Antenna assembly and electronic equipment

Abstract

The utility model provides an antenna assembly and electronic equipment. The antenna assembly comprises a circuit board; the interference module is arranged on the circuit board; an antenna radiation structure, wherein the antenna radiation structure and the interference module are arranged at an interval; and a cooling fin, wherein the cooling fin is arranged opposite to the circuit board. The radiating fin covers the interference module and extends towards the antenna radiation structure; the radiating fin is provided with an open groove, the open groove at least penetrates through the conductive base layer of the radiating fin in the thickness direction of the radiating fin, and the open groove is located between the interference module and the antenna radiation structure. The utility model aims to solve the technical problem of antenna receiving interference caused by arrangement of cooling fins in the prior art.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to antenna components and electronic equipment. Background Art

[0002] There is also an antenna radiation structure inside the electronic device to achieve communication with the outside world. Since the electronic device is equipped with a high-power electronic module, it will generate a lot of heat when working. Therefore, the electronic device usually attaches a heat sink to the housing of the electronic device to achieve the purpose of heat dissipation. However, since the heat sink is usually a conductor and has a wide coverage area, the interference signal generated by the high-power module in the electronic device oscillates and reflects back and forth between the heat sink and the circuit board until the interference signal is transmitted to the edge of the heat sink and radiated, which will interfere with the reception and transmission of the antenna radiation structure. Utility Model Content

[0003] The main purpose of the present application is to provide an antenna assembly and an electronic device, aiming to solve the technical problem of antenna reception interference caused by the provision of a heat sink in the prior art.

[0004] The present application provides an antenna assembly, the antenna assembly comprising:

[0005] Circuit boards;

[0006] An interference module, wherein the interference module is arranged on the circuit board;

[0007] an antenna radiation structure, wherein the antenna radiation structure is spaced apart from the interference module; and

[0008] A heat sink, the heat sink is arranged opposite to the circuit board; the heat sink covers the interference module and extends toward the antenna radiation structure; a groove is provided on the heat sink, the groove at least penetrates the conductive base layer of the heat sink in the thickness direction of the heat sink, and the groove is located between the interference module and the antenna radiation structure.

[0009] Optionally, the spacing between the slot and the interference module is 6-15 mm; and / or the width of the slot is 4-5 mm.

[0010] Optionally, the conductive base layer is a graphite base layer.

[0011] Optionally, there is a spacing direction between the antenna radiation structure and the interference module;

[0012] The extending direction of the slots is arranged to intersect with the spacing direction.

[0013] Optionally, there are multiple slots, and the multiple slots are arranged at intervals between the antenna radiation structure and the interference module.

[0014] Optionally, the distance between two adjacent slots is at least 20 mm.

[0015] Optionally, the number of the antenna radiation structures is at least two, and the at least two antenna radiation structures include a first antenna radiation structure and a second antenna radiation structure; the first antenna radiation structure is located on one side in the length direction of the circuit board, and the second antenna radiation structure is located on one side in the width direction of the circuit board;

[0016] The slot includes a first slot and a second slot, the first slot is located between the first antenna radiation structure and the interference module, and the second slot is located between the second antenna radiation structure and the interference module.

[0017] Optionally, the first slot and the second slot are connected to each other.

[0018] Optionally, the slot divides the heat sink into a first part and a second part, the first part covers the interference module, and the second part extends from the slot toward the antenna radiation structure;

[0019] The edge of the slot has a connection portion, and the first part and the second part are connected via the connection portion; and / or an insulating layer is provided on the heat sink, and the first part and the second part are connected via the insulating layer.

[0020] An embodiment of the present application further provides an electronic device, which includes the antenna assembly as described above.

