Integrated circuit batch test equipment

Abstract

The utility model discloses integrated circuit batch test equipment, which belongs to the technical field of integrated circuits, aims at solving the problems that the integrated circuit is difficult to take out, an integrated circuit chip is easy to damage and the equipment is inconvenient to move, and comprises an equipment platform, supporting legs, a moving mechanism, a test equipment main body, a placing plate and a taking-out mechanism, the supporting legs are symmetrically and fixedly installed on the bottom face of the equipment platform, the moving mechanism is arranged below the supporting legs, the testing equipment body is installed above the equipment platform, the placing plate is arranged in the testing equipment body, placing grooves are evenly formed in the upper portion of the placing plate, and the taking-out mechanism is arranged in the placing plate. According to the utility model, through the arranged taking-out mechanism, the integrated circuit chip which is placed in the test groove and is subjected to a test can be ejected out, so that a worker can take away the chip conveniently, the damage to the chip is reduced, the integrity of the chip is improved, and meanwhile, the working efficiency can also be improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of integrated circuits, and in particular relates to integrated circuit batch testing equipment. Background Art

[0002] An integrated circuit board is a carrier for carrying integrated circuits, but when we say integrated circuit board, we often also mean integrated circuit. Integrated circuit boards are mainly made of silicone, so they are generally green. They are a semiconductor manufacturing process that manufactures many transistors, resistors, capacitors and other components on a smaller single crystal silicon wafer, and combines the components into a complete electronic circuit using multi-layer wiring or tunnel wiring methods.

[0003] The prior art discloses an integrated circuit chip batch testing device with patent announcement number CN216310197U. When the above patent is in use, the staff can take out the integrated circuit chips in the first batch test slot and put the integrated circuit chips to be tested again, and wait for the integrated circuit chips on the second batch test slot to be inspected, and then move back and forth to inspect the integrated circuit chips in batches, and can take and place the integrated circuit chips while inspecting, which saves the time of placing materials and improves the testing speed. However, there are still the following deficiencies in actual use: from a practical point of view, after the inspection of the equipment is completed, the staff needs to take out the integrated circuit chips placed in the test slot one by one. The test slot has a certain depth, and it is difficult to take out, and it is easy to cause damage to the integrated circuit chips, and the working efficiency is low. Moreover, the equipment is not easy to move, and cannot be easily moved to the location required by the staff, which reduces the scope of application and practicality of the equipment.

[0004] Therefore, there is a need for an integrated circuit batch testing device to solve the problems in the prior art that the integrated circuit chips are difficult to remove, are easily damaged, and are inconvenient to move. Utility Model Content

[0005] The purpose of the utility model is to provide an integrated circuit batch testing device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an integrated circuit batch testing device, comprising a device platform, support legs, a moving mechanism, a test device body, a placement plate and a removal mechanism, wherein the support legs are symmetrically fixedly installed on the bottom surface of the device platform, the moving mechanism is arranged below the support legs, the test device body is installed above the device platform, the placement plate is arranged inside the test device body, and placement grooves are evenly opened above the placement plate, and the removal mechanism is arranged inside the placement plate.

[0007] The taking-out mechanism consists of an ejection disk, a connecting column, a first transverse plate, a second transverse plate, a vertical rod, a mounting disk, a torsion spring, a limiting column and a fixed block. The ejection disk is arranged inside the placement groove, the connecting column is fixedly connected to the bottom of the ejection disk, the first transverse plate is fixedly connected to the bottom of the connecting column, the second transverse plate is symmetrically fixedly connected to both ends of the first transverse plate, the vertical rod is fixedly connected to the upper middle part of the second transverse plate, and the mounting disk is fixedly connected to the top surface of the vertical rod.

[0008] It should be noted in the scheme that the vertical rod extends out of the top surface of the placement plate, the torsion spring is fixedly connected between the mounting plate and the top surface of the placement plate, and the torsion spring is sleeved on the outside of the vertical rod, and the limit column is fixedly connected to one side of the mounting plate.

[0009] It is further worth noting that the fixing block is fixedly connected to the top of the placement plate, and the fixing block is arranged on the right side of the vertical rod, and the top surface of the fixing block is provided with an arc groove adapted to the limiting column.

[0010] It should be further explained that the moving mechanism is composed of a mounting plate, wheels, a connecting plate, a threaded rod, a base plate, a sliding rod and a suction cup. The mounting plate is fixedly connected to the bottom surface of the supporting leg, the connecting plate is fixedly connected to one side of the mounting plate, the threaded rod is threadedly connected to the inside of the connecting plate, and the base plate is rotatably connected to the bottom end of the threaded rod.

[0011] As a preferred implementation, the slide rod is symmetrically slidably connected to two sides of the connecting plate, and the bottom surface of the slide rod is fixedly connected to the bottom plate.

[0012] As a preferred embodiment, the wheels are symmetrically mounted below the mounting plate, and the suction cups are symmetrically fixedly connected to the bottom surface of the base plate.

