Multi-chip packaging integrated circuit
By designing a multi-chip package integrated circuit and adopting a package base and package cover structure, more efficient space utilization and rapid chip replacement are achieved, solving the problems of large space and waste of resources in the existing chip package structure.
Patent Information
- Application Number
- CN202420386999.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-29
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2034-02-28
AI Technical Summary
The existing chip packaging structure takes up a lot of space, reducing space utilization. When the chip is damaged and needs to be replaced, the entire packaging structure needs to be demolished, causing waste of resources.
A multi-chip package integrated circuit is designed, adopting a package base and package cover structure, and the chip is fixed and replaced by clamping mechanism and fixing parts, and the heat dissipation effect is improved by using the heat dissipation plate and ventilation duct.
It achieves more efficient space utilization, facilitates rapid chip replacement and maintenance, and avoids waste of resources.
Smart Images
Figure CN222483352U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of chip packaging, in particular to a multi-chip packaging integrated circuit. Background Art
[0002] Chip packaging is the shell used to install semiconductor integrated circuit chips. It has the functions of placing, fixing, sealing, protecting chips and enhancing electrical and thermal performance. Chip packaging is a bridge between the internal world of the chip and the external circuit. The contacts of the chip are connected to the pins of the package shell with wires, and the pins are connected to other devices through the wires on the printed circuit board. Packaging plays an important role in CPUs and other LSI integrated circuits.
[0003] Most of the existing packaging structures integrate multiple chips on the same plane and are integrated packages. This packaging method occupies a large space, reduces space utilization, and also reduces practicality. When one of the chips is damaged and needs to be replaced, the entire packaging structure needs to be dismantled, or the entire integrated chip needs to be directly replaced, resulting in product waste. Therefore, a multi-chip packaged integrated circuit is proposed. Utility Model Content
[0004] The utility model aims to provide a multi-chip packaged integrated circuit to solve the existing problems.
[0005] In order to solve the above technical problems, the utility model is realized by the following technical solutions:
[0006] The utility model is a multi-chip packaged integrated circuit, comprising a package base and a package cover, wherein fixing grooves are arranged on one side of two opposite surfaces of the package base and the package cover, fixing pieces are arranged in the fixing grooves, a first clamping mechanism is fixedly connected to the right portion of the upper end of the package base, a second clamping mechanism is fixedly connected to the left portion of the upper end of the first clamping mechanism, a third clamping mechanism is fixedly connected to the left portion of the upper end of the second clamping mechanism, a fourth clamping mechanism is fixedly connected to the left portion of the upper end of the third clamping mechanism, semiconductor chips are arranged in the first clamping mechanism, the second clamping mechanism, the third clamping mechanism and the fourth clamping mechanism, and a heat sink is arranged on the lower surface of the package base.
[0007] Furthermore, the fixing groove is a "T"-shaped groove, the fixing piece is an I-shaped plate structure, and the fixing piece is snap-fitted with the fixing grooves on the packaging base and the packaging cover.
[0008] Furthermore, a surface of the fixing piece is provided with screw holes, and a plurality of heat dissipation holes are provided in the heat dissipation plate.
[0009] Furthermore, the first clamping mechanism, the second clamping mechanism, the third clamping mechanism and the fourth clamping mechanism are of the same structure, and the first clamping mechanism, the second clamping mechanism, the third clamping mechanism and the fourth clamping mechanism are arranged in a stepped shape.
[0010] Furthermore, a plurality of ventilation ducts are arranged on the upper surface of the heat dissipation plate, the ventilation ducts are fixedly connected to the lower surfaces of the first clamping mechanism, the second clamping mechanism, the third clamping mechanism and the fourth clamping mechanism, and a plurality of heat sinks are arranged on the lower surface of the heat dissipation plate.
[0011] Furthermore, the first clamping mechanism includes a U-shaped frame, a limiting groove is provided on one side of the U-shaped frame, a groove is provided on one surface of the U-shaped frame, a plurality of limiting springs are provided on the other surface of the U-shaped frame, an extrusion plate is provided at one end of the limiting spring, an insulating layer is provided on the lower surface of the extrusion plate, a pull rod is provided on the upper surface of the extrusion plate, the pull rod passes through the U-shaped frame and extends to the outside, a limiting block is provided on one side of the extrusion plate, and the limiting block and the limiting groove cooperate with each other.