[0021] In the technical solution of the embodiment of the present application, the heat sink is arranged relative to the circuit board and covers the interference module; the interference module emits interference signals when working, and since the heat sink is provided with a groove penetrating its conductive base layer in the thickness direction, the interference signal reflected from the oscillation between the heat sink and the circuit board can be radiated into the air from the groove, thereby reducing the amplitude and intensity of the interference signal reflected between the circuit board and the heat sink, so that when the interference signal is radiated from the edge of the heat sink to the antenna, the amplitude and intensity have been greatly reduced, thereby reducing the interference intensity of the interference to the antenna radiation structure and reducing the influence on the receiving and transmitting performance of the antenna radiation structure; in this way, the heat dissipation function of the heat sink can be guaranteed at the same time, and the influence of the receiving interference on the antenna radiation structure caused by the setting of the heat sink can be reduced, thereby ensuring that the antenna radiation structure has a high receiving and transmitting sensitivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0023] Figure 1 A first structural schematic diagram of an antenna assembly provided in an embodiment of the present application;

[0024] Figure 2 A second structural schematic diagram of the antenna assembly provided in an embodiment of the present application;

[0025] Figure 3 A third structural schematic diagram of the antenna assembly provided in an embodiment of the present application;

[0026] Figure 4 A schematic diagram of the structure of a heat sink in an antenna assembly provided in an embodiment of the present application;

[0027] Figure 5 A fourth structural schematic diagram of an antenna assembly provided in an embodiment of the present application;

[0028] Figure 6 This is a fifth structural schematic diagram of the antenna assembly provided in an embodiment of the present application.

[0029] Reference numerals list

[0030] 110 Circuit Board 1411 First slot 120 Antenna radiation structure 1412 Second slot 130 Interference module 142 Part I 140 Heat sink 143 Part 2 121 First antenna radiation structure 144 Connection parts 122 Second antenna radiation structure 145 Conductive base 141 Slotting 146 Insulation layer DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0032] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0033] In this application, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0034] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0035] The interference module will generate interference signals when it is working; when there is a heat sink above the interference module, because the heat sink is usually a conductor, it will act as a reflector for the interference signal, and the metal materials, devices, GND, etc. on the circuit board will act as another reflector. The interference signal is reflected multiple times between the upper and lower reflectors, and finally radiates from the edge of the heat sink; because the heat sink basically covers the entire circuit board in order to fully dissipate heat, the antenna radiation structure will be set at the edge of the heat sink, and the distance between the two reflectors is relatively close, which guides the radiation direction of the interference signal to the antenna radiation structure. Therefore, the interference signal is radiated to the antenna radiation structure and received by the antenna radiation structure, interfering with the antenna radiation structure, affecting the receiving and transmitting sensitivity of the electronic equipment, that is, reducing the receiving and transmitting performance.

[0036] For this reason, Figure 1 and Figure 2 As shown, the present application proposes an antenna assembly, the antenna assembly comprising:

[0037] Circuit board 110;

[0038] An interference module 130, wherein the interference module 130 is disposed on the circuit board 110;

[0039] An antenna radiation structure 120, wherein the antenna radiation structure 120 is spaced apart from the interference module 130; and

[0040] A heat sink 140, wherein the heat sink 140 is arranged opposite to the circuit board 110; the heat sink 140 covers the interference module 130 and extends toward the antenna radiation structure 120; a slot 141 is provided on the heat sink 140, and the slot 141 at least penetrates the conductive base layer 145 of the heat sink 140 in the thickness direction of the heat sink 140, and the slot 141 is located between the interference module 130 and the antenna radiation structure 120.

[0041] In the technical solution of the embodiment of the present application, the heat sink 140 is arranged relative to the circuit board 110 and covers the interference module 130; the interference module 130 is entangled with interference signals when working. Since the heat sink 140 is provided with a groove 141 that penetrates its conductive base layer 145 in the thickness direction, the interference signal reflected by the oscillation between the heat sink 140 and the circuit board 110 can be radiated from the groove 141 into the air, thereby reducing the amplitude and intensity of the interference signal reflected between the circuit board 110 and the heat sink 140. In this way, when the interference signal is radiated from the edge of the heat sink 140 to the antenna, the amplitude and intensity have been greatly reduced, thereby reducing its interference intensity to the antenna radiation structure 120 and reducing the impact on the receiving and transmitting performance of the antenna radiation structure 120; in this way, the heat dissipation function of the heat sink 140 can be guaranteed at the same time, and the impact of the receiving interference on the antenna radiation structure 120 caused by the setting of the heat sink 140 can also be reduced, thereby ensuring that the antenna radiation structure 120 has a high receiving and transmitting sensitivity.

