Packaging structure
By adopting a simplified packaging structure in semiconductor production, the substrate units are arranged on the same plane and through direct electrical connection between conductive components and electronic components, the problems of difficult and high production cost of substrate circuits in the prior art are solved, and the problem of high production cost of substrate circuits is realized. The effects of process simplification, yield improvement and cost reduction.
Patent Information
- Application Number
- CN202420422899.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-05
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2034-03-05
AI Technical Summary
In the existing semiconductor production technology, the difficulty of making substrate circuits is increased, resulting in a decrease in product yield, and the packaging structure has many processes, complex processes, and high production costs.
A package structure is provided in which the substrate unit is arranged on the same plane, in an electrical signal transmission isolation state, simplifying the manufacturing process through direct electrical connection between the conductive component and the electronic component.
The packaging structure simplifies the manufacturing process, improves yield, reduces production costs and avoids additional connection circuits.
Smart Images
Figure CN222483356U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of chip manufacturing, and in particular, to a packaging structure. Background Art
[0002] When manufacturing semiconductor products, defects in the circuits on the substrate during the production process will result in the entire substrate being scrapped. As the precision requirements for the circuits on the substrate become higher and higher, the difficulty of making the substrate circuits is also increasing, affecting the product yield. In existing semiconductor production technology, substrates are usually split into smaller sub-substrates, and then the smaller substrates are combined into larger substrate products that meet the performance requirements according to product requirements.
[0003] The prior art generally adopts the method of setting through holes to connect the substrate unit and the surface circuit layer. Figure 1 FIG. 2 shows a side view schematic diagram of a packaging structure of the prior art. Figure 1 As shown, the packaging structure of the prior art includes a plurality of substrate units 900 and a surface circuit layer 904. The substrate unit 900 includes a sub-substrate 901, a molding layer 903 and a fan-out circuit layer 902 arranged in sequence from bottom to top. The surface circuit layer 904 is arranged above the fan-out circuit layer 902. The sub-substrate 901 is electrically connected to the surface circuit layer 904 through a conductor post 905 in a through hole penetrating the molding layer 903 and the fan-out circuit layer 902. It can be seen that this packaging structure requires the design and manufacture of special through holes in the process of combining substrates, and the arrangement of conductive posts or conductive layers in the through holes to connect the circuit in the sub-substrate to the surface circuit layer of the combined substrate. The disadvantages of this packaging structure are that there are many manufacturing processes, complex processes, and high production costs.
[0004] In summary, the art needs to provide a packaging structure that can overcome the defects of the prior art. Utility Model Content
[0005] The present application provides a packaging structure, which can solve the problems of the prior art. The purpose of the present application is achieved through the following technical solutions.
[0006] One embodiment of the present application provides a packaging structure, which includes: a substrate, the substrate includes a plurality of substrate units, the plurality of substrate units are arranged on the same plane, and the plurality of substrate units are in an isolated state of electrical signal transmission; a conductive component, the conductive component includes a first conductive part, and the first conductive parts are respectively arranged on one side of the substrate unit; an electronic component, the electronic component includes a plurality of connecting terminals, and the electronic component is electrically connected to the first conductive part through the plurality of connecting terminals.
[0007] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the substrate also includes a first molding layer and a second molding layer, the first molding layer covers the multiple substrate units, and the second molding layer is arranged on the other side of the multiple substrate units opposite to the first conductive component.
[0008] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the conductive component also includes a second conductive component, the second conductive component is arranged on a side of the second molding layer facing the multiple substrate units, and the density of the conductive circuit of the second conductive component is less than the density of the conductive circuit of the first conductive component.
[0009] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the conductive component further includes a third conductive component, and the third conductive component is disposed on the other side of the second molding layer opposite to the second conductive component.
[0010] In some optional embodiments, according to the packaging structure provided by one of the embodiments of the present application, the density of the conductive circuits of the third conductive component is less than the density of the conductive circuits of the first conductive component.
[0011] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the conductive component further includes a connecting circuit, and the first conductive component, the second conductive component and the third conductive component are electrically connected through the connecting circuit.
[0012] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the connecting circuit includes a first circuit and a second circuit, the first circuit is arranged in the substrate unit, and the second circuit is arranged in the second molding layer.
[0013] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the diameter of the first circuit is smaller than the diameter of the second circuit.
[0014] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the connecting circuit further includes a third circuit, the third circuit is arranged in the first molding layer, and the first circuit is electrically connected to the second conductive component through the third circuit.
[0015] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the projection of the electronic component in the vertical direction covers a plurality of substrate units.
