Chip resistor easy to package

Abstract

The utility model discloses a chip resistor easy to package, which comprises a ceramic substrate, the front end of the ceramic substrate is fixedly connected with an external weld leg, the external weld leg is welded with a circuit board, and the upper end of the ceramic substrate is provided with a surface electrode; the first-layer cover glass is arranged inside the bottom end of the second-layer cover glass, and the second-layer cover glass is fixedly connected to the bottom end of the ceramic substrate. The side end of the ceramic substrate is fixedly connected with the external welding pin, and the external welding pin is of a tin structure, so that welding spots are low, and the ceramic substrate is easy to weld with a circuit board.

Description

Technical Field

[0001] The utility model relates to a technical field, in particular to a chip resistor that is easy to package. Background Art

[0002] Chip components have the advantages of small size, light weight, high installation density, strong shock resistance, strong anti-interference ability, good high-frequency characteristics, etc. They are widely used in computers, mobile phones, electronic dictionaries, medical electronic products, camcorders, electronic electricity meters and VCD players.

[0003] General chip resistors are welded on circuit boards to achieve various functions of chip resistors, but this type of chip resistor is not convenient to be welded with circuit board packaging. A Chinese patent discloses a chip resistor with application number "CN202210778486.6", including a resistor substrate and a resistor element. Based on the use direction, a resistor element is arranged in the middle of the upper end of the resistor substrate, and a first front electrode is arranged on the resistor substrate on the left and right sides of the resistor element, and the two ends of the resistor element are respectively overlapped on the ends of the first front electrodes on both sides; a second front electrode is arranged on the upper end of the first front electrode, and the inner end of the second front electrode is overlapped on the end of the resistor element; by staggeredly overlapping the first front electrode, the second front electrode and the third front electrode with the resistor element, the first protective layer and the second protective layer, the expansion of the end of the first protective layer is limited by the third front electrode, thereby reducing the amount of cumulative expansion, thereby reducing the risk of the nickel plating or tin plating being pushed open. However, this type of chip resistor is not conducive to packaging with a circuit board. Utility Model Content

[0004] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art and provide a chip resistor that is easy to package. By fixing and connecting an external soldering foot to the side end of a ceramic substrate, the external soldering foot is a tin structure, the soldering point is low, and it is easy to be soldered to a circuit board.

[0005] The utility model also provides a patch resistor with the above-mentioned easy-to-package structure, including: a ceramic substrate, an external electrode, the front end of the ceramic substrate is fixedly connected with an external soldering foot, the external soldering foot is soldered to a circuit board, and the upper end of the ceramic substrate is provided with a surface electrode; a second layer of cover glass, a layer of cover glass is provided inside the bottom end of the second layer of cover glass, and the second layer of cover glass is fixedly connected to the bottom end of the ceramic substrate. By fixing the external soldering foot on the side end of the ceramic substrate, the external soldering foot is a tin structure, the solder joint is low, and it is easy to be soldered to the circuit board.

[0006] According to the easily packaged chip resistor of the utility model, the external electrode is fixedly connected to the side end of the ceramic substrate, thereby improving the effect of the external electrode.

[0007] According to the easily packaged chip resistor of the utility model, the bottom end of the external electrode is connected to the middle electrode, thereby improving the effect of the middle electrode.

[0008] According to the easily packaged chip resistor of the utility model, the bottom end of the middle electrode is connected to the terminal electrode, thereby improving the use effect of the terminal electrode.

[0009] According to the easily packaged chip resistor of the utility model, the bottom end of the terminal electrode is connected to a back electrode, thereby improving the use effect of the back electrode.

[0010] According to the easy-to-package chip resistor of the utility model, the bottom end of the back electrode is connected with a resistor body, thereby improving the use effect of the resistor body.

[0011] According to the easy-to-package chip resistor of the utility model, the bottom end of the resistor body is connected with a surface electrode, thereby improving the use effect of the surface electrode.

[0012] Beneficial Effects

[0013] 1. Compared with the prior art, this easily packaged chip resistor has an external soldering foot fixedly connected to the side end of the ceramic substrate. The external soldering foot is a tin structure, the soldering point is low, and it is easy to be soldered to the circuit board.