[0042] It should be noted that the interference module 130 can be a power module, baseband module or storage module inside the electronic device; a shielding cover is usually provided on the outside of the interference module 130 to shield the signal; however, due to various reasons such as the shielding cover cannot be completely closed and the PCB surface circuit is exposed, interference signals are often emitted, which interfere with the antenna radiation structure 120 of the electronic device and affect the sensitivity of signal reception.

[0043] In some prior arts, a hole / slot structure is provided at a position of the heat sink 140 facing the periphery of the interference module 130, so that the interference signal of the interference module 130 can be radiated directly from the hole / slot structure; however, due to the influence of assembly, etc., the hole / slot of the heat sink 140 is not completely facing the periphery of the interference module 130, so that part of the interference signal of the interference module 130 will still oscillate and reflect back and forth between the heat sink 140 and the circuit board 110, propagate toward the antenna radiation structure 120, and interfere with the antenna radiation structure 120. In the technical solution of the present application, a slot 141 is provided between the interference module 130 and the antenna radiation structure 120, so that the interference signal can be radiated from the slot 141 during the oscillation propagation process, thereby avoiding the interference of part of the interference signal caused by assembly and other reasons on the antenna radiation structure 120.

[0044] In the technical solution of the embodiment of the present application, an opening may be provided at the position where the heat sink 140 faces the interference module 130, and a slot 141 may be provided on the heat sink 140, the slot 141 at least penetrates the conductive base layer 145 of the heat sink 140 in the thickness direction of the heat sink 140, and the slot 141 is located between the interference module 130 and the antenna radiation structure 120; or an opening may not be provided at the position where the heat sink 140 faces the interference module 130. In the technical solution of the embodiment of the present application, a slot may be provided at the position where the heat sink 140 faces the peripheral edge of the shielding cover of the interference module 130, and a slot 141 may be provided on the heat sink 140, the slot 141 at least penetrates the conductive base layer 145 of the heat sink 140 in the thickness direction of the heat sink 140; or a slot may not be provided at the position where the heat sink 140 faces the peripheral edge of the shielding cover of the interference module 130. In a specific implementation process, whether the heat sink 140 is provided with holes and / or grooves facing the interference module 130 is mainly determined comprehensively based on the strength of the interference signal generated by the interference module 130 and the heat dissipation area required by the heat sink 140 .

[0045] In an embodiment, the slot 141 may be one of a linear slot 141, a curved slot 141, a W-shaped slot 141, a C-shaped slot 141, a V-shaped slot 141 or an L-shaped slot 141, or a slot 141 formed by a combination of multiple linear shapes. The shape of the slot 141 is mainly determined based on the positional relationship between the antenna radiation structure 120 and the interference module 130, and the number of the antenna radiation structure 120 and the interference module 130. The slot 141 is set to set a channel for the interference signal to radiate outward between the antenna radiation structure 120 and the interference module 130. The implementer can make specific settings according to the specific situation.

[0046] As an optional implementation of the above embodiment, Figure 2As shown, the spacing between the slot 141 and the interference module 130 is 6-15mm; and / or, the width of the slot 141 is 4-5mm. In an embodiment, the distance between the interference module 130 and the slot 141 is between 6-15mm, so that the interference signal can be radiated out of the heat sink 140; at the same time, the installation error is taken into account, even if the error causes a certain offset in the position of the slot 141, the spacing is 6-15mm, which can ensure that the slot 141 is between the interference module 130 and the antenna radiation structure 120. For example, the spacing can be 6mm, 7mm, 8mm, 9mm, 10mm, 11mm, 12mm, 13mm, 14mm or 15mm.

[0047] In the embodiment, the width of the slot 141 is 4-5 mm, which ensures that the interference signal can be radiated from the slot 141, and at the same time ensures that the heat dissipation area is not reduced much due to the provision of the slot 141, that is, the interference to the antenna radiation structure 120 can be reduced and the heat dissipation can be ensured. For example, the width of the slot 141 is 4 mm, 4.2 mm, 4.4 mm, 4.6 mm, 4.8 mm or 5 mm.

