigeration plate to absorb the heat generated by the high-temperature side. The support block 320 is arranged at the opposite end of the semiconductor refrigeration plate, and the support block is engaged with the heat sink. The partition plate 330 is arranged on the relatively long side of the heat sink. The purpose of the partition plate and the support block is to separate the low-temperature area and the high-temperature area. The two are installed between the low-temperature side and the high-temperature side of the semiconductor refrigeration plate to separate the two areas, play a role in heat preservation for the low-temperature area, improve the efficiency of refrigeration, and avoid energy waste; at the same time, the partition plate, the support block and the heat sink form the aforementioned cold air duct;

[0033] Reference Figure 3 , Figure 4 It should be noted that a guide groove 311 for the flow of cooling liquid is provided inside the heat sink 310, and an inlet and an outlet for inputting and outputting cooling liquid into and out of the guide groove are provided on the side of the heat sink. Since the heat sinks in this embodiment are symmetrically distributed along the two sides of the semiconductor refrigeration unit, in order to achieve the connection of the guide grooves between the heat sinks on both sides, the circulating water cooling unit also includes an inlet pipe 340 and an outlet pipe 350 for connecting the guide groove 311 inside the heat sink. The inlet pipe is connected to the inlet of the guide groove, and the outlet pipe is connected to the outlet of the guide groove. In this way, cooling water enters through the inlet pipe, flows in the heat sink, and finally flows out through the outlet pipe, taking away the heat generated on the high-temperature side of the semiconductor refrigeration plate.

[0034] Furthermore, the low-temperature end and the high-temperature end of the semiconductor refrigeration plate 210 are both provided with a thermal grease layer. The low-temperature side of the semiconductor refrigeration plate is connected to the cooling block through the thermal grease to fully dissipate the cold air, and the high-temperature side is connected to the heat dissipation block through the thermal grease to cool the high-temperature side.

[0035] Furthermore, a water pipe joint 360 is provided at the connection between the water inlet pipe 340 and the water outlet pipe 350 and the heat sink 310. The presence of the water pipe joint can facilitate the rapid disassembly and assembly of the water inlet pipe and the water outlet pipe and the heat sink, so as to improve the flexibility of the circulating water cooling unit.

[0036] As a preferred technical solution of this embodiment, in order to achieve effective connection between the support block and the partition piece and the heat sink block, the long side of the heat sink block 310 is provided with a mounting slot 312 for engaging with the support block 320 and the partition piece 330, that is, the long side of the heat sink block is provided with a mounting slot, and correspondingly, the support block and the partition piece are provided with a card block corresponding to the mounting slot, so that during installation, a stable connection between the support block and the partition piece can be achieved.

[0037] As a preferred technical solution of this embodiment, the cold air delivery unit includes a turbofan 410 arranged at the output end of the cold air duct. Furthermore, the cold air delivery unit also includes a dustproof net 420 arranged on the side wall of one side of the outer shell 10 and a protective net 430 arranged on the side wall of the other side of the outer shell 10. The dustproof net corresponds to the air inlet position of the cold air duct. The protective net 430 is also located at the output end of the turbofan. When in use, the outside air enters the inner cavity of the outer shell through the dustproof net, and is converted into low-temperature air through the cooling effect of the semi-closed cavity. Finally, the cold air is directed to the area that needs cooling through the turbofan, thereby realizing local cooling and cooling in an open area.

[0038] Reference Figure 5 As a preferred technical solution of this embodiment, the semiconductor refrigeration device applied to open space also includes a DC power supply unit 50 for supplying power to the semiconductor refrigeration unit and the cold air delivery unit. At the same time, a protective shell 60 is provided on the outside of the DC power supply unit. When in use, the DC power supply unit is electrically connected to the semiconductor refrigeration plate and the turbo fan to power both of them. It should be noted that the DC power supply unit can be connected to the semiconductor refrigeration plate and the turbo fan with a quick plug connector, so that a quick and flexible connection can be achieved.

[0039] It should be emphasized that due to the fast response characteristics of semiconductor refrigerators, a temperature difference of more than 70°C can be formed between the low-temperature side and the high-temperature side within tens of seconds. In order to protect the semiconductor refrigerator, the circulating water cooling system must be started first, and then the DC power supply unit of the semiconductor refrigerator is connected. Therefore, the order of circulating cooling water conduction and semiconductor refrigerator operation cannot be reversed during the startup process; similarly, when shutting down the entire device, the refrigerator power supply must be disconnected first, and then the circulating cooling water is turned off. This process is the opposite of the startup process.