[0016] In some optional embodiments, according to a packaging structure provided by one of the above embodiments of the present application, the projection area of the electronic component in the vertical direction is smaller than the area of a single substrate unit, and the projection of the electronic component in the vertical direction is within the range of the single substrate unit in the top-view direction.
[0017] The advantages of the packaging structure according to the embodiment of the present application are that the redistribution layer is directly electrically connected to the electronic component through the substrate unit without the need for additional connecting circuits, thereby simplifying the manufacturing process, improving the yield rate, and reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Other features, objectives and advantages of the present application will become more apparent through the detailed description of non-limiting embodiments of the present application with reference to the following drawings.
[0019] Figure 1 A schematic side view of a packaging structure of the prior art is shown;
[0020] Figure 2 A schematic side view of a packaging structure according to an embodiment of the present application is shown;
[0021] Figure 3 A schematic top projection diagram of an electronic component, a substrate unit, and a first mold sealing layer of a packaging structure according to an embodiment of the present application is shown;
[0022] Figure 4 A top view projection diagram of a packaging structure according to a second embodiment of the present application is shown;
[0023] Figure 5 It shows that Figure 4 The schematic cross-sectional side view of the packaging structure at the dotted line B according to the second embodiment of the present application is shown;
[0024] Figure 6 A top view projection diagram of a packaging structure according to a third embodiment of the present application is shown;
[0025] Figure 7 It shows that Figure 6 The schematic cross-sectional side view of the packaging structure at the dotted line C according to the third embodiment of the present application is shown;
[0026] Figure 8 It shows that Figure 2 A schematic diagram of a manufacturing process of a packaging structure according to an embodiment of the present application is shown;
[0027] Fig. 9 A schematic side view of a packaging structure according to another embodiment of the present application is shown;
[0028] Fig.10 It shows that Fig. 9A schematic diagram of a manufacturing process of a packaging structure according to another embodiment of the present application is shown;
[0029] Figures 11 to 15 A plurality of schematic top views of packaging structures using different electronic component arrangement methods are shown.
[0030] Numbers and component names: 1-substrate, 2-conductive component, 3-electronic component, 4-first mold sealing layer, 5-second mold sealing layer, 6-third mold sealing layer, 7-fourth mold sealing layer, 8-solder ball, 11-substrate unit, 21-first conductive component, 22-second conductive component, 23-third conductive component, 24-first circuit, 25-second circuit, 26-third circuit, 27-conductive terminal, 31-connecting terminal, 101-first carrier, 102-release layer, 103-substrate, 104-substrate module, 105-first molding layer, 106-second carrier, 107-substrate unit, 108-second molding layer, 109-third molding layer, 110-fourth molding layer, 111-first conductive component, 112-second conductive component, 113-conductive terminal, 114-adhesive layer, 900-substrate unit, 901-first substrate, 902-second substrate, 903-molding layer, 904-electrical connector, 905-conductive column, A-electronic component projection. DETAILED DESCRIPTION
[0031] The specific implementation methods of the present application are described below in conjunction with the accompanying drawings and examples. Through the contents recorded in this specification, those skilled in the art can clearly and completely understand the technical solutions, technical problems solved, and technical effects produced by the present application. It is understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. In addition, for ease of description, only the parts related to the present application are shown in the accompanying drawings.
[0032] It should be readily understood that the meanings of “on,” “over,” and “over…” in this application should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also means “on something” including the presence of intermediate components or layers therebetween.
[0033] Additionally, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," "upper," etc. may be used herein to describe the relationship of one element or component to another element or component illustrated in the drawings. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may likewise be interpreted accordingly.
[0034] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of the specification are only used to match the contents recorded in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of the present application, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size, without affecting the effects and purposes that can be achieved by the present application, should still fall within the scope of the technical content disclosed in the present application. At the same time, the terms such as "on", "first", "second" and "one" quoted in this specification are only for the convenience of narration, and are not used to limit the scope of the implementation of the present application. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present application without substantially changing the technical content.
[0035] The term "layer" as used herein refers to a material portion including an area with a certain thickness. The layer can extend over the entire lower or upper structure, or can have a degree less than the range of the lower or upper structure. In addition, the layer can be a region of a homogeneous or inhomogeneous continuous structure, and its thickness is less than the thickness of the continuous structure. For example, the layer can be located between the top surface and the bottom surface of the continuous structure or between any pair of horizontal planes therebetween. The layer can extend horizontally, vertically and / or along a tapered surface. A substrate can be a layer, one or more layers can be included therein, and / or one or more layers can be present thereon, above and / or below. A layer can include multiple layers. For example, a semiconductor layer can include one or more doped or undoped semiconductor layers, and can have the same or different materials.