[0013] Compared with the prior art, the integrated circuit batch testing equipment provided by the utility model has at least the following beneficial effects:

[0014] (1) The removal mechanism can be used to eject the integrated circuit chip placed in the test slot after the test is completed, making it easier for the staff to take out the chip, reducing damage to the chip, improving the integrity of the chip, and also improving work efficiency.

[0015] (2) Through the mobile mechanism, the device can not only be moved to the required location through the wheels, thereby improving the convenience of using the device, but can also be fixed to the ground through the suction cup to ensure the stability of the device during testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0017] Figure 2It is a left view structural schematic diagram of the utility model;

[0018] Figure 3 This is a schematic diagram of the internal structure of the placement plate of the utility model;

[0019] Figure 4 It is a schematic diagram of the structure of the taking-out mechanism of the utility model.

[0020] In the figure: 1. Equipment platform; 2. Support legs; 3. Moving mechanism; 4. Test equipment body; 5. Placement plate; 6. Removal mechanism; 301. Mounting plate; 302. Wheels; 303. Connecting plate; 304. Threaded rod; 305. Bottom plate; 306. Sliding rod; 307. Suction cup; 601. Ejection plate; 602. Connecting column; 603. First horizontal plate; 604. Second horizontal plate; 605. Vertical rod; 606. Mounting plate; 607. Torsion spring; 608. Limiting column; 609. Fixing block. DETAILED DESCRIPTION

[0021] The present invention will be further described below in conjunction with the embodiments.

[0022] See also Figure 1-4 The utility model provides an integrated circuit batch testing device, including a device platform 1, support legs 2, a moving mechanism 3, a test device body 4, a placement plate 5 and a taking-out mechanism 6. The support legs 2 are symmetrically fixedly installed on the bottom surface of the device platform 1, the moving mechanism 3 is arranged below the support legs 2, the test device body 4 is installed above the device platform 1, the placement plate 5 is arranged inside the test device body 4, and placement grooves are evenly opened above the placement plate 5, and the taking-out mechanism 6 is arranged inside the placement plate 5.

[0023] The taking-out mechanism 6 is composed of an ejection disk 601, a connecting column 602, a first transverse plate 603, a second transverse plate 604, a vertical rod 605, a mounting disk 606, a torsion spring 607, a limiting column 608 and a fixing block 609. The ejection disk 601 is arranged inside the placement groove, the connecting column 602 is fixedly connected to the bottom of the ejection disk 601, the first transverse plate 603 is fixedly connected to the bottom of the connecting column 602, the second transverse plate 604 is symmetrically fixedly connected to both ends of the first transverse plate 603, the vertical rod 605 is fixedly connected to the upper middle part of the second transverse plate 604, and the mounting disk 606 is fixedly connected to the top surface of the vertical rod 605.

[0024] Further as Figure 1 , Figure 3 and Figure 4 As shown, it is worth to explain in detail that the vertical rod 605 extends out of the top surface of the placement plate 5, the torsion spring 607 is fixedly connected between the mounting plate 606 and the top surface of the placement plate 5, and the torsion spring 607 is sleeved on the outside of the vertical rod 605, and the limiting column 608 is fixedly connected to one side of the mounting plate 606;

[0025] Through the elastic action of the torsion spring 607, after the limit of the limit column 608 is released, the installation plate 606 is driven to reset, so that the second cross plate 604 is in its original state, and the ejection plate 601 no longer protrudes from the inside of the placement slot, which is convenient for placing the chip again and testing the chip.

[0026] Further as Figure 1 , Figure 3 and Figure 4 As shown, it is worth to explain in detail that the fixing block 609 is fixedly connected to the top of the placement plate 5, and the fixing block 609 is arranged on the right side of the vertical rod 605, and the top surface of the fixing block 609 is provided with an arc groove adapted to the limiting column 608;

[0027] By placing the limiting column 608 into the arc groove, the height of the mounting plate 606 can be fixed, and at the same time, the ejection plate 601 is ensured to lift the chip, which is convenient for the staff to take the chips away in turn, thereby improving the practicality of the device.

[0028] According to the above working process, it can be known that: through the set removal mechanism 6, the integrated circuit chip placed in the test slot after the test is completed can be ejected, which is convenient for the staff to take away the chip, reduce damage to the chip, improve the integrity of the chip, and also improve work efficiency.

[0029] Further as Figure 1 and Figure 2 As shown, it is worth specifically explaining that the moving mechanism 3 is composed of a mounting plate 301, wheels 302, a connecting plate 303, a threaded rod 304, a bottom plate 305, a sliding rod 306 and a suction cup 307. The mounting plate 301 is fixedly connected to the bottom surface of the supporting leg 2, the connecting plate 303 is fixedly connected to one side of the mounting plate 301, the threaded rod 304 is threadedly connected to the inside of the connecting plate 303, the bottom plate 305 is rotatably connected to the bottom end of the threaded rod 304, the sliding rod 306 is symmetrically slidably connected to both sides of the connecting plate 303, and the bottom surface of the sliding rod 306 is fixedly connected to the bottom plate 305;

[0030] The sliding rod 306 is provided to prevent the bottom plate 305 from rotating, thereby ensuring the stability of the bottom plate 305 moving downward.