[0040] When the utility model is in use, after the circulating water cooling unit starts working, the DC power supply unit is connected to provide the required DC power to the semiconductor refrigeration plate 210. After the semiconductor refrigeration plate is connected, it starts working quickly, and its low-temperature side diffuses cold air through the cold conduction block 230. The cold air is located in a semi-enclosed cavity composed of the outer shell 10, the support block 320, and the partition plate 330, and a low-temperature area is quickly formed. Finally, the turbo fan 410 is turned on. The power supply of the turbo fan is also provided by the DC power supply unit. The outside air enters the cavity of the outer shell through the dustproof net 420, and is converted into low-temperature cold air through the cooling effect of the semi-enclosed cavity. Finally, the turbo fan guides the cold air to the area that needs to be cooled, thereby realizing local cooling and cooling in an open area.

[0041] The semiconductor refrigeration device of this embodiment has the following advantages:

[0042] 1. Highly integrated: The volume of the whole device is much smaller than that of mobile air-conditioning equipment, and its maximum length does not exceed 0.3m. The quick-plug circulating water cooling unit and DC power supply unit can be flexibly moved;

[0043] 2. Low cost and easy maintenance: The whole device reduces the restrictions on material selection as much as possible, and the selected components are easy to obtain, replace and update;

[0044] 3. High efficiency of energy utilization: The unique combination of cooling block and cold air duct greatly improves the efficiency of cold air utilization, and the directional output of cold air by the turbo fan improves the control effect of cooling the local area.

[0045] The above-described embodiments are merely descriptions of preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Without departing from the design spirit of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary technicians in this field should all fall within the protection scope determined by the claims of the present invention.

Claims

1. A semiconductor refrigeration device for use in an open space, comprising a housing (10), characterized in that: Also includes: A semiconductor refrigeration unit, wherein the semiconductor refrigeration unit is arranged in the inner cavity of the housing (10); A circulating water cooling unit, the circulating water cooling unit being arranged outside the semiconductor refrigeration unit and being used to absorb heat from the high temperature side of the semiconductor refrigeration unit, the circulating water cooling unit forming a cold air duct in the inner cavity of the housing (10); and A cold air delivery unit is arranged at the output end of the cold air duct.

2. The semiconductor refrigeration device for use in an open space according to claim 1, characterized in that: There are multiple semiconductor refrigeration units, and the multiple semiconductor refrigeration units are distributed in an S shape along the inner cavity of the cold air duct.

3. The semiconductor refrigeration device for use in an open space according to claim 2, characterized in that: The semiconductor refrigeration unit comprises a semiconductor refrigeration plate (210), pins (220) arranged on the semiconductor refrigeration plate for connecting to the positive and negative electrodes of a power source, and a cooling block (230) arranged on the low-temperature side of the semiconductor refrigeration plate, wherein the cooling block is provided with through grooves (231) for forming dense teeth on the cooling block body.

4. The semiconductor refrigeration device for use in an open space according to claim 3, characterized in that: The low-temperature end and the high-temperature end of the semiconductor refrigeration sheet (210) are both provided with a thermally conductive silicone grease layer.

5. The semiconductor refrigeration device for use in an open space according to claim 4, characterized in that: The circulating water cooling unit comprises a heat sink (310) arranged relatively outside the semiconductor refrigeration plate (210), a support block (320) arranged at the opposite end of the semiconductor refrigeration plate and engaged with the heat sink block, a partition plate (330) arranged at the opposite long side of the heat sink block to form the cold air duct with the heat sink block, and a water inlet pipe (340) and a water outlet pipe (350) for connecting to the guide groove (311) inside the heat sink block.

6. The semiconductor refrigeration device for use in an open space according to claim 5, characterized in that: A water pipe joint (360) is provided at the connection between the water inlet pipe (340) and the water outlet pipe (350) and the heat sink block (310).

7. The semiconductor refrigeration device for use in an open space according to claim 5, characterized in that: The long side of the heat dissipation block (310) is provided with a mounting slot (312) for engaging with the support block (320) and the partition piece (330).

8. The semiconductor refrigeration device for use in an open space according to claim 1, characterized in that: The cold air delivery unit comprises a turbo fan (410) arranged at the output end of the cold air duct.

9. The semiconductor refrigeration device for use in an open space according to claim 8, characterized in that: The cold air delivery unit further comprises a dustproof net (420) arranged on a side wall of one side of the housing (10) and corresponding to the position of the cold air duct, and a protective net (430) arranged on a side wall of the other side of the housing (10) and located at the output end of the turbofan.

10. The semiconductor refrigeration device for use in an open space according to claim 1, characterized in that: The semiconductor refrigeration device for use in an open space further comprises a DC power supply unit (50) for supplying power to the semiconductor refrigeration unit and the cold air delivery unit, and a protective shell (60) is provided outside the DC power supply unit.

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