[0036] The term "substrate" used herein refers to a material on which a subsequent material layer is added. The substrate itself can be patterned. The material added to the top of the substrate can be patterned or can remain unpatterned. In addition, the substrate can include a variety of semiconductor materials, such as silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, indium phosphide, etc. Alternatively, the substrate can be made of a non-conductive material, such as glass, plastic, sapphire wafer, polyamide fiber (Polyamide, PA), polyimide (Polyimide, PI), epoxy resin (Epoxy), poly-p-phenylene benzo isoxazole (Poly-p-phenylene benzo isoxazole, PBO) fiber, FR-4 epoxy glass cloth laminate, PP (PrePreg, prepreg material or semi-cured resin, semi-cured sheet) or ABF (Ajinomoto Build-up Film) and the like. Further alternatively, the substrate can have a semiconductor device or circuit formed therein.
[0037] It should also be noted that the longitudinal section corresponding to the embodiment of the present application may be a section corresponding to the front view direction, the transverse section may be a section corresponding to the right view direction, and the horizontal section may be a section corresponding to the top view direction.
[0038] In addition, the embodiments and features in the embodiments of the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.
[0039] Figure 2 FIG. 2 shows a schematic side view of a packaging structure according to an embodiment of the present application. Figure 2 As shown, the packaging structure includes: a substrate 1, the substrate 1 includes a plurality of substrate units 11, the plurality of substrate units 11 are arranged on the same plane, and the plurality of substrate units 11 are in an isolated state of electrical signal transmission, wherein the isolated state means that the substrate units 11 are not directly electrically connected; a conductive component 2, the conductive component 2 includes a first conductive part 21, and the first conductive part 21 is respectively arranged on one side of the substrate unit 11; an electronic component 3, the electronic component 3 includes a plurality of connecting terminals 31, and the electronic component 3 is electrically connected to the first conductive part 21 through the plurality of connecting terminals 31.
[0040] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the substrate 1 also includes a first molding layer 4 and a second molding layer 5, the first molding layer 4 covers a plurality of substrate units 11, and the second molding layer 5 is arranged on the other side of the plurality of substrate units 11 opposite to the first conductive component 21.
[0041] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the conductive component 2 also includes a second conductive component 22, and the second conductive component 22 is arranged on the side of the second molding layer 5 facing the multiple substrate units 11, and the density of the conductive circuit of the second conductive component 22 is less than the density of the conductive circuit of the first conductive component 21.
[0042] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the conductive component 2 further includes a third conductive component 23 , and the third conductive component 23 is disposed on the other side of the second molding layer 5 opposite to the second conductive component 22 .
[0043] In some optional embodiments, according to the packaging structure provided by one of the embodiments of the present application, the density of the conductive circuits of the third conductive component 23 is less than the density of the conductive circuits of the first conductive component 21 .
[0044] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the conductive component 2 also includes a connecting circuit (not shown), and the first conductive component 21, the second conductive component 22 and the third conductive component 23 are electrically connected through the connecting circuit.
[0045] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the connecting circuit includes a first circuit 24 and a second circuit 25, the first circuit 24 is arranged in the substrate unit 11, and the second circuit 25 is arranged in the second molding layer 5.
[0046] In some optional implementations, according to the packaging structure provided by one of the above implementations of the present application, the diameter of the first line 24 is smaller than the diameter of the second line 25 .
[0047] In some optional embodiments, according to the packaging structure provided by one of the above embodiments of the present application, the connecting circuit also includes a third line 26, the third line 26 is arranged in the first molding layer 4, and the first line 24 is electrically connected to the second conductive component 22 through the third line 26.
[0048] In some optional embodiments, a packaging structure is provided according to the above-mentioned one embodiment of the present application, wherein the packaging structure also includes a third molding layer 6, a fourth molding layer 7 and a solder ball 8, the third molding layer 6 is arranged on the upper surface of the first molding layer 4, the substrate unit 11 and the first conductive component 21, the connecting terminal 31 passes through the third molding layer 6 and is electrically connected to the first conductive component 21, the fourth molding layer 7 is arranged on the lower surface of the second molding layer 5, the third conductive component 23 is exposed from the second molding layer 5, and the solder ball 8 is connected to the exposed third conductive component 23.
