High-precision and high-efficiency die bonder

By designing a crystal solid machine including a blue film tensioning mechanism, a substrate transmission mechanism, a swing arm and a correction platform, combined with the position correction of the camera, the problem that existing crystal solid machine is difficult to take into account both high precision and high efficiency, and realizes the problem of high precision and high efficiency. Efficient and accurate wafer pick-up and drop process.

CN222483294UActive Publication Date: 2025-02-14YOUGUANG INTELLIGENT SEMICON TECH (SHENZHEN) CO LTD
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Patent Information

Application Number
CN202420274017.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-02-02
Publication Date
2025-02-14
Estimated Expiration
2034-02-02

AI Technical Summary

Technical Problem

It is difficult for existing crystal solid machines to take into account high accuracy and high efficiency during crystal solidification. The XY axis displacement mechanism ensures position accuracy but slow movement speed, and the swing arm mechanism moves fast but poor position accuracy.

Method used

A solid crystal machine including a blue film tensioning mechanism, a substrate transmission mechanism, a first swing arm, a second swing arm, a correction platform and a camera identification is designed. By swinging back and forth between the correcting table, the blue film tensioning mechanism and the substrate transmission mechanism, the correcting table and the recognition camera are used to correct the position to achieve high precision and high efficiency wafer pick-up and placement.

Benefits of technology

It achieves high efficiency and high accuracy during wafer pick-up and placement. Through the coordination of the correction platform and the identification camera, the accurate alignment of the wafer and the tape is ensured, and the product accuracy is improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a die bonder with high precision and high efficiency. The die bonder comprises a first swing arm, a deviation rectifying table, a first identification camera and a second swing arm, the first swing arm and the second swing arm are each provided with a material taking mechanism. The deviation rectifying table is arranged between the blue film tensioning mechanism and the substrate conveying mechanism, the first swing arm is arranged between the deviation rectifying table and the blue film tensioning mechanism, and the second swing arm is arranged between the deviation rectifying table and the substrate conveying mechanism; the deviation rectifying table comprises a material carrying seat, a first translation driving mechanism and a second translation driving mechanism, the first translation driving mechanism and the second translation driving mechanism drive the material carrying seat to move in the first direction and the second direction respectively, and the first recognition camera is arranged above the material carrying seat. The high-precision and high-efficiency die bonder adopts the first swing arm and the second swing arm to take and place wafers, and the working efficiency is high. The first identification camera can identify the position of the wafer on the deviation correction table, and the first translation driving mechanism and the second translation driving mechanism correct the position of the wafer according to the identification result, so that the wafer is more accurately aligned with the material sheet after being taken and placed.
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Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip production, in particular to a high-precision and high-efficiency crystal bonding machine. Background Art

[0002] When bonding the wafer, the die bonder needs to remove the wafer from the blue film and then place it on the PCB substrate. The existing technology usually uses an XY axis displacement mechanism or a swing arm mechanism to pick up the wafer. The use of an XY axis displacement mechanism for loading can ensure high position accuracy, but the moving speed is slow and the production efficiency is low; while the use of a swing arm mechanism for loading has a fast moving speed and high production efficiency, but the position accuracy after loading is poor. Therefore, it is necessary to provide a die bonder with both high precision and high efficiency. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a high-precision and high-efficiency crystal bonding machine.

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is: a high-precision and high-efficiency crystal bonding machine, including a blue film tensioning mechanism and a substrate transmission mechanism; including a first driving mechanism, a first swing arm, a deflection correction platform, a first recognition camera, a second driving mechanism and a second swing arm; the first swing arm and the second swing arm are both provided with a material picking mechanism; the deflection correction platform is arranged between the blue film tensioning mechanism and the substrate transmission mechanism, the first driving mechanism is used to drive the first swing arm to swing back and forth between the deflection correction platform and the blue film tensioning mechanism, and the second driving mechanism is used to drive the second swing arm to swing back and forth between the deflection correction platform and the substrate transmission mechanism; the deflection correction platform includes a loading seat, a first translation driving mechanism and a second translation driving mechanism, the first translation driving mechanism is used to drive the loading seat to move along the first direction, the second translation driving mechanism is used to drive the loading seat to move along the second direction, and the first recognition camera is arranged above the loading seat.

[0005] Furthermore, the first translation drive mechanism or the second translation drive mechanism is a linear slide module.