[0012] The utility model has the following beneficial effects:
[0013] The utility model pulls up the extrusion plate by pulling the pull rod upward, and places the semiconductor chip in the grooves of the first clamping mechanism, the second clamping mechanism, the third clamping mechanism and the fourth clamping mechanism in sequence, then releases the pull rod, and the limit spring presses the extrusion plate downward so that the semiconductor chip is fixed in the groove, and then the packaging cover is covered on the first clamping mechanism, the second clamping mechanism, the third clamping mechanism and the fourth clamping mechanism, and the fixing piece is inserted into the fixing groove of the packaging base and the packaging cover, so that the packaging base and the packaging cover are sealed, and the installation is completed; when the semiconductor chip is damaged and needs to be replaced, it is necessary to screw the matching bolt into the screw hole of the fixing piece, and then pull the fixing piece to pull it out, so as to facilitate the rapid separation of the packaging base and the packaging cover, and pull the pull rod to quickly replace the damaged semiconductor chip to avoid waste.
[0014] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0016] Figure 1 It is a schematic diagram of the overall structure of a multi-chip packaged integrated circuit;
[0017] Figure 2 A top view of a multi-chip package integrated circuit;
[0018] Figure 3 for Figure 2 Middle AA section;
[0019] Figure 4 for Figure 3 Middle BB cross-section.
[0020] In the accompanying drawings, the components represented by the reference numerals are listed as follows:
[0021] 1-packaging base, 2-packaging cover, 3-fixing groove, 4-fixing piece, 5-screw hole, 6-first clamping mechanism, 7-second clamping mechanism, 8-third clamping mechanism, 9-fourth clamping mechanism, 10-semiconductor chip, 11-heat sink, 12-heat sink, 13-ventilation duct, 61-U-shaped frame, 62-limiting groove, 63-limiting spring, 64-extrusion plate, 65-insulating layer, 66-pull rod, 67-groove, 68-limiting block. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0023] In the description of the present invention, it should be understood that the terms "upper", "middle", "outer", "inner" and the like indicating directions or positional relationships are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limitations on the present invention.
[0024] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0025] See also Figure 1-Figure 4As shown, the utility model is a multi-chip packaged integrated circuit, including a packaging base 1 and a packaging cover 2, a fixing groove 3 is provided on one side of the two opposite surfaces of the packaging base 1 and the packaging cover 2, a fixing member 4 is provided in the fixing groove 3, a first clamping mechanism 6 is fixedly connected to the right portion of the upper end of the packaging base 1, a second clamping mechanism 7 is fixedly connected to the left portion of the upper end of the first clamping mechanism 6, a third clamping mechanism 8 is fixedly connected to the left portion of the upper end of the second clamping mechanism 7, a fourth clamping mechanism 9 is fixedly connected to the left portion of the upper end of the third clamping mechanism 8, semiconductor chips 10 are provided in the first clamping mechanism 6, the second clamping mechanism 7, the third clamping mechanism 8 and the fourth clamping mechanism 9, and a heat sink 11 is provided on the lower surface of the packaging base 1.
[0026] The fixing groove 3 is a “T”-shaped groove, the fixing member 4 is an I-shaped plate structure, and the fixing member 4 is snap-fitted with the fixing groove 3 on the packaging base 1 and the packaging cover 2 .
[0027] A screw hole 5 is disposed on one surface of the fixing member 4 , and a plurality of heat dissipation holes are disposed in the heat dissipation plate 11 .
[0028] The first clamping mechanism 6 , the second clamping mechanism 7 , the third clamping mechanism 8 and the fourth clamping mechanism 9 have the same structure, and are arranged in a stepped shape.
[0029] Among them, a plurality of ventilation ducts 13 are arranged on the upper surface of the heat dissipation plate 11 , and the ventilation ducts 13 are fixedly connected to the lower surfaces of the first clamping mechanism 6 , the second clamping mechanism 7 , the third clamping mechanism 8 and the fourth clamping mechanism 9 , and a plurality of heat sinks 12 are arranged on the lower surface of the heat dissipation plate 11 .
[0030] Among them, the first clamping mechanism 6 includes a U-shaped frame 61, a limiting groove 62 is arranged on one side of the U-shaped frame 61, a groove 67 is arranged on one surface of the U-shaped frame 61, and a plurality of limiting springs 63 are arranged on the other surface of the U-shaped frame 61. An extrusion plate 64 is arranged at one end of the limiting spring 63, an insulating layer 65 is arranged on the lower surface of the extrusion plate 64, a pull rod 66 is arranged on the upper surface of the extrusion plate 64, the pull rod 66 passes through the U-shaped frame 61 and extends to the outside, a limiting block 68 is arranged on one side of the extrusion plate 64, and the limiting block 68 cooperates with the limiting groove 62.