[0049] Figure 3 FIG. 2 shows a schematic top view of a packaging structure according to an embodiment of the present application. Figure 3 As shown, the projection area of the electronic component 3 in the vertical direction is smaller than the area of the single substrate unit 11 , and the projection of the electronic component 3 in the vertical direction is within the range of the single substrate unit 11 in the top view direction.
[0050] Figure 4 A top view projection of a packaging structure according to a second embodiment of the present application is shown. Figure 5 It shows that Figure 4 FIG. 2 is a schematic cross-sectional side view of a packaging structure according to a second embodiment of the present application at a dotted line B. Figure 4 and Figure 5 As shown, a plurality of substrate units 11 are disposed on the first molding layer 4 , and the projection of the electronic component 3 in the vertical direction covers the plurality of substrate units 11 , and one electronic component 3 is electrically connected to the plurality of substrate units 11 , respectively.
[0051] Figure 6 A top view projection of a packaging structure according to a third embodiment of the present application is shown. Figure 7 It shows that Figure 6 FIG. 2 is a schematic cross-sectional side view of a packaging structure according to a third embodiment of the present application at a dotted line C. Figure 6 and Figure 7 As shown, a plurality of substrate units 11 are disposed on the first molding layer 4 , and projections of the electronic components 3 in the vertical direction are respectively located within the range of the substrate units 11 in the top view direction, and one substrate unit 11 can be electrically connected to a plurality of electronic components 3 .
[0052] Figure 8 It shows that Figure 2 The schematic diagram of the manufacturing process of the packaging structure according to one embodiment of the present application is shown in FIG. Figure 8 As shown, the production process of the package structure includes multiple steps:
[0053] Step 1001: providing a first carrier 101, disposing a release layer 102 on the upper surface of the first carrier 101, and disposing a substrate 103 above the release layer 102;
[0054] Step 1002: Cut the first carrier 101, the release layer 102 and the substrate 103 to form a substrate module 104, wherein Figure 5 The dotted lines in the figure represent the locations of the cuts;
[0055] Step 1003: providing a second carrier 106 , disposing a first mold sealing layer 105 on the upper surface of the second carrier 106 , and disposing the flipped substrate module 104 on the first mold sealing layer 105 ;
[0056] Step 1004: removing the release layer 102 and the substrate 103 to obtain a substrate unit 107;
[0057] Step 1005: using the second mold sealing layer 108 to cover the upper surface of the substrate unit 107 and the first mold sealing layer 105;
[0058] Step 1006: disposing a third mold sealing layer 109 on the substrate unit 107, electrically connecting the substrate unit 107 and the third mold sealing layer 109, disposing a fourth mold sealing layer 110 on the third mold sealing layer 109 and exposing the first conductive component 111 from the bottom of the fourth mold sealing layer 110;
[0059] Step 1007: remove the second carrier 106 and flip the package structure, and then perform step 1008a or step 1008b;
[0060] Step 1008a: laser etching or dry etching the first encapsulation layer 105 so that the second conductive component 112 is exposed from the bottom of the first encapsulation layer 105; and
[0061] Step 1008 b : grinding or dry-etching the first encapsulation layer 105 to expose the second conductive component 112 , wherein the upper surface of the first encapsulation layer 105 after grinding or dry-etching is substantially flush with the upper surface of the exposed second conductive component 112 .
[0062] Fig. 9 FIG. 2 shows a schematic side view of a packaging structure according to another embodiment of the present application. Fig. 9 As shown, the conductive component 2 further includes a conductive terminal 27, which is disposed on the upper surface of the first conductive component 21 on the upper surface of the substrate unit 11. The conductive terminal 27 is used to connect electronic components or other external packaging products.