[0048] As an optional implementation of the above embodiment, the conductive base layer 145 is a graphite base layer. That is, in the technical solution of the embodiment of the present application, the heat sink 140 is a graphite sheet with graphite as the base layer, which has good heat dissipation performance. In addition, graphite is a lightweight material, and using it for heat dissipation can reduce the overall mass of the mobile terminal and facilitate the realization of a thin and light mobile terminal. Moreover, the graphite material has strong plasticity and can be smoothly attached to any flat and curved surface.

[0049] In some embodiments, the heat sink 140 may further include an insulating layer 146 disposed on the surface of the graphite substrate. The groove 141 may penetrate the entire heat sink 140 (including the insulating layer 146) in the thickness direction, or may only penetrate the graphite substrate in the thickness direction.

[0050] In some other embodiments, the conductive base layer 145 may also be a copper foil base layer or an aluminum foil base layer.

[0051] As an optional implementation of the above embodiment, there is a spacing direction between the antenna radiation structure 120 and the interference module 130. The antenna radiation structure 120 is usually set at a position far away from the interference module 130 to avoid direct radiation of the interference module 130. It is usually attached to the housing of the electronic device and / or reused by the metal housing of the electronic device, and is electrically connected to the signal processing chip of the circuit board 110.

[0052] The extending direction of the slot 141 is arranged to intersect with the spacing direction. For example, the antenna radiation structure 120 and the interference module 130 are arranged to intersect with each other in the length direction of the circuit board 110, and the spacing direction is the length direction; the extending direction of the slot 141 is arranged to intersect with the length direction, for example, the slot 141 is extended along the width direction of the circuit board 110, or the extending direction of the slot 141 is 45 degrees to the spacing direction, etc. In general, the extending direction of the slot 141 is arranged perpendicular to the spacing direction.

[0053] As an optional implementation of the above embodiment, the number of the slots 141 is multiple, and the multiple slots 141 are arranged at intervals between the antenna radiation structure 120 and the interference module 130. Figure 1 and Figure 6 As shown, two slots 141 are provided between the antenna radiation structure 120 and the interference module 130, which can maximize the reduction of the intensity of the interference signal radiated to the antenna radiation structure 120, so that the antenna radiation structure 120 is not interfered by the interference signal. Opening two slots can better reduce the amplitude of the interference signal reaching the antenna radiation structure 120. When the interference signal is transmitted between the heat sink 140 and the circuit board 110, a part of the energy is dissipated into the air when passing through the first slot, and the energy transmitted forward is reduced. When passing through the second slot, a part of the energy is dissipated into the air again, and the energy transmitted forward to the antenna radiation structure 120 is further reduced, that is, the intensity of the interference signal that can reach the antenna radiation structure 120 has been reduced twice, and the interference received by the antenna radiation structure 120 is smaller than that of the solution with only one slot, and the performance is better.

[0054] In a specific embodiment, a greater number of slots 141 will significantly reduce the strength of the interference signal, but this will cause the heat dissipation area of ​​the heat sink 140 to decrease. Therefore, the number of slots 141 is mainly determined based on the strength of the interference signal and the heat dissipation area required by the heat sink 140, and can be two or more.

[0055] As an optional implementation of the above embodiment, the distance H between two adjacent slots 141 is at least 20 mm. For example, the distance H between two adjacent slots 141 is 20 mm, 24 mm, 28 mm, or 32 mm.

[0056] With the development of communication technology, the number of antenna radiation structures 120 is gradually increasing. Therefore, the number of antenna radiation structures 120 in an electronic device is usually at least two; as an optional implementation of the above embodiment, Figure 5 and Figure 6As shown, the number of the antenna radiation structures 120 is at least two, and the at least two antenna radiation structures 120 include a first antenna radiation structure 121 and a second antenna radiation structure 122; the first antenna radiation structure 121 is located on one side of the length direction of the circuit board 110, and the second antenna radiation structure 122 is located on one side of the width direction of the circuit board 110; the slot 141 includes a first slot 1411 and a second slot 1412, the first slot 1411 is located between the first antenna radiation structure 121 and the interference module 130, and the second slot 1412 is located between the second antenna radiation structure 122 and the interference module 130. That is, in this embodiment, a slot 141 is provided between any antenna radiation structure 120 and the interference module 130, so that the interference signal of the interference module 130 can be radiated when it propagates to the antenna radiation structure 120.