[0006] Furthermore, at least one air suction hole is provided on the loading seat.

[0007] Furthermore, the material taking mechanism is a vacuum suction cup.

[0008] Furthermore, the first driving mechanism is provided with a first lifting driving mechanism, and the first lifting driving mechanism is used to drive the first swing arm to move up and down.

[0009] Furthermore, the second driving mechanism is provided with a second lifting driving mechanism, and the second lifting driving mechanism is used to drive the second swing arm to move up and down.

[0010] Furthermore, the first driving mechanism or the second driving mechanism is a rotating motor.

[0011] Furthermore, the first recognition camera is a CCD camera.

[0012] Furthermore, a second recognition camera is provided above the blue film tensioning mechanism.

[0013] Furthermore, a third recognition camera is provided above the substrate transmission mechanism.

[0014] The beneficial effect of the utility model is that the high-precision and high-efficiency die bonder adopts the first swing arm and the second swing arm to take and place the wafer from the blue film tensioning mechanism to the substrate transmission mechanism, and the working efficiency is high. The deflection correction table is used as the intermediate transfer position to carry the wafer. At this time, the first recognition camera can identify the position of the wafer on the deflection correction table. The first translation drive mechanism and the second translation drive mechanism are used to correct the position of the wafer according to the recognition result of the first recognition camera, so that the wafer can be more accurately aligned with the material after taking and placing, which is conducive to improving product accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic structural diagram of a high-precision and high-efficiency die bonding machine according to Embodiment 1 of the utility model.

[0016] Description of labels:

[0017] 1. Blue film tensioning mechanism;

[0018] 2. Substrate transmission mechanism;

[0019] 3. First driving mechanism; 31. First swing arm; 311. Material taking mechanism; 32. First lifting driving mechanism;

[0020] 4. Deflection correction platform; 41. Material carrier; 42. First translation drive mechanism; 43. Second translation drive mechanism; 44. Air suction hole;

[0021] 5. First recognition camera;

[0022] 6. Second driving mechanism; 61. Second swing arm; 62. Second lifting driving mechanism;

[0023] 7. Second recognition camera;

[0024] 8. The third recognition camera. DETAILED DESCRIPTION

[0025] In order to explain the technical content, achieved objectives and effects of the present invention in detail, the following is an explanation in conjunction with the implementation modes and the accompanying drawings.

[0026] Please refer to Figure 1, a high-precision and high-efficiency crystal bonding machine, comprising a blue film tensioning mechanism 1 and a substrate transmission mechanism 2; comprising a first driving mechanism 3, a first swing arm 31, a deflection correction platform 4, a first recognition camera 5, a second driving mechanism 6 and a second swing arm 61; the first swing arm 31 and the second swing arm 61 are both provided with a material picking mechanism 311; the deflection correction platform 4 is arranged between the blue film tensioning mechanism 1 and the substrate transmission mechanism 2, the first driving mechanism 3 is used to drive the first swing arm 31 to swing back and forth between the deflection correction platform 4 and the blue film tensioning mechanism 1, and the second driving mechanism 6 is used to drive the second swing arm 61 to swing back and forth between the deflection correction platform 4 and the substrate transmission mechanism 2; the deflection correction platform 4 comprises a loading seat 41, a first translation driving mechanism 42 and a second translation driving mechanism 43, the first translation driving mechanism 42 is used to drive the loading seat 41 to move along a first direction, the second translation driving mechanism 43 is used to drive the loading seat 41 to move along a second direction, and the first recognition camera 5 is arranged above the loading seat 41.

[0027] From the above description, it can be seen that the beneficial effect of the utility model is that the high-precision and high-efficiency die bonder adopts the first swing arm 31 and the second swing arm 61 to place the wafer from the blue film tensioning mechanism 1 to the substrate transmission mechanism 2, and the working efficiency is high. The deflection correction table 4 is used as an intermediate transfer position to carry the wafer. At this time, the first recognition camera 5 can identify the position of the wafer on the deflection correction table 4. The first translation drive mechanism 42 and the second translation drive mechanism 43 are used to correct the position of the wafer according to the recognition result of the first recognition camera 5, so that the wafer can be more accurately aligned with the material after being taken and placed, which is conducive to improving product accuracy.