[0031] See also Figure 1-Figure 4As shown, this embodiment is an installation process of a multi-chip packaged integrated circuit. First, the pull rod 66 is pulled upward to pull up the extrusion plate 64, and the semiconductor chip 10 is placed in the grooves 67 of the first clamping mechanism 6, the second clamping mechanism 7, the third clamping mechanism 8 and the fourth clamping mechanism 9 in sequence. Then, the pull rod 66 is released, and the limit spring 63 presses the extrusion plate 64 downward to fix the semiconductor chip 10 in the groove 67. Then, the packaging cover 2 is covered on the first clamping mechanism 6, the second clamping mechanism 7, the third clamping mechanism 8 and the fourth clamping mechanism 9. Then, the fixing member 4 is inserted into the fixing groove 3 of the packaging base 1 and the packaging cover 2 to seal the packaging base 1 and the packaging cover 2 to complete the installation. When the semiconductor chip 10 is damaged and needs to be replaced, the matching bolt needs to be screwed into the screw hole 5 of the fixing member 4, and then the fixing member 4 is pulled out to separate the packaging base 1 and the packaging cover 2. Then, the pull rod 66 is pulled to quickly replace the damaged semiconductor chip 10.
[0032] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0033] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.
Claims
1. A multi-chip packaged integrated circuit, comprising a package base (1) and a package cover (2), characterized in that: The packaging base (1) and the packaging cover (2) are provided with fixing grooves (3) on one side of the two opposite surfaces, and a fixing member (4) is provided in the fixing groove (3). The upper right part of the packaging base (1) is fixedly connected to a first clamping mechanism (6), the upper left part of the first clamping mechanism (6) is fixedly connected to a second clamping mechanism (7), the upper left part of the second clamping mechanism (7) is fixedly connected to a third clamping mechanism (8), and the upper left part of the third clamping mechanism (8) is fixedly connected to a fourth clamping mechanism (9). Semiconductor chips (10) are provided in the first clamping mechanism (6), the second clamping mechanism (7), the third clamping mechanism (8) and the fourth clamping mechanism (9), and a heat sink (11) is provided on the lower surface of the packaging base (1).
2. The multi-chip package integrated circuit according to claim 1, characterized in that: The fixing groove (3) is a "T"-shaped groove, the fixing member (4) is an I-shaped plate structure, and the fixing member (4) is snap-fitted with the fixing groove (3) on the packaging base (1) and the packaging cover (2).
3. The multi-chip package integrated circuit according to claim 1, characterized in that: A screw hole (5) is provided on one surface of the fixing member (4), and a plurality of heat dissipation holes are provided in the heat dissipation plate (11).
4. The multi-chip package integrated circuit according to claim 1, characterized in that: The first clamping mechanism (6), the second clamping mechanism (7), the third clamping mechanism (8) and the fourth clamping mechanism (9) have the same structure, and the first clamping mechanism (6), the second clamping mechanism (7), the third clamping mechanism (8) and the fourth clamping mechanism (9) are arranged in a stepped shape.
5. The multi-chip package integrated circuit according to claim 1, characterized in that: The upper surface of the heat dissipation plate (11) is provided with a plurality of ventilation ducts (13), the ventilation ducts (13) are fixedly connected to the lower surfaces of the first clamping mechanism (6), the second clamping mechanism (7), the third clamping mechanism (8) and the fourth clamping mechanism (9), and the lower surface of the heat dissipation plate (11) is provided with a plurality of heat sinks (12).
6. The multi-chip package integrated circuit according to claim 1, characterized in that: The first clamping mechanism (6) comprises a U-shaped frame (61), a limiting groove (62) is arranged on one side of the U-shaped frame (61), a groove (67) is arranged on one surface of the U-shaped frame (61), a plurality of limiting springs (63) are arranged on the other surface of the U-shaped frame (61), an extrusion plate (64) is arranged at one end of the limiting spring (63), an insulating layer (65) is arranged on the lower surface of the extrusion plate (64), a pull rod (66) is arranged on the upper surface of the extrusion plate (64), the pull rod (66) passes through the U-shaped frame (61) and extends to the outside, a limiting block (68) is arranged on one side of the extrusion plate (64), and the limiting block (68) cooperates with the limiting groove (62).