[0057] As an optional implementation of the above embodiment, the first slot 1411 and the second slot 1412 are connected to each other. In the embodiment, the first slot 1411 and the second slot 1412 are connected to form an L-shaped slot 141, so that the interference signal propagated to the intersection of the two can be radiated into the air.

[0058] As an optional implementation of the above embodiment, the slot 141 divides the heat sink 140 into a first portion 142 and a second portion 143, wherein the first portion 142 covers the interference module 130, and the second portion 143 extends from the slot 141 toward the antenna radiation structure 120. Figure 3 As shown, the edge of the slot 141 has a connection portion 144, and the first portion 142 and the second portion 143 are connected via the connection portion 144; and / or, as Figure 4 As shown, an insulating layer 146 is provided on the heat sink 140, and the first part 142 and the second part 143 are connected through the insulating layer 146. In this embodiment, the heat sink 140 is a complete structure as a whole, and the first part 142 and the second part 143 divided by the groove 141 are still connected. In some embodiments, the connecting part 144 is located at at least one end of the extending direction of the groove 141, and the groove 141 is not provided to connect the first part 142 and the second part 143. In some embodiments, the groove 141 of the heat sink 140 does not have an insulating layer 146 penetrating its surface, so the first part 142 and the second part 143 are connected through the insulating layer 146.

[0059] The present application also provides an electronic device, which includes an antenna assembly. The specific structure of the antenna assembly refers to the above embodiment. Since the antenna assembly adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here. The electronic device can be a smart phone, a tablet computer, a smart watch and other devices.

[0060] The above description is only an optional embodiment of the present application, and does not limit the patent scope of the present application. All equivalent structural changes made by using the contents of the present application specification and drawings under the application concept of the present application, or directly / indirectly used in other related technical fields are included in the patent protection scope of the present application.

Claims

1. An antenna assembly, characterized in that: The antenna assembly comprises: Circuit boards; An interference module, wherein the interference module is arranged on the circuit board; an antenna radiation structure, wherein the antenna radiation structure is spaced apart from the interference module; and A heat sink, the heat sink is arranged opposite to the circuit board; the heat sink covers the interference module and extends toward the antenna radiation structure; a groove is provided on the heat sink, the groove at least penetrates the conductive base layer of the heat sink in the thickness direction of the heat sink, and the groove is located between the interference module and the antenna radiation structure.

2. The antenna assembly according to claim 1, wherein: The spacing between the slot and the interference module is 6-15 mm; and / or the width of the slot is 4-5 mm.

3. The antenna assembly according to claim 1, wherein: The conductive base layer is a graphite base layer.

4. The antenna assembly according to claim 1, wherein: There is a spacing direction between the antenna radiation structure and the interference module; The extending direction of the slots is arranged to intersect with the spacing direction.

5. The antenna assembly according to claim 1, wherein: There are multiple slots, and the multiple slots are arranged at intervals between the antenna radiation structure and the interference module.

6. The antenna assembly according to claim 5, characterized in that The distance between two adjacent slots is at least 20 mm.

7. The antenna assembly according to claim 1, wherein: The number of the antenna radiation structures is at least two, and the at least two antenna radiation structures include a first antenna radiation structure and a second antenna radiation structure; the first antenna radiation structure is located on one side of the length direction of the circuit board, and the second antenna radiation structure is located on one side of the width direction of the circuit board; The slot includes a first slot and a second slot, the first slot is located between the first antenna radiation structure and the interference module, and the second slot is located between the second antenna radiation structure and the interference module.

8. The antenna assembly according to claim 7, wherein: The first slot and the second slot are connected to each other.

9. The antenna assembly according to claim 1, wherein: The slot divides the heat sink into a first part and a second part, the first part covers the interference module, and the second part extends from the slot toward the antenna radiation structure; The edge of the groove has a connection portion, and the first part and the second part are connected via the connection portion; And / or an insulating layer is provided on the heat sink, and the first part and the second part are connected through the insulating layer.

10. An electronic device, characterized in that: The electronic device comprises the antenna assembly according to any one of claims 1 to 9.

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