[0028] Furthermore, the first translation driving mechanism 42 or the second translation driving mechanism 43 is a linear slide module.

[0029] It can be seen from the above description that the first translation drive mechanism 42 or the second translation drive mechanism 43 is easy to obtain and use, and has a high movement accuracy.

[0030] Furthermore, at least one air suction hole 44 is provided on the loading seat 41 .

[0031] It can be known from the above description that the suction holes 44 can absorb the wafer to prevent the wafer from being shifted relative to the carrier 41 .

[0032] Furthermore, the material taking mechanism 311 is a vacuum suction cup.

[0033] Furthermore, the first driving mechanism 3 is provided with a first lifting driving mechanism 32 , and the first lifting driving mechanism 32 is used to drive the first swing arm 31 to move up and down.

[0034] It can be seen from the above description that the first lifting drive mechanism 32 can make the material taking mechanism 311 on the first swing arm 31 approach or move away from the material.

[0035] Furthermore, the second driving mechanism 6 is provided with a second lifting driving mechanism 62 , and the second lifting driving mechanism 62 is used for driving the second swing arm 61 to move up and down.

[0036] It can be seen from the above description that the first lifting drive mechanism 32 can make the material taking mechanism 311 on the second swing arm 61 close to or away from the material.

[0037] Furthermore, the first driving mechanism 3 or the second driving mechanism 6 is a rotary motor.

[0038] It can be seen from the above description that the first driving mechanism 3 or the second driving mechanism 6 is easy to obtain and use.

[0039] Furthermore, the first recognition camera 5 is a CCD camera.

[0040] It can be seen from the above description that the recognition result of the first recognition camera 5 is accurate and efficient.

[0041] Furthermore, a second recognition camera 7 is provided above the blue film tensioning mechanism 1 .

[0042] From the above description, it can be known that the second recognition camera 7 can detect whether the first swing arm 31 picks up the wafer from the blue film to avoid idling; or the second recognition can identify whether the wafer on the blue mold is moved into place.

[0043] Furthermore, a third recognition camera 8 is provided above the substrate transmission mechanism 2 .

[0044] It can be known from the above description that the third recognition camera 8 can detect whether the second swing arm 61 prevents the wafer from being placed on the sheet, or the third recognition camera 8 can recognize whether the sheet is moved into place.

[0045] Please refer to Figure 1, Embodiment 1 of the utility model is: a high-precision and high-efficiency crystal bonding machine, comprising a blue film tensioning mechanism 1 and a substrate transmission mechanism 2; comprising a first driving mechanism 3, a first swing arm 31, a deflection correction platform 4, a first recognition camera 5, a second driving mechanism 6 and a second swing arm 61; a material picking mechanism 311 is provided on the first swing arm 31 and the second swing arm 61; the deflection correction platform 4 is arranged between the blue film tensioning mechanism 1 and the substrate transmission mechanism 2, the first driving mechanism 3 is used to drive the first swing arm 31 to swing back and forth between the deflection correction platform 4 and the blue film tensioning mechanism 1, and the second driving mechanism 6 is used to drive the second swing arm 61 to swing back and forth between the deflection correction platform 4 and the substrate transmission mechanism 2; the deflection correction platform 4 comprises a loading seat 41, a first translation driving mechanism 42 and a second translation driving mechanism 43, the first translation driving mechanism 42 is used to drive the loading seat 41 to reciprocate along the first direction, the second translation driving mechanism 43 is used to drive the loading seat 41 to reciprocate along the second direction, and the first recognition camera 5 is arranged above the loading seat 41.

[0046] Specifically, the first drive mechanism 3 and the second drive mechanism 6 are both rotating motors, and the output shafts of the first drive mechanism 3 and the second drive mechanism 6 are both vertically arranged, the output shaft of the first drive mechanism 3 is fixedly connected to one end of the first swing arm 31, and the output shaft of the second drive mechanism 6 is fixedly connected to one end of the second swing arm 61. The material picking mechanism 311 is a vacuum suction cup. The first drive mechanism 3 is provided with a first lifting drive mechanism 32, and the first lifting drive mechanism 32 is used to drive the first swing arm 31 to move up and down. The second drive mechanism 6 is provided with a second lifting drive mechanism 62, and the second lifting drive mechanism 62 is used to drive the second swing arm 61 to move up and down. The first lifting drive mechanism 32 and the second lifting drive mechanism 62 are preferably ball screw modules. The first direction is perpendicular to the second direction. The first translation drive mechanism 42 and the second translation drive mechanism 43 are both linear slide modules. The first recognition camera 5 is a CCD camera.