[0031] Further as Figure 1 and Figure 2 As shown, it is worth to explain in detail that the wheels 302 are symmetrically mounted below the mounting plate 301, and the suction cups 307 are symmetrically fixedly connected to the bottom surface of the bottom plate 305;

[0032] The device can be moved freely by the wheels 302 and can be fixed by the suction cup 307 to avoid movement during the test and affect the test use.

[0033] This solution has the following working process: when in use, the device is moved to the desired location through the wheels 302 at the bottom, and then the threaded rods 304 on both sides are rotated to drive the bottom plate 305 to move downward under the restriction of the slide rod 306 until the suction cup 307 at the bottom is close to the ground and sucked tightly to the ground. At this time, the device is fixed to the ground by the suction cup 307 to ensure that the device does not move at will; then the integrated circuit chip is placed in the placement groove on the placement plate 5, and the placement plate 5 is driven to move to the test device body by the rollers under the placement plate 5 4, the integrated circuit chip is tested. After the test is completed, the placement plate 5 is driven by the roller to move out of the interior of the test equipment body 4, and then the installation plate 606 is pulled upward, and the limiting column 608 is rotated at the same time until the limiting column 608 is stuck in the arc-shaped groove above the fixing block 609. At this time, the second horizontal plate 604 is driven upward by the vertical rod 605, and the connecting column 602 is driven upward by the first horizontal plate 603. The chip in the placement groove is lifted up by the ejection plate 601, which is convenient for the staff to take away the chip and improve the work efficiency.

[0034] In summary: through the set removal mechanism 6, the integrated circuit chip placed in the test slot after the test is completed can be ejected, which is convenient for the staff to take out the chip, reduce damage to the chip, improve the integrity of the chip, and at the same time improve work efficiency; through the set moving mechanism 3, not only can the device be moved to the required location through the wheels 302 to improve the convenience of using the device, but it can also be fixed to the ground through the suction cup 307 to ensure the stability of the device during testing.

Claims

1. An integrated circuit batch testing device, comprising a device platform (1), a support leg (2), a moving mechanism (3), a testing device body (4), a placement plate (5) and a removal mechanism (6), characterized in that: The support legs (2) are symmetrically fixedly mounted on the bottom surface of the equipment platform (1); the moving mechanism (3) is arranged below the support legs (2); the test equipment body (4) is installed above the equipment platform (1); the placement plate (5) is arranged inside the test equipment body (4); placement grooves are evenly arranged above the placement plate (5); and the removal mechanism (6) is arranged inside the placement plate (5); The taking-out mechanism (6) is composed of an ejection disk (601), a connecting column (602), a first transverse plate (603), a second transverse plate (604), a vertical rod (605), a mounting disk (606), a torsion spring (607), a limiting column (608) and a fixing block (609); the ejection disk (601) is arranged inside the placement groove; the connecting column (602) is fixedly connected to the bottom of the ejection disk (601); the first transverse plate (603) is fixedly connected to the bottom of the connecting column (602); the second transverse plate (604) is symmetrically fixedly connected to both ends of the first transverse plate (603); the vertical rod (605) is fixedly connected to the upper middle part of the second transverse plate (604); and the mounting disk (606) is fixedly connected to the top surface of the vertical rod (605).

2. The integrated circuit batch testing device according to claim 1, characterized in that: The vertical rod (605) extends out of the top surface of the placement plate (5), the torsion spring (607) is fixedly connected between the mounting plate (606) and the top surface of the placement plate (5), and the torsion spring (607) is sleeved on the outside of the vertical rod (605), and the limiting column (608) is fixedly connected to one side of the mounting plate (606).

3. The integrated circuit batch testing device according to claim 1, characterized in that: The fixing block (609) is fixedly connected to the top of the placement plate (5), and the fixing block (609) is arranged on the right side of the vertical rod (605). The top surface of the fixing block (609) is provided with an arc groove that matches the limiting column (608).

4. The integrated circuit batch testing device according to claim 1, characterized in that: The mobile mechanism (3) is composed of a mounting plate (301), wheels (302), a connecting plate (303), a threaded rod (304), a bottom plate (305), a sliding rod (306) and a suction cup (307); the mounting plate (301) is fixedly connected to the bottom surface of the supporting leg (2); the connecting plate (303) is fixedly connected to one side of the mounting plate (301); the threaded rod (304) is threadedly connected to the inside of the connecting plate (303); and the bottom plate (305) is rotatably connected to the bottom end of the threaded rod (304).

5. The integrated circuit batch testing device according to claim 4, characterized in that: The sliding rod (306) is symmetrically slidably connected to the two sides of the connecting plate (303), and the bottom surface of the sliding rod (306) is fixedly connected to the bottom plate (305).

6. The integrated circuit batch testing device according to claim 4, characterized in that: The wheels (302) are symmetrically mounted below the mounting plate (301), and the suction cups (307) are symmetrically fixedly connected to the bottom surface of the bottom plate (305).

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