[0014] 2. Compared with the prior art, this easy-to-package chip resistor uses electrode structures of various materials, is fixed on both ends of a ceramic substrate, and connects the resistor body and the surface electrode at the top of the ceramic substrate, thereby improving the effect of the chip resistor. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The utility model is further described below in conjunction with the accompanying drawings and embodiments;

[0016] Figure 1 It is a structural diagram of the entire utility model;

[0017] Figure 2 It is a structural diagram of the cross section of the utility model;

[0018] Figure 3 for Figure 2 The enlarged structural diagram at A in the middle;

[0019] Figure 4 This is a structural diagram of the utility model from a bottom-up perspective.

[0020] Legend:

[0021] 1. Two layers of cover glass; 2. External electrode; 3. Ceramic substrate; 4. External solder pins; 5. One layer of cover glass; 6. Middle electrode; 7. End electrode; 8. Back electrode; 9. Resistor; 10. Surface electrode. DETAILED DESCRIPTION

[0022] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0023] refer to Figure 1-4 The easily packaged chip resistor of this embodiment includes: a ceramic substrate 3 and an external electrode 2, which supports the overall structure and has an insulating effect. The front end of the ceramic substrate 3 is fixedly connected with an external solder pin 4, which is soldered to the circuit board to facilitate the packaging of the chip resistor and the circuit board. A surface electrode 10 is provided on the upper end of the ceramic substrate 3;

[0024] The second layer of cover glass 1 protects the top of the ceramic substrate 3. A cover glass 5 is arranged inside the bottom of the second layer of cover glass 1, and the second layer of cover glass 1 is fixedly connected to the bottom of the ceramic substrate 3. Improve the strength of the second layer of cover glass 1. The external electrode 2 is fixedly connected to the side end of the ceramic substrate 3, and the material of the external electrode 2 is copper paste. The bottom end of the external electrode 2 is connected to the middle electrode 6, and the material of the middle electrode 6 is silver paste. The bottom end of the middle electrode 6 is connected to the end electrode 7, and the material of the end electrode 7 is platinum paste. The bottom end of the end electrode 7 is connected to the back electrode 8, and the material of the back electrode 8 is aluminum paste. The bottom end of the back electrode 8 is connected to the resistor 9, and the material of the resistor 9 is graphite material. The bottom end of the resistor 9 is connected to the surface electrode 10, and the material of the surface electrode 10 is a metal silver structure. Use corresponding materials to improve the use effect of the chip resistor.

[0025] Working principle: When using the sealed resistor, use a welding gun to melt the external solder pin 4 and weld it to the corresponding position of the circuit board to improve the welding effect of the sealed resistor.

[0026] When making a chip resistor, a resistor body 9 is set on the top of a ceramic substrate 3, a through-surface electrode 10 is connected to the resistor body 9, a cover glass 5 is wrapped around the outer end of the ceramic substrate 3, and a second cover glass 1 is encapsulated on the outer end of the cover glass 5. Finally, the external electrode 2, the middle electrode 6, the end electrode 7, and the back electrode 8 are installed on the ceramic substrate 3 in a corresponding order.

[0027] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A chip resistor that is easy to package, characterized in that: include: A ceramic substrate (3), an external electrode (2), the front end of the ceramic substrate (3) being fixedly connected to an external soldering foot (4), the external soldering foot (4) being soldered to a circuit board, and the upper end of the ceramic substrate (3) being provided with a surface electrode (10); A second layer of cover glass (1), wherein a layer of cover glass (5) is arranged inside the bottom end of the second layer of cover glass (1), and the second layer of cover glass (1) is fixedly connected to the bottom end of the ceramic substrate (3).

2. The easily packaged chip resistor according to claim 1, characterized in that: The external electrode (2) is fixedly connected to the side end of the ceramic substrate (3).

3. The easily packaged chip resistor according to claim 2, characterized in that: The bottom end of the external electrode (2) is connected to an intermediate electrode (6).

4. The easily packaged chip resistor according to claim 3, characterized in that: The bottom end of the intermediate electrode (6) is connected to a terminal electrode (7).

5. The easily packaged chip resistor according to claim 4, characterized in that: The bottom end of the terminal electrode (7) is connected to a back electrode (8).

6. The easily packaged chip resistor according to claim 5, characterized in that: The bottom end of the back electrode (8) is connected to a resistor (9).

7. The easily packaged chip resistor according to claim 6, characterized in that: The bottom end of the resistor (9) is connected to a surface electrode (10).

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