[0047] In order to prevent the wafer on the carrier 41 from shifting relative to the carrier 41, the carrier 41 is provided with at least one suction hole 44. In this embodiment, the number of the suction holes 44 is multiple. In other embodiments, the carrier 41 may be provided with two, three or more suction holes 44.

[0048] As a preferred embodiment, a second recognition camera 7 is provided above the blue film tensioning mechanism 1. It is easy to understand that the second recognition camera 7 can detect whether the first swing arm 31 picks up a wafer from the blue film to avoid idling; or the second recognition can identify whether the wafer on the blue mold is moved into place.

[0049] As a preferred embodiment, a third recognition camera 8 is provided above the substrate transfer mechanism 2. It is easy to understand that the third recognition camera 8 can detect whether the second swing arm 61 prevents the wafer from being placed on the material sheet, or the third recognition camera 8 can recognize whether the material sheet is moved into place.

[0050] In summary, the high-precision and high-efficiency die bonding machine provided by the utility model adopts the first swing arm and the second swing arm to take and place the wafer from the blue film tensioning mechanism to the substrate transmission mechanism, and has high working efficiency. The deflection correction table is used as the intermediate transfer position to carry the wafer. At this time, the first recognition camera can identify the position of the wafer on the deflection correction table. The first translation drive mechanism and the second translation drive mechanism are used to correct the position of the wafer according to the recognition result of the first recognition camera, so that the wafer can be more accurately aligned with the material after taking and placing, which is conducive to improving product accuracy.

[0051] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent transformations made using the contents of the specification and drawings of the present invention, or directly or indirectly applied in the relevant technical field, are also included in the patent protection scope of the present invention.

Claims

1. A high-precision and high-efficiency die bonding machine, comprising a blue film tensioning mechanism and a substrate transmission mechanism; characterized in that: It includes a first driving mechanism, a first swing arm, a deflection correction platform, a first recognition camera, a second driving mechanism and a second swing arm; the first swing arm and the second swing arm are both provided with a material picking mechanism; the deflection correction platform is arranged between the blue film tensioning mechanism and the substrate transmission mechanism, the first driving mechanism is used to drive the first swing arm to swing back and forth between the deflection correction platform and the blue film tensioning mechanism, and the second driving mechanism is used to drive the second swing arm to swing back and forth between the deflection correction platform and the substrate transmission mechanism; the deflection correction platform includes a loading seat, a first translation driving mechanism and a second translation driving mechanism, the first translation driving mechanism is used to drive the loading seat to move along the first direction, the second translation driving mechanism is used to drive the loading seat to move along the second direction, and the first recognition camera is arranged above the loading seat.

2. A high-precision and high-efficiency die bonding machine according to claim 1, characterized in that: The first translation drive mechanism or the second translation drive mechanism is a linear slide module.

3. A high-precision and high-efficiency die bonding machine according to claim 1, characterized in that: The material loading seat is provided with at least one air suction hole.

4. The high-precision and high-efficiency die bonding machine according to claim 1, characterized in that: The material taking mechanism is a vacuum suction cup.

5. The high-precision and high-efficiency die bonding machine according to claim 1, characterized in that: The first driving mechanism is provided with a first lifting driving mechanism, and the first lifting driving mechanism is used to drive the first swing arm to move up and down.

6. The high-precision and high-efficiency die bonding machine according to claim 1, characterized in that: The second driving mechanism is provided with a second lifting driving mechanism, and the second lifting driving mechanism is used for driving the second swing arm to move up and down.

7. The high-precision and high-efficiency die bonding machine according to claim 1, characterized in that: The first driving mechanism or the second driving mechanism is a rotary motor.

8. The high-precision and high-efficiency die bonding machine according to claim 1, characterized in that: The first recognition camera is a CCD camera.

9. The high-precision and high-efficiency die bonding machine according to claim 1, characterized in that: A second recognition camera is provided above the blue film tensioning mechanism.

10. The high-precision and high-efficiency die bonding machine according to claim 1, characterized in that: A third recognition camera is arranged above the substrate transmission mechanism.