[0063] Fig.10 It shows that Fig. 9 FIG. 1 is a schematic diagram of a manufacturing process of a packaging structure according to another embodiment of the present application. Fig.10 As shown,
[0064] Step 2001: providing a first carrier 101, disposing a release layer 102 on the upper surface of the first carrier 101, disposing a substrate 103 above the release layer 102, wherein a conductive terminal 113 is disposed on the upper surface of the substrate 103;
[0065] Step 2002: Cut the first carrier board 101, the release layer 102 and the substrate 103 to form a substrate module 104, wherein Figure 5 The dotted lines in the figure represent the locations of the cuts;
[0066] Step 2003: providing a second carrier 106, and placing the flipped substrate module 104 on the second carrier 106 via an adhesive layer 114, wherein the adhesive layer 114 can be made of tape or adhesive, and the tape includes but is not limited to UV release tape;
[0067] Step 2004: removing the release layer 102 and the substrate 103 to obtain a substrate unit 107;
[0068] Step 2005: Use the second mold sealing layer 108 to cover the upper surface of the substrate unit 107 and the adhesive layer 114;
[0069] Step 2006: a third mold sealing layer 109 is disposed on the substrate unit 107, the substrate unit 107 and the third mold sealing layer 109 are electrically connected, a fourth mold sealing layer 110 is disposed on the third mold sealing layer 109 and the first conductive component 111 is exposed from the bottom of the fourth mold sealing layer 110, and then step 2007a or step 2007b is performed according to the different materials of the adhesive layer 114;
[0070] Step 2007a: The material of the adhesive layer 114 is a tape. After removing the second carrier 106 , the tape is removed, and then step 2008 is performed:
[0071] Step 2007b: the material of the bonding layer 114 is an adhesive, the adhesive is cleaned off after the second carrier 106 is removed, and then step 2008 is performed; and
[0072] Step 2008: Flip the package structure.
[0073] Figures 11 to 15 Schematic top views of packaging structures using different electronic component arrangement methods are shown. Figures 11 to 15 As shown, substrate units 11 of different shapes and numbers can be selected and arranged as needed, and one or more electronic components 3 can be respectively arranged on one or more substrate units 11 as needed.
[0074] The advantages of the packaging structure according to the embodiment of the present application are that the redistribution layer is directly electrically connected to the electronic component through the substrate unit without the need for additional connecting circuits, thereby simplifying the manufacturing process, improving the yield rate, and reducing costs.
[0075] Although the present application has been described and illustrated with reference to the specific embodiments of the present application, these descriptions and illustrations are not intended to limit the present application. It will be clearly understood by those skilled in the art that various changes may be made, and equivalent elements may be substituted within the embodiments without departing from the scope of protection of the present application as defined by the claims. Due to variables in the manufacturing process, etc., there may be differences between the technical reproduction in the present application and the actual device. There may be other embodiments of the present application that are not specifically described. The description and illustrations should be regarded as illustrative, not restrictive, and modifications may be made according to the purpose and spirit of the present application, all of which are within the scope of protection of the claims. Although the methods disclosed herein have been described with reference to specific operations performed in a specific order, it should be understood that these operations may be recombined, subdivided or arranged to form equivalent methods without departing from the teachings of the present application. Therefore, unless specifically indicated herein, the order and grouping of operations do not limit the present application.
Claims
1. A packaging structure, characterized in that: include: A substrate, the substrate comprising a plurality of substrate units, the plurality of substrate units being arranged on the same plane, and the plurality of substrate units being in an isolated state for electrical signal transmission; A conductive component, wherein the conductive component includes a first conductive component, and the first conductive component is respectively arranged on one side of the substrate unit; The electronic component comprises a plurality of connection terminals, and the electronic component is electrically connected to the first conductive component through the plurality of connection terminals.
2. The packaging structure according to claim 1, characterized in that: The substrate further includes a first molding layer and a second molding layer, the first molding layer covers the plurality of substrate units, and the second molding layer is disposed on the other side of the plurality of substrate units opposite to the first conductive component.
3. The packaging structure according to claim 2, characterized in that: The conductive assembly further includes a second conductive component, which is disposed on a side of the second molding layer facing the plurality of substrate units, and a density of conductive circuits of the second conductive component is smaller than a density of conductive circuits of the first conductive component.
4. The packaging structure according to claim 3, characterized in that: The conductive component further includes a third conductive component disposed on another side of the second molding layer opposite to the second conductive component.
5. The packaging structure according to claim 4, characterized in that: The density of the conductive lines of the third conductive component is smaller than the density of the conductive lines of the first conductive component.
6. The packaging structure according to claim 4, characterized in that: The conductive component further includes a connecting circuit, and the first conductive component, the second conductive component and the third conductive component are electrically connected through the connecting circuit.
7. The packaging structure according to claim 6, characterized in that: The connection circuit includes a first circuit and a second circuit, the first circuit is arranged in the substrate unit, and the second circuit is arranged in the second molding layer.
8. The packaging structure according to claim 7, characterized in that: The diameter of the first line is smaller than the diameter of the second line.
9. The packaging structure according to claim 1, characterized in that: The projection of the electronic component in the vertical direction covers a plurality of substrate units.
10. The packaging structure according to claim 1, characterized in that: The projection area of the electronic component in the vertical direction is smaller than the area of a single substrate unit, and the projection of the electronic component in the vertical direction is within the range of the single substrate unit in the